RU2795111C2 - Folding device - Google Patents

Abstract

FIELD: computer engineering.

SUBSTANCE: effect of the invention is achieved due to: a body that folds relative to the folding axis and includes the first part of the body and the second part of the body; a hinge structure connected to the first body part and the second body part; flexible display; a number of magnets; battery placed in the first part of the body; a first PCB located between the battery and the second side wall, and a second PCB located between the battery and the third side wall; a wireless communication circuit located on the first PCB; and a first electrical path and a second electrical path located in the first housing part and electrically connected to the wireless communication circuit and the second printed circuit board, wherein part of the first electrical path and part of the second electrical path are located between the first magnet and the battery, while part of the first electrical path is laid on a part of the second electrical path in the space between the first magnet and the battery.

EFFECT: technical result consists in the possibility of placing electronic components in the limited internal space of the case of a foldable portable communication device.

9 cl, 17 dwg

Description

The technical field to which the invention belongs

[1] The disclosure relates to a folding device.

State of the art

[2] With the development of electronic communication technologies, electronic devices have appeared that perform various functions. These electronic devices can typically perform one or more functions.

[3] Since the functional differences between electronic devices of manufacturing companies have been markedly reduced in recent years, electronic devices are being strengthened in terms of design and gradually becoming thinner to meet the desires of consumers.

[4] The above information is provided as a reference only to assist in understanding the disclosure. No claim has been made or made as to whether any of the above can be applied as prior art in relation to disclosure.

The essence of the invention

Solution

[5] Such an electronic device may be foldable with a flexible display. The foldable type electronic device can be positioned in the folded state by overlapping at least two of the housings. The cases may be thin so that the electronic device may be thin when folded. Reducing the thickness of each case reduces interior space, which can make it difficult to place components in the case. The electronic device may include magnets for holding the folded state against the elastic force of the flexible display. The magnet takes up part of the interior space of the case, which can make it difficult to place other components. For example, if the interior space of the case is reduced, the electrical path (for example, transmission line) associated with the antenna device, or the electrical paths associated with various other components other than the antenna device, cannot be easily located in the small interior space in the case, while avoiding electrical interference from peripheral components.

[6] Aspects of the disclosure are to address at least the above problems and/or disadvantages and provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide an electronic device that includes magnets for efficiently accommodating components within the limited interior space of each case.

[7] Additional aspects of the embodiments are set forth in part in the description which follows, and in part are obvious from the description or may be recognized through practice of the presented embodiments.

[8] In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a collapsible housing configured to include a hinge structure, a first housing structure that has a first surface that is connected to the hinge structure and is directed in a first direction, a second surface that is directed in a second direction opposite the first direction , and a first side member that at least partially surrounds the space between the first surface and the second surface, and a second body structure that has a third surface that is connected to the hinge structure and is directed in a third direction, a fourth surface that is directed in a fourth direction opposite to the third direction, a second side element that at least partially surrounds the space between the third surface and the fourth surface and which is folded around the hinge structure onto the first body structure, the first side element provides a first side surface and a second side surface that are directed opposite to each other and a third side surface that is orthogonal to the first side surface and located separately from the hinge structure, the second side element provides a fourth side surface that is directed in the same direction as the first side surface, a fifth side surface that is directed in that the same direction as the second side surface, and a sixth side surface which is directed in the same direction as the third side surface in the folded state, and the first surface faces the third surface in the folded state, and the third direction is the same as the first direction in the unfolded state, a flexible display configured to extend from a first surface to a third surface, a first magnet positioned around a third side surface in a first housing structure, a second magnet having a polarity different from that of the first magnet and positioned around a sixth side surface in a second of the housing structure so as to face the first magnet in the folded state, and at least one electrical path disposed in a recess formed in the first magnet.

[9] According to various embodiments of the invention, the electrical path for the antenna device or various other assemblies can improve spatial efficiency and be located in the limited interior space of the housing along with the magnet.

[10] In addition, the effects that can be obtained or predicted due to various embodiments of the disclosure will be explicitly or implicitly disclosed in the detailed description of the embodiments of the disclosure. For example, various effects predicted according to various embodiments of the disclosure will be disclosed in the detailed description which will be described below.

[11] Other aspects, advantages, and features of the invention will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the accompanying drawings, discloses various embodiments of the invention.

Brief description of the drawings

[12] The foregoing and other exemplary aspects, features, and advantages of specific embodiments of the disclosure should become more apparent from the description below, taken in conjunction with the accompanying drawings, in which:

[13] FIG. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the disclosure;

[14] FIG. 2 is a view illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure;

[15] FIG. 3 is a view illustrating a collapsed state of an electronic device according to an embodiment of the disclosure;

[16] FIG. 4 is an exploded perspective view of the electronic device shown in FIG. 2 or 3, according to an embodiment of the invention;

[17] FIG. 5A is a sectional view illustrating an unfolded state of an electronic device according to an embodiment of the disclosure;

[18] FIG. 5B is a sectional view illustrating a collapsed state of an electronic device according to an embodiment of the present disclosure;

[19] FIG. 6 illustrates an electronic device in an unfolded state according to an embodiment of the disclosure;

[20] FIG. 7 illustrates an electronic device in an unfolded state according to an embodiment of the disclosure;

[21] FIG. 8A illustrates a portion of an electronic device according to an embodiment of the disclosure;

[22] FIG. 8B is a sectional view along line A-A of the electronic device shown in FIG. 8A according to an embodiment of the invention;

[23] FIG. 9A is a sectional view of various first magnets according to an embodiment of the invention;

[24] FIG. 9B is a sectional view of various first magnets according to an embodiment of the invention;

[25] FIG. 9C is a sectional view of various first magnets according to an embodiment of the invention;

[26] FIG. 9D is a sectional view of various first magnets according to an embodiment of the invention;

[27] FIG. 9E is a sectional view of various first magnets according to an embodiment of the invention;

[28] FIG. 10A illustrates an electronic device according to an embodiment of the disclosure; And

[29] FIG. 10B is a sectional view along the line D-D of the first magnet and electrical path of the electronic device shown in FIG. 10A according to an embodiment of the disclosure.

[30] It should be noted that throughout the drawings, like reference numerals are used to illustrate identical or similar elements, features, and structures.

Optimal Mode for Carrying Out the Invention

[31] The following description with reference to the accompanying drawings is provided to assist in a full understanding of the various embodiments of the disclosure as defined by the claims and their equivalents. It includes various details to assist in this understanding, but they are to be regarded as merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the spirit and scope of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and brevity.

[32] The terms and words used in the following description and in the claims are not limited to bibliographical meanings, but are used by the inventor simply to provide a clear and consistent understanding of the disclosure. Accordingly, those skilled in the art will appreciate that the following description of various embodiments of the disclosure is provided for purposes of illustration only, and not for purposes of limiting the disclosure as defined by the appended claims and their equivalents.

[33] It should be understood that the singular forms "a", "an" and "the" include multiple entities, unless the context clearly dictates otherwise. Thus, for example, a reference to a "component surface" includes a reference to one or more such surfaces.

[34] FIG. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the disclosure.

[35] Referring to FIG. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short range wireless communication network) or an electronic device 104 or a server 108 via a second network 199 (e.g., a long range wireless communication network). . According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via a server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a module 176 sensors, interface 177, tactile module 179, camera module 180, power control module 188, battery 189, communication module 190, subscriber identity module (SIM) 196, or antenna module 197. In some embodiments, at least one (for example, , display device 160, or camera module 180) of components may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, a sensor module 176 (eg, a fingerprint sensor, an iris sensor, or a light sensor) may be implemented as built into the display device 160 (eg, a display).

[36] Processor 120 may execute, for example, software (eg, program 140) to control at least one other component (eg, hardware or software component) of electronic device 101 associated with processor 120, and may perform various processing or data calculations. According to one embodiment, as at least part of processing or computing data, processor 120 may load an instruction or data received from another component (eg, sensor module 176 or communication module 190) into volatile memory 132, process the instruction or data, stored in volatile memory 132 and store received data in non-volatile memory 134. In an embodiment, processor 120 may include a main processor 121 (eg, a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (eg, a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP)), which operates independently of or in conjunction with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121 or be specific to a particular function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

[37] The auxiliary processor 123 may manage at least some functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 instead of the main processor 121 when the main processor 121 is in an inactive (eg, sleeping) state, or together with the main processor 121 when the main processor 121 is in an awake state (eg, while executing an application). According to an embodiment, auxiliary processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) operatively coupled to auxiliary processor 123.

[38] Memory 130 may store various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101. Various data may include, for example, software (e.g., program 140) and the input or output for the command associated with them. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[39] Program 140 may be stored in memory 130 as software and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[40] The input device 150 may receive a command or data to be used by another component (eg, processor 120) of the electronic device 101, from outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse , keyboard, or digital pen (such as a stylus).

[41] The audio output device 155 may output audio signals outside the electronic device 101. The audio output device 155 may include, for example, a speaker or a receiver. The loudspeaker can be used for general purposes such as media playback or recording playback, while the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from or as part of the speaker.

[42] The display device 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display device 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the associated display, hologram device, and projector. According to an embodiment, the display device 160 may include a touch detection circuit adapted to detect a touch, or a sensor circuit (eg, a pressure sensor) adapted to measure the intensity of a force generated by a touch.

[43] The audio module 170 can convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may receive sound through an input device 150 or output sound through an audio output device 155 or headphones of an external electronic device (e.g., electronic device 102), directly (e.g., wired) or wirelessly connected to electronic device 101.

[44] The sensor module 176 may detect an operating state (eg, power or temperature) of the electronic device 101 or an environmental state (eg, user state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor , humidity sensor or light sensor.

[45] Interface 177 may support one or more of the specified protocols to be used for electronic device 101 to communicate with an external electronic device (eg, electronic device 102) either directly (eg, via a wired network) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[46] The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, electronic device 102). According to an embodiment, connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

[47] The tactile module 179 can convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that can be recognized by the user through their tactile sensation or kinesthetic sensation. In an embodiment, the tactile module 179 may include, for example, an electric motor, a piezoelectric assembly, or an electrical stimulator.

[48] The camera module 180 may capture a still image or moving images. According to an embodiment, camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[49] Power control module 188 may control the power supplied to electronic device 101. According to one embodiment, power control module 188 may be implemented at least as part of, for example, a power control integrated circuit (PMIC).

[50] The battery 189 may supply power to at least one component of the electronic device 101. In an embodiment, the battery 189 may include, for example, a primary cell that is not rechargeable, a secondary cell that is rechargeable, or a fuel cell. .

[51] The communication module 190 may support establishing a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108) and communicating over the established communication channel . Communication module 190 may include one or more communication processors that operate independently of processor 120 (eg, an application processor (AP)) and support direct (eg, wired) communication or wireless communication. According to an embodiment, communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network communication module ( LAN) or power line communication (PLC) module). A respective one of these communication modules may communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wireless Direct Connection (Wi-Fi), or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long distance network such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These different types of communication modules may be implemented as a single component (e.g., a single chip) or may be implemented as multiple components (e.g., multiple chips) separate from each other.The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as a first network 198 or a second network 199, using subscriber information (e.g., international identifier mobile subscriber (IMSI)) stored in the subscriber identification module 196 .

[52] Antenna module 197 may transmit or receive a signal or power to or from (e.g., an external electronic device) electronic device 101. According to an embodiment, antenna module 197 may include an antenna including a radiating assembly composed of a conductive material or a conductive pattern formed within or on a substrate (eg, a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include a plurality of antennas. In such a case, at least one antenna suitable for the communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., wireless communication module 192) from a plurality antennas. The signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating node may be further formed as part of the antenna module 197.

[53] At least some of the above-described components can interconnect and exchange signals (e.g., commands or data) with each other using a communication scheme between peripheral devices (e.g., bus, general purpose input/output interface (GPIO), serial peripheral interface (SPI) or Mobile Industrial Processor Interface (MIPI)).

[54] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 associated with the second network 199. Each of the electronic devices 102 and 104 may be a device of the same type as the electronic device 101 or other type. According to an embodiment, all or some of the operations to be performed on the electronic device 101 may be performed on one or more external electronic devices 102, 104, or 108. For example, if the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101, instead of or in addition to performing a function or service, may request one or more external electronic devices to perform at least part of the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the function or service requested, or an additional function or additional service related to the request, and communicate the result of the execution to the electronic device 101. The electronic device 101 may provide the result with further with or without processing the result, at least as part of the response to the request. For this purpose, for example, cloud computing, distributed computing or client-server computing technology can be used.

[55] An electronic device according to various embodiments may be one of various types of electronic devices. Electronic devices may include, for example, a portable communications device (eg, smartphone), a computing device, a portable multimedia device, a portable medical device, a camera, a wearable device, or home appliances. According to an embodiment of the invention, the electronic devices are not limited to those described above.

[56] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments, and include various modifications, equivalents, or replacements for the respective embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to like or related elements. It should be understood that the singular form of the noun corresponding to the clause may include one or more elements, unless the relevant context clearly indicates otherwise. As used herein, each of phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B, and C" and "at least one of A, B, or C" may include all possible combinations of the items listed together in the respective one of the phrases. In this context, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the respective component from another and do not limit the components in another aspect (e.g., in importance or order) . It should be understood that if a node (e.g., the first node) is referred to with or without the term "operatively" or "communicatively" as "associated with", "associated with", "connected to", or "connected to" another node (for example, to the second node), this means that the node can be connected to another node directly (for example, by wire), wirelessly, or through a third node.

[57] As used herein, the term "module" may include a module implemented in hardware, software, or firmware, and may be used interchangeably with other terms, such as "logic", "logic block", "part" or " scheme". A module may be a single subcomponent or a minimal unit or part of it adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented as an application specific integrated circuit (ASIC).

