SE0003050D0 - composite - Google Patents

composite

Info

Publication number
SE0003050D0
SE0003050D0 SE0003050A SE0003050A SE0003050D0 SE 0003050 D0 SE0003050 D0 SE 0003050D0 SE 0003050 A SE0003050 A SE 0003050A SE 0003050 A SE0003050 A SE 0003050A SE 0003050 D0 SE0003050 D0 SE 0003050D0
Authority
SE
Sweden
Prior art keywords
composite
gel
encapsulated
capsule
mechanical strength
Prior art date
Application number
SE0003050A
Other languages
Swedish (sv)
Inventor
Peter Isberg
Anna-Liisa Loenn
Original Assignee
Abb Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Ab filed Critical Abb Ab
Priority to SE0003050A priority Critical patent/SE0003050D0/en
Publication of SE0003050D0 publication Critical patent/SE0003050D0/en
Priority to PCT/SE2001/001841 priority patent/WO2002019423A1/en

Links

Abstract

An electronic device comprising at least one semiconductor device (11) encapsulated in a capsule comprising a composite that contains gel and a more rigid elastomer, where said gel (14) is situated nearest to said at least one semiconductor component. The composite has good temperature resistance, is chemically stable, has high dielectric and mechanical strength.
SE0003050A 2000-08-30 2000-08-30 composite SE0003050D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0003050A SE0003050D0 (en) 2000-08-30 2000-08-30 composite
PCT/SE2001/001841 WO2002019423A1 (en) 2000-08-30 2001-08-30 Composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0003050A SE0003050D0 (en) 2000-08-30 2000-08-30 composite

Publications (1)

Publication Number Publication Date
SE0003050D0 true SE0003050D0 (en) 2000-08-30

Family

ID=20280821

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0003050A SE0003050D0 (en) 2000-08-30 2000-08-30 composite

Country Status (2)

Country Link
SE (1) SE0003050D0 (en)
WO (1) WO2002019423A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10243513A1 (en) * 2002-09-19 2004-04-01 Robert Bosch Gmbh Electrical and / or micromechanical component and method
JP4735446B2 (en) * 2006-07-04 2011-07-27 三菱電機株式会社 Semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2712618B2 (en) * 1989-09-08 1998-02-16 三菱電機株式会社 Resin-sealed semiconductor device
US5165956A (en) * 1991-09-27 1992-11-24 At&T Bell Laboratories Method of encapsulating an electronic device with a silicone encapsulant
JP3436435B2 (en) * 1995-02-22 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 Method of curing ultraviolet-curable silicone composition
JP3353526B2 (en) * 1995-03-23 2002-12-03 株式会社デンソー Semiconductor package and manufacturing method thereof
US6020409A (en) * 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
GB9815080D0 (en) * 1998-07-10 1998-09-09 Dow Corning Sa Compressible silicone composition

Also Published As

Publication number Publication date
WO2002019423A1 (en) 2002-03-07

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