KR20230109522A - Electronic device comprising antenna - Google Patents

Abstract

According to an embodiment, an electronic device includes a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure, disposed inside the housing A magnet structure comprising a magnet and a conductive coating member enclosing a surface of the magnet; and a wireless communication circuit electrically connected to the conductive coating member, wherein the magnet is disposed such that the first housing and the second housing are maintained in a folded state, and the wireless communication circuit comprises: By feeding power to a portion of the conductive coating members of the magnet structure, signals of a designated first frequency band may be transmitted and/or received using at least one of the conductive coating members as a first antenna radiator.
In addition to this, various embodiments identified through the specification are possible.

Description

Electronic device comprising an antenna {ELECTRONIC DEVICE COMPRISING ANTENNA}

Various embodiments disclosed in this document relate to an electronic device including an antenna.

Electronic devices including various types of displays are being developed to satisfy users' portability and convenience. For example, an electronic device may include a foldable display. An electronic device including a foldable display (hereinafter referred to as a foldable electronic device) can secure portability through a reduction of the display by folding a housing and a display of the electronic device in half.

Also, the foldable electronic device may include a plurality of magnets to maintain a folded state. For example, when the foldable electronic device is in a folded state, a plurality of magnets disposed at the edge of each housing may be adjacent to each other, thereby maintaining the foldable electronic device in a folded state.

Electronic devices include antenna modules supporting wireless communication services of various frequency bands, for example, 3G, 4G, or 5G services. Meanwhile, a processor (eg, CP, communication processor) of the electronic device communicates with the base station and determines a communication method to be used in the electronic device. For example, the wireless communication circuitry of the electronic device may communicate with the base station using one or more of a 3G/4G communication method or a 5G communication method.

In the foldable electronic device, a plurality of magnets may be located in an area adjacent to an edge of the housing to sustain the foldable structure. However, due to the plurality of magnets positioned adjacent to the edge of the housing, the effective volume of the antenna may be relatively reduced.

Also, in order to improve the performance of the antenna of the electronic device, the antenna may be spaced apart from the plurality of magnets, but the size of the foldable electronic device may increase due to the distance between the antenna and the plurality of magnets.

Various embodiments disclosed in this document may provide an electronic device capable of securing an effective volume of an antenna while including a magnet.

According to various embodiments disclosed in this document, an electronic device includes a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure; a magnet structure disposed inside the housing, the magnet structure including a magnet and a conductive coating member enclosing a surface of the magnet; and a wireless communication circuit electrically connected to the conductive coating member, wherein the magnet is disposed such that the first housing and the second housing are maintained in a folded state, and the wireless communication circuit comprises: By feeding power to a portion of the conductive coating member of the magnet structure, a signal of a designated first frequency band may be transmitted and/or received using the conductive coating member as an antenna radiator.

According to various embodiments disclosed in this document, an electronic device includes a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure; A part of the edge of the first housing includes a conductive portion, and a magnet structure disposed in an area adjacent to the conductive portion of the edge of the first housing inside the housing, the magnet structure comprising a magnet ( including a magnet and a conductive coating member enclosing the surface of the magnet; and a wireless communication circuit disposed on a printed circuit board (PCB) and electrically connected to the conductive coating member, wherein the magnet may maintain a folded state in which the first housing and the second housing are folded. A portion of the conductive coating member of the magnet structure is electrically connected to the conductive portion of the edge of the first housing, and another portion is electrically connected to the ground of the PCB, and the wireless communication circuit , By feeding power to a portion of the conductive portion, a signal of a fourth frequency band designated based on a second electrical path including the conductive portion and the conductive coating member electrically connected to the ground may be transmitted and/or received. .

According to various embodiments disclosed in this document, an electronic device includes a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure; A part of the edge of the first housing includes a conductive portion, and a magnet structure disposed in an area adjacent to the conductive portion of the edge of the first housing inside the housing, the magnet structure being a magnet. ) and a conductive coating member enclosing the surface of the magnet; and a wireless communication circuit disposed on a printed circuit board (PCB) and electrically connected to the conductive coating member, wherein the magnet may maintain a folded state in which the first housing and the second housing are folded. Both ends of the conductive portion of the first edge of the first housing are electrically connected to the PCB, and the magnet structure is electrically connected to a portion of the conductive portion of the first edge of the first housing. And, the wireless communication circuit, by feeding power to the conductive portion of the first housing, a fifth frequency band designated based on a third electrical path including the conductive portion and the conductive coating member electrically connected to the conductive portion. A signal may be transmitted and/or received.

According to various embodiments disclosed in this document, an electronic device may provide an antenna capable of securing an effective volume while using at least one magnet.

Also, according to various embodiments, an electronic device may provide an electronic device in which the performance of an antenna is secured while the size of the electronic device is reduced.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is a diagram illustrating front and rear views of an electronic device in an unfolded state according to an exemplary embodiment.
2 is a perspective view of an electronic device in a folded state according to an exemplary embodiment;
3 shows the inside of the first housing according to one embodiment.
4 shows a magnet structure according to one embodiment.
5 is a cross-sectional view of the magnet structure of FIG. 4 according to an embodiment.
6 is a cross-sectional view of the magnet structure of FIG. 4 according to another embodiment.
7 is a cross-sectional view of the magnet structure of FIG. 4 according to another embodiment.
8 is a perspective view of the magnet structure of FIG. 7 according to an embodiment.
9 is a cross-sectional view of the magnet structure of FIG. 7 according to another embodiment.
10 is a graph comparing antenna performances of magnet structures according to an embodiment.
11 is a graph comparing performances of first antennas according to an embodiment.
12 is a graph comparing performance of a second antenna according to an embodiment.
13 is a graph comparing performance of a third antenna according to an embodiment.
14 is a graph comparing radiation efficiencies of a first magnet antenna and a radiator of a second antenna according to an exemplary embodiment.
15 shows a magnet structure according to another embodiment.
16 is a cross-sectional view taken along line AA' of the magnet structure of FIG. 15 according to an embodiment.
17 shows a magnet structure according to another embodiment.
18 is a cross-sectional view taken along line BB′ of the magnet structure of FIG. 17 according to an embodiment.
19 is a graph comparing antenna performances of second magnet antennas according to an embodiment.
20 is a graph comparing performance of a first antenna according to an embodiment.
21 is a graph comparing performances of third antennas according to an embodiment.
22 is a graph comparing radiation efficiencies of a first magnet antenna and a radiator of a second antenna according to an embodiment.
23 shows a magnet structure according to one embodiment.
24 is a cross-sectional view taken along line C-C′ of the magnet structure of FIG. 23 according to an embodiment.
25 illustrates a magnet structure and a switching module according to one embodiment.
26 is a graph comparing radiation efficiency of magnet antennas according to an embodiment.
27 is a graph comparing reflection coefficients of first magnet antennas according to an embodiment.
28 illustrates a magnet of a magnet structure according to an embodiment.
29 is a graph comparing radiation performances of first magnet antennas according to types of structures of FIG. 28 according to an embodiment.
30 is a front view of an electronic device according to another embodiment.
31 illustrates a computer device according to another embodiment.
32 is a diagram illustrating an electronic device in a network environment according to an embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to the specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is a diagram illustrating front and rear views of an electronic device in an unfolded state according to an exemplary embodiment.

Referring to FIG. 1 , an electronic device 100 according to an embodiment may include a housing 110 and a flexible display 120 disposed in the housing 110 . In this document, the surface on which the flexible display 120 is disposed is defined as the front of the electronic device 100 . And, the opposite side of the front side is defined as the back side of the electronic device 100 . In addition, a surface surrounding the space between the front and rear surfaces is defined as a side surface of the electronic device 100 .

In one embodiment, the housing 110 may include a first housing 111 and a second housing 112 . The first housing 111 and the second housing 112 may form at least a portion of a front surface, at least a portion of a rear surface, and at least a portion of a side surface of the electronic device 100 .

According to an embodiment, the flexible display 120 may be positioned on at least a portion of the front surfaces of the first housing 111 and the second housing 112 .

According to an embodiment, the first housing 111 and the second housing 112 may include a rear cover 160 forming a rear surface of the electronic device 100 . For example, the first housing 111 may include a first rear cover 161 and the second housing 112 may include a second rear cover 162 .

In one example, the first rear cover 161 of the first housing 111 and the second rear cover 162 of the second housing 112 may form at least a portion of the rear surface of the electronic device 100. .

In one embodiment, the rear cover 160 has been described as a component included in the housing 110 of the electronic device 100, but in another embodiment, the rear cover 160 may be formed as a separate component from the housing 110. can

In one embodiment, the rear cover 160 may include an insulating material (eg, plastic resin). In another embodiment, the rear cover 160 may include a conductive material (eg, aluminum).

According to one embodiment, the first housing 111 and the second housing 112 are disposed on both sides around a folding axis (eg, the first axis) parallel to the x-axis, and the folding axis (eg, the first axis) axis) may have an overall symmetrical shape with respect to However, it is not limited to a symmetrical shape, and the first housing 111 and the second housing 112 may have an asymmetrical shape with respect to the folding axis (eg, the first axis).

According to an embodiment, the electronic device 100 may have an unfolded state (100A), a folded state (100B), and/or an intermediate state. In one embodiment, the state of the electronic device 100 may vary according to an angle or a distance between the first housing 111 and the second housing 112 . For example, a state in which the first housing 111 and the second housing 112 are disposed at an angle of 180 degrees may be an unfolded state (100A). For another example, a state in which the first housing 111 and the second housing 112 face each other may be a folded state 100B or a folded state 100B. A folded state 100B of the electronic device 100 is shown in FIG. 2 .

As another example, a state in which the first housing 111 and the second housing 112 are disposed at a certain angle to each other may be an intermediate state. However, specific angles formed by the first housing 111 and the second housing 112 in the folded state and the unfolded state are for convenience of explanation, and are not limited thereto.