[58] The various embodiments set forth herein may be implemented as software (eg, program 140) including one or more instructions that are stored on a storage medium (eg, internal memory 136 or external memory 138), which can be read by a machine (for example, the electronic device 101). For example, a processor (eg, processor 120) of a machine (eg, electronic device 101) may call at least one of one or more instructions stored on a storage medium and execute it with or without the use of one or more other components under processor control. This allows the machine to perform at least one function in accordance with at least one instruction called. One or more instructions may include code generated by a compiler or code executed by an interpreter. The computer-readable storage medium may be provided in the form of a non-volatile storage medium. The term "non-volatile" simply means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between where the data is stored in a semi-permanent manner on the storage medium and where the data is temporarily stored. on the data carrier.

[59] According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. A computer program product may be sold as a product between a seller and a buyer. A computer program product may be distributed in the form of a computer-readable storage medium (eg, compact disc read only memory (CD-ROM)) or distributed (eg, downloaded or uploaded) over the Internet via an application store (eg, PlayStore™) or between two user accounts. devices (such as smartphones) directly. When distributed over a network, at least a portion of the computer program product may be temporarily generated or at least temporarily stored on a computer-readable storage medium, such as the memory of a manufacturer's server, an application store server, or a relay server.

[60] According to various embodiments, each component (eg, module or program) of the components described above may include one or more objects. In various embodiments, one or more of the components described above may be omitted, or one or more other components may be added. Alternatively, or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more of the functions of each of the plurality of components in the same or similar manner as they were performed by the corresponding one of the plurality of components prior to integration. In various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, multiple times, or heuristically, or one or more operations may be performed in a different order or omitted, or other operations may be added.

[61] FIG. 2 is a view illustrating a flat or unfolded state of an electronic device according to an embodiment of the invention.

[62] FIG. 3 is a view illustrating the collapsed state of an electronic device according to an embodiment of the invention.

[63] Referring to FIG. 2 and 3, in one embodiment, the electronic device 20 (e.g., the electronic device 101 of FIG. 1) may include a collapsible housing 200, a hinged lid 230 that covers a collapsible portion of the collapsible housing 200, and a flexible or collapsible display 300 (hereinafter abbreviated display 300) (e.g., display 160 in FIG. 1), which is located within the space defined by the folding case 200. According to one embodiment, the folding case 200 may include a front surface 200a, to which the display 300 is opened, a back surface 200b, which is directed towards the side opposite the front surface 200a, and side surfaces 200c and 200d which surround the space between the front surface 200a and the rear surface 200b.

[64] According to one embodiment, the collapsible body 200 may include a first body structure 210 and a second body structure 220 that are connected by a hinge structure (not shown). For example, the first body structure 210 may be rotatably coupled to the second body structure 220 via a hinge structure.

[65] According to one embodiment, the first hull structure 210 may include a first surface 2001 that is directed in the first direction 201, a second surface 2002 that is directed in the second direction 202 opposite the first direction 201, and a first side surface 200c that, at least partially surrounds the space between the first surface 2001 and the second surface 2002. The second hull structure 220 may include a third surface 2003 that is directed in a third direction 203, a fourth surface 2004 that is directed in a fourth direction 204 opposite the third surface 2003 , and a second side surface 200d that at least partially surrounds the space between the third surface 2003 and the fourth surface 2004. The front surface 200a of the electronic device 20 may include the first surface 2001 and the third surface 2003, and the rear surface 200b of the electronic device 20 may include a second surface 2002 and a fourth surface 2004. In various embodiments (not shown), the first body structure 210 may refer to a structure in which some of the first surface 2001, the second surface 2002, and the first side surface 200c are formed. In various embodiments (not shown), the second hull structure 220 may refer to a structure in which some of the third surface 2003, the fourth surface 2004, and the second side surface 200d are formed.

[66] According to one embodiment, the collapsible body 200 may include a transparent plate (not shown) (e.g., a resin plate including various coating layers) from which the first surface 2001 and the third surface 2003 are formed. The display 300 may be positioned along the transparent plate and exposed through the first surface 2001 and the third surface 2003. The transparent plate may have the flexibility to enable the folded state of the electronic device 20. According to one embodiment, the display 300 may be implemented to include a transparent plate, and the transparent plate may be excluded from the folding housing 200.

[67] According to one embodiment, the first body structure 210 may include a first back cover 280 that is located on one side of the folding axis A and forms at least a portion of the second surface 2002. For example, the first back cover 280 may be substantially a rectangular outer border 281, and the outer border 281 may be surrounded by the first side element 211. According to various embodiments, the first side element 211 and the first back cover 280 may be integrally formed and may include the same material.

[68] According to one embodiment, the second body structure 220 may include a second back cover 290 that is located on the other side of the folding axis A and forms at least a portion of the fourth surface 2004. For example, the second back cover 290 may have a substantially a rectangular outer border 291, and the outer border 291 may be surrounded by a second side member 221. In various embodiments, the second side member 221 and the second back cover 290 may be integrally formed and may include the same material.

[69] According to various embodiments, the first back cover 280 and/or the second back cover 290 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium) or combinations of at least two materials.

[70] According to one embodiment, the first back cover 280 and the second back cover 290 may be substantially symmetrical in shape about the folding axis A. The first back cover 280 and the second back cover 290 are not necessarily symmetrical in shape to each other. In another embodiment, the first back cover 280 and/or the second back cover 290 may be provided in various different shapes.

[71] In one embodiment, first hull structure 210 may include a first side member (or first side bezel structure) 211 that defines first side surface 200c, and second hull structure 220 may include a second side member (or second side bezel structure) 221 which forms the second side surface 200d. The first side member 211 and/or the second side member 221 may include a metal or polymer.

[72] According to various embodiments, the first side member 211 and the second side member 221 may extend to form a peripheral region of the front surface 200a. For example, the front surface 200a of the electronic device 20 may be formed by the display 300 and partial areas of the first and second side members 211 and 221 that are adjacent to the display 300.

[73] According to various embodiments, a partial region (not shown) of the first side member 211 that is adjacent to the outer boundary 281 of the first back cover 280, and/or a partial area (not shown) of the second side member 221 that is adjacent to the outer boundary 291 the second back cover 290 may form part of the back surface 200b. For example, the back surface 200b of the electronic device 20 may be formed by a first back cover 280, a partial area of the first side member 211 that abuts the first back cover 280, a second back cover 290, and a partial area of the second side piece 221 that abuts the second back cover 290 ).

[74] According to one embodiment, the first side member 211 and the second side member 221 may be positioned on both sides of the folding axis A and may be symmetrical in shape with respect to the folding axis A as a whole.

[75] According to one embodiment, the first cabinet structure 210 may further include a component arrangement area 214 that extends from the first side member 211 or connects to the first side member 211 and forms the first surface 2001 together with the display 300. The first side member area 211 , other than the component layout area 214, may be symmetrical in shape to the second side member 221. At least one portion effectively using the first surface 2001 may be located in the component layout area 214. According to one embodiment, the component arrangement area 214 may be formed to have an area set adjacent to one corner of the first side member 211. According to various embodiments, the layout, shape, and size of the component arrangement area 214 is not limited to the illustrated example. For example, in another embodiment, the component arrangement area 214 may be included in another corner of the first side member 211, or in an arbitrary area between the upper and lower end corners of the first side member 211. Components for performing various functions installed in the electronic device 20 may be disclosed to the first surface 2001 through the component layout area 214 or through one or more holes (not shown) provided in the component layout area 214 . In one embodiment, the component 246 located in the component arrangement area 214 may include at least one of various sensors such as a proximity sensor, a front camera, a light emitting assembly, or a receiver. For example, the light emitting node may provide status information of the electronic device 20 in the form of light. In another embodiment, the light emitting node may provide, for example, a light source that is associated with the operation of the front camera. The light emitting assembly may include, for example, an LED, an IR LED, and a xenon lamp.

[76] According to one embodiment, electronic device 20 may include at least one of audio modules 241 and 242, button input devices 243, or connector holes 244.

[77] According to one embodiment, the audio modules 241 and 242 may include a microphone hole 241 or a speaker hole 242. A microphone for receiving external sounds may be located in the microphone hole 241 . In any embodiment, a plurality of microphones may be positioned in the microphone hole 241 to be able to sense the direction of sounds. The speaker hole 242 may include an external speaker hole or a communication receiver hole. In either embodiment, speaker hole 242 and microphone hole 241 may be formed as a single hole, or a speaker (eg, a piezo speaker) may be included in the design without speaker hole 242.

[78] According to one embodiment, the key input devices 243 may be located on the side surfaces 200c and 200d of the folding case 200. In another embodiment, the electronic device 20 may not include some or all of the above key input devices 243, and the keypad 243 inputs that are not included may be implemented on the display 300 in another form, such as soft buttons. In any embodiment, the key input device may include a sensor module (e.g., one or more components 245 located in the first back region 282) that is located on the second surface 2002 of the first housing structure 210.

[79] According to one embodiment, connector hole 244 may include a first connector hole that can accommodate a connector (e.g., a USB connector) for transmitting/receiving power and/or data to/from an external electronic device, and/or a second connector hole. for a jack (such as a headphone jack) that may contain a jack for transmitting/receiving audio to/from an external electronic device. The positions or number of connector holes are not limited to the example shown in FIG. 3 and are subject to change.

[80] In another example (not shown), at least one of an audio module (for example, a receiver for communication), a sensor module (for example, a proximity or fingerprint sensor), a camera module (for example, a front camera), or a light emitting node may be included on the rear side of the display area of the display screen 300. In another example (not shown), the display 300 may be connected to or located adjacent to the touch sensor circuitry, a pressure sensor capable of measuring touch intensity (pressure), and/or a digitizer that detects stylus based on magnetic field.

[81] In one embodiment, the first cabinet structure 210 and the second cabinet structure 220 may form a recess, which is a space in which the display 300 is positioned together. In the illustrated embodiment, due to the component arrangement area 214, the recess may have two or more widths that differ from each other in a direction perpendicular to the folding axis A.

[82] For example, the recess may include a first width w1 between the first portion 221a of the second side member 221, which is parallel to the folding axis A, and the first portion 211a of the first side member 211, which is formed on the outer boundary of the component arrangement area 214. The recess may have a second width w2 between the second fragment 221b of the second side element 221 and the second fragment 211b of the first side element 211, which does not correspond to the component arrangement area 214 and is parallel to the folding axis A. The second width w2 may be greater than the first width w1. According to one embodiment, the first fragment 211a of the first hull structure 210 and the first fragment 221a of the second hull structure 220, both of which are asymmetrical in shape to each other, can form the first recess width w1, and the second fragment 211b of the first hull structure 210 and the second fragment 221b of the second hull structures 220, both of which are symmetrical in shape to each other, may form a second recess width w2. According to one embodiment, the first and second fragments 221a and 221b of the second body structure 220 may differ from each other in distance from the folding axis A. The width of the recess is not limited to the illustrated example. In various embodiments, the recess may have a plurality of widths depending on the shape of the component arrangement area 214 or asymmetric portions of the first and second hull structures 210 and 220.

[83] In accordance with various embodiments, one or more components may be located on the rear surface 200b of the electronic device 20 or may be visually exposed to it. For example, at least a portion of the secondary display 293 may be visually exposed through the second rear region 292 of the second back cover 290. For example, one or more components 245 may be visually disclosed through the first rear region 282 of the first back cover 280. In various embodiments, one or more components 245 may include a sensor (eg, a proximity sensor or a heart rate sensor) and/or a rear camera.

[84] Referring to FIG. 3, a hinged cover 230 may be positioned between the first body structure 210 and the second body structure 220 and may cover an internal component (eg, a hinge structure). According to any embodiment, the hinge structure may be referred to as the assembly that includes the hinge cover 230. In one embodiment, according to the state (e.g., unfolded state or folded state) of the electronic device 20, the hinge cover 230 may be partially closed. the first and second hull structures 210 and 220 or open outwards.

[85] For example, as shown in FIG. 2, in the case where the electronic device 20 is in the unfolded state, the hinge cover 230 may be covered by the first case structure 210 and the second case structure 220 and may not be visible. For example, as shown in FIG. 3, in the case where the electronic device 20 is in a folded state (for example, in a fully folded state), the hinge cover 230 can be opened outwardly between the first case structure 210 and the second case structure 220. For example, in the case where the electronic device 20 is in an intermediate state (e.g., a state between an unfolded state and a collapsed state) in which the first body structure 210 and the second body structure 220 are folded at a predetermined angle, the hinge cover 230 may be partially opened outwardly between the first body structure 210 and the second body structure 220 The area in which the hinge cover 230 is open in the intermediate state may be smaller than the area in which the hinge cover 230 is open in the fully collapsed state. In one embodiment, the hinge cover 230 may include a curved surface, and the curved surface may form one side surface of the electronic device 20 when folded.

[86] According to various embodiments, the display 300 may be a display, at least a partial area of which may be deformed into a flat or curved surface. In one embodiment, as shown in FIG. 2, the display 300 may include a fold area 303, a first area 301 located on one side of the fold area 303 (right side of the fold area 303), and a second area 302 located on the other side of the fold area 303 (left side of the fold area 303) .

[87] According to various embodiments, the division into regions of the display 300 illustrated in FIG. 2 is given as an example, and the display 300 may be divided into a plurality of areas (eg, four or more areas or two areas) according to a structure or function. For example, in the embodiment shown in FIG. 2, the display area 300 may be divided into a folding area 303 extending parallel to the y-axis or the folding-axis A. However, in another embodiment, the display area 300 may be divided based on a different folding area (eg, a folding area parallel to the x-axis) or a different folding axis (eg, a folding axis parallel to the x-axis).

