SE0401749D0 - Arrangement and method for increasing heat transfer - Google Patents

Arrangement and method for increasing heat transfer

Info

Publication number
SE0401749D0
SE0401749D0 SE0401749A SE0401749A SE0401749D0 SE 0401749 D0 SE0401749 D0 SE 0401749D0 SE 0401749 A SE0401749 A SE 0401749A SE 0401749 A SE0401749 A SE 0401749A SE 0401749 D0 SE0401749 D0 SE 0401749D0
Authority
SE
Sweden
Prior art keywords
arrangement
heat transfer
increasing heat
voltage
heat
Prior art date
Application number
SE0401749A
Other languages
Swedish (sv)
Other versions
SE0401749L (en
Inventor
Anna Borgstroem
Roderick Barrett
Original Assignee
Anna Borgstroem
Roderick Barrett
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anna Borgstroem, Roderick Barrett filed Critical Anna Borgstroem
Priority to SE0401749A priority Critical patent/SE0401749L/en
Publication of SE0401749D0 publication Critical patent/SE0401749D0/en
Priority to US11/160,634 priority patent/US20060005946A1/en
Priority to PCT/SE2005/001064 priority patent/WO2006004524A1/en
Publication of SE0401749L publication Critical patent/SE0401749L/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to an arrangement comprising at least one heat source ( 140 ) being adapted to transfer heat to at least one first element ( 110 ), a power source ( 100 ) being provided for applying a first voltage (V 1 ) to said first element ( 110 ), at least one second element ( 150 ) having a second voltage (V 2 ), wherein an electric field (E), generated by a potential difference (V 1 -V 2 ), between the first element ( 110 ) and the second element ( 150 ), causes an ionized medium, heated by the first element ( 110 ), to move towards the second element ( 150 ), thereby achieving an increased heat transfer from the first element ( 110 ).
SE0401749A 2004-07-02 2004-07-02 Apparatus and method for cooling a heat source SE0401749L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0401749A SE0401749L (en) 2004-07-02 2004-07-02 Apparatus and method for cooling a heat source
US11/160,634 US20060005946A1 (en) 2004-07-02 2005-07-01 Arrangement and method for increasing heat transfer
PCT/SE2005/001064 WO2006004524A1 (en) 2004-07-02 2005-07-01 Arrangement and method for increasing heat transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0401749A SE0401749L (en) 2004-07-02 2004-07-02 Apparatus and method for cooling a heat source

Publications (2)

Publication Number Publication Date
SE0401749D0 true SE0401749D0 (en) 2004-07-02
SE0401749L SE0401749L (en) 2006-01-03

Family

ID=32768764

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0401749A SE0401749L (en) 2004-07-02 2004-07-02 Apparatus and method for cooling a heat source

Country Status (2)

Country Link
US (1) US20060005946A1 (en)
SE (1) SE0401749L (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1882099A2 (en) * 2005-01-24 2008-01-30 Thorrn Micro Technologies, Inc. Electro-hydrodynamic pump and cooling apparatus comprising an electro-hydrodynamic pump
US7269008B2 (en) * 2005-06-29 2007-09-11 Intel Corporation Cooling apparatus and method
US7260958B2 (en) * 2005-09-14 2007-08-28 National Taipei University Technology Electrohydrodynamic condenser device
US20100177519A1 (en) * 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
US7545640B2 (en) * 2007-02-16 2009-06-09 Intel Corporation Various methods, apparatuses, and systems that use ionic wind to affect heat transfer
US7839634B2 (en) * 2007-08-22 2010-11-23 Chien Ouyang Micro thrust cooling
US20090155090A1 (en) * 2007-12-18 2009-06-18 Schlitz Daniel J Auxiliary electrodes for enhanced electrostatic discharge
US20090168344A1 (en) * 2007-12-31 2009-07-02 Ploeg Johan F Thermal device with electrokinetic air flow
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
US8624503B2 (en) * 2009-12-10 2014-01-07 Panasonic Precision Devices Co., Ltd. Collector-radiator structure for an electrohydrodynamic cooling system
TWI418972B (en) * 2010-04-14 2013-12-11 Acer Inc Heat dissipation system and heat dissipation method
EP2577419A1 (en) 2010-05-26 2013-04-10 Tessera, Inc. Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices
US8139354B2 (en) * 2010-05-27 2012-03-20 International Business Machines Corporation Independently operable ionic air moving devices for zonal control of air flow through a chassis
WO2012064615A1 (en) * 2010-11-11 2012-05-18 Tessera, Inc. Electronic system with ventilation path through inlet-positioned ehd air mover, over ozone reducing surfaces, and out through outlet-positioned heat exchanger
US20130153199A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Performance and noise control for a heat sink air mover
WO2016041581A1 (en) * 2014-09-16 2016-03-24 Huawei Technologies Co., Ltd Method, device and system for cooling
RU2652700C2 (en) * 2016-09-12 2018-04-28 Владимир Дмитриевич Шкилев Method of intensification of heat convection

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3224497A (en) * 1963-03-26 1965-12-21 Inter Probe Method and apparatus for lowering the temperature of a heated body
US3872917A (en) * 1971-04-08 1975-03-25 Inter Probe Cooling apparatus and method for heat exchangers
US3703813A (en) * 1971-10-14 1972-11-28 Albert Olevitch Laser beam reflector system
US4558208A (en) * 1983-05-12 1985-12-10 Harry Hill Associates Heating structure for an oven

Also Published As

Publication number Publication date
SE0401749L (en) 2006-01-03
US20060005946A1 (en) 2006-01-12

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