SE0003050D0 - composite - Google Patents
compositeInfo
- Publication number
- SE0003050D0 SE0003050D0 SE0003050A SE0003050A SE0003050D0 SE 0003050 D0 SE0003050 D0 SE 0003050D0 SE 0003050 A SE0003050 A SE 0003050A SE 0003050 A SE0003050 A SE 0003050A SE 0003050 D0 SE0003050 D0 SE 0003050D0
- Authority
- SE
- Sweden
- Prior art keywords
- composite
- gel
- encapsulated
- capsule
- mechanical strength
- Prior art date
Links
Abstract
An electronic device comprising at least one semiconductor device (11) encapsulated in a capsule comprising a composite that contains gel and a more rigid elastomer, where said gel (14) is situated nearest to said at least one semiconductor component. The composite has good temperature resistance, is chemically stable, has high dielectric and mechanical strength.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0003050A SE0003050D0 (en) | 2000-08-30 | 2000-08-30 | composite |
PCT/SE2001/001841 WO2002019423A1 (en) | 2000-08-30 | 2001-08-30 | Composite |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0003050A SE0003050D0 (en) | 2000-08-30 | 2000-08-30 | composite |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0003050D0 true SE0003050D0 (en) | 2000-08-30 |
Family
ID=20280821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0003050A SE0003050D0 (en) | 2000-08-30 | 2000-08-30 | composite |
Country Status (2)
Country | Link |
---|---|
SE (1) | SE0003050D0 (en) |
WO (1) | WO2002019423A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10243513A1 (en) * | 2002-09-19 | 2004-04-01 | Robert Bosch Gmbh | Electrical and / or micromechanical component and method |
JP4735446B2 (en) * | 2006-07-04 | 2011-07-27 | 三菱電機株式会社 | Semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2712618B2 (en) * | 1989-09-08 | 1998-02-16 | 三菱電機株式会社 | Resin-sealed semiconductor device |
US5165956A (en) * | 1991-09-27 | 1992-11-24 | At&T Bell Laboratories | Method of encapsulating an electronic device with a silicone encapsulant |
JP3436435B2 (en) * | 1995-02-22 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | Method of curing ultraviolet-curable silicone composition |
JP3353526B2 (en) * | 1995-03-23 | 2002-12-03 | 株式会社デンソー | Semiconductor package and manufacturing method thereof |
US6020409A (en) * | 1997-09-19 | 2000-02-01 | Dow Corning Corporation | Routes to dielectric gel for protection of electronic modules |
GB9815080D0 (en) * | 1998-07-10 | 1998-09-09 | Dow Corning Sa | Compressible silicone composition |
-
2000
- 2000-08-30 SE SE0003050A patent/SE0003050D0/en unknown
-
2001
- 2001-08-30 WO PCT/SE2001/001841 patent/WO2002019423A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2002019423A1 (en) | 2002-03-07 |
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