[88] According to one embodiment, the first and second areas 301 and 302 of the display 300 may be symmetrical in shape with respect to the folding area 303 as a whole. According to one embodiment, unlike the first region 301, the second region 302 may include a notch due to the presence of the component arrangement region 214, but may be symmetrical in shape with the first region 301 with respect to the folding region 303 in a region other than the cut notch. . For example, the first region 301 and the second region 302 may include fragments that are symmetrical in shape with respect to the folding region 303 and fragments that are asymmetrical in shape with respect to the folding region 303.

[89] According to one embodiment, the angle and distance formed by the first body structure 210 and the second body structure 220 can be changed in accordance with the unfolded state, the collapsed state, or the intermediate state of the foldable body 200. Next, the operations of the first and second body structures 210 and 220 and display areas 300 according to the state (for example, unfolded state or folded state) of the electronic device 20.

[90] According to one embodiment, in the case where the electronic device 20 is in the unfolded state (for example, see FIG. 2), the first direction 201, in which the first surface 2001 of the first case structure 210 is directed, and the third direction 203, in which the third surface 2003 of the second body structure 220 is directed may be identical. For example, in the unfolded state, the first surface 2001 of the first housing structure 210 and the third surface 2003 of the second housing structure 220 may be positioned to have the same direction (e.g., the direction in which the front surface 200a of the electronic device 20 is directed) at an angle of about 180 degrees. In the state in which the electronic device 20 is in the unfolded state, the surfaces of the first and second regions 301 and 302 of the display 300 may be directed in the same direction (for example, the direction in which the front surface 200a of the electronic device 20 is directed) at an angle of about 180 degrees. The folding area 303 of the display 300 may form the same plane as the first area 301 and the second area 302.

[91] In one embodiment, when the electronic device 20 is in a folded state (eg, see FIG. 3), the first case structure 210 and the second case structure 220 may face each other. For example, in the folded state, the first surface 2001 of the first hull structure 210 and the third surface 2003 of the second hull structure 220 may face each other. When folded, the surfaces of the first and second regions 301 and 302 of the display 300 may face each other at a slight angle (eg, at an angle of about 0 to 10 degrees). In the folded state, at least a portion of the fold region 303 may have a curved surface of a predetermined curvature.

[92] In one embodiment, in the case where the electronic device 20 is in an intermediate state (e.g., in a state between the unfolded state and the folded state), the first case structure 210 and the second case structure 220 may be located at a certain angle. In an intermediate state, the first surface 2001 of the first cabinet structure 210 and the third surface 2003 of the second cabinet structure 220, or the surfaces of the first and second regions 301 and 302 of the display 300, may be formed at an angle that is greater than the folded state and less than the unfolded state. . In the intermediate state, at least a portion of the fold region 303 may have a curved surface of a predetermined curvature, the curvature being less than in the folded state.

[93] According to one embodiment, the first side member 211 may include a plurality of first conductive portions (not shown) that are physically or electrically separated. Each of the first non-conductive members 271 may be positioned between a plurality of first conductive portions. According to one embodiment, the first non-conductive elements 271 may extend from the first non-conductive internal structures (not shown) located within the first hull structure 210. The first internal structures (not shown) may be connected to the first side element 211, and thus a plurality of first conductive parts can be maintained in a physically separated state using the first internal structures. For example, the first internal structures may be injection molded into a mold connected to the first side member 211.

[94] According to one embodiment, the second side member 221 may include a plurality of second conductive portions (not shown) that are separated physically or electrically. Each of the second non-conductive elements 272 may be positioned between a plurality of second conductive portions. According to one embodiment, the second non-conductive members 272 may extend from second non-conductive internal structures (not shown) disposed within the second body structure 220. The second internal structures may be coupled to the second side member 221 and thus a plurality of second conductive portions may be supported in a physically separated state by second internal structures. For example, the second internal structures may be injection molded into a mold connected to the second side member 221.

[95] According to one embodiment, at least one of the plurality of first conductive portions of the first side member 211 can be used as an antenna radiator (or radiator or antenna) that is electrically coupled to a wireless communication circuit (e.g., wireless communication module 192 in Fig. 1) and can transmit or receive a signal having a selected (or given) frequency. For example, at least one of the first conductive portions may be electrically connected to the wireless circuitry and ground and operate as an inverted F antenna (IFA). According to any embodiment, at least one of the plurality of second conductive portions of the second side member 221 may be electrically connected to the wireless communication circuit and used as an antenna radiator.

[96] Referring to FIG. 3, when the electronic device 20 is in a folded state, the second side member 221 and the first side member 211 may be adjacent to each other, and a wireless communication circuit in which at least one of the first conductive parts is used as an antenna radiator may be electrically influenced by the second side member 221. For example, in the folded state, the second side member 221 may degrade the performance (e.g., radiation characteristics of an antenna) of a wireless communication circuit in which at least one of the first conductive parts is used as a radiator antennas. For example, electromagnetic wave energy (or electromagnetic field) radiated from at least one of the first conductive portions, which is used as an antenna radiator, can be blocked by the second side member 221. According to one embodiment, to reduce this electrical influence, the first non-conductive members 271 of the first side member 211 and the second non-conductive members 272 of the second side member 221 may be designed to be substantially aligned with each other when folded.

[97] Referring to FIG. 3, the first non-conductive members 271 of the first side member 211 and the second non-conductive members 272 of the second side member 221 may be substantially aligned with each other in the folded state so that the radiation characteristics of the antenna may be improved, but it may be difficult to provide radiation characteristics of the antenna above the specified values due to electromagnetic coupling between the first and second conductive parts adjacent to each other. For example, due to the electric field discharged from the first conductive parts used as the radiator of the folded antenna, a spurious resonance (or spurious component) may be generated on the second conductive parts and may degrade the radiation characteristics of the antenna of the first conductive part in the wireless communication circuit, in which at least one of the first conductive parts is used as the radiator of the antenna. For example, in the folded state, a capacitance may be formed between the first conductive part and the second conductive part due to electromagnetic coupling, and the electromagnetic wave energy (or electromagnetic field) emitted from the first conductive part used as an antenna radiator can be induced to the second conductive parts. Due to the induced energy of the electromagnetic wave, a reverse current may be generated on the second conductive parts, in contrast to the forward direction flowing on the first conductive parts, and thus the radiation characteristics of the antenna of the first conductive part in the wireless communication scheme, in which at least , one of the first conductive parts used as the radiator of the antenna may be degraded. According to one embodiment, the electronic device 20 may include a frequency control circuit to prevent degradation of the radiation characteristics of the antenna of the at least one first conductive portion in the folded state by the second side member 221. In the frequency control circuit, an electrical assembly, such as one having inductance, capacitance, or conductance may be included in the transmission line for the antenna radiator (eg, at least one first conductive part).

[98] According to various embodiments, the hinge structure (eg, hinge cover 230) may include at least one of the third conductive portions. At least one of the third conductive parts of the hinge structure can be electrically connected to the wireless communication circuitry (eg, wireless communication module 192 in FIG. 1) and used as an antenna radiator.

[99] FIG. 4 is an exploded perspective view of the electronic device shown in FIG. 2 or 3 according to an embodiment of the invention.

[100] Referring to FIG. 4, in one embodiment, the electronic device 20 may include at least one of: a display portion 30, a support member assembly 40, a board portion 450, a first side member 211, a second side member 221, a first back cover 280, or a second back cover 290. The display portion 30 used herein may refer to a display module or display assembly.

[101] Display portion 30 may include, for example, display 300 and one or more plates or layers 340 on which display 300 is mounted. In one embodiment, plate 340 may be positioned between display 300 and support member assembly 40. The display 300 may be located on at least a portion of one surface (for example, the top surface of FIG. 4) of the plate 340. The plate 340 may have a shape corresponding to the display 300. For example, a partial area of the plate 340 may have a shape corresponding to the notch 304 display 300.

[102] According to one embodiment, the leg assembly 40 may include a first leg 410, a second leg 420, a hinge structure 401 that is located between the first leg 410 and the second leg 420, a hinge cover 230 that covers the hinge structure 401 as viewed from the outside, and wiring elements 430 (e.g., flexible printed circuits (FPC)) that intersect the first support element 410 and the second support element 420.

[103] In one embodiment, the support element assembly 40 may be located between the plate 340 and the board portion 450. For example, the first support member 410 may be located between the first area 301 of the display 300 and the first board 451 (eg, the first printed circuit board (PCB)). The second support member 420 may be located between the second area 302 of the display 300 and the second board 452 (eg, the second printed circuit board).

[104] According to one embodiment, the wiring elements 430 and at least a portion of the hinge structure 401 may be located within the support element assembly 40. The wiring elements 430 may be located in a direction (eg, in the x-axis direction) through the first support element 410 and the second support element 420. The wiring elements 430 may be located in a direction (eg, the x-axis direction) perpendicular to the folding axis (eg, the axis y or folding axis A in Fig. 2) of the folding area 303 of the display 300.

[105] According to one embodiment, the board portion 450 may include a first board 451, which is located on the side of the first support element 410, and a second board 452, which is located on the side of the second support element 420. The first board 451 and the second board 452 may be located within the space defined by the support member assembly 40, the first side member 211, the second side member 221, the first rear cover 280, and the second rear cover 290. Components for implementing various functions of the electronic device 20 may be installed on the first board 451 and the second board 452.

[106] According to one embodiment, the first side member 211 and the second side member 221 can be assembled to connect on both sides of the support member assembly 40 in a state in which the display portion 30 is attached to the support member assembly 40. According to various embodiments, the first side member 211 and the second side member 221 may be connected to the leg assembly 40 by sliding on both sides of the leg assembly 40.

[107] According to various embodiments, at least a portion of the first support member 410 may be integrally formed with the first side member 211 and may include the same material as the first side member 211. In various embodiments, at least , a portion of the second support member 420 may be integrally formed with the second side member 221 and may include the same material as the second side member 221.

[108] According to various embodiments, the first hull structure 210 may be a structure that includes a first side member 211 and a first support member 410. In one embodiment, the second hull structure 220 may be a structure that includes a second side member 221 and the second support element 420.

[109] In one embodiment, the first hull structure 210 may include a first rotary bearing surface 212, and the second hull structure 220 may include a second rotary bearing surface 222 corresponding to the first rotary bearing surface 212. The first rotary bearing surface 212 and the second the pivot support surface 222 may include curved surfaces corresponding to the curved surface included in the hinge cover 230.

[110] In one embodiment, when the electronic device 20 is in the unfolded state (eg, see FIG. 2), the first hinged support surface 212 and the second hinged support surface 222 may close the hinge cover 230, and the hinge cover 230 may not open. to the rear surface of the electronic device 20, or may be minimally opened to the rear surface of the electronic device 20. When the electronic device 20 is in the folded state (for example, see Fig. 3), the hinge cover 230 can be opened to the maximum between the first rotary support surface 212 and the second rotary support surface 222.

[111] FIG. 5A is a sectional view illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.

[112] FIG. 5B is a sectional view illustrating the collapsed state of an electronic device according to an embodiment of the present disclosure.

[113] Referring to FIG. 5A and 5B, in one embodiment, electronic device 50 (e.g., electronic device 20 in FIG. 2) may include a foldable case 500 (e.g., foldable case 200 in FIG. 2 or 3), a first display 540 (e.g., display 300 in Fig. 2), a second display 544 (e.g., secondary display 293 in Fig. 2), at least one first magnet 550, at least one second magnet 560, or at least one electrical path 590.

[114] According to one embodiment, the collapsible body 500 may include a first body structure 510 (e.g., first body structure 210 in FIG. 2), a second body structure 520 (e.g., second body structure 220 in Fig. 2), or a hinge structure. 530 (eg, hinge structure 401 in FIG. 4).

[115] According to one embodiment, the first hull structure 510 may include a first surface 5001 (eg, first surface 2001 in FIG. 2) that is directed in a first direction 501 (eg, in first direction 201 in FIG. 2), and a second surface 5002 (eg, second surface 2002 in FIG. 2) that is directed in a second direction 502 (eg, second direction 202 in FIG. 2) opposite the first direction 501. In a sectional view, the first hull structure 510 may include a third side surface 500c that is located separate from the hinge structure 530 in the space between the first surface 5001 and the second surface 5002.

[116] According to one embodiment, the second hull structure 520 may include a third surface 5003 (e.g., third surface 2003 in FIG. 2) that is directed in a third direction 503 (e.g., third direction 203 in FIG. 2), and a fourth surface 5004 (e.g., fourth surface 2004 in FIG. 2) that is directed in a fourth direction 504 (e.g., fourth direction 204 in FIG. 2) opposite the third direction 503. side surface 500d, which is located separately from the hinge structure 530 in the space between the third surface 5003 and the fourth surface 5004. in directions opposite to each other. When the electronic device 50 is in the folded state (for example, see FIG. 5B), the third side surface 500c and the sixth side surface 500d may together form one side surface of the electronic device 50.

[117] According to one embodiment, the hinge structure 530 can connect the first body structure 510 and the second body structure 520, and the first body structure 510 and the second body structure 520 can rotate around the hinge structure 530. In an unfolded state (see FIG. 5A), the first direction 501 may be substantially the same as the third direction 503. According to one embodiment, when folded (see Fig. 5B), the first surface 5001 may face the third surface 5003.

[118] According to one embodiment, the first display 540 may extend from the first surface 5001 to the third surface 5003. The first display 540 may include a first fragment 541 that forms at least a portion of the first surface 5001 and a second fragment 542 that forms at least a portion of the third surface 5003. The first display 540 may include a fold fragment 543 (e.g., fold region 303 in FIG. 2) that connects the first fragment 541 and the second fragment 542.

[119] According to one embodiment, the second display 544 may be exposed through the fourth surface 5004. For example, when viewed over the fourth surface 5004, the second display 544 may be positioned to overlap the second portion 542 of the first display 540.

