SE0200146L - Device for centering the laser beam in a laser processing system - Google Patents

Device for centering the laser beam in a laser processing system

Info

Publication number
SE0200146L
SE0200146L SE0200146A SE0200146A SE0200146L SE 0200146 L SE0200146 L SE 0200146L SE 0200146 A SE0200146 A SE 0200146A SE 0200146 A SE0200146 A SE 0200146A SE 0200146 L SE0200146 L SE 0200146L
Authority
SE
Sweden
Prior art keywords
laser beam
laser
centering
processing system
instance
Prior art date
Application number
SE0200146A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE0200146D0 (en
SE524066C2 (en
Inventor
Ulf Sandstroem
Sven-Olov Roos
Anders Lindskog
Original Assignee
Permanova Lasersystem Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Permanova Lasersystem Ab filed Critical Permanova Lasersystem Ab
Priority to SE0200146A priority Critical patent/SE524066C2/en
Publication of SE0200146D0 publication Critical patent/SE0200146D0/en
Priority to AT03731855T priority patent/ATE506139T1/en
Priority to PCT/SE2003/000037 priority patent/WO2003061895A1/en
Priority to DE60336796T priority patent/DE60336796D1/en
Priority to EP03731855A priority patent/EP1467832B1/en
Publication of SE0200146L publication Critical patent/SE0200146L/en
Publication of SE524066C2 publication Critical patent/SE524066C2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Laser Surgery Devices (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

Means for visualizing the laser beam (1´) in an aperture, for instance the nozzle opening, in a laser machining system, for instance in a laser cutting device, and in which system the laser beam is transmitted from a laser source (1) to the workpiece (3) to be processed and wherein a nozzle (7) is arranged coaxially with the laser beam (1´) to deliver an assisting gas. The visualizing means comprises an equipment (10, 12), in the form of an optical image system to make an image of the laser beam (1´) and/or the aperture (11).
SE0200146A 2002-01-21 2002-01-21 Device for centering the laser beam in a laser processing system SE524066C2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE0200146A SE524066C2 (en) 2002-01-21 2002-01-21 Device for centering the laser beam in a laser processing system
AT03731855T ATE506139T1 (en) 2002-01-21 2003-01-20 MEANS FOR VISIBILITY OF THE LASER BEAM IN A LASER PROCESSING SYSTEM
PCT/SE2003/000037 WO2003061895A1 (en) 2002-01-21 2003-01-20 Means for visualizing the laser beam in a laser machining system
DE60336796T DE60336796D1 (en) 2002-01-21 2003-01-20 EM LASER PROCESSING SYSTEM
EP03731855A EP1467832B1 (en) 2002-01-21 2003-01-20 Means for visualizing the laser beam in a laser machining system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0200146A SE524066C2 (en) 2002-01-21 2002-01-21 Device for centering the laser beam in a laser processing system

Publications (3)

Publication Number Publication Date
SE0200146D0 SE0200146D0 (en) 2002-01-21
SE0200146L true SE0200146L (en) 2003-07-22
SE524066C2 SE524066C2 (en) 2004-06-22

Family

ID=20286705

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0200146A SE524066C2 (en) 2002-01-21 2002-01-21 Device for centering the laser beam in a laser processing system

Country Status (5)

Country Link
EP (1) EP1467832B1 (en)
AT (1) ATE506139T1 (en)
DE (1) DE60336796D1 (en)
SE (1) SE524066C2 (en)
WO (1) WO2003061895A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060932B2 (en) 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7286223B2 (en) 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
US7379483B2 (en) 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
US7880116B2 (en) 2003-03-18 2011-02-01 Loma Linda University Medical Center Laser head for irradiation and removal of material from a surface of a structure
US7057134B2 (en) 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7038166B2 (en) 2003-03-18 2006-05-02 Loma Linda University Medical Center Containment plenum for laser irradiation and removal of material from a surface of a structure
ATE446159T1 (en) * 2005-05-31 2009-11-15 Trumpf Werkzeugmaschinen Gmbh LASER PROCESSING MACHINE WITH LASER PROCESSING NOZZLE ADJUSTMENT FOR ALIGNING THE LASER BEAM WITH THE LASER PROCESSING NOZZLE HOLE
DE102009042529A1 (en) * 2009-09-22 2011-05-26 Precitec Kg A laser processing head with a focus position adjustment unit and a system and method for adjusting a focus position of a laser beam