In one embodiment, the first housing 111 may include a first edge 111a adjacent to the folding axis (eg, the first axis) and substantially parallel to the folding axis, and the second housing 112 may include a second edge 112a adjacent to the folding axis (eg, the first axis) and substantially parallel to the folding axis. In one embodiment, when the electronic device 100 is in an unfolded state, the first edge 111a of the first housing 111 is in contact with the second edge 112a of the second housing 112 or is separated by a predetermined distance. can be separated from each other.

In one embodiment, the first housing 111 and/or the second housing 112 may include a conductive part (eg, metal).

According to one embodiment, the first housing 111 may include a first conductive portion 141 . In one embodiment, the first conductive portion 141 may be formed to correspond to the first edge 111a of the first housing 111 . For example, the first conductive portion 141 may be formed along the first edge 111a of the first housing 111 .

According to one embodiment, the second housing 112 may include a second conductive portion 142 . In one embodiment, the second conductive portion 142 may be formed to correspond to the second edge 112a of the second housing 112 . For example, the second conductive portion 142 may be formed along the second edge 112a of the second housing 112 .

In one embodiment, when the electronic device 100 is in an unfolded state, the first conductive portion 141 and the second conductive portion 142 may contact each other or may be separated from each other by a predetermined distance.

However, the first conductive portion 141 and the second conductive portion 142 shown in FIG. 1 are for convenience of explanation, and the first conductive portion 141 and the second conductive portion 142 have various sizes and shapes. can have

In one embodiment, at least a portion of the first housing 111 and the second housing 112 is formed of a metal material (eg, aluminum) or a non-metal material having a stiffness of a size selected to support the flexible display 120. It can be.

In one embodiment, the housing 110 and the flexible display 120 may form an internal space in which various parts (eg, a printed circuit board or a battery) of the electronic device 100 may be disposed. For example, the internal space of the electronic device 100 may be formed by the flexible display 120 , side members of the housing 110 , and the rear cover 160 .

According to one embodiment, the flexible display 120 may be disposed on the housing 110 . For example, the flexible display 120 may be seated on a recess formed by the housing 110 and form most of the front surface of the electronic device 100 . In one embodiment, the flexible display 120 may include a first area 121 and a second area 122 . The first area 121 and the second area 122 of the flexible display 120 may be divided based on a first axis serving as a standard for folding or unfolding the electronic device 100 . The division of regions of the flexible display 120 shown in FIG. 1 is exemplary, and in another embodiment, the flexible display 120 may be divided into two or more regions according to a structure or function. For example, the flexible display 120 includes a folding area having a predetermined curvature when the electronic device 100 is folded around a folding axis (eg, a first axis), and a first housing 111 based on the folding area. It can be divided into a first region 121 located in and a second region 122 located in the second housing 112 . The first region 121 and the second region 122 may have generally symmetrical shapes around a folding axis (eg, the first axis).

According to an embodiment, the arrangement structure of the first area 121 and the second area 122 of the flexible display 120 may vary according to the state of the electronic device 100 . For example, when the electronic device 100 is in an unfolded state, the first area 121 and the second area 122 of the flexible display 120 form an angle of 180 degrees to each other and are in the same direction (eg : -y direction).

For another example, when the electronic device 100 is in a folded state, the first area 121 and the second area 122 of the flexible display 120 have a narrow angle (eg, at 0 degrees). between 10 degrees) and can face each other. For another example, when the electronic device 100 is in an intermediate state, the angle between the first region 121 and the second region 122 of the flexible display 120 is greater than that of the folded state and smaller than that of the unfolded state. can form In this case, at least a portion of the flexible display 120 may be formed of a curved surface having a predetermined curvature, and the curvature at this time may be smaller than that in a folded state.

However, the specific angle formed by the first region 121 and the second region 122 in the above-described folded state and unfolded state is for convenience of description, and is not limited thereto.

According to an embodiment, the electronic device 100 may include a camera hole 150 and/or a sub display 151.

In one embodiment, the camera hole 150 may correspond to a hole through which at least one lens of the camera module 180 is exposed. Light from the outside of the electronic device 100 may be incident to the camera module 180 disposed inside the electronic device 100 through the camera hole 150 . In one embodiment, the camera hole 150 may be disposed parallel to the first axis (eg, the x-axis). For example, it may be disposed adjacent to an edge of the first housing 111 opposite to the first edge 111a. However, the arrangement of the camera hole 150 is not limited thereto. In another embodiment, the camera hole 150 may be disposed parallel to a second axis (eg, y-axis) perpendicular to the first axis. For example, it may be disposed along the edge of the first housing 111 perpendicular to the first edge 111a.

In an embodiment, the sub display 151 may display a designated object (eg, the current time or the remaining battery level of the electronic device 100). In one embodiment, the sub display 151 may be turned off in a unfolded state and turned on in a folded state. As another example, the sub display 151 may be turned on regardless of its state. According to one embodiment, the size of the sub display 151 is not limited to the size shown in FIG. 1 . For example, when the camera hole 150 is disposed parallel to the second axis, the sub display 151 may have a length corresponding to that of a camera module disposed parallel to the second axis.

2 is a perspective view of an electronic device in a folded state according to an exemplary embodiment;

Referring to FIG. 2 , the electronic device 100 according to an embodiment may include a hinge cover 130. For example, the hinge cover 130 may be disposed between the first housing 111 and the second housing 112 to cover an internal part (eg, a hinge structure).

In one embodiment, at least a portion of the hinge cover 130 may be covered by portions of the first housing 111 and the second housing 112 or exposed to the outside according to the state of the electronic device 100 . For example, when the electronic device 100 is in an unfolded state, the hinge cover 130 may not be exposed because it is covered by the first housing 111 and the second housing 112 . As another example, when the electronic device 100 is in a folded state, the hinge cover 130 may be exposed to the outside by a first width w1 between the first housing 111 and the second housing 112. . For another example, when the first housing 111 and the second housing 112 are in an intermediate state in which the first housing 111 and the second housing 112 are folded with a certain angle, the hinge cover 130 is the first housing ( 111) and the second housing 112 may be partially exposed to the outside. However, the width of the portion exposed to the outside of the hinge cover 130 in the intermediate state may be smaller than the width length (eg, the first width w1 ) exposed to the outside in the folded state. In one embodiment, the hinge cover 130 may include a curved surface. In one embodiment, the hinge cover 130 may include a conductive material (eg, aluminum).

In one embodiment, the internal structure between the hinge cover 130 and the first conductive portion 141 is not shown in the drawing, but in reality, the first conductive portion 141 has a predetermined distance from the hinge cover 130 can be separated As another example, the second conductive portion 142 may actually be spaced apart from the hinge cover 130 by a predetermined distance.

3 shows the inside of the first housing according to one embodiment.

Referring to FIG. 3 according to an embodiment, the electronic device 100 includes a hinge structure 350, a magnet 310, a plurality of antenna radiators 320, a PCB 330, and/or a wireless communication circuit (not shown). ) may be included.

According to an embodiment, the electronic device 100 includes a battery 341, a front camera module 342, a rear camera module 343, a microphone module 344, a receiver (RCV) 345, and/or a vibration motor. A sensor 346 may be further included, but is not limited thereto. For example, the electronic device 100 may further include a speaker module (not shown).

In one embodiment, the first battery 341, the front camera module 342, the rear camera module 343, the microphone module 344, the receiver 345, and/or the vibration motor sensor (Motor, 346) are electronic It can be disposed within the first housing 111 of the device 100. For another example, a second battery (not shown) may be disposed within the second housing 112 of the electronic device 100 .

According to one embodiment, the hinge structure 350 may physically connect the first housing 111 and the second housing 112 . In one embodiment, the hinge structure 350 may physically connect the first housing 111 and the second housing 112 to be rotatable. For example, the first housing 111 and the second housing 112 may be rotatably connected about a first axis by a hinge structure 350 .

According to one embodiment, the first housing 111 includes a first edge 300a, a second edge 300b opposite to the first edge, a third edge 300c opposite to the hinge structure 350, and a first edge 300a. A fourth edge 300d connecting the edge 300a and the third edge 300c and/or a fifth edge 300e connecting the second edge 300b and the third edge 300c may be included. there is.

According to one embodiment, a portion of the edge of the first housing 111 may include a conductive part and a non-conductive part.

In an embodiment, the first edge 300a, the second edge 300b, the third edge 300c, the fourth edge 300d, and the fifth edge 300e may be formed as conductive parts. For example, the first edge 300a, the second edge 300b, the third edge 300c, the fourth edge 300d, and the fifth edge 300e may be formed of a metal member.

In one embodiment, a first boundary portion 301a where the first edge 300a and the fourth edge 300d meet, and a second boundary portion 301b where the fourth edge 300d and the third edge 300c meet. , the third boundary portion 301c where the third edge 300c and the fifth edge 300e meet, and the fourth boundary portion 301d where the fifth edge 300e and the second edge 300b meet are non-conductive. It can be formed in parts. In one embodiment, the first boundary portion 301a, the second boundary portion 301b, the third boundary portion 301c, and the fourth boundary portion 301d may be formed as segmented parts. For another example, a dielectric material may be formed on the first boundary portion 301a, the second boundary portion 301b, the third boundary portion 301c, and the fourth boundary portion 301d.

According to an embodiment, the electronic device 100 may use a conductive portion formed on a part of an edge of the first housing 111 as an antenna radiator.

According to an embodiment, a PCB 330 may be disposed inside the electronic device 100, and a wireless communication circuit may be disposed on the PCB 330. In one embodiment, the wireless communication circuit disposed on the PCB 330 is electrically connected to the plurality of antenna radiators 320 using a portion of the edge of the first housing 111 to transmit and/or transmit signals of a designated frequency band. or receive.

