SE0103121D0 - Cooling of optical modules - Google Patents

Cooling of optical modules

Info

Publication number
SE0103121D0
SE0103121D0 SE0103121A SE0103121A SE0103121D0 SE 0103121 D0 SE0103121 D0 SE 0103121D0 SE 0103121 A SE0103121 A SE 0103121A SE 0103121 A SE0103121 A SE 0103121A SE 0103121 D0 SE0103121 D0 SE 0103121D0
Authority
SE
Sweden
Prior art keywords
cooling
laser unit
unit
cools
operates
Prior art date
Application number
SE0103121A
Other languages
Swedish (sv)
Inventor
Krister Froejdh
Original Assignee
Optillion Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optillion Ab filed Critical Optillion Ab
Priority to SE0103121A priority Critical patent/SE0103121D0/en
Publication of SE0103121D0 publication Critical patent/SE0103121D0/en
Priority to PCT/SE2002/001703 priority patent/WO2003026084A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
    • H01S5/02446—Cooling being separate from the laser chip cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

This invention relates to an arrangement for efficient cooling of an optical transmitter module (200). This is achieved by separating the cooling of the laser unit (220) from the cooling of the driver unit (210). According to a first embodiment of the invention, two separate heat sinks (271, 272) which are thermally insulated from each other are used. At least one first heat sink (271) cools the driver unit (210) and operates at a rather high temperature, and at least one second heat sink (272) cools the laser unit (220) and operates at a much lower temperature. In a second embodiment of the invention, the driver unit and the laser unit are mounted on the same carrier, the laser unit being separated from the carrier by at least one thermal insulator.
SE0103121A 2001-09-19 2001-09-19 Cooling of optical modules SE0103121D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0103121A SE0103121D0 (en) 2001-09-19 2001-09-19 Cooling of optical modules
PCT/SE2002/001703 WO2003026084A1 (en) 2001-09-19 2002-09-19 Cooling of optical transmitter modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0103121A SE0103121D0 (en) 2001-09-19 2001-09-19 Cooling of optical modules

Publications (1)

Publication Number Publication Date
SE0103121D0 true SE0103121D0 (en) 2001-09-19

Family

ID=20285379

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0103121A SE0103121D0 (en) 2001-09-19 2001-09-19 Cooling of optical modules

Country Status (2)

Country Link
SE (1) SE0103121D0 (en)
WO (1) WO2003026084A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2405993A (en) 2003-09-11 2005-03-16 Agilent Technologies Inc An arrangement for dissipating heat in an electro-optical system
CN102185246B (en) * 2011-03-29 2015-06-03 华南理工大学 Single-frequency optical fiber laser resonant cavity
KR101757749B1 (en) 2013-07-03 2017-07-14 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 Heat isolation structures for high bandwidth interconnects
JP6156311B2 (en) * 2014-09-29 2017-07-05 ブラザー工業株式会社 Laser module, laser oscillator and laser processing apparatus
CN104795378B (en) * 2015-03-23 2018-05-08 广东美的制冷设备有限公司 Intelligent power module and its manufacture method
US9883612B2 (en) 2015-06-02 2018-01-30 International Business Machines Corporation Heat sink attachment on existing heat sinks
JP6880777B2 (en) * 2017-01-27 2021-06-02 富士通株式会社 Optical module
CN110178065A (en) * 2019-04-11 2019-08-27 深圳市亚派光电器件有限公司 Light emission component and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992014342A1 (en) * 1991-01-31 1992-08-20 Hitwell Video, Inc. Method and apparatus for viewing a bore hole
JP2763980B2 (en) * 1992-01-14 1998-06-11 富士通株式会社 Optical semiconductor module
JPH10190141A (en) * 1996-12-20 1998-07-21 Fujitsu Ltd Optical semiconductor module
JP3180701B2 (en) * 1997-02-07 2001-06-25 日本電気株式会社 Semiconductor laser device
US6155724A (en) * 1997-03-04 2000-12-05 Hamamatsu Photonics Kk Light transmitting module for optical communication and light transmitting unit thereof
US6072814A (en) * 1997-05-30 2000-06-06 Videojet Systems International, Inc Laser diode module with integral cooling
US5913108A (en) * 1998-04-30 1999-06-15 Cutting Edge Optronics, Inc. Laser diode packaging

Also Published As

Publication number Publication date
WO2003026084A1 (en) 2003-03-27

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