SE0401749D0 - Arrangement and method for increasing heat transfer - Google Patents
Arrangement and method for increasing heat transferInfo
- Publication number
- SE0401749D0 SE0401749D0 SE0401749A SE0401749A SE0401749D0 SE 0401749 D0 SE0401749 D0 SE 0401749D0 SE 0401749 A SE0401749 A SE 0401749A SE 0401749 A SE0401749 A SE 0401749A SE 0401749 D0 SE0401749 D0 SE 0401749D0
- Authority
- SE
- Sweden
- Prior art keywords
- arrangement
- heat transfer
- increasing heat
- voltage
- heat
- Prior art date
Links
- 230000005684 electric field Effects 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0401749A SE0401749L (sv) | 2004-07-02 | 2004-07-02 | Anordning och förfarande för att kyla en värmekälla |
PCT/SE2005/001064 WO2006004524A1 (en) | 2004-07-02 | 2005-07-01 | Arrangement and method for increasing heat transfer |
US11/160,634 US20060005946A1 (en) | 2004-07-02 | 2005-07-01 | Arrangement and method for increasing heat transfer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0401749A SE0401749L (sv) | 2004-07-02 | 2004-07-02 | Anordning och förfarande för att kyla en värmekälla |
Publications (2)
Publication Number | Publication Date |
---|---|
SE0401749D0 true SE0401749D0 (sv) | 2004-07-02 |
SE0401749L SE0401749L (sv) | 2006-01-03 |
Family
ID=32768764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0401749A SE0401749L (sv) | 2004-07-02 | 2004-07-02 | Anordning och förfarande för att kyla en värmekälla |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060005946A1 (sv) |
SE (1) | SE0401749L (sv) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006079111A2 (en) * | 2005-01-24 | 2006-07-27 | Thorrn Micro Technologies, Inc. | Electro-hydrodynamic pump and cooling apparatus comprising an electro-hydrodynamic pump |
US7269008B2 (en) * | 2005-06-29 | 2007-09-11 | Intel Corporation | Cooling apparatus and method |
US7260958B2 (en) * | 2005-09-14 | 2007-08-28 | National Taipei University Technology | Electrohydrodynamic condenser device |
US20100177519A1 (en) * | 2006-01-23 | 2010-07-15 | Schlitz Daniel J | Electro-hydrodynamic gas flow led cooling system |
US7545640B2 (en) * | 2007-02-16 | 2009-06-09 | Intel Corporation | Various methods, apparatuses, and systems that use ionic wind to affect heat transfer |
US7839634B2 (en) * | 2007-08-22 | 2010-11-23 | Chien Ouyang | Micro thrust cooling |
US20090155090A1 (en) * | 2007-12-18 | 2009-06-18 | Schlitz Daniel J | Auxiliary electrodes for enhanced electrostatic discharge |
US20090168344A1 (en) * | 2007-12-31 | 2009-07-02 | Ploeg Johan F | Thermal device with electrokinetic air flow |
US20090323276A1 (en) * | 2008-06-25 | 2009-12-31 | Mongia Rajiv K | High performance spreader for lid cooling applications |
US8624503B2 (en) * | 2009-12-10 | 2014-01-07 | Panasonic Precision Devices Co., Ltd. | Collector-radiator structure for an electrohydrodynamic cooling system |
TWI418972B (zh) * | 2010-04-14 | 2013-12-11 | Acer Inc | 散熱系統與散熱方法 |
EP2577419A1 (en) | 2010-05-26 | 2013-04-10 | Tessera, Inc. | Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices |
US8139354B2 (en) * | 2010-05-27 | 2012-03-20 | International Business Machines Corporation | Independently operable ionic air moving devices for zonal control of air flow through a chassis |
WO2012064615A1 (en) * | 2010-11-11 | 2012-05-18 | Tessera, Inc. | Electronic system with ventilation path through inlet-positioned ehd air mover, over ozone reducing surfaces, and out through outlet-positioned heat exchanger |
US20130153199A1 (en) * | 2011-12-14 | 2013-06-20 | International Business Machines Corporation | Performance and noise control for a heat sink air mover |
EP3019798B1 (en) * | 2014-09-16 | 2018-05-23 | Huawei Technologies Co., Ltd. | Method, device and system for cooling |
RU2652700C2 (ru) * | 2016-09-12 | 2018-04-28 | Владимир Дмитриевич Шкилев | Способ интенсификации конвективного теплообмена |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3224497A (en) * | 1963-03-26 | 1965-12-21 | Inter Probe | Method and apparatus for lowering the temperature of a heated body |
US3872917A (en) * | 1971-04-08 | 1975-03-25 | Inter Probe | Cooling apparatus and method for heat exchangers |
US3703813A (en) * | 1971-10-14 | 1972-11-28 | Albert Olevitch | Laser beam reflector system |
US4558208A (en) * | 1983-05-12 | 1985-12-10 | Harry Hill Associates | Heating structure for an oven |
-
2004
- 2004-07-02 SE SE0401749A patent/SE0401749L/sv unknown
-
2005
- 2005-07-01 US US11/160,634 patent/US20060005946A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20060005946A1 (en) | 2006-01-12 |
SE0401749L (sv) | 2006-01-03 |
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