According to an embodiment, the electronic device 100 may include a plurality of antenna radiators 320 . For example, the plurality of antenna radiators 320 include a first antenna radiator 321, a second antenna radiator 322, a third antenna radiator 323, a fourth antenna radiator 324, or a fifth antenna radiator ( 325) may be included.

According to an embodiment, the plurality of antenna radiators 320 may be LB (low band, eg, within about 600 MHz to about 1,000 MHz), MB (middle band, eg, within about 1,500 MHz to about 2,200 MHz), HB (high band) band, eg, within about 1,900 MHz to about 2,400 MHz), and/or signals of a new radio (NR) band may be transmitted and/or received.

According to an embodiment, the NR band may include signals of the n77 band (eg, within about 3,300 MHz to about 4,200 MHz) and/or the n78 band (eg, within about 3,300 to about 3,800 MHz).

In an embodiment, the plurality of antenna radiators 320 may include a first edge 300a, a second edge 300b, a third edge 300c, a fourth edge 300d, and/or a fifth edge 300a where conductive parts are formed. It may be formed on the edge 300e.

According to an embodiment, the first antenna radiator 321 may be formed on the first edge 300a. In one embodiment, the wireless communication circuit transmits a signal of a designated frequency band using the first antenna radiator 321 by feeding power to a portion of the first antenna radiator 321 formed on the first edge 300a and/or can receive it. For example, the wireless communication circuit may transmit and/or receive signals of the LB, MB, HB, and/or NR bands using the first antenna radiator 321 including a switch and a matching circuit. there is.

According to an embodiment, the second antenna radiator 322 may be formed on the fourth edge 300d. In one embodiment, the wireless communication circuit transmits and/or receives signals of a designated frequency band by using the fourth edge 300d as the second antenna radiator 322 by feeding a part of the fourth edge 300d. can For example, the wireless communication circuit may transmit and/or receive signals within the MB to NR bands using the second antenna radiator 322 .

According to an embodiment, the third antenna radiator 323 may be formed on the third edge 300c. In one embodiment, the wireless communication circuit transmits and/or receives signals of a designated frequency band by using the third edge 300c as a third antenna radiator 323 by feeding power to a portion of the third edge 300c. can For example, the wireless communication circuit may be used as the third antenna radiator 323 to transmit and/or receive signals of the LB, MB, and/or HB.

According to an embodiment, the fourth antenna radiator 324 may be formed on the fifth edge 300e. In one embodiment, the wireless communication circuit transmits and/or receives signals of a designated frequency band by using the fifth edge 300e as the fourth antenna radiator 324 by feeding power to a portion of the fifth edge 300e. can For example, the wireless communication circuit uses the fourth antenna radiator 324 to provide GPS (for example, about 1.5 GHz), 2.5G WIFI (for example, within about 2.4 GHz to about 2.6 GHz), and 5G WIFI (for example, about 2.6 GHz). 5 GHz) signals can be transmitted and/or received.

According to an embodiment, the fifth antenna radiator 325 may be formed on the second edge 300b. In one embodiment, the wireless communication circuit transmits and/or receives signals of a designated frequency band by using the second edge 300b as the fifth antenna radiator 325 by feeding a part of the second edge 300b. can For example, the wireless communication circuit transmits and/or receives signals of the NR band (eg, the n77 band or the n78 band) by using the second edge 300b as the fifth antenna radiator 325. can

A signal transmitted and/or received by each antenna radiator is only an example and is not limited thereto. For example, the wireless communication circuit may use the fourth edge 300d as the second antenna radiator 322 to transmit and/or receive signals of GPS (eg, 1.5 GHz), WIFI 2.4G, and WIFI 5G. there is.

The antenna radiator 320 included in the electronic device 100 has been described with the first antenna radiator 321 to the fifth antenna radiator 325 as examples, but is not limited thereto. For example, the electronic device 100 may further include a sixth antenna radiator 326 and a seventh antenna radiator 327 disposed inside the electronic device 100 .

According to an embodiment, the sixth antenna radiator 326 may be disposed in an area on the PCB 330 adjacent to the rear camera module 343 and the second edge 300b. In one embodiment, the sixth antenna radiator 326 may transmit and/or receive signals in a designated frequency band. For example, the sixth antenna radiator 326 may transmit and/or receive the WIFI 5G signal.

According to an embodiment, the seventh antenna radiator 327 may be disposed on the PCB 330 adjacent to the hinge structure 350 between the battery 341 and the first edge 300a. In one embodiment, the seventh antenna radiator 327 may transmit and/or receive signals in a designated frequency band. For example, the seventh antenna radiator 327 can transmit and/or receive the WIFI 2.4G signal.

According to an embodiment, the electronic device 100 may include a magnet 310 for maintaining a folded state (eg, a folded state 100B of FIG. 2 ) of the electronic device 100 . For example, the electronic device 100 may include a first magnet 311 and/or a second magnet 312 . As another example, the electronic device 100 may include only the first magnet 311 . For another example, the electronic device 100 may include a first magnet 311 , a second magnet 312 , and a third magnet 313 .

According to an embodiment, the magnet 310 may be disposed in one area inside the electronic device 100 . In one embodiment, the magnet 310 may be disposed inside the electronic device 100 adjacent to the edge of the first housing 111 . For example, among the magnets 310, the first magnet 311 may be disposed surrounded by the conductive portion of the fourth edge 300d. For example, the second magnet 312 of the magnets 310 may be disposed surrounded by the conductive portion of the fifth edge 300e.

As another example, the third magnet 313 of the magnets 310 is adjacent to the third edge 300c and is adjacent to the microphone module 344 and the motor sensor 346 and is a region inside the electronic device 100. can be placed in

According to one embodiment, the magnet 310 may be arranged so that the first housing 111 and the second housing 112 can maintain a folded state (eg, a folded state 100B of FIG. 2 ). there is. For example, when the edge of the first housing 111 is in contact with the edge (not shown) of the second housing 112 in the folded state 100B, the first housing disposed adjacent to the edge of the first housing 111 The magnet 311 may be attached by attraction between a fourth magnet (not shown) disposed adjacent to the edge of the second housing 112 and the magnet. For example, the second magnet 312 distinguished from the first magnet 311 disposed adjacent to the edge of the first housing 111 is a third magnet disposed adjacent to the edge of the second housing 112 ( It may be attached by attraction between a fifth magnet (not shown) and the magnet (not shown).

For example, the edge of the first housing 111 and the edge of the second housing 112 may maintain a state of being adjacent to each other by the attraction between the magnets 310 disposed at the edge of each housing 110 .

According to an embodiment, the edge of the first housing 111 and the edge of the second housing 112 are attached by the magnet 310, so that a force greater than the magnetic force of the magnet is applied from the outside to unfold the electronic device 100. Until lost, the electronic device 100 may maintain the folded state 100B.

As the folded state 100B is maintained by the magnet 310, the electronic device 100 can provide a user with a portable electronic device.

According to an embodiment, the electronic device 100 may use a magnet structure including at least one of the magnets 310 as an antenna radiator. For example, the electronic device 100 may use a magnet structure including the first magnet 311 (eg, the magnet structure 410 of FIG. 4 ) as an antenna radiator.

According to one embodiment, specific embodiments related to the magnet structure 410 used as an antenna radiator will be described in detail with reference to FIGS. 4 to 24 .

4 shows a magnet structure according to one embodiment.

According to an embodiment, the electronic device 100 may include a plurality of antenna radiators 320 and a magnet structure 410 .

According to an embodiment, the electronic device 100 may use at least a portion of the magnet structure 410 as an antenna radiator. According to an embodiment, the wireless communication circuit of the electronic device 100 uses a conductive coating member (eg, the conductive coating member 412 of FIG. 5 ) of the magnet structure 410 to transmit a designated frequency band. A signal may be transmitted and/or received.

According to an embodiment, the magnet structure 410 may include at least one magnet among the magnets 310 and a conductive coating member 412 enclosing a surface of the at least one magnet. For example, the magnet structure 410 may include a first magnet 311 and a conductive coating member 412 covering a surface of the first magnet 311 . According to an embodiment, the magnet structure 410 may be disposed inside the electronic device 100. For example, the magnet structure 410 may be disposed in an area adjacent to the conductive portion of the fourth edge 300d of the first housing 111 . In one embodiment, the magnet structure 410 may be formed surrounded by the conductive portion of the fourth edge 300d. For example, the magnet structure 410 may be disposed in an inner space between the conductive portion of the fourth edge 300d and the PCB 330 .

According to one embodiment, the magnet structure 410 has been described as being disposed in an area adjacent to the fourth edge 300d of the first housing 111, but is not limited thereto. For example, the magnet structure 410 may be disposed in an area adjacent to the fifth edge 300e of the first housing 111 .

According to an embodiment, the magnet structure 410 may include a magnet 411 (eg, the magnet 310 and/or the first magnet 311 of FIG. 3 ) and a conductive coating member applied to the surface of the magnet 411 (eg, the magnet 310 and/or the first magnet 311). : The conductive coating member 412 of FIG. 5) may be included.

In one embodiment, the conductive coating member 412 may be formed enclosing the surface of the magnet 411 .

In one embodiment, magnet 411 may refer to magnet 310 of FIG. 3 .

According to one embodiment, the magnet structure 410 has been described as including one magnet 411, but is not limited thereto. According to one embodiment, the magnet structure 410 may include a plurality of magnets. For example, the magnet structure 410 includes the first magnet 311 of FIG. 3 , the conductive coating member applied to the first magnet 311 , the second magnet 312 , and the second magnet 312 applied to the magnet structure 410 . A conductive coating member may be included.