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4427873A (en) * 1982-03-18 1984-01-24 Amada Engineering & Service Co. Method and apparatus for aligning axes of assisting gas nozzles with laser beam axes in laser processing machines
JPS5933092A (en) * 1982-08-17 1984-02-22 Mitsubishi Electric Corp Optical guide for laser
FR2541468B1 (en) * 1983-02-17 1986-07-11 Commissariat Energie Atomique DEVICE FOR ALIGNING A LASER BEAM THROUGH OPTICAL SIGHTING MEANS, METHOD FOR LOCATING THE LASER BEAM EMISSION AXIS AND METHOD FOR IMPLEMENTING THE DEVICE, FOR CONTROLLING ALIGNMENT
JPS60221187A (en) 1984-04-18 1985-11-05 Mitsubishi Electric Corp Axial aligning device of laser beam and nozzle
JPH1015681A (en) 1996-07-05 1998-01-20 Hitachi Seiko Ltd Device for adjusting condensing position of laser beam
JP3761657B2 (en) * 1997-03-10 2006-03-29 株式会社アマダ Laser processing method and apparatus
CA2343722A1 (en) * 1998-09-09 2000-09-21 Gerald F. Hermann Robotically operated laser head

Also Published As

Publication number Publication date
SE0200146D0 (en) 2002-01-21
EP1467832A1 (en) 2004-10-20
ATE506139T1 (en) 2011-05-15
WO2003061895A1 (en) 2003-07-31
EP1467832B1 (en) 2011-04-20
DE60336796D1 (en) 2011-06-01
SE524066C2 (en) 2004-06-22

Similar Documents

Publication Publication Date Title
ATE400388T1 (en) COMBINED DEVICE FOR MATERIAL PROCESSING WITH A CUTTER AND A LASER
ATE512751T1 (en) LASER PROCESSING PROCESS
MY157824A (en) Laser beam machining method, laser beam machining apparatus, and laser beam machined product
ATE369935T1 (en) DEVICE FOR GENERATING A ROTATING LASER BEAM
DE50206621D1 (en) Tool head for laser material processing
WO2006050043A3 (en) Method and apparatus for laser welding
FR2817782B1 (en) LASER CUTTING PROCESS AND INSTALLATION WITH DOUBLE-FLOW CUTTING HEAD AND DOUBLE FIREPLACE
SE0200146D0 (en) Device for centering the laser beam in a laser processing system
MXPA01013068A (en) Laser welding method and apparatus.
DE60305183D1 (en) SYSTEM AND METHOD FOR MACHINING OBJECTS BY MEANS OF A LASER
EP1199127A3 (en) Underwater laser processing apparatus and underwater laser processing method
DE60325002D1 (en) Method and apparatus for controlling transmission power density in a free-space optical transmission system
ATE146390T1 (en) DEVICE FOR PROTECTIVE GAS COVERAGE WHEN WELDING DRILLS
WO2019068823A3 (en) Apparatus for machining a workpiece with a laser beam
JP6150612B2 (en) Optical fiber transmission type laser processing apparatus, laser emitting unit, and optical fiber attaching / detaching method
ATE269184T1 (en) LASER DEVICE FOR USE IN MATERIAL PROCESSING
SE0101562D0 (en) Apparatus for cooling a workpiece
DE50306488D1 (en) Method and apparatus for laser cutting
FI930006A0 (en) ANORDINATION OF FOERFARANDE FOER AVSKAERNING AV ETT ROER VID DESS INNEROMKRETS
Hennigs et al. Multifunctional hand-held laser processing device
KR970003860A (en) Wafer cutting device using laser beam
Kellock YAG vs. CO sub 2 Power Struggle
Klykova et al. The fiber-optical system application experience for radiation transportation at robotized laser processing
ATE324607T1 (en) LENS AND MICROSCOPE
KR20040098259A (en) A pollution level detecting device of protecting glass device in optic head for laser system