[120] According to one embodiment, at least one first magnet 550 may be located within the first housing structure 510. According to one embodiment, at least one second magnet 560 may be located within the second housing structure 520. In the folded state electronic device 50 (see FIG. 5B), at least one first magnet 550 and at least one second magnet 560 may be positioned to be aligned or facing each other. The collapsed state of electronic device 50 can be maintained by an attractive force between at least one first magnet 550 and at least one second magnet 560. For example, an attractive force between at least one first magnet 550 and at least one second magnet 560 may be provided to maintain the folded state against the spring force of the first display 540 (eg, the restoring force with which the fold piece 543 attempts to straighten out in a folded state). In one embodiment, the distance between the at least one first magnet 550 and the at least one second magnet 560 when the electronic device 50 is folded may be about 10 mm or less.

[121] According to one embodiment, the first magnet 550 may include a first magnetic pole 550a and a second magnetic pole 550b that have different polarities. The first magnet 550 may be positioned such that the first magnetic pole 550a points in the first direction 501 and the second magnetic pole 550b points in the second direction 502. The second magnet 560 may include a third magnetic pole 560a and a fourth magnetic pole 560b, which have different polarities. The second magnet 560 may be positioned such that the third magnetic pole 560a points in the third direction 503 and the fourth magnetic pole 560b points in the fourth direction 504. In one embodiment, the first magnetic pole 550a and the third magnetic pole 560a may have polarities different from each other.

[122] According to various embodiments, when viewed over the second surface 5002, at least a portion of at least one first magnet 550 may overlap the first fragment 541 of the first display 540. According to various embodiments, when viewed over the fourth surface 5004, at least a portion of the at least one second magnet 560 may overlap the second portion 542 of the first display 540. For example, the first and second portions 541 and 542 of the first display 540 may be located between the at least one first magnet 550 and, at least one second magnet 560 in the folded state of the electronic device 50 (see Fig. 5B).

[123] According to various embodiments, when viewed over the fourth surface 5004, the second display 544 may not overlap at least one second magnet 560. According to various embodiments, the size of the second display 544 is not limited to those shown in FIG. 5A and 5B and may take various shapes. For example, when viewed over the fourth surface 5004, the second display 544 may extend to overlap at least one second magnet 560.

[124] In one embodiment, in a sectional view, at least one first magnet 550 may be located closer to the third side surface 500c of the first body structure 510 than the hinge structure 530. In one embodiment, the at least one first the magnet 550 may be positioned in the first space 512 that is formed around the third side surface 500c. For example, the first space 512 may be the space formed between the first side member 211 and the first leg member 410 in FIG. 4. According to various embodiments, the first space 512 may be formed in the first side member 211 in FIG. 4 or in the portion of the first support member 410 that is adjacent to the first side member 211 (eg, within about 20 mm).

[125] In one embodiment, in a sectional view, at least one second magnet 560 may be located closer to the sixth side surface 500d of the second body structure 520 than the hinge structure 530. In one embodiment, the at least one second the magnet 560 may be located in the second space 522, which is formed around the sixth side surface 500d. For example, the second space 522 may be the space formed between the second side member 221 and the second leg member 420 in FIG. 4. According to various embodiments, the second space 522 may be formed in the second side member 221 in FIG. 4 or in the portion of the second support member 420 that is adjacent to the second side member 221 (eg, within about 20 mm).

[126] According to one embodiment, when viewed over the second surface 5002, the first space 512 may at least partially overlap the second space 522 when the electronic device 50 is collapsed (see FIG. 5B). In one embodiment, in a sectional view, the first space 512 and the second space 522 may be asymmetrical in shape about the folding axis A of the electronic device 50 (see FIG. 5A). According to various embodiments (not illustrated), in sectional view, first space 512 and second space 522 may be substantially symmetrical in shape about the folding axis A of the electronic device 50.

[127] According to one embodiment, in a sectional view, at least one first magnet 550 located in the first space 512 and at least one second magnet 560 located in the second space 522 may have an asymmetric shape about the axis A folding in the unfolded state of the electronic device 50 (see Fig. 5A). In various embodiments (not illustrated) in sectional view, at least one first magnet 550 and at least one second magnet 560 may be substantially symmetrical in shape about the folding axis A of the electronic device 50.

[128] According to one embodiment, in a sectional view, one surface 551 of at least one first magnet 550 may face one surface 561 of at least one second magnet 560 when the electronic device 50 is folded (see FIG. 5B). According to one embodiment, when viewed over the second surface 5002, one surface 551 of the at least one first magnet 550 may have a smaller area than one surface 561 of the at least one second magnet 560 in the collapsed state of the electronic device 50. According to various embodiments (not illustrated), when viewed over the second surface 5002, one surface 551 of at least one first magnet 550 can be formed to have substantially the same area or a larger area than one surface 561, at least of at least one second magnet 560 in the collapsed state of the electronic device 50. In various embodiments, one surface 551 of the at least one first magnet 550 may be substantially parallel to one surface 561 of the at least one second magnet 560 in the collapsed state of the electronic device. devices 50.

[129] According to one embodiment, at least one electrical path 590 may be located in the first space 512. For example, at least one electrical path 590 may include various conductive elements such as a coaxial cable or a flexible printed circuit board. (FPCB).

[130] According to one embodiment, at least one electrical path 590 may be wiring (e.g., a transmission line) for an antenna device or antenna system (not shown) that is included in electronic device 50. According to various embodiments, at least at least one electrical path 590 may be wiring for various other nodes.

[131] According to one embodiment, at least one first magnet 550 may include a recess 553 having the shape of a dent. According to one embodiment, at least one electrical path 590 may be located in recess 553. A design in which at least one electrical path 590 is located in recess 553 may increase space efficiency to accommodate at least one electrical path 590 within the limited interior space of the first housing structure 510 along with at least one first magnet 550.

[132] According to various embodiments, the position of the recess 553 or the number of recesses 553 is not limited to the example shown in FIG. 5A or 5B and may be modified.

[133] In any embodiment (not shown), recess 553 may be replaced with a through hole.

[134] FIG. 6 illustrates an electronic device in an unfolded state according to an embodiment of the disclosure.

[135] Referring to FIG. 6, in one embodiment, electronic device 60 (e.g., electronic device 20 in FIG. 2 or electronic device 50 in FIG. 5A) may include at least one of a first side member 610 (e.g., first side member 211 in Fig. 2), the second side element 620 (for example, the second side element 221 in Fig. 2), the hinge structure 630 (for example, the hinge structure 530 in Fig. 5A), the wireless communication circuit 680 (for example, the wireless communication module 192 on Fig. 1) or processor 690 (for example, processor 120 in Fig. 1).

[136] According to one embodiment, the electronic device 60 may include a first side surface 611 and a fourth side surface 612 that are directed in a first direction, a second side surface 621 and a fifth side surface 622 that are directed in a second direction opposite the first direction. , and a third side surface 631 and a sixth side surface 632, which are directed in a third direction perpendicular to the first direction.

[137] According to one embodiment, the first side surface 611 may be formed by the first side element 610, and the fourth side surface 612 may be formed by the second side element 620. When the electronic device 60 is in the unfolded state or in the folded state (for example, see FIG. 3), the first side surface 611 and the fourth side surface 612 may together form one side surface of the electronic device 60. According to one embodiment, the second side surface 621 may be formed by the first side element 610, and the fifth side surface 622 may be formed by the second side element 620. When the electronic device 60 is in the unfolded state or in the folded state (for example, see FIG. 3), the second side surface 621 and the fifth side surface 622 may together form another side surface of the electronic device 60.

[138] In one embodiment, third side surface 631 (eg, third side surface 500c in FIG. 5A) may be formed by first side member 610, and sixth side surface 632 (eg, sixth side surface 500d in FIG. 5A) may be formed by the second side member 620. When the electronic device 60 is in the unfolded state, the third side surface 631 and the sixth side surface 632 may be located in opposite directions to each other. When the electronic device 60 is in the folded state (for example, see FIG. 3), the third side surface 631 and the sixth side surface 632 may together form one side surface of the electronic device 60.

[139] According to one embodiment, the first side member 610 may include a plurality of conductive portions. For example, the first side member 610 may include a first conductive portion A1, a first insulating portion 641, a second conductive portion A2, a second insulating portion 642, and a third conductive portion A3 that are arranged on one side of the hinge structure 630 in order. The first side member 610 may include a fourth conductive portion A4, a third insulating portion 643, a fifth conductive portion A5, a fourth insulating portion 644, and a sixth conductive portion A6, which are disposed on the other side of the hinge structure 630 in order. The first side member 610 may include a fifth insulating portion 645 between the third conductive portions A3 and the sixth conductive portion A6. The fourth and fifth conductive parts A4 and A5 may form part of the first side surface 611. The sixth conductive part A6 may include a piece A61 that forms part of the third side surface 631 and a piece A62 that forms part of the first side surface 611. First and second the conductive portions A1 and A2 may constitute a part of the second side surface 621. The third conductive portion A3 may include a portion A31 that forms a portion of the second side surface 621 and a portion of A32 that forms a portion of the third side surface 631.

[140] According to one embodiment, the first insulating portion 641 may be located between the first and second conductive portions A1 and A2 and may form part of the second side surface 621. The first and second conductive portions A1 and A2 may be electrically or physically separated by the first insulating portion 641 The second insulating portion 642 may be located between the second and third conductive portions A2 and A3 and may form part of the second side surface 621. The second and third conductive portions A2 and A3 may be electrically or physically separated by the second insulating portion 642. The third insulating portion 643 may be located between the fourth and fifth conductive parts A4 and A5 and may form part of the first side surface 611. The fourth and fifth conductive parts A4 and A5 may be electrically or physically separated by the third insulating part 643. The fourth insulating part 644 may be located between the fifth and sixth conductive portions A5 and A6 and may form part of the first side surface 611. The fifth and sixth conductive portions A5 and A6 may be electrically or physically separated by the fourth insulating portion 644. The fifth insulating portion 645 may be located between the third and sixth conductive portions A3 and A6 and may form part of the third side surface 631. The third and sixth conductive portions A3 and A6 may be electrically or physically separated by the fifth insulating portion 645.

[141] According to one embodiment, the second side member 620 may include a plurality of conductive portions. For example, the second side member 620 may include a seventh conductive portion A7, a sixth insulating portion 646, an eighth conductive portion A8, a seventh insulating portion 647, and a ninth conductive portion A9, which are arranged on one side of the hinge structure 630 in order. The second side member 620 may include a tenth conductive portion A10, an eighth insulating portion 648, an eleventh conductive portion A11, a ninth insulating portion 649, and a twelfth conductive portion A12, which are arranged on the other side of the hinge structure 630 in order. The second side member 620 may include a tenth insulating portion 650 between the ninth conductive portion A9 and the twelfth conductive portion A12. The tenth and eleventh conductive portions A10 and A11 may form part of the fourth side surface 612. The twelfth conductive portion A12 may include a piece A121 that forms part of the sixth side surface 632 and a piece A122 that forms part of the fourth side surface 612. The seventh and eighth the conductive portions A7 and A8 may constitute a portion of the fifth side surface 622. The ninth conductive portion A9 may include a portion A91 that forms a portion of the fifth side surface 622 and a portion of A92 that constitutes a portion of the sixth side surface 632.

[142] According to one embodiment, the sixth insulating portion 646 may be located between the seventh and eighth conductive portions A7 and A8 and may form part of the fifth side surface 622. The seventh and eighth conductive portions A7 and A8 may be electrically or physically separated by the sixth insulating portion 646 The seventh insulating portion 647 may be located between the eighth and ninth conductive portions A8 and A9 and may form part of the fifth side surface 622. The eighth and ninth conductive portions A8 and A9 may be electrically or physically separated by the seventh insulating portion 647. The eighth insulating portion 648 may be located between the tenth and eleventh conductive portions A10 and A11 and may form part of the fourth side surface 612. The tenth and eleventh conductive portions A10 and A11 may be electrically or physically separated by the eighth insulating portion 648. The ninth insulating portion 649 may be located between the eleventh and twelfth conductive portions A11 and A12 and may form part of the fourth side surface 612. The eleventh and twelfth conductive portions A11 and A12 may be electrically or physically separated by the ninth insulating portion 649. The tenth insulating portion 650 may be located between the ninth and twelfth conductive portions A9 and A12 and may form part of the sixth side surface 632. The ninth and twelfth conductive portions A9 and A12 may be electrically or physically separated by the tenth insulating portion 650. For example, the first insulating portion 641, the second insulating portion 642, the third insulating portion 643, the fourth insulating portion 644, or the fifth the insulating portion 645 may be the first non-conductive member 271 in FIG. 2. For example, the sixth insulating part 646, the seventh insulating part 647, the eighth insulating part 648, the ninth insulating part 649, or the tenth insulating part 650 may be the second non-conductive members 272 in FIG. 2.

[143] According to one embodiment, the first insulating part 641 and the sixth insulating part 646, the second insulating part 642 and the seventh insulating part 647, the third insulating part 643 and the eighth insulating part 648, the fourth insulating part 644 and the ninth insulating part 649, the fifth insulating part 645 and the tenth insulating portion 650 can be substantially aligned with each other in the folded state of the electronic device 60 (see FIG. 3).

[144] According to one embodiment, when viewed over the second surface (e.g., second surface 5002 in FIG. 5A), the first conductive portions A1 and the seventh conductive portion A7, the second conductive portions A2 and the eighth conductive portion A8, the third conductive portions A3, and the ninth conductive part A9, the fourth conductive parts A4 and the tenth conductive part A10, the fifth conductive parts A5 and the eleventh conductive part A11, or the sixth conductive parts A6 and the twelfth conductive part A12 may at least partially overlap each other when the electronic device is folded 60 (see Fig. 3).