According to one embodiment, the magnet structure 410 may be electrically connected to a wireless communication circuit disposed on the PCB 330. For example, as a portion of the conductive coating member 412 of the magnet structure 410 extends to the PCB 330, the conductive coating member 412 of the magnet structure 410 may be electrically connected to the wireless communication circuit. As another example, the conductive coating member 412 of the magnet structure 410 may be electrically connected to the wireless communication circuit on the PCB 330 by a conductive connection member (eg, c-clip).

According to an embodiment, the electronic device 100 may use a structure (not shown) disposed inside the electronic device 100 as an antenna radiator. In one example, the electronic device 100 may use at least a portion of the magnet structure 410 as an antenna radiator.

According to an embodiment, the wireless communication circuit may transmit and/or receive signals of a designated frequency band by using the magnet structure 410 of the first housing 111 as an antenna radiator. For example, the wireless communication circuit transmits and/or receives signals of a designated frequency band by using the magnet structure 410 adjacent to the conductive portion of the fourth edge 300d of the first housing 111 as an antenna radiator. can

According to one embodiment, the magnet structure 410 has been described taking the magnet structure 410 disposed adjacent to the fourth edge 300d of the first housing 111 as an example, but is not limited thereto. As another example, the wireless communication circuit may include a magnet structure 410 disposed inside the electronic device 100 while being spaced apart from the fifth edge of the first housing 111 (eg, the fifth edge 300e of FIG. 3 ). can be used as an antenna radiator.

In one embodiment, the wireless communication circuit may use the conductive coating member 412 of the magnet structure 410 as an antenna radiator by feeding power to the conductive coating member 412 of the magnet structure 410 . For example, the wireless communication circuit supplies signals of a designated first frequency band by using the conductive coating member 412 as a first antenna radiator by feeding power to a portion of the conductive coating member 412 through the first power supply unit F1. can be transmitted and/or received.

According to one embodiment, a portion of the conductive coating member 412 of the magnet structure 410 may be electrically connected to the wireless communication circuit through the first power supply unit F1. For example, the first power supply unit F1 of FIG. 4 may be a point where a wireless communication circuit supplies power to a portion of the conductive coating member 412 of the magnet structure 410 .

According to an embodiment, the designated first frequency band may include a signal of the Sub 6 GHz band. For example, the designated first frequency band may include signals of the n77 band (eg, within about 3,300 MHz to about 4,200 MHz), but is not limited thereto. For another example, the designated first frequency band may include signals in the n78 band (eg, within about 3,300 MHz to about 3,800 MHz).

According to an embodiment, the electronic device 100 may use a part of the fourth edge 300d of the housing 110 as an antenna radiator different from the antenna radiator of the magnet structure 410 .

According to one embodiment, a portion of the fourth edge 300d may be electrically connected to a wireless communication circuit disposed on the PCB 330 . For example, a part of the fourth edge 300d may be electrically connected to the wireless communication circuit through the second power supply part F2, and another part of the fourth edge 300d may be connected to the second ground part G2. Through this, it may be electrically connected to the PCB 330 .

According to an embodiment, the second power supply unit F2 may be a point where the wireless communication circuit and a part of the fourth edge 300d are electrically connected. For example, the second power supply unit F2 may be a point where the wireless communication circuit supplies power to a part of the conductive portion of the fourth edge 300d.

According to an embodiment, the second ground portion G2 may be a point where the ground on the PCB 330 and another part of the fourth edge 300d are electrically connected.

According to an embodiment, the wireless communication circuit may use the conductive portion of the fourth edge 300d as the second antenna radiator 322 by feeding power to the conductive portion of the fourth edge 300d. For example, the wireless communication circuit supplies the conductive portion of the fourth edge 300d to a portion of the conductive portion of the fourth edge 300d through the second power feeding part F2 to transfer the conductive portion of the fourth edge 300d to the second antenna radiator 322. It is possible to transmit and/or receive signals within the designated MB to NR frequency bands using

For example, the frequency band of the signal transmitted and/or received using the second antenna radiator 322 may include within about 1,500 MHz to about 4,200 MHz.

In this case, according to an embodiment, the magnet structure 410 may not be electrically connected to the conductive portion of the fourth edge 300D. For example, the magnet structure 410 and the fourth edge 300d may independently serve as an antenna radiator.

According to an embodiment, the magnet structure included in the electronic device 100 has been described as including one magnet structure 410 as an example, but is not limited thereto. For example, the electronic device 100 may include a plurality of magnet structures each of which is used as a separate antenna radiator.

Hereinafter, an antenna using the conductive coating member 412 of the magnet structure 410 described later as the first antenna radiator may be referred to as a first magnet antenna.

According to one embodiment, the first magnet antenna 401 has been described as using one magnet structure 410 as an example, but is not limited thereto. For example, the first magnet antenna 401 may transmit and/or receive signals of a designated frequency band by using a plurality of magnet structures electrically connected to each other as one antenna radiator.

According to an embodiment, by using the magnet structure 410 as an antenna radiator, the electronic device 100 can secure an effective volume of the antenna while maintaining performance of the antenna. In addition, by securing an effective volume of the antenna, the size of the housing 110 does not increase, and thus the electronic device 100 can provide a user with a portable electronic device.

The ground portion electrically connected to the ground of the PCB 330 shown in FIGS. 4 to 24 may include a first ground portion G1, a second ground portion G2, and a third ground portion G3. , The power supply unit electrically connected to the wireless communication circuit may include a first power supply unit F1, a second power supply unit F2, and a third power supply unit F3.

5 is a cross-sectional view of the magnet structure of FIG. 4 according to an embodiment.

According to an embodiment, the electronic device 100 includes a magnet structure 410, a first housing 111, a first support structure 541, a second support structure 542, a third support structure 543, and a rear surface. It may include a cover (or back glass, 160), a flexible display 120, and/or a PCB 330.

According to an embodiment, the first support structure 541 , the second support structure 542 , and the third support structure 543 may be disposed in an internal space of the electronic device 100 . In one embodiment, the first support structure 541 , the second support structure 542 , and the third support structure 543 are the flexible display 120 , the rear cover 160 , and the first housing 111 . It may be disposed in the inner space of the electronic device 100 formed by the side member 409 .

For example, at least a portion of the first support structure 541 may be located in the inner space of the electronic device 100 adjacent to the rear surface of the flexible display 120 .

For example, at least a portion of the second support structure 542 is positioned on the rear surface of the flexible display 120 and a portion may come into contact with the side member 409 of the first housing 111 .

For example, at least a portion of the third support structure 543 may be located inside the electronic device 100 adjacent to the rear surface of the rear cover 160 . For example, at least a portion of the third support structure 543 is the electronic device 100 surrounded by the magnet structure 410, the PCB 330 disposed on the first support structure 541, and the rear cover 160. can be located inside.

According to an embodiment, a plurality of electronic components may be disposed on the first support structure 541 . For example, a PCB 330, a battery (not shown), and a camera module (not shown) may be positioned on the first support structure 541 .

According to one embodiment, the PCB 330 may be positioned on the first support structure 541 . For example, the first support structure 541 may be formed as a bracket, and the PCB 330 may be positioned on the bracket.

According to one embodiment, the second support structure 542 and the third support structure 543 may be formed to support the magnet structure 410 . For example, parts of the second support structure 542 and the third support structure 543 are formed to surround the magnet structure 410 inside the electronic device 100, and inside the electronic device 100, the magnet structure ( 410) can be fixed.

According to one embodiment, a tape 550 may be disposed on the second support structure 542 . For example, the second support structure 542 may be attached to the rear cover 160 by a tape 550 . For another example, the second support structure 542 may be attached to the flexible display 120 by the tape 550 . As another example, the second support structure 542 may be attached to the magnet structure 410 by a tape 550 .

According to an embodiment, by disposing the tape 550 on the second support structure 542, the back cover 160, the flexible display 120, and the magnet structure 410 are formed on the outer or inner surface of the electronic device 100. can be fixed on

According to an embodiment, at least a portion of the third support structure 543 may be disposed inside the electronic device 100 between the rear cover 160 and the PCB 330.

According to an embodiment, the magnet structure 410 may be disposed inside the electronic device 100 while being surrounded by the second support structure 542 , the PCB 330 , and the third support structure 543 .

According to one embodiment, the cross section of the magnet structure 410 may be formed in a rectangular shape, but is not limited thereto. For example, the cross section of the magnet structure 410 may be formed in a circular shape. As another example, the cross section of the magnet structure 410 may be formed in a hexagonal shape.

According to one embodiment, the magnet structure 410 may be electrically connected to the PCB 330. In one embodiment, the conductive coating member 412 of the magnet structure 410 may be electrically connected to the wireless communication circuit through the first power supply unit F1. For example, the conductive coating member 412 of the magnet structure 410 may be electrically connected to the wireless communication circuit through the first conductive connecting member 420 . For example, a first conductive connection member 420 may be disposed in the first power feeding part F1.

According to one embodiment, the first conductive connection member 420 may be formed as a c-clip, but is not limited thereto. For another example, the first conductive connection member 420 may be formed of a flexible printed circuit board (FPCB).

According to an embodiment, the first conductive connection member 420 may be electrically connected to the conductive coating member 412 by the conductive auxiliary member 421 . For example, one surface of the conductive coating member 412 may be attached to a part of the conductive auxiliary member 421, and the other surface opposite to the one surface may be connected to the first conductive connection member 420. For example, the conductive auxiliary member 421 may be formed of a metal sheet, but is not limited thereto.

According to an embodiment, since the conductive auxiliary member 421 is attached between the conductive coating member 412 and the first conductive connection member 420, the conductive coating member 412 and the first conductive connection member 420 are prevented from corrosion. becoming can be prevented.

According to one embodiment, the wireless communication circuit may use the magnet structure 410 as the first magnet antenna 401 by using the first conductive connection member 420 . In one embodiment, an antenna using the conductive coating member 412 of the magnet structure 410 as the first antenna radiator may be referred to as a first magnet antenna 401 .

According to one embodiment, the wireless communication circuit may supply power to a portion of the conductive coating member 412 of the magnet structure 410 through the first power supply unit F1. For example, the wireless communication circuit may directly supply power to a portion of the conductive coating member 412 through the first conductive connection member 420 .

According to an embodiment, the wireless communication circuit uses the conductive coating member 412 of the magnet structure 410 as an antenna radiator by feeding power to a portion of the conductive coating member 412 through the first power supply unit F1. A signal of the first frequency band may be transmitted and/or received. According to an embodiment, the wireless communication circuit uses the conductive coating member 412 of the magnet structure 410 as an antenna radiator by feeding power to a portion of the conductive coating member 412 through the first conductive connection member 420. A signal of the designated first frequency band may be transmitted and/or received.

According to one embodiment, the wireless communication circuit may transmit and/or receive signals of a designated first frequency band using the first magnet antenna 401 including the magnet structure 410 . For example, the designated first frequency may transmit and/or receive signals in a frequency band within about 3.2 GHz to about 4.2 GHz.

According to an embodiment, the electronic device 100 including the magnet 411 can secure an effective volume of the antenna by using the first magnet antenna 401 including the magnet structure 410 in the wireless communication circuit. there is. In addition, the electronic device 100 may provide an electronic device having antenna performance secured without increasing the size of the electronic device 100 .

According to an embodiment, the first magnet antenna 401 using the conductive coating member 412 of the magnet structure 410 uses the conductive portion of the first housing 111 adjacent to the magnet structure 410 of FIG. 4 . It can be distinguished from a 2-antenna radiator (eg, 322 in FIG. 4).

According to an embodiment, the wireless communication circuit may use the magnet structure 410 and the conductive portion of the fourth edge 300d of the first housing 111 as respective antenna radiators.

6 is a cross-sectional view of the magnet structure of FIG. 4 according to some embodiments.

According to an embodiment, unlike the electronic device 100 of FIG. 5 , the electronic device 100 of FIG. 6 may further include a second conductive connection member 621 .

According to an embodiment, the electronic device 100 of FIG. 6 may transmit and/or receive a signal of a different frequency band from that of the electronic device 100 of FIG. 5 by further including a second conductive connection member 621 . there is.

According to an embodiment, the second support structure 542 and the third support structure 543 may include a non-conductive material. For example, at least a portion of the second support structure 542 and the third support structure 543 may be formed of an injection member (eg, a plastic material).

According to one embodiment, the second conductive connection member 621 may electrically connect the wireless communication circuit located on the PCB 330 and the magnet structure 410 . For example, a part of the second conductive connection member 621 may be electrically connected to the first conductive connection member 620 electrically connected to the wireless communication circuit. For example, another part of the second conductive connection member 621 may be electrically connected to the conductive coating member 412 of the magnet structure 410 .

For another example, the other part of the second conductive connection member 621 may be electrically connected to the conductive coating member 412 by the conductive auxiliary member 622 .

According to an embodiment, the second conductive connection member 621 may be disposed on the third support structure 543 at least a portion of which is formed of a non-conductive member.

According to an embodiment, the third support structure 543 has a first surface 544 facing the rear cover 160, and a second surface 545 opposite to the first surface 544 and facing the flexible display 120. ) may be included.

According to an embodiment, the second conductive connection member 621 may be disposed on the second surface 545 of the third support structure 543 . For example, the second conductive connection member 621 may be disposed along the second surface 545 of the third support structure 543 .

According to an embodiment, the second conductive connection member 621 is disposed along the second surface 545 of the third support structure 543 and electrically connected to the first conductive connection member 620, thereby being a conductive coating member. (412) and the wireless communication circuit can be electrically connected.

According to an embodiment, the wireless communication circuit may use the conductive coating member 412 of the magnet structure 410 as an antenna radiator by using the first conductive connecting member 620 and the second conductive connecting member 621. .

According to an embodiment, the wireless communication circuit uses the conductive coating member 412 of the magnet structure 410 as an antenna radiator by feeding power to a portion of the conductive coating member 412 through the first power supply unit F1. A signal of the second frequency band may be transmitted and/or received. For example, the wireless communication circuit feeds power to the conductive coating member 412 through the first conductive connection member 620 disposed in the first power supply unit F1 and the second conductive connection member 621, thereby generating a magnet A signal of a designated second frequency band may be transmitted and/or received by using the conductive coating member 412 of the structure 410 as an antenna radiator.

According to an embodiment, the antenna including the first conductive connection member 620, the second conductive connection member 621, the auxiliary conductive member 622, and the magnet structure 410 is referred to as the first magnet antenna 601. can be called

According to one embodiment, the wireless communication circuit feeds power to a part of the conductive coating member 412 through the first conductive connection member 620 and the second conductive connection member 621, so that the first magnet antenna of FIG. 6 ( 601) may transmit and/or receive signals of a designated second frequency band distinct from the first frequency band of the first magnet antenna 401 of FIG. 5 .

7 is a cross-sectional view of the magnet structure of FIG. 4 according to some embodiments.

8 is a perspective view of the magnet structure of FIG. 7 according to an embodiment.

According to an embodiment, FIG. 7 shows a cross section of a magnet structure 410 disposed inside the electronic device 100, and FIG. 8 is a perspective view of the magnet structure 710 of FIG. 7 .

According to an embodiment, unlike the electronic device 100 of FIGS. 5 to 6 , the electronic device 100 of FIGS. 7 to 8 includes a conductive extension member 712 and a conductive pattern 714 . ) may be further included.

According to an embodiment, the electronic device 100 of FIGS. 7 to 8 further includes a conductive extension member 712 and a conductive pattern 714, so that the electronic device 100 of FIG. 5 ) and/or may transmit and/or receive signals of a different frequency band.

Referring to FIGS. 7 to 8 , the conductive extension member 712 according to an embodiment may be formed to extend from a portion of the conductive coating member 412 of the magnet structure 710 . According to another embodiment, the conductive extension member 712 may be connected to a portion of the conductive coating member 412 of the magnet structure 710 by a connecting member (not shown).

According to an embodiment, the conductive pattern member 714 may be connected to the conductive extension member 712 . For example, the conductive pattern member 714 is connected to a portion of the conductive extension member 712, so that the conductive extension member 712 and the conductive pattern member 714 may be electrically connected.

According to an embodiment, the conductive pattern member 714 and the conductive extension member 712 have been described as separate members, but are not limited thereto. For another example, the conductive pattern member 714 may be integrally formed with the conductive extension member 712 .

According to an embodiment, the conductive extension member 712 may extend from a portion of the conductive coating member 412 and be disposed along the second surface 545 of the third support structure 543 . According to an embodiment, the conductive pattern member 714 may be disposed on the first surface 544 of the third support structure 543 . For example, the conductive pattern member 714 may be disposed between the first surface 544 of the third supporting structure 543 and the rear cover 160 .

In one embodiment, the third support structure 543 may include a hole 713 . In one embodiment, the conductive extension member 712 is disposed along the second surface 545 of the third support structure 543 and passes through the hole 713 to the first surface 544 of the third support structure 543. ) may be connected to the conductive pattern member 714 disposed on.

According to an embodiment, the conductive pattern member 714 may be formed of an antenna pattern member (eg, a stainless use steel (SUS) member).

According to one embodiment, the wireless communication circuit includes a conductive pattern member 714, a conductive extension member 712 electrically connected to the conductive pattern member 714, and a conductive coating member electrically connected to the conductive extension member 712 ( 412) may be used as an antenna radiator to transmit and/or receive signals of a designated third frequency band. For example, the wireless communication circuit feeds power to the conductive coating member 412 through the first conductive connection member 420 disposed in the first power supply unit F1, and uses the first magnet antenna 701 to designate a first power supply. Signals in three frequency bands can be transmitted and/or received.

According to an embodiment, the electronic device 100 further includes a conductive extension member 712 and a conductive pattern member 714, so that the electronic device 100 of FIG. 7 is provided through the first magnet antenna 701. A signal of a third frequency band different from that of the first magnet antenna 401 may be transmitted and/or received.

9 is a cross-sectional view of the magnet structure of FIG. 7 according to some embodiments.

According to one embodiment, the magnet structure 910 of FIG. 9 may be formed in a substantially different shape from the magnet structure 410 of FIG. 4 .

According to one embodiment, unlike the magnet structure 410 of FIG. 4 , the magnet structure 910 of FIG. 9 may further include a protrusion 919 . In one embodiment, the magnet structure 910 may further include a protrusion 919 protruding from the edge of the first housing 111 toward the inside of the electronic device 100 . In another embodiment, the protrusion 919 may protrude toward the inside of the electronic device 100 from a portion of the magnet structure 910 . For example, the protrusion 919 may be formed from a part of the magnet structure 910 adjacent to the rear cover 160 or the third support structure 543 toward the inside of the electronic device 100 in the first direction (eg, -(y) ) direction) can protrude.

According to one embodiment, the cross section of the protrusion 919 shown in FIG. 9 is shown as a rectangle (rectangular shape), but is not limited thereto. For example, the cross section of the protrusion 919 may be formed as a circular protrusion.

According to one embodiment, by forming the protrusion 919, a portion of the PCB 330 and the protrusion of the magnet structure 910 when viewed in a second direction perpendicular to the first direction (eg, -(z) direction) (919) can be nested.

According to an embodiment, when viewed in the second direction (eg, the -(z) direction), a first conductive connection member ( 920) may be placed. According to one embodiment, by disposing the first conductive connection member 920, the wireless communication circuit on the PCB 330 and the protrusion 919 of the magnet structure 910 may be electrically connected.

According to one embodiment, the wireless communication circuit may be electrically connected to a part of the conductive coating member 912 of the protrusion 919 of the magnet structure 910 through the first power feeding part F1.