[145] According to one embodiment, at least one of the first, second, third, fourth, fifth, and sixth conductive portions A1, A2, A3, A4, A5, and A6 of the first side member 610 may be electrically connected to the wireless circuit 680. communication (such as radio frequency integrated circuit (RFIC) or intermediate frequency integrated circuit (IFIC), and can be used as an antenna radiator.

[146] For example, the second conductive part A2 can operate as the first antenna radiator (1). The first antenna radiator (1) may be electrically connected to the wireless circuit 680 with at least one power point (not shown) and may be electrically connected to ground G1 with at least one ground point (not shown). According to one embodiment, the first antenna system 6801 may include a first antenna radiator (1), a ground G1 that is electrically connected to the first antenna radiator (1), or a first transmission line 651 between the first antenna radiator (1) and the wireless communication circuit 680 . The first transmission line 651 can be defined as a system of conductors that acts as a structure for transmitting radio frequency (RF) signals (voltages, currents) through the first antenna radiator (1) and uses the action of wave propagation in accordance with the electrical node (for example, a node having resistance, inductance, conductance or capacitance per unit length). The first transmission line 651 may include various types of wiring that connect the wireless communication circuit 680 and the first antenna radiator (1). The wireless communication circuit 680 can supply a current (eg, a radiation current or a radio signal) to the first antenna radiator (1) via the first transmission line 651 and transmit or receive radio electromagnetic waves through the first antenna radiator (1).

[147] For example, the third conductive part A3 can work as a second antenna radiator (2). The second antenna radiator (2) may be electrically connected to the wireless circuit 680 with at least one power point (not shown) and may be electrically connected to ground G2 with at least one ground point (not shown). According to one embodiment, the second antenna system 6802 may include a second antenna radiator (2), ground G2 that is electrically connected to the second antenna radiator (2), or a second transmission line 661 between the second antenna radiator (2) and the wireless communication circuit 680 . The second transmission line 661 can be defined as a system of conductors that acts as a structure for transmitting radio frequency (RF) signals (voltages, currents) through the second antenna radiator (2) and uses the action of wave propagation in accordance with the electrical node (for example, a node having resistance, inductance, conductance or capacitance per unit length). The second transmission line 661 may include various types of wiring that connect the wireless communication circuit 680 and the second antenna radiator (2). The wireless communication circuit 680 can supply current (eg, a radiation current or a radio signal) to the second antenna radiator (2) via the second transmission line 661 and transmit or receive radio electromagnetic waves through the second antenna radiator (2).

[148] For example, the fifth conductive part A5 can operate as the third antenna radiator (3). The third antenna radiator (3) may be electrically connected to the wireless communication circuit 680 with at least one power point (not shown) and may be electrically connected to the ground G3 with at least one ground point (not shown). According to one embodiment, the third antenna system 6803 may include a third antenna radiator (3), a ground G3 that is electrically connected to the third antenna radiator (3), or a third transmission line 671 between the third antenna radiator (3) and the wireless communication circuit 680 . The third transmission line 671 can be defined as a system of conductors that acts as a structure for transmitting radio frequency (RF) signals (voltages, currents) through the third antenna radiator (3) and uses the action of wave propagation in accordance with the electrical node (for example, a node having resistance, inductance, conductance or capacitance per unit length). The third transmission line 671 may include various types of wiring that connect the wireless communication circuit 680 and the third antenna radiator (3). The wireless communication circuit 680 can supply a current (eg, a radiation current or a radio signal) to the third antenna radiator (3) via the third transmission line 671 and transmit or receive radio electromagnetic waves through the third antenna radiator (3).

[149] For example, a part (not shown) of the sixth conductive part A6, which is located between the first side surface 611 and the third side surface 631 and forms part of the third side surface 631 and part of the first side surface 611 can work as the fourth antenna radiator (4). The fourth antenna radiator (4) may be electrically connected to the wireless communication circuitry 680 with at least one power point (not shown) and may be electrically connected to ground G4 with at least one ground point (not shown). According to one embodiment, the fourth antenna system 6804 may include a fourth antenna radiator (4), a ground G4 that is electrically connected to the fourth antenna radiator (4), or a fourth transmission line 681 between the fourth antenna radiator (4) and the wireless communication circuit 680. . The fourth transmission line 681 can be defined as a conductor system that acts as a structure for transmitting radio frequency (RF) signals (voltages, currents) through the fourth antenna radiator (4) and uses the action of wave propagation in accordance with the electrical node (for example, a node having resistance, inductance, conductance or capacitance per unit length). The fourth transmission line 681 may include various types of wiring that connect the wireless communication circuit 680 and the fourth antenna radiator (4). The wireless communication circuit 680 can supply current (eg, a radiation current or a radio signal) to the fourth antenna radiator (4) via the fourth transmission line 681 and transmit or receive radio electromagnetic waves through the fourth antenna radiator (4).

[150] According to one embodiment, at least one of the grounds G1, G2, G3, and G4 may be at least one ground or at least one ground layer that is located on the first printed circuit board 601 (for example, , the first board 451 in Fig. 4), on which the wireless communication circuit 680 or the processor 690 is located. may be a ground included in at least one of the plurality of printed circuit boards.

[151] According to one embodiment, the reflection characteristic and impedance of an antenna radiator (e.g., the first antenna radiator (1), the second antenna radiator (2), the third antenna radiator (3), or the fourth antenna radiator (4)) are related to the radiation characteristics of the antenna and can be varied depending on the shape, size or material of the antenna radiator. The radiation characteristic of an antenna radiator may include an antenna radiator pattern (or antenna pattern), which is a directivity function that indicates the relative distribution of power radiated at the antenna radiator and the polarization state (or antenna polarization) of the radiated radio waves at the antenna radiator. Antenna radiator impedance can be related to power transfer to the antenna radiator from a transmitter (eg, wireless circuit 680) or power transfer to a receiver (eg, wireless circuit 680) from an antenna radiator. In order to minimize reflection at the connecting part between the transmission line (for example, the first transmission line 651, the second transmission line 661, the third transmission line 671 or the fourth transmission line 681) and the antenna radiator (for example, the first antenna radiator (1), the second antenna radiator (2 ), the third antenna radiator (3) or the fourth antenna radiator (4)), the impedance of the antenna radiator is matched to the impedance of the transmission line, and thus maximum power transmission (or minimum power loss) or efficient signal transmission based on the radiator is possible. antennas. This impedance matching can direct the efficient flow of signals at a particular frequency.

[152] According to various embodiments, the first transmission line 651, the second transmission line 661, the third transmission line 671, or the fourth transmission line 681 may be at least one electrical path 590 in FIG. 5A or FIG. 5b.

[153] According to one embodiment, the frequency band that electronic device 60 may use may include a low band (LB) of about 600 MHz to 1 GHz, a mid band (MB) of about 1 to 2.3 GHz, a high band (HB) approximately 2.3 to 2.7 GHz or Ultra High Band (UHB) approximately 2.7 to 6 GHz. According to various embodiments, electronic device 60 may additionally use other frequency bands. According to one embodiment, the first antenna system 6801, the second antenna system 6802, the third antenna system 6803, or the fourth antenna system 6804 may support a communication mode that uses at least one of LB, MB, HB, or UHB. For example, the first antenna system 6801, the second antenna system 6802, the third antenna system 6803, or the fourth antenna system 6804 may support various communication services such as Global System for Mobile Communications (GSM), Long Term Evolution (LTE), or 5th Generation Network (5G). ) that uses the corresponding frequency band.

[154] According to various embodiments, the wireless communication circuit 680 may support at least one communication technology: single input multiple output (SIMO), multiple input single output (MISO), diversity or multiple input multiple output (MIMO). ) using at least one antenna radiator (for example, the first antenna radiator (1), the second antenna radiator (2), the third antenna radiator (3) or the fourth antenna radiator (4)).

[155] According to one embodiment, wireless communication circuit 680 or processor 690 can transmit or receive data via MIMO technology using multiple antenna radiators in a communication mode that uses an appropriate frequency band. In one embodiment, electronic device 60 may include a memory (eg, memory 130 in FIG. 1) that is electrically coupled to processor 690. The memory may store instructions to instruct processor 690 to transmit or receive data using MIMO technology selectively using a plurality of antenna radiators from the first antenna radiator (1), the second antenna radiator (2), the third antenna radiator (3), or the fourth antenna radiator (4) depending on the communication mode.

[156] For example, MIMO technology may include a beamforming circuit that adjusts the phase information of each antenna radiator, controls the signal strength according to the position angle between the base station (or transmitter) and the user, and eliminates environmental interference to improve performance. For example, the MIMO technology may include a diversity scheme that maintains distance between antenna radiators to improve performance in order to independently transmit signals between antenna radiators. For example, MIMO technology may include a multiplexing scheme that creates virtual auxiliary channels between transmitters of the transmit and receive antennas, transmits various data through the transmit antennas to increase the transmission rate. According to one embodiment, technology can be used for a base station transmitting different data through each transmit antenna and an electronic device 60 separating the transmitted data through adequate signaling. For example, 4×4 MIMO technology may use four antennas for the base station (or transmitter) and electronic device 60 (or receiver). For example, wireless communication circuitry 680 or processor 690 may transmit or receive data via a first antenna radiator (1), a second antenna radiator (2), a third antenna radiator (3), or a fourth antenna radiator (4) using MIMO technology. According to various embodiments, the third antenna radiator (3) and the fourth antenna radiator (4) can operate as antenna diversity.

[157] According to one embodiment, the wireless communication circuit 680 can be configured to transmit and/or receive signals of different frequencies in a given frequency band through the first antenna radiator (1), the second antenna radiator (2), the third antenna radiator (3)) or the fourth antenna emitter (4).

[158] According to various embodiments, the wireless communication circuit 680 can be configured to receive signals of a certain frequency through the first antenna radiator (1), the second antenna radiator (2), the third antenna radiator (3), or the fourth antenna radiator (4)).

[159] According to various embodiments, electronic device 60 may further include at least one fifth antenna radiator (not shown) that is located within electronic device 60 and electrically coupled to wireless communication circuitry 680. At least one fifth antenna radiator may be electrically connected to the ground of the first circuit board 601. According to any embodiment, at least one fifth antenna radiator may not be electrically connected to the ground of the first circuit board 601. According to various embodiments, the circuit 680 wireless communication can be configured to select four of the first antenna radiator (1), the second antenna radiator (2), the third antenna radiator (3), the fourth antenna radiator (4), and at least one fifth antenna radiator and for receiving signals of a given frequency through the selected four antenna radiators.

[160] FIG. 7 illustrates an electronic device in an unfolded state according to an embodiment of the invention.

[161] Referring to FIG. 7, electronic device 70 (e.g., electronic device 20 in FIG. 2, electronic device 50 in FIG. 5A, or electronic device 60 in FIG. 6) may include at least one of a first housing structure 710, a second housing structures 720, a plurality of first magnets 751, 752, and 753, a plurality of second magnets 761, 762, and 763, a first circuit board 771, a second circuit board 772, a third circuit board 773, a fourth circuit board 774, a first battery 781, a second battery 782, a first electrical path 791, second electrical path 792, third electrical path 793, fourth electrical path 794, or fifth electrical path 795.

[162] According to one embodiment, the first hull structure 710 may include a first side member 711 and a first support member 712. For example, the first side member 711 (e.g., first side member 211 in FIG. 2) may include a first conductive portion B1 (for example, the first conductive part A1 in Fig. 6), the second conductive part B2 (for example, the second conductive part A2 in Fig. 6), the third conductive part B3 (for example, the third conductive part A3 in Fig. 6), the fourth conductive part B4 (for example, the fourth conductive part A4 in Fig. 6), the fifth conductive part B5 (for example, the fifth conductive part A5 in Fig. 6), or the sixth conductive part B6 (for example, the sixth conductive part A6 in Fig. 6) and may include a first insulating part 741 (for example, the first insulating part 641 in Fig. 6), a second insulating part 742 (for example, the second insulating part 642 in Fig. 6), a third insulating part 743 (for example, the third insulating part 643 in Fig. 6 6), the fourth insulating part 744 (for example, the fourth insulating part 644 in FIG. 6) or the fifth insulating part 745 (for example, the fifth insulating part 645 in Fig. 6). According to one embodiment, the first support member 712 (e.g., first support member 410 in FIG. 4) may include a first internal conductive portion 712a that is integrally formed with or physically connected to at least one conductive portion (e.g., , the first conductive part B1, the second conductive part B2, the third conductive part B3, the fourth conductive part B4, the fifth conductive part B5 or the sixth conductive part B6) of the first side member 711. According to one embodiment, the first support member 712 may include a first internal a non-conductive portion 712b connected to the first inner conductive portion 712a. For example, the first insulating part 741, the second insulating part 742, the third insulating part 743, the fourth insulating part 744, or the fifth insulating part 745 may be integrally formed with or physically connected to the first internal non-conductive part 712b.

[163] According to one embodiment, the second hull structure 720 may include a second side member 721 and a second support member 722. For example, the second side member 721 (e.g., second side member 221 in FIG. 2) may include a seventh conductive portion B7 (for example, the seventh conductive part A7 in Fig. 6), the eighth conductive part B8 (for example, the eighth conductive part A8 in Fig. 6), the ninth conductive part B9 (for example, the ninth conductive part A9 in Fig. 6), the tenth conductive part B10 (for example, the tenth conductive part A10 in Fig. 6), the eleventh conductive part B11 (for example, the eleventh conductive part A11 in Fig. 6), or the twelfth conductive part B12 (for example, the twelfth conductive part A12 in Fig. 6), and may include a sixth insulating part 746 (for example, the sixth insulating part 646 in Fig. 6), a seventh insulating part 747 (for example, the seventh insulating part 647 in Fig. 6), an eighth insulating part 748 (for example, the eighth insulating part 648 in Fig. 6). . 6), a ninth insulating part 749 (for example, the ninth insulating part 649 in Fig. 6), or a tenth insulating part 750 (for example, the tenth insulating part 650 in Fig. 6). According to one embodiment, the second support member 722 (e.g., second support member 420 in FIG. 4) may include a second internal conductive portion 722a that is integrally formed with, or physically connected to, at least one conductive portion (e.g., , (the seventh conductive portion B7, the eighth conductive portion B8, the ninth conductive portion B9, the tenth conductive portion B10, the eleventh conductive portion B11, or the twelfth conductive portion B12) of the second side member 721. According to one embodiment, the second support member 722 may include a second an inner non-conductive portion 722b connected to the second inner conductive portion 722a.For example, the sixth insulating portion 746, the seventh insulating portion 747, the eighth insulating portion 748, the ninth insulating portion 749, or the tenth insulating portion 750 may be integrally formed with the second inner non-conductive portion 722b or physically connected to it.