According to one embodiment, the wireless communication circuit may transmit and/or receive signals of a designated fourth frequency band using the first magnet antenna 901 including the magnet structure 910 . For example, the wireless communication circuit feeds power to the conductive coating member 912 disposed on the protruding portion 919 through the first power feeding portion F1, so that the first magnet antenna 901 including the magnet structure 910 ) may be used to transmit and/or receive a signal of a designated fourth frequency band.

According to an embodiment, since the protrusion 919 is further formed on the magnet structure 910, the size of the radiator compared to the first magnet antenna 401 of FIG. 5 is achieved by the conductive coating member 912 positioned on the protrusion 919. is changed, the electronic device 100 of FIG. 9 may include a first magnet antenna 901 that transmits and/or receives a signal of a fourth frequency band different from the first magnet antenna 401 of FIG. 5 .

10 is a graph comparing antenna performances of magnet structures according to an embodiment.

According to an embodiment, the graph of FIG. 10 shows a first magnet antenna 401 including a magnet structure 410 in an open state (open mode, 100A) and a folded state (close mode, 100B) of the electronic device 100 . ) performance can be compared.

The x-axis of the graph of FIG. 10 is an axis representing frequency (MHz), and the Y-axis is an axis representing radiation efficiency ([dB]).

According to an embodiment, the first magnet antenna 401 may transmit and/or receive signals in a frequency band ranging from about 3,300 MHz to about 4,200 MHz. For another example, signals in a frequency band within 5,000 HGz to 6000 HGz may be transmitted and/or received.

According to an embodiment, referring to FIG. 10 , performance of the magnet antenna may be substantially the same in an unfolded state (open mode, 100A) and a folded state (close mode, 100B) of the electronic device 100 . For example, the performance of the magnet antenna may be substantially the same in an open state (open mode, 100A) and a folded state (close mode, 100B) in a frequency band within 5,000 HGz to 6000 HGz.

When the foldable electronic device uses the edge of the housing as an antenna radiator, loss of antenna performance may occur in the folded state (close mode, 100B) than in the unfolded state (open mode, 100A). In the folded state, as the edges of the first housing 111 and the second housing 112 are disposed adjacent to each other, coupling may occur, and thus performance degradation of the antenna may occur.

According to an embodiment, when referring to the deterioration of the antenna performance of the foldable electronic device, the electronic device 100 is in a folded state (open mode, 100A) within a frequency range of about 3,300 MHz to about 4,200 MHz. The performance of the first magnet antenna 401 in the close mode (100B) may be substantially the same.

11 is a graph comparing performances of first antennas according to an embodiment.

According to an embodiment, FIG. 11 shows the first antenna radiator 321 of the electronic device 100 including the first magnet antenna 401 and the electronic device 100 not including the first magnet antenna 401. It is a graph comparing performance of the first antenna radiator 321.

For example, the graph of FIG. 11 shows the first antenna radiator 321 when the first magnet antenna 401 and the first antenna radiator 321 are formed together and when only the first antenna radiator 321 is formed. It is a graph comparing radiation efficiency.

Referring to FIGS. 3 and 11 according to an embodiment, the radiation efficiency of the first antenna radiator 321 is compared to the case where only the first antenna radiator 321 is formed, and the first magnet antenna 401 and the first antenna radiator ( 321) may be substantially the same as when formed together. In one embodiment, despite the close arrangement of the first magnet antenna 401 and the first antenna radiator 321 , the first antenna radiator 321 may not be interfered with by the first magnet antenna 401 .

12 is a graph comparing performance of a second antenna according to an embodiment.

According to an embodiment, FIG. 12 shows the second antenna radiator 322 of the electronic device 100 including the first magnet antenna 401 and the second antenna of the electronic device not including the first magnet antenna 401. It is a graph comparing the performance of the radiator 322.

For example, the graph of FIG. 12 shows the second antenna radiator 322 when the first magnet antenna 401 and the second antenna radiator 322 are formed together and when only the second antenna radiator 322 is formed. It is a graph comparing radiation efficiency.

Referring to FIGS. 3 and 12 according to an embodiment, the radiation efficiency of the second antenna radiator 322 is compared to the case where only the second antenna radiator 322 is formed, and the first magnet antenna 401 and the second antenna radiator ( 322) may be substantially the same as when formed together. In one embodiment, despite the close arrangement of the first magnet antenna 401 and the second antenna radiator 322 , the second antenna radiator 322 may not be interfered with by the first magnet antenna 401 .

13 is a graph comparing performance of a third antenna according to an embodiment.

According to an embodiment, FIG. 13 shows the third antenna radiator 323 of the electronic device 100 including the first magnet antenna 401 and the third antenna of the electronic device not including the first magnet antenna 401. It is a graph comparing the performance of the radiator 323.

For example, the graph of FIG. 13 shows the third antenna radiator 323 when the first magnet antenna 401 and the third antenna radiator 323 are formed together and when only the third antenna radiator 323 is formed. It is a graph comparing radiation efficiency.

Referring to FIGS. 3 and 13 according to an embodiment, the radiation efficiency of the third antenna radiator 323 is compared to the case where only the third antenna radiator 323 is formed and the first magnet antenna 401 and the third antenna radiator ( 323) may be substantially the same as when formed together. In one embodiment, despite the close arrangement of the first magnet antenna 401 and the third antenna radiator 323 , the third antenna radiator 323 may not be interfered with by the first magnet antenna 401 .

14 is a graph comparing radiation efficiencies of a first magnet antenna and a radiator of a second antenna according to an exemplary embodiment.

Referring to FIG. 3 according to an embodiment, a second antenna radiator 322 among antenna radiators 320 may be disposed closer to the first magnet antenna 401 than other antenna radiators 320 .

According to an embodiment, the graph of FIG. 14 shows the effect of antenna radiation performance according to the close arrangement of the second antenna radiator 322 and the first magnet antenna 401 .

According to an embodiment, graph S11 may show the reflection coefficient of the first magnet antenna 401 . According to an embodiment, graph S22 may show a reflection coefficient of the second antenna radiator 322 . According to an embodiment, graph S21 may show radiation efficiency according to mutual influence between the first magnet antenna 401 and the second antenna radiator 322 .

According to an embodiment, when the radiation efficiency is -10 dB or less, the radiation performance of the second antenna radiator 322 is obtained when the first magnet antenna 401 is formed and when the second antenna radiator 322 is formed alone. may be substantially the same as

Referring to graph S21 of FIG. 14 , when the electronic device 100 includes the first magnet antenna 401, the radiation performance of the second antenna radiator 322 of the electronic device 100 may be -10 dB or less. In one embodiment, referring to graph S21 , the first magnet antenna 401 may not substantially affect the radiation performance of the second antenna radiator 322 .

15 shows a magnet structure according to one embodiment.

16 is a cross-sectional view taken along line AA' of the magnet structure of FIG. 15 according to an embodiment.

According to an embodiment, unlike the electronic device 100 of FIG. 4 , the electronic device 100 of FIGS. 15 and 16 includes a magnet structure 1510 and a conductive portion 1530 of the first housing 111 as an antenna. It can be used as a radiator to transmit and/or receive signals in a designated frequency band.

According to an embodiment, an antenna using the magnet structure 1510 and the conductive portion 1530 of the first housing 111 as an antenna radiator may be referred to as a second magnet antenna 1501.

According to an embodiment, the electronic device 100 may include a first antenna radiator 321 , a second magnet antenna 1501 , and/or a third antenna radiator 323 .

According to an embodiment, the second magnet antenna 1501 of FIGS. 15 and 16, unlike the first magnet antennas 401, 701, and 901 of FIGS. 5 to 9 formed only of the magnet structure 410, A conductive portion 1530 of the housing 111 may be further included.

For example, the second magnet antenna 1501 may include a first conductive connection member 1520, an auxiliary conductive member 1521, a magnet structure 1510, a third conductive connection member 1540, and/or a magnet structure 1510. ) and the conductive portion 1530 of the first housing 111 electrically connected.

According to an embodiment, the conductive portion 1530 of the first housing 111 of the second magnet antenna 1501 may be electrically connected to the PCB 330 through the second ground portion G2. For example, the first point X may correspond to the second ground portion G2 and is disposed on the PCB 330 at the first point X of the conductive portion 1530 of the first housing 111. can be electrically connected to the ground.

According to an embodiment, the magnet structure 1510 of the second magnet antenna 1501 may be electrically connected to the PCB 330 through the second power feeding part F2. For example, the magnet structure 1510 may be electrically connected to a wireless communication circuit on the PCB 330 through the second power supply unit F2.

According to an embodiment, the magnet structure 1510 may be electrically connected to the PCB 330 by the first conductive connection member 1520 disposed in the second power feeding part F2. Also, according to an embodiment, referring to FIG. 16 , the magnet structure 1510 may further include an auxiliary conductive member 1521 .

According to an embodiment, the first conductive connection member 1520 and the auxiliary conductive member 1521 may refer to the first conductive connection member 420 and the auxiliary conductive member 421 of FIGS. 4 and 5 .

Referring to FIG. 15 , another second point Y of the conductive portion 1530 of the first housing 111 according to an embodiment may be electrically connected to the magnet structure 1510 . For example, the second point Y of the conductive portion 1530 of the first housing 111 may be electrically connected to the conductive coating member 1512 of the magnet structure 1510 . In one example, the second point Y of the conductive portion 1530 is electrically connected to the conductive coating member 1512 of the magnet structure 1510 by a third conductive connecting member 1540 (eg, c-clip or FPCB). can be connected

Referring to FIG. 16 according to an embodiment, the conductive portion 1530 of the side member 409 of the first housing 111 may include a first region 1531 and a second region 1532 . In an embodiment, the first region 1531 may include a region exposed to the outside of the electronic device 100 among the conductive parts 1530 of the side member 409 of the first housing 111 . For example, one surface of the first region 1531 may form the exterior of the electronic device 100 and the other surface may be formed toward the inside of the electronic device 100 .

In an embodiment, the second region 1532 may include a region facing the inside of the electronic device 100 among the conductive parts 1530 of the side member 409 of the first housing 111 . In an embodiment, the second region 1532 may extend toward the inside of the electronic device 100 from the other surface of the first region 1531 of the conductive portion 1530 . For example, the second region 1532 may extend toward the inside of the electronic device 100 from a portion of the other surface of the first region 1531 adjacent to the flexible display 120 . According to one embodiment, the second area 1532 may be formed as a flange.

According to one embodiment, when viewed from the top of the rear cover 160, at least a portion of the second region 1532 may overlap at least a portion of the magnet structure 1510. For example, when viewed from the top of the rear cover 160, the third conductive connection member 1540 may be located in an area where at least a portion of the second area 1532 and at least a portion of the magnet structure 1510 overlap. .

According to an embodiment, a third conductive connection member 1540 may be disposed on the second region 1532 . For example, the third conductive connection member 1540 is disposed on the second region 1532 of the conductive portion 1530 of the first housing 111, and the conductive coating member 1512 of the magnet structure 1510 and the conductive portion 1530 of the first housing 111 may be electrically connected.

According to an embodiment, the wireless communication circuit supplies power to the conductive coating member 1512 of the magnet structure 1510 through the second power supply unit F2, thereby using the second magnet antenna 1501 to designate a fifth frequency band. It is possible to transmit and / or receive a signal of. For example, the wireless communication circuit feeds power to the conductive coating member 1512 of the magnet structure 1510 through the first conductive connection member 1520 and the conductive auxiliary member 1521 disposed in the second power supply unit F2. , the first conductive connection member 1520, the conductive auxiliary member 1521, the conductive coating member 1512, the third conductive connection member 1540, the second region 1532 of the conductive portion 1530, and the conductive portion ( Based on the electrical path including the first region 1531 (1530), a signal of a designated fifth frequency band may be transmitted and/or received.

According to one embodiment, the fifth frequency may include a frequency band within a range of about 2.4 GHz to about 2.5 GHz. According to another embodiment, the fifth frequency may include a frequency band within about 5.0 GHz to about 5.8 GHz.

According to an embodiment, by using the magnet structure 1510 as an antenna radiator, the electronic device 100 can secure an effective volume of the antenna while maintaining performance of the antenna. In addition, by securing an effective volume of the antenna, the size of the housing 110 does not increase, and thus the electronic device 100 can provide a user with a portable electronic device.

17 shows a magnet structure according to some embodiments.

18 is a BB′ cross-sectional view of the magnet structure of FIG. 17 according to some embodiments.

According to an embodiment, unlike the conductive coating member 1512 of the magnet structure 1510 of FIG. 15 connected to the wireless communication circuit through the second power supply unit F2, the magnet structure 1710 of FIGS. 17 and 18 The conductive coating member 1712 of may be electrically connected to the ground through the second ground portion G2.

According to an embodiment, the second magnet antenna 1701 includes a first conductive connection member 1720, an auxiliary conductive member 1721, a magnet structure 1710, a third conductive connection member 1740, and a magnet structure 1710. and the conductive portion 1730 of the side member 409 of the first housing 111 electrically connected to the first housing 111 .

According to an embodiment, the magnet structure 1710 of the second magnet antenna 1701 may be electrically connected to the PCB 330. For example, the second magnet structure 1710 may be electrically connected to the ground of the PCB 330 through the second ground portion G2. For example, the magnet structure 1710 may be electrically connected to the ground of the PCB 330 through the first conductive connection member 1720 disposed on the second ground portion G2.

According to an embodiment, the first conductive connection member 1720 may be additionally connected to the auxiliary conductive member 1721 to electrically connect the magnet structure 1710 and the PCB 330 to each other.

According to an embodiment, the first conductive connection member 1720 and the auxiliary conductive member 1721 may refer to the first conductive connection member 420 and the auxiliary conductive member 421 of FIGS. 4 and 5 .

Referring to FIG. 17 , the conductive portion 1730 of the side member 409 of the first housing 111 of the second magnet antenna 1701 according to an embodiment may be electrically connected to the PCB 330 . For example, the third point Z of the conductive portion 1730 of the first housing 111 may be electrically connected to the wireless communication circuit of the PCB 330 .

According to an embodiment, the conductive portion 1730 may be electrically connected to the magnet structure 1710 by the third conductive connecting member 1740 . For example, referring to FIG. 18 , the conductive portion 1730 may be electrically connected to the magnet structure 1710 at the fourth point P. In one example, the conductive portion 1730 may be electrically connected to the conductive coating member 1712 at the fourth point P by a conductive connection member (eg, c-clip or FPCB).

According to an embodiment, a third conductive connection member 1740 may be disposed on the second region 1732 of the conductive portion 1730 of the first housing 111 . For example, the third conductive connection member 1740 is disposed on the second region 1732 of the conductive portion 1730 of the first housing 111 to form a conductive coating member 1712 of the magnet structure 1710. and the conductive portion 1730 of the first housing 111 may be electrically connected.

According to one embodiment, the wireless communication circuit, by feeding a portion of the conductive portion 1730 of the side member 409 of the first housing 111 through the second power supply (F2), the second magnet antenna (1701) ) can be used to transmit and/or receive signals in a designated frequency band.

For example, the wireless communication circuit feeds power to the third point Z of the conductive portion 1730 of the first housing 111, thereby forming the first region 1531 of the conductive portion 1530 and the conductive portion 1530. Based on the electrical path including the second region 1532, the third conductive connection member 1540, the conductive coating member 1512, the conductive auxiliary member 1521 and / or the first conductive connection member 1520, A signal of the designated sixth frequency band may be transmitted and/or received.

According to one embodiment, the third point (Z) may be a second power supply (F2) that supplies power to a portion of the wireless communication circuit and the conductive portion 1730 of the first housing 111.

According to an embodiment, the sixth frequency may include a frequency band within a range of about 2.4 GHz to about 2.5 GHz. According to another embodiment, the sixth frequency may include a frequency band within about 5.0 GHz to about 5.8 GHz.

According to an embodiment, by using the magnet structure 1710 as an antenna radiator, an effective radiation volume of the antenna can be additionally secured, so that the radiation performance of the antenna of the electronic device 100 can be improved. In addition, by securing an effective volume of the antenna, the size of the housing 110 does not increase, and thus the electronic device 100 can provide a user with a portable electronic device.

According to an embodiment, other than the connection relationship between the conductive coating member 1712 of the third magnet structure 1710 shown in FIGS. 17 and 18 and the ground of the PCB 330 through the second ground portion G2. An embodiment of the second magnet antenna 1701 may refer to the embodiment of the second magnet antenna 1501 of FIG. 16 .

19 is a graph comparing antenna performances of second magnet antennas according to an embodiment.

According to an embodiment, the graph of FIG. 19 shows a second magnet antenna (using the magnet structures 1510 and 1710 in an open state (open mode, 100A) and a folded state (close mode, 100B) of the electronic device 100). 1501 and 1701) can be compared.

The x-axis of the graph of FIG. 17 is an axis representing frequency (MHz), and the Y-axis is an axis representing radiation efficiency ([dB]).

According to one embodiment, the second magnet antennas 1501 and 1701 may transmit and/or receive signals of WIFI 2.4G (range within about 2,400 MHz to about 2,500 MHz). For another example, a signal of WIFI 5G (range within about 5,000 HGz to about 5,800 HGz) may be transmitted and/or received.

According to an embodiment, referring to FIG. 19 , performance of the magnet antenna may be substantially the same in an unfolded state (open mode, 100A) and a folded state (close mode, 100B) of the electronic device 100 . For example, in a frequency band ranging from about 5,000 HGz to about 5,800 HGz, the performance of the magnet antenna may be substantially the same in an open state (open mode, 100A) and a closed state (close mode, 100B).

When the foldable electronic device uses the edge of the housing as an antenna radiator, loss of antenna performance may occur in the folded state (close mode, 100B) than in the unfolded state (open mode, 100A). This is because, in a folded state, coupling occurs as the edges of the first housing and the second housing are disposed adjacent to each other, thereby deteriorating the performance of the antenna.

According to an embodiment, when referring to the deterioration of the antenna performance of the foldable electronic device, the electronic device 100 is in an open state (open mode, 100A) in a frequency band within a range of about 5,000 HGz to about 5,800 HGz and Performances of the second magnet antennas 1501 and 1701 in a closed mode (100B) may be substantially the same.

20 is a graph comparing performance of a first antenna according to an embodiment.

According to an embodiment, FIG. 20 illustrates the first antenna radiator 321 of the electronic device 100 including the second magnet antennas 1501 and 1701 and the electronic device not including the second magnet antennas 1501 and 1701. It is a graph comparing performance of the first antenna radiator 321 of (100).

For example, the graph of FIG. 20 shows the first antenna radiator 321 when the second magnet antennas 1501 and 1701 and the first antenna radiator 321 are formed together and when only the first antenna radiator 321 is formed. ) is a graph comparing the radiation efficiency.

Referring to FIGS. 3 and 20 according to an embodiment, the radiation efficiency of the first antenna radiator 321 is the case where only the first antenna radiator 321 is formed, and the second magnet antennas 1501 and 1701 and the first antenna. It may be substantially the same as the case where the radiator 321 is formed together. In one embodiment, despite the close arrangement of the second magnet antennas 1501 and 1701 and the first antenna radiator 321, the first antenna radiator 321 is not interfered with by the second magnet antennas 1501 and 1701. may not be

21 is a graph comparing performances of third antennas according to an embodiment.