[164] According to one embodiment, the first printed circuit board 771 and/or the second printed circuit board 772 may be connected to the first support member 712 via attachment points such as screws. According to one embodiment, when viewed over a second surface (e.g., second surface 2002 in FIG. 2 or second surface 5002 in FIG. 5A), the first circuit board 771 may be located closer to the fifth conductive portion B5 than the second conductive portion B2, and the second circuit board 772 may be located closer to the second conductive part B2 than the fifth conductive part B5. According to various embodiments, the first board 451 in FIG. 4 or the first circuit board 601 in FIG. 6 may include a first circuit board 771 and a second circuit board 772.

[165] For example, various nodes such as a camera module (for example, a 7711 camera and a 7712 flash), a sensor module 7713 (for example, an optical sensor module such as a fingerprint sensor), a wireless communication module (for example, a wireless communication module 192 on 1) and a processor (eg, processor 120 in FIG. 1) may be located on a first circuit board 771. In various embodiments, one or more components 245 in FIG. 2 may be mounted on the first printed circuit board 771 or may be electrically connected to the first printed circuit board 771. In various embodiments, key input devices 7714 and 7715 (e.g., key input devices 243 in FIG. 2) may be located in a through hole ( not shown) formed at least in a portion (for example, the sixth conductive portion B6) of the first side member 711 and electrically connected to the first printed circuit board 771.

[166] For example, various nodes such as connector 7721 (for example, USB connector), which corresponds to the connector hole 7722 (for example, connector hole 244 in Fig. 2) formed in the second conductive part B2, microphone 7723, which corresponds to the microphone hole (e.g., microphone hole 241 in FIG. 2), or a speaker (not shown) that matches the speaker hole (e.g., speaker hole 242 in FIG. 2) may be located on the second circuit board 772.

[167] According to one embodiment, the first circuit board 771 may include a fifth connector 7716 and the second circuit board 772 may include a sixth connector 7726. The fifth connector 7716 and the sixth connector 7726 may be electrically connected via a third electrical path 793 such like FCB. The first circuit board 771 and the second circuit board 772 may exchange different signals via the third electrical path 793.

[168] According to one embodiment, when viewed over a second surface (e.g., second surface 2002 in FIG. 2 or second surface 5002 in FIG. 5A), a first battery 781 may be located between the first circuit board 771 and the second circuit board 772. In one embodiment, when viewed over a second surface (eg, second surface 2002 in FIG. 2), first battery 781 may be rectangular. According to one embodiment, when viewed over the second surface, the fifth connector 7716 may be located between the first battery 781 and the fifth conductive portion B5. According to one embodiment, when viewed over the second surface, the sixth connector 7726 may be located between the first battery 781 and the second conductive part B2. For example, a fifth slot 7716 or a sixth slot 7726 may be located around the first battery 781 (eg, within about 20 mm). According to one embodiment, when viewed over the second surface, the third electrical path 793 (e.g., FPCB) may be positioned across the first battery 781.

[169] According to one embodiment, when viewed over a second surface (eg, second surface 2002 in FIG. 2), a plurality of first magnets 751, 752, and 753 (eg, at least one first magnet 550 in FIG. 5A) may be positioned along a third side surface 731 (e.g., third side surface 631 in FIG. 6) that is defined by the first side member 711. In one embodiment, when viewed over the second surface, a plurality of first magnets 751, 752, and 753 may be positioned around third side surface 731 (for example, within about 20 mm). According to one embodiment, a plurality of first magnets 751, 752, and 753 may be positioned around part B31 of third conductive part B3 that is substantially parallel to folding axis A, or around part B61 of sixth conductive part B6 (for example, within 10 mm). For example, when viewed over the second surface, one first magnet 751 may be at least partially positioned between the portion B31 of the third conductive portion B3 and the first battery 781. For example, when viewed over the second surface, the other first magnets 752 and 753 may be, at least partially located between the part B61 of the sixth conductive part B6 and the first battery 781.

[170] In one embodiment, a plurality of first magnets 751, 752, and 753 may be located in a first space (e.g., first space 512 in FIG. 5A) formed around third side surface 731. In one embodiment, the first space may be a space formed between the first side member 711 and the first support member 712. According to various embodiments, the first space may be formed in the first side member 711 or in a portion of the first abutment member 712 that is adjacent to the first side member 711 (for example, within about 20 mm ). For example, when viewed over a second surface (e.g., second surface 2002 in FIG. 2), at least a portion of the first space may be located between third side surface 731 and first battery 781.

[171] According to one embodiment, when viewed over a second surface (e.g., second surface 2002 in FIG. 2), at least some of the plurality of first magnets 751, 752, and 753 may not overlap the first circuit board 771 and/or the second circuit board 772. In various embodiments (not illustrated), at least one of the first magnets may be located at various other positions that are close to the third side surface 731. For example, when viewed over the second surface, at least one of the first magnets may be positioned between part B61 of the sixth conductive part B6 and the first circuit board 771. For example, when viewed over the second surface, at least one of the first magnets may be positioned between part B31 of the third conductive part B3 and the second circuit board 772.

[172] According to one embodiment, the third PCB 773 and/or the fourth PCB 774 may be connected to the second support member 722 via attachment points such as screws. In one embodiment, when viewed over a fourth surface (e.g., fourth surface 2004 in FIG. 2 or fourth surface 5004 in FIG. 5A), the third circuit board 773 may be located closer to the eleventh conductive portion B11 than the eighth conductive portion B8, and the fourth circuit board 774 may be located closer to the eighth conductive part B8 than the eleventh conductive part B11. According to various embodiments, the second board 452 in FIG. 4 may include a third circuit board 773 and a fourth circuit board 774. According to various embodiments, various nodes such as the sub display 293 in FIG. 2 or the second display 544 in FIG. 5A may be electrically connected to the third printed circuit board 773 and/or the fourth printed circuit board 774, or may be mounted on the third printed circuit board 773 and/or the fourth printed circuit board 774.

[173] According to one embodiment, when viewed over a fourth surface (e.g., fourth surface 2004 in Fig. 2 or fourth surface 5004 in Fig. 5A), a second battery 782 may be located between the third circuit board 773 and the fourth circuit board 774. In one embodiment, when viewed over a fourth surface (eg, fourth surface 2004 in FIG. 2), second battery 782 may be rectangular.

[174] According to one embodiment, when viewed over a fourth surface (eg, fourth surface 2004 in FIG. 2), a plurality of second magnets 761, 762, and 763 (eg, at least one second magnet 560 in FIG. 5A) may be positioned along a sixth side surface 732 (e.g., sixth side surface 632 in FIG. 6) that is defined by the second side member 721. In one embodiment, when viewed over the fourth surface, a plurality of second magnets 761, 762, and 763 may be positioned around sixth side surface 732 (for example, within about 20 mm). According to one embodiment, a plurality of second magnets 761, 762, and 763 may be positioned around the portion B91 of the ninth conductive portion B9 that is substantially parallel to the folding axis A, or around the portion B121 of the twelfth conductive portion B12 (for example, within 10 mm). For example, when viewed over the fourth surface, one second magnet 761 may be at least partially located between the portion B91 of the ninth conductive portion B9 and the second battery 782. For example, when viewed over the fourth surface, the other second magnets 762 and 763 may be, at least partially located between part B121 of the twelfth conductive part B12 and the second battery 782.

[175] According to one embodiment, a plurality of second magnets 761, 762, and 763 may be located in a second space (e.g., second space 522 in FIG. 5A) that is formed around the sixth side surface 732. In one embodiment, the second space may be a space formed between the second side member 721 and the second support member 722. According to various embodiments, the second space may be formed in the second side member 721 or in a portion of the second abutment member 722 that is adjacent to the second side member 721 (e.g., within about 20 mm). For example, when viewed over a fourth surface (e.g., fourth surface 2004 in FIG. 2), at least a portion of the second space may be located between the sixth side surface 732 and the second battery 782.

[176] According to one embodiment, when viewed over a fourth surface (e.g., fourth surface 2004 in FIG. 2), at least some of the plurality of second magnets 761, 762, and 763 may not overlap the third circuit board 773 and/or the fourth printed circuit board 774. In various embodiments (not illustrated), at least one of the second magnets may be located at various positions close to the sixth side surface 732. For example, when viewed over the fourth surface, at least one of the second The magnets may be positioned between the B121 portion of the twelfth conductive portion B12 and the third circuit board 773. For example, when viewed over the fourth surface, at least one of the second magnets may be positioned between the B91 portion of the ninth conductive portion B9 and the fourth circuit board 774.

[177] In one embodiment, a plurality of first magnets 751, 752, and 753 and a plurality of second magnets 761, 762, and 763 may be positioned to be aligned or facing each other when the electronic device 70 is folded (see FIG. 5B). . The collapsed state of the electronic device 70 may be maintained by attractive forces between the plurality of first magnets 751, 752, and 753 and the plurality of second magnets 761, 762, and 763.

[178] According to one embodiment, the first magnet 751, 752, or 753 may include a first magnetic pole (eg, first magnetic pole 550a in FIG. 5A) and a second magnetic pole (eg, second magnetic pole 550b in FIG. 5A)) whose polarity is different from each other. The first magnet 751, 752, or 753 may be positioned such that its first magnetic pole points in a first direction (eg, first direction 501 in FIG. 5A) and its second magnetic pole points in a second direction (eg, second direction 502 in Fig. 5A). The second magnet 761, 762, or 763 may include a third magnetic pole (eg, third magnetic pole 560a in FIG. 5A) and a fourth magnetic pole (eg, fourth magnetic pole 560b in FIG. 5A), both of which have different polarities. from each other. The second magnet 761, 762, or 763 may be positioned such that its third magnetic pole points in a third direction (eg, third direction 503 in FIG. 5A) and its fourth magnetic pole points in a fourth direction (eg, fourth direction 504 in Fig. 5A). According to one embodiment, the first magnetic pole and the third magnetic pole may have polarities (eg, S or N polarity) that are different from each other.

[179] According to various embodiments, the polarities of the plurality of first magnets 751, 752, and 753 may be arranged in the same manner as each other. In various embodiments, the polarities of one first magnet of the plurality of first magnets 751, 752, and 753 may be arranged to be different from the polarity of the other first magnet.

[180] According to various embodiments, the positions or numbers of the first magnets located in the first housing structure 710 or the second magnets located in the second housing structure 720 are not limited to the example illustrated in FIG. 7 and are subject to change.

[181] In one embodiment, first electrical path 791 and second electrical path 792 may electrically connect first circuit board 771 and second circuit board 772. In one embodiment, when viewed over a second surface (e.g., second surface 2002 in FIG. 2) , part of the first electrical path 791 and/or part of the second electrical path 792 may be located in the first space (for example, the first space 512 in Fig. 5A) formed around the third side surface 731. For example, part of the first electrical path 791 and/or part a second electrical path 792 may be located in the first space along with a plurality of first magnets 751 and 752.

[182] According to one embodiment, the plurality of first magnets 751 and 752 may include recesses (e.g., recess 553 in FIG. 5A), part of the first electrical path 791 and/or part of the second electrical path 792 may be located in the recesses.

[183] According to one embodiment, the first electrical path 791 or the second electrical path 792 may be wiring (eg, a transmission line) for at least one antenna system. For example, the first electrical path 791 or the second electrical path 792 may be a transmission line for an antenna system (e.g., the first antenna system 6801 in FIG. 6) that uses the second conductive portion B2 and/or a transmission line for the antenna system (e.g., the second antenna system 6802 in Fig. 6), which uses the third conductive part B3.

[184] According to one embodiment, a fourth electrical path 794 (e.g., FPCB) or a fifth electrical path 795 (e.g., FPCB) may electrically connect the first circuit board 771 and the third circuit board 773, which are respectively located in the first package structure 710 and the second package structure. structure 720 across the hinge structure (eg, hinge structure 530 in FIG. 5A).

[185] According to various embodiments, electronic device 70 may include at least one fifth electrical path (not shown) that electrically connects third circuit board 773 and fourth circuit board 774. According to various embodiments, when viewed over fourth surface (eg, fourth surface 2004 in FIG. 2), at least a portion of the fifth electrical path may be located in the second space (eg, second space 522 in FIG. 5A) formed around the sixth side surface 732). In various embodiments, at least a portion of the fifth electrical path may be located in the second space along with a plurality of second magnets 761 and 762. In various embodiments, the plurality of second magnets 761 and 762 may include recesses similar to the first magnets (e.g., the first magnet 550 in Fig. 5A), and part of the fifth electrical path may be located in the recess.

[186] According to one embodiment, the first electrical path 791 or the second electrical path 792 may be a coaxial cable. According to various embodiments, the first electrical path 791 or the second electrical path 792 may be various other conductive elements.

[187] FIG. 8A illustrates a portion of an electronic device according to an embodiment of the disclosure.

[188] FIG. 8B is a sectional view along line A-A of the electronic device shown in FIG. 8A according to an embodiment of the disclosure.

[189] FIG. 9A, 9B, 9C, 9D and 9E are sectional views of various first magnets according to various embodiments of the disclosure.

[190] Referring to FIG. 8A and 8B, the electronic device 70 may include at least one of a second conductive portion B2, a third conductive portion B3, a sixth conductive portion B6, first inner conductive portions 802, 803, and 806, inner supports 813, 814, 815. , 816 and 817, the first internal non-conductive portion 712b, the first circuit board 771, the second circuit board 772, the first battery 781, or a plurality of first magnets 751 and 752.

[191] Referring to FIG. 8A, when viewed over a second surface (e.g., second surface 2002 in FIG. 2), first inner conductive portions 802, 803, and 806 (e.g., first inner conductive portion 712a in FIG. 7) may include, for example, a first inner a conductive part 802 that is connected to the second conductive part B2, a first inner conductive part 803 that is connected to the third conductive part B3, or a first inner conductive part 806 that is connected to the sixth conductive part B6. When viewed over a second surface (eg, second surface 2002 in FIG. 2), the inner supports 813, 814, 815, and 816 may include internal supports 813, 814, and 815 that at least partially surround the first battery 781, and an inner support 816 that is at least partially located between the first battery 781 and the display 840. Referring to FIG. 8B, the inner support 817 may face one surface 7521 of the first magnet 752 directed in the first direction 8001 (eg, in the first direction 201 in FIG. 2).

[192] According to various embodiments, at least some of the internal supports 813, 814, 815, 816, and 817 may be implemented in the first internal non-conductive portion 712b.

[193] According to one embodiment, the first electrical path 791 may include a first terminal (or first connector) 7911 for electrical connection with the first printed circuit board 771 and a second terminal (or second connector) 7912 for electrical connection with the second printed circuit board 772. According to In one embodiment, the second electrical path 792 may include a third terminal (or third connector) 7923 for electrical connection to the first printed circuit board 771 and a fourth terminal (or fourth connector) 7924 for electrical connection with the second printed circuit board 772. The first printed circuit board 771 may include a connector (not shown) for electrical connection to the first terminal 7911 and a connector (not shown) for electrical connection to the third terminal 7923. The second circuit board 772 may include a connector (not shown) for electrical connection to the second terminal 7912 and connector (not shown) for electrical connection to the fourth terminal of the 7924.

[194] According to any embodiment, the first lead 7911 or the third lead 7923 may be connected to the first printed circuit board 771 with a conductive bonding material such as solder. In any embodiment, the second lead 7912 or the fourth lead 7924 may be connected to the second circuit board 772 with a conductive bonding material such as solder.

[195] In one embodiment, when viewed over a second surface (e.g., second surface 2002 in FIG. 2), first battery 781 may be positioned between first terminal 7911 and second terminal 7912 and/or between third terminal 7923 and fourth terminal 7924 .

[196] In one embodiment, as shown in FIG. 7 and 8A, the second terminal 7912 and/or the fourth terminal 7924 may be located closer to the second insulating portion 742 than the first insulating portion 741.

[197] According to one embodiment, the first inner conductive portion 802 connected to the second conductive portion B2 may be electrically connected to the second printed circuit board 772. For example, the first inner conductive portion 802 may include a protruding portion 802a to partially cover the second printed circuit board. board 772. A conductive connector (such as solder) or a flexible conductive member (such as a C-clamp (such as a C-spring), pin, spring, conductive poron, conductive rubber, conductive tape, or copper connector) may be placed between protruding fragment 802a and the second circuit board 772.

[198] According to one embodiment, the second conductive portion B2 may be electrically connected to a wireless communication circuit (e.g., wireless communication module 192 in FIG. 1 or wireless communication circuit 680 in FIG. 6) that is located on the first printed circuit board 771 through the first electrical path 791 or second electrical path 792 and operate as an antenna radiator (eg, the first antenna radiator (1) in FIG. 6). According to various embodiments, the first inner conductive part 802 can also operate as an antenna radiator together with the second conductive part B2. According to one embodiment, the protruding portion 802a may become a feed structure for an antenna radiator including the second conductive portion B2. In one embodiment, as shown in FIG. 7 and 8A, the protruding portion 802a used as the feed structure may be positioned closer to the second insulating portion 742 than to the first insulating portion 741.

[199] In one embodiment, as shown in FIG. 7 and 8A, the second terminal 7912 and/or the fourth terminal 7924 may be positioned to be separated from the protruding portion 802a used as the feed structure below a set distance (eg, about 30 mm). Thus, the radiation characteristics of the antenna of the antenna system (eg, the first antenna system 6801 in FIG. 6) using the second conductive part B2 can be secured.

[200] According to one embodiment, the first inner conductive portion 803 connected to the third conductive portion B3 may be electrically connected to the second circuit board 772. For example, the first inner conductive portion 803 may include protruding portions 803a, 803b, and 803c to partially cover the second circuit board 772. A conductive connector (such as solder) or a flexible conductive member (such as a C-clip, pin, spring, conductive poron, conductive rubber, conductive tape, or copper connector) may be positioned between the protruding pieces 803a , 803b and 803c and the second circuit board 772). According to one embodiment, the third conductive part B3 may be electrically connected to the wireless communication circuit (for example, to the wireless communication module 192 in Fig. 1 or the wireless communication circuit 680 in Fig. 6) that is located on the first printed circuit board 771, through the first electrical path 791 or second electrical path 792 and operate as an antenna radiator (eg, second antenna radiator (2) in FIG. 6). According to various embodiments, the first inner conductive part 803 may also work as an antenna radiator together with the third conductive part B3. According to one embodiment, at least one of the protruding portions 803a, 803b, and 803c may become a feed structure for an antenna radiator including the third conductive portion B3. According to various embodiments, some of the raised portions 803a, 803b, and 803c may become part of the ground that is electrically connected to the ground of the second printed circuit board 772.

[201] In one embodiment, as shown in FIG. 7 and 8A, the protruding portion 803a, 803b, or 803c used as the feed structure may be located closer to the second insulating portion 742 than to the fifth insulating portion 745.

[202] In one embodiment, as shown in FIG. 7 and 8A, the second terminal 7912 and/or the fourth terminal 7924 may be positioned to be separated from the protruding portion 803a, 803b or 803c used as the feed structure below a set distance (eg, about 30 mm). Thus, the radiation characteristics of the antenna of the antenna system (eg, the second antenna system 6802 in FIG. 6) using the third conductive part B3 can be secured.

[203] In one embodiment, as shown in FIG. 7 and 8A, the second terminal 7912 and/or the fourth terminal 7924 may be located closer to the second insulating portion 742 than the first insulating portion 741 and the fifth insulating portion 745. 6) using the second conductive part B2 and/or an antenna system (eg, the second antenna system 6802 in Fig. 6) using the third conductive part B3 can be provided.

[204] According to one embodiment, when the second terminal 7912 and/or the fourth terminal 7924 are closer to the second insulating portion 742 than the first insulating portion 741 and the fifth insulating portion 745, the first electrical path 791 and/or the second electrical path 792 may be located in a first space (e.g., first space 512 in FIG. 5A) formed around the third side surface 731 along with a plurality of first magnets 751 and 752. This arrangement structure can make the electronic device 70 thin while providing the radiation characteristics of the antenna system ( for example, the first antenna system 6801 in Fig. 6) using the second conductive part B2, and/or the antenna system (eg, the second antenna system 6802 in Fig. 6) using the third conductive part B3.

[205] Referring to FIG. 8B, first magnet 752 may be located in first space 800 (e.g., first space 512 in FIG. 5A) that is formed by sixth conductive portion B6, inner conductive portions 806, and inner supports 813 and 817. In one embodiment, first magnet 752 may include a front surface 7521 (for example, one surface 551 in Fig. 5B), which is essentially directed in the first direction 8001 (for example, the first direction 201 in Fig. 2 or the first direction 501 in Fig. 5A), the rear surface 7522, which is located on the side opposite the front surface 7521, the first side surface 7523, which faces the sixth conductive part B6, and the second side surface 7524, which faces the first battery 781. According to one embodiment, the inner conductive part 806 may be located between the sixth conductive part B6 and the first side surface 7523 of the first magnet 752. The inner support 813 may be located between the first battery 781 and the second side surface 7524 of the first magnet 752. The inner support 817 may be positioned to face the front surface 7521 of the first magnet 752.

[206] According to one embodiment, the inner support 817 may be formed from a non-conductive material so as not to shield the magnetic force from the first magnet 751.

[207] According to various embodiments, in order to ensure the radiation characteristics of the antenna of the antenna system (for example, the fourth antenna system 6804 in Fig. 6) using the sixth conductive part B6, the inner conductive part 806 can be replaced with a non-conductive material, and be implemented, for example, in the first inner non-conductive portion 712b.

[208] According to various embodiments, with reference to FIG. 8B, a non-magnetic material may be located in at least a partial region of the first magnet 752 such that the magnetic field generated by the first magnet 752 does not substantially distribute magnetic force in a second direction 8002 and/or a fifth or sixth direction 8005 or 8006 orthogonal to second direction 8002. In one embodiment, the non-magnetic material may be located in at least a partial region of the first magnet 752 such that the magnetic field generated by the first magnet 752 substantially distributes the magnetic force in the first direction 8001. For example, the non-magnetic material may include an amorphous metal such as amorphous tape, polycarbonate, or epoxy.

[209] According to various embodiments, the inner conductive portion 806 and/or the sixth conductive portion B6 may include a layer formed from a non-magnetic material (e.g., an amorphous metal such as an amorphous tape, a polycarbonate, or an epoxy resin) that is at least , partially located between the first magnet 752 and the sixth conductive part B6 so as not to be magnetized by the first magnet 752. For example, the layer may be formed in the form of a sheet that may be attached to the first magnet 752, or may be formed by coating.

[210] According to various embodiments, the surface (not shown) of the first magnet 752, with which the recess 801 is formed, can be covered with a non-magnetic material, and thereby the influence of the magnetic field generated by the first magnet 752 on the first electrical path 791 and the second electrical path 792 can be shortened.

[211] According to various embodiments, the first magnet 751, 752, or 753 may be a shielded magnet. The shielded magnet may be a metallic magnetic substance that directs the magnetic field lines formed between the N and S poles of the magnet. The shielded magnet allows the magnetic force to be distributed in a first direction 8001 that is substantially directed toward a second surface (eg, second surface 2002 in FIG. 2). According to one embodiment, the shielded magnet may include a shield structure that includes a magnet and a ferromagnetic substance (eg, iron) attached to a partial region of the magnet.

[212] According to one embodiment, when viewed above the display 840, a portion 845 of the display 840 may be positioned to overlap a portion of the front surface 7521 of the first magnet 752. In various embodiments, when viewed above the display 840, at least a portion of the front surface 7521 of first magnet 752 may be positioned to overlap display 840.

[213] According to one embodiment, the first magnet 752 located in the first space 800 may include a recess 801 (eg, recess 553 in FIG. 5A) for receiving a first electrical path 791 and a second electrical path 792. For example, recess 801 may be shaped in which the corner portion at which the rear surface 7522 and the second side surface 7524 of the first magnet 752 intersect is removed. an electrical path 791 and a second electrical path 792 within the confined interior of the electronic device 70 along with the first magnet 752.

[214] According to various embodiments, the cross-sectional structure of the first magnet 751 taken along another line B-B in the electronic device 70 in FIG. 8A may be equivalent to when at least a portion of the first inner conductive portion 806 connected to the sixth conductive portion B6 in FIG. 8B is replaced by the first internal non-conductive portion 712b.

[215] In various embodiments, as shown in FIG. 9A, the first magnet 952a located in the first space 800 may have a shape in which the corner portion at which the front surface 7521 and the second side surface 7524 of the first magnet 952a intersect is removed.

[216] In various embodiments, as shown in FIG. 9B, the first magnet 952b located in the first space 800 may have a shape in which the corner portion at which the rear surface 7522 and the first side surface 7523 of the first magnet 952b intersect is removed.

[217] In various embodiments, as shown in FIG. 9C, the first magnet 952c located in the first space 800 may have a shape in which the corner portion at which the front surface 7521 and the first side surface 7523 of the first magnet 952c intersect is removed.

[218] In various embodiments, with reference to FIG. 9D, the first magnet 952d located in the first space 800 may have a recess 801c pressed into the rear surface 7522 in the first direction 8001.

[219] In various embodiments, as shown in FIG. 9E, the first magnet 952e located in the first space 800 may have a through hole 801e for receiving the first electrical path 791 and the second electrical path 792.

[220] FIG. 10A illustrates an electronic device according to an embodiment of the disclosure.

[221] FIG. 10B is a sectional view along line D-D of the first magnet and electrical path of the electronic device shown in FIG. 10A according to an embodiment of the disclosure.

[222] Referring to FIG. 10A, in one embodiment, the electronic device 1000 (e.g., electronic device 20 in Fig. 2, electronic device 50 in Fig. 5A, or electronic device 70 in Fig. 7) may include a first circuit board 1071 (e.g., the first circuit board 771 in Fig. 7), the first battery 1081 (for example, the first battery 781 in Fig. 7), the first magnet 1050 (for example, the first magnet 751 in Fig. 7), or the button input device 1090 (for example, the button input device 7715 in Fig. .7).

[223] According to one embodiment, when viewed over a second surface (e.g., second surface 2002 in FIG. 2), an electrical path 1091, such as an FPCB, that is electrically connected between the keypad 1090 and the first circuit board 1071 may overlap the first magnet 1050.

[224] Referring to FIG. 10B, the first magnet 1050 may include a recess 1053 in which an electrical path 1091 may reside. the first magnet 1050.

[225] According to one embodiment of the invention, an electronic device (eg, electronic device 50 in Fig. 5A) may include a collapsible housing (eg, collapsible housing 500 in Fig. 5A). The folding body may include a hinged structure (eg, hinged structure 530 in FIG. 5A). The collapsible body may include a first body structure (e.g., first body structure 510 in Fig. 5A) that has a first surface (e.g., first surface 5001 in Fig. 5A) that is connected to the hinge structure and is directed in a first direction (e.g., , first direction 501 in Fig. 5A), a second surface (for example, second surface 5002 in Fig. 5A) that is directed in a second direction (for example, second direction 502 in Fig. 5A) opposite the first direction, and a first side member (for example , the first side element 610 in Fig. 6), which at least partially surrounds the space between the first surface and the second surface. The collapsible body may include a second body structure (e.g., second body structure 520 in Fig. 5A) that has a third surface (e.g., third surface 5003 in Fig. 5A) that is connected to the hinge structure and is directed in a third direction (e.g. , third direction 503 in Fig. 5A), a fourth surface (for example, fourth surface 5004 in Fig. 5A) that is directed in a fourth direction (for example, fourth direction 504 in Fig. 5A) opposite the third direction, and a second side member (for example , second side member 620 in Fig. 6), which at least partially surrounds the space between the third surface and the fourth surface, and which is folded around the hinge structure onto the first hull structure. The first side element may have a first side surface (for example, the first side surface 611 in Fig. 6) and a second side surface (for example, the second side surface 621 in Fig. 6) that are directed opposite to each other, and a third side surface (for example, the third side surface 631 in Fig. 6), which is orthogonal to the first side surface and is located separately from the hinge structure. The second side member may provide a fourth side surface (e.g., fourth side surface 612 in FIG. 6) that is directed in the same direction as the first side surface, a fifth side surface (e.g., fifth side surface 622 of FIG. 6), which points in the same direction as the second side surface, and a sixth side surface (eg, sixth side surface 632 in FIG. 6) which points in the same direction as the third side surface when folded. The first surface may face the third surface in the folded state, and the third direction may be the same as the first direction in the unfolded state. The electronic device may include a flexible display (eg, display 540 in FIG. 5A) that extends from the first surface to the third surface. The electronic device may include a first magnet (eg, first magnet 550 in FIG. 5A) that is located around a third side surface in the first housing structure. The electronic device may include a second magnet (e.g., second magnet 560 in FIG. 5A) whose polarity is different from that of the first magnet and which is positioned around the sixth side surface in the second housing structure so as to face the first magnet when folded. . The electronic device may include at least one electrical path (e.g., electrical path 590 in FIG. 5A or first and second electrical paths 791 and 792 in FIG. 8B) that is located in a recess (e.g., recess 553 in FIG. 5A or recess 801 in Fig. 8B) formed in the first magnet.

[226] According to one embodiment of the invention, the electronic device may further include a first battery (eg, first battery 781 in FIG. 7) that is located between the first surface and the second surface. When viewed over the second surface, the first magnet (eg, the first magnet 751, 752, or 753 in FIG. 7) may be positioned between the third side surface and the first battery.

[227] According to one embodiment of the disclosure, the electronic device may further include a first circuit board (e.g., first circuit board 771 in FIG. 7) that is located between the first surface and the second surface and is located closer to the first side surface than the second side surface, and a second circuit board (eg, second circuit board 772 in FIG. 7) that is closer to the second side surface than the first side surface. When viewed above the second surface, the first battery may be positioned between the first printed circuit board and the second printed circuit board. At least one electrical path (eg, first electrical path 791 and second electrical path 792 in FIG. 7) may electrically connect the first printed circuit board and the second printed circuit board.

[228] According to one embodiment of the invention, the electronic device may further include a second battery (eg, second battery 782 in FIG. 7) that is located between the third surface and the fourth surface. When viewed above the second surface, the second magnet may be positioned between the sixth side surface and the second battery.

[229] According to one embodiment of the invention, the electronic device may further include a third printed circuit board (for example, the third printed circuit board 773 in Fig. 7), which is located between the third surface and the fourth surface and is located closer to the fourth side surface than the fifth side surface, and a fourth circuit board (eg, fourth circuit board 774 in FIG. 7) that is closer to the fifth side surface than the fourth side surface. When viewed over the fourth surface, the second battery may be positioned between the third circuit board and the fourth circuit board.

[230] According to one embodiment of the invention, the first side member may include a first conductive portion (e.g., first conductive portion A1 in FIG. 6) and a second conductive portion (e.g., second conductive portion A2 in FIG. 6) that form part the second side surface, a third conductive part (for example, the third conductive part A3 in Fig. 6), which forms part of the second side surface and a third side surface part, the fourth conductive part (for example, the fourth conductive part A4 in Fig. 6) and the fifth conductive part (for example, the fifth conductive part A5 in Fig. 6), which form part of the first side surface, the sixth conductive part (for example, the sixth conductive part A6 in Fig. 6), which forms part of the first side surface and part of the third side surface, the first an insulating part (for example, the first insulating part 641 in Fig. 6) between the first conductive part and the second conductive part, the second insulating part (for example, the second insulating part 642 in Fig. 6) between the second conductive part and the third conductive part, the third insulating part (for example, the third insulating part 643 in Fig. 6) between the fourth conductive part and the fifth conductive part, the fourth insulating part (for example, the fourth insulating part 644 in Fig. 6) between the fifth conductive part and the sixth conductive part, and a fifth insulating part (for example, the fifth insulating part 645 in Fig. 6) between the third conductive part and the sixth conductive part.

[231] According to one embodiment of the invention, the second side member may include a seventh conductive portion (e.g., seventh conductive portion A7 in FIG. 6) and an eighth conductive portion (e.g., eighth conductive portion A8 in FIG. 6) that form a part the fifth side surface, the ninth conductive part (for example, the ninth conductive part A9 in Fig. 6), which forms the fifth side surface part and the sixth side surface part, the tenth conductive part (for example, the tenth conductive part A10 in Fig. 6), and the eleventh conductive a part (for example, the eleventh conductive part A11 in Fig. 6) that forms part of the fourth side surface, a twelfth conductive part (for example, the twelfth conductive part of part A12 in Fig. 6) that forms part of the fourth side surface and a part of the sixth side surface, the sixth insulating part (for example, the sixth insulating part 646 in Fig. 6) between the seventh conductive part and the eighth conductive part, the seventh insulating part (for example, the seventh insulating part 647 in Fig. 6) between the eighth conductive part and the ninth conductive part, the eighth insulating part (for example, the eighth insulating part 648 in Fig. 6) between the tenth conductive part and the eleventh conductive part, the ninth insulating part (for example, the ninth insulating part 649 in Fig. 6) between the eleventh conductive part and the twelfth conductive part, and the tenth insulating part (for example, the tenth insulating part 650 in Fig. 6) between the ninth conductive part and the twelfth conductive part. The first insulating part and the sixth insulating part, the second insulating part and the seventh insulating part, the third insulating part and the eighth insulating part, the fourth insulating part and the ninth insulating part, and the fifth insulating part and the tenth insulating part can be practically aligned in the folded state.

[232] According to one embodiment of the disclosure, the electronic device may further include a first circuit board (e.g., first circuit board 771 in FIG. 7) that is located between the first surface and the second surface and is located closer to the first side surface than the second side surface, and a second circuit board (eg, second circuit board 772 in FIG. 7) that is closer to the second side surface than the first side surface. At least one electrical path (eg, first electrical path 791 and second electrical path 792 in FIG. 7) may electrically connect the first printed circuit board and the second printed circuit board.

[233] According to one embodiment of the disclosure, the at least one electrical path may include a first terminal (e.g., first terminal 7911 in FIG. 8A) that is electrically connected to the first printed circuit board and a second terminal (e.g., second terminal 7912 in Fig. 8A), which is electrically connected to the second circuit board. When viewed above the second surface, the second lead may be located closer to the third side surface (eg, third side surface 731 in FIG. 7) than to the hinge structure.

[234] According to one embodiment of the disclosure, the electronic device may further include at least one wireless communication circuit (e.g., wireless communication circuit 680 in FIG. 6) that is located on a first circuit board (e.g., the first circuit board 771 in Fig. 7) is electrically connected to the second conductive part (eg, the second conductive part B2 in Fig. 7) by at least one electrical path and is configured to transmit and/or receive first band signals.

[235] According to one embodiment of the invention, the second printed circuit board (for example, the second printed circuit board 772 in Fig. 8A) can be electrically connected to the first position (for example, with the protruding fragment 802a in Fig. 8B) on the second conductive part, which is closer to the second insulating part (for example, the second insulating part 742 in Fig. 7) than to the first insulating part (for example, the first insulating part 741 in Fig. 7).

[236] According to one embodiment of the disclosure, at least one wireless communication circuit may be electrically connected to the third conductive part (e.g., the third conductive part B3 in FIG. 8A) via at least one electrical path (e.g., the first electrical path 791 and second electrical path 792 in Figure 8A) and may be configured to transmit and/or receive second frequency band signals.

[237] According to one embodiment of the invention, the second printed circuit board (for example, the second printed circuit board 772 in Fig. 8A) can be electrically connected to the second position (for example, the protruding fragment 803a, 803b or 803c) on the third conductive part, which is close to the second insulating part (for example, the second insulating part 742 in Fig. 8A).

[238] According to one embodiment of the invention, the first magnet may be positioned around a portion of the third conductive portion (eg, third conductive portion B3 in FIG. 7) that forms the third side surface.

[239] According to one embodiment of the invention, the first magnet may be positioned around a portion of the sixth conductive portion (eg, the sixth conductive portion B6 in FIG. 7) that forms the third side surface.

[240] According to one embodiment of the invention, when viewed over the second surface, the first magnet may at least partially overlap the display.

[241] According to one embodiment of the invention, when viewed over the fourth surface, the second magnet may at least partially overlap the display.

[242] According to one embodiment of the invention, one surface (for example, one surface 551 in Fig. 5B) of the first magnet, directed in the first direction, may differ in shape from one surface (for example, one surface 561 in Fig. 5B) of the second magnet, directed in the third direction.

[243] According to one embodiment of the invention, at least one electrical path may include a coaxial cable.

[244] According to one embodiment of the disclosure, the at least one electrical path may include a flexible printed circuit board (FPCB) (e.g., electrical path 1091 in FIG. 10A) that is electrically coupled to a key input device (e.g., key input device 1090 in Fig. 10A).

[245] While the disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will appreciate that various changes in form and content may be made without departing from the spirit and scope of the disclosure as defined by the appended claims and its equivalents.

Claims (29)

1. Foldable portable communication device (20, 50, 60, 70) with a flexible display for user interaction, containing: body (200) folding relative to the axis of folding and including the first part (210, 510, 610, 710) of the body and the second part (220, 520, 620, 720) of the body, the first part of the body having the first side wall (631, 731) substantially parallel to the fold axis, a second side wall (611) extending from the first end of the first side wall and substantially perpendicular to the fold axis, and a third side wall (621) extending from the second end of the first side wall and substantially perpendicular to the fold axis. ; a hinged structure (530, 630) connected to the first housing part and the second housing part; a flexible display (300) including a first display part located in the first housing part and a second display part located in the second housing part; a plurality of magnets including a first magnet (751, 752, 753) and a second magnet (761, 762, 763), wherein the first magnet is placed in the first part of the housing and is located along a part of the first side wall, and the second magnet is placed in the second part housing and facing the first magnet when the housing is folded; battery (781), placed in the first part of the housing, and at least part of the battery is located between the first magnet and the hinge structure; a plurality of printed circuit boards (PCBs) (771, 772) disposed in the first case portion and including a first PCB located between the battery and the second side wall and a second PCB located between the battery and the third side wall; a wireless communication circuit located on the first PCB; And the first electrical path (791) and the second electrical path (792) located in the first housing part and electrically connected to the wireless communication circuit and the second printed circuit board, wherein at least a part of the first electrical path and a part of the second electrical path are located between the first magnet and the battery , wherein part of the first electrical path is laid on a portion of the second electrical path in the space between the first magnet and the battery. 2. Foldable portable communication device according to claim 1, in which the first side wall contains a non-conductive part and a conductive part located between the non-conductive part and the third side wall, and the conductive part is configured to work as at least part of the antenna; And wherein, when viewed in a direction substantially perpendicular to the first side wall, the first magnet at least partially overlaps the conductive portion and substantially does not overlap the non-conductive portion. 3. Foldable portable communication device according to claim 1 or 2, in which the third side wall includes another non-conductive part and another conductive part located between the conductive part and the other non-conductive part, while the other conductive part extends from the conductive part and is configured to work together with the conductive part as at least parts of the antenna. 4. Foldable portable communication device according to claim 3, wherein the other conductive part includes a conductive part protruding towards the battery side and in contact with the second PCB. 5. Foldable portable communication device according to claim 4, wherein the first distance between the conductive part and the other non-conductive part is shorter than the second distance between the conductive part and the non-conductive part. 6. Folding portable communication device according to any one of paragraphs. 2-4, in which the second PCB includes a connector mounted thereon and connected to a connection terminal of the first electrical path; And wherein the third distance between the connector and the other non-conductive part is shorter than the fourth distance between the connector and the non-conductive part. 7. Foldable portable communication device according to any one of paragraphs. 2-6, which also includes an internal non-conductive part located between the conductive part and the first magnet. 8. Foldable portable communication device according to claim 6, wherein the internal non-conductive part is integral with the non-conductive part or is physically connected to the non-conductive part. 9. The foldable portable communication device according to any one of the preceding claims, in which the plurality of magnets includes a third magnet placed in the first part of the body and located at a distance from the first magnet along the first side wall, and a fourth magnet placed in the second part of the body and located in a different position corresponding to the third magnet; And wherein the first side wall includes another conductive portion located between the conductive portion and the second side wall; And wherein, when viewed in a direction substantially perpendicular to the first side wall, the third magnet at least partially overlaps with the other conductive part and does not substantially overlap with the non-conductive part.

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