According to an embodiment, FIG. 21 shows the third antenna radiator 323 of the electronic device 100 including the second magnet antennas 1501 and 1701 and the electronic device not including the second magnet antennas 1501 and 1701. It is a graph comparing the performance of the third antenna radiator 323 of

For example, the graph of FIG. 13 shows the third antenna radiator 323 when the second magnet antennas 1501 and 1701 and the third antenna radiator 323 are formed together and when only the third antenna radiator 323 is formed. ) is a graph comparing the radiation efficiency.

Referring to FIGS. 3 and 21 according to an embodiment, the radiation efficiency of the third antenna radiator 323 is the case when only the third antenna radiator 323 is formed, and the second magnet antennas 1501 and 1701 and the third antenna It may be substantially the same as the case where the radiator 323 is formed together. In one embodiment, despite the close arrangement of the second magnet antennas 1501 and 1701 and the third antenna radiator 323, the third antenna radiator 323 is not interfered with by the second magnet antennas 1501 and 1701. may not be

22 is a graph comparing radiation efficiencies of a first magnet antenna and a radiator of a second antenna according to an embodiment.

Referring to FIG. 22 according to an embodiment, a third antenna radiator 323 among antenna radiators 320 may be disposed closer to the second magnet antennas 1501 and 1701 than other antenna radiators.

According to an embodiment, the graph of FIG. 22 shows the effect of antenna radiation performance according to the close arrangement of the third antenna radiator 323 and the second magnet antennas 1501 and 1701 .

According to an embodiment, graph S11 may show reflection coefficients of the second magnet antennas 1501 and 1701. According to an embodiment, graph S22 may show a reflection coefficient of the third antenna radiator 323 . According to an embodiment, graph S21 may show radiation efficiency according to mutual influence between the second magnet antennas 1501 and 1701 and the third antenna radiator 323 .

According to an embodiment, when the radiation efficiency is -10 dB or less, the radiation performance of the second antenna radiator 322 is obtained when the first magnet antenna 401 is formed and when the second antenna radiator 322 is formed alone. may be substantially the same as

Referring to graph S21 of FIG. 22 , when the second magnet antennas 1501 and 1701 are formed, the radiation performance of the third antenna radiator 323 may be -10 dB or less. In one embodiment, referring to graph S21, the second magnet antennas 1501 and 1701 may not substantially affect the radiation performance of the third antenna radiator 323.

23 shows a magnet structure according to some embodiments.

24 is a cross-sectional view taken along line C-C′ of the magnet structure of FIG. 23 according to an embodiment.

According to an embodiment, unlike the electronic device 100 of FIGS. 15 to 18 , the electronic device 100 of FIG. 23 may include a magnet structure 2410 that is not directly connected to the PCB 330. .

According to an embodiment, the third magnet antenna 2401 may include a magnet structure 2410 and a conductive portion 2430 of the first housing 111 .

According to one embodiment, the magnet structure 2410 of FIG. 23 may be electrically connected to the conductive portion 2430 of the side member 409 of the first housing 111 . For example, the conductive coating member 2411 of the magnet structure 2410 may be electrically connected to a part of the conductive portion 2430 of the first housing 111 without being directly connected to the PCB 330 .

According to an embodiment, both ends of the conductive portion 2430 of the side member 409 of the first housing 111 may be electrically connected to the PCB 330 . For example, a portion of the conductive portion 2430 may be electrically connected to the wireless communication circuit through the second power supply unit F2. For example, another part of the conductive portion 2430 may be electrically connected to the ground on the PCB 330 through the second ground portion G2.

According to an embodiment, a portion of the conductive portion 2430 of the side member 409 of the first housing 111 may be electrically connected to the magnet structure 2410 . For example, referring to FIG. 24 , the conductive portion 2430 of the side member 409 of the first housing 111 is the first region 2431 exposed to the outside of the electronic device 100 and the electronic device 100. It may include a second region 2432 facing the inside of.

The first region 2431 and the second region 2432 of the conductive portion 2430 of FIG. 24 according to an embodiment are the first region 1531 and the second region 1532 of the conductive portion 1530 of FIG. 16 . ) can be referenced.

Referring to FIG. 23 according to an embodiment, the magnet structure 2410 is not directly connected to the PCB 330 and may be electrically connected to the second region 2432 of the conductive portion 2430. For example, the magnet structure 2410 may be electrically connected to the second region 2432 of the conductive portion 2430 by a third conductive connecting member 2440 formed on the second region 2432 .

According to an embodiment, the wireless communication circuit supplies power to a portion of the conductive portion 2430 of the first housing 111 electrically connected to the PCB 330 through the second power supply F2, thereby providing a third magnet antenna. A signal of a designated seventh frequency band may be transmitted and/or received by using the 2401 as an antenna radiator.

According to an embodiment, the third magnet antenna 2401 may be an antenna including a conductive portion 2430 and a conductive coating member 2412 of the magnet structure 2410 .

According to an embodiment, the magnet structure 2410 is not directly connected to the PCB 330 but connected to the second region 2432 of the conductive portion 2430, so that the electronic device 100 of FIG. A signal of the seventh frequency band may be transmitted and/or received based on an electrical path different from that of the electronic device 100 of FIG. 17 .

According to an embodiment, by using the magnet structure 2410 as an antenna radiator, the electronic device 100 can additionally secure an effective radiation volume of the antenna, so that the radiation performance of the antenna of the electronic device 100 can be improved. there is. In addition, by securing an effective volume of the antenna, the size of the housing 110 does not increase, and thus the electronic device 100 can provide a user with a portable electronic device.

25 illustrates a magnet structure and a switching module according to one embodiment.

According to an embodiment, the electronic device 100 may further include a switching module 2510. For example, the electronic device 100 may further include a switching module 2510 including at least one lumped element (eg, an inductor or capacitor) for impedance matching.

According to one embodiment, the magnet structure 410 may be electrically connected to the PCB 330 by the switching module 2510. For example, the conductive coating member 412 of the magnet structure 410 may be electrically connected to the wireless communication circuit of the PCB 330 through the switching module 2510 including at least one lumped element. According to another embodiment, the switching module 2510 may be electrically connected to the PCB 330 by a conductive connection member 2520.

According to an embodiment, the conductive connection member 2520 may include a coaxial cable.

According to one embodiment, the conductive connection member 2520 and the switching module 2510 have been described as separate components, but are not limited thereto. For example, the conductive connection member 2520 may be formed of one connection member including the switching module 2510 .

According to an embodiment, a wireless communication circuit in the electronic device 100 may control the switching module 2510. For example, the wireless communication circuit may control the switching module 2510 so that the switching module 2510 performs impedance matching in response to the designated frequency band.

According to one embodiment, the magnet structure 410 may transmit and/or receive signals of various frequency bands by being electrically connected to the switching module 2510 . For example, the resonance frequency of the first antenna using the magnet structure 410 may be changed through the switching module 2510 .

Changes in the resonant frequency and the performance of the first antenna by the switching module 2510 will be described in detail with reference to FIGS. 26 and 27 .

26 is a graph comparing radiation efficiency of magnet antennas according to an embodiment.

According to an embodiment, FIG. 26 is a graph comparing radiation efficiency between the first magnet antenna 401 and a first magnet antenna 401 further including a switching module (eg, the switching module 2510 of FIG. 25 ). . For example, the switching module 2510 may include a lumped element, and FIG. 26 is a graph comparing radiation efficiency between the first magnet antenna 401 and the first magnet antenna 401 including the lumped element. am.

In the graph of FIG. 26, the x-axis represents frequency ([MHz]), and the y-axis represents radiation efficiency ([dB]).

According to an embodiment, since the electronic device 100 further includes the switching module 2510, the first magnet antenna 401 can adjust frequency resonance through impedance matching. For example, since the electronic device 100 further includes the lumped element of the switching module 2510, the first magnet antenna 401 can adjust frequency resonance through impedance matching.

For example, the first magnet antenna 401 further including the lumped element of the switching module 2510 may transmit and/or receive signals in a frequency band ranging from about 4,200 MHz to about 6,000 MHz. According to an embodiment, in a frequency band ranging from about 4,200 MHz to about 6,000 MHz, the first magnet antenna 401 may adjust frequency resonance using the lumped element of the switching module 2510.

27 is a graph comparing reflection coefficients of first magnet antennas according to an embodiment.

Unlike the graph of FIG. 26, the graph of FIG. 27 shows the reflection coefficient ([dB]) of the first magnet antenna 401 further including the lumped element of the switching module 2510 of the first magnet antenna 401. shows

According to an embodiment, the electronic device 100 further includes a switching module 2510 including a lumped element to change the resonant frequency of the first magnet antenna 401 using the first magnet antenna 401 ( shift) can be done. For example, since the electronic device 100 uses the switching module 2510 including the lumped element, the resonant frequency band ranges from about 5,200 MHz to about 6,000 MHz and from about 3,200 MHz to about 5,000 MHz. range can be changed.

According to an embodiment, by further including the switching module 2510, the electronic device 100 may transmit and/or receive signals of various frequency bands.

Although the first magnet antenna 401 has been described as an example in FIGS. 25 to 27, it is not limited thereto. For example, the second magnet antenna ( 1501 in FIG. 15 and 1701 in FIG. 17 ) and the third magnet antenna ( 2401 in FIG. 24 ) may further include a switching module 2510 .

28 illustrates a magnet of a magnet structure according to an embodiment.

According to an embodiment, the magnet structure 410 may be implemented with at least one of the magnet structure 2820 and the magnet structure 2821 of FIG. 28 .

According to an embodiment, the magnet structure 410 may be formed of a magnet 411 and a conductive coating member 412 surrounding a surface of the magnet 411 .

According to an embodiment, structures 2820 and 2830 to be described later may refer to the magnet structure 410 of FIG. 4 , and magnets 2821 and 2831 to be described below may refer to the magnet 411 of FIGS. 3 and 4 . can do.

According to an embodiment, the first structure 2810 may be formed of only the conductive coating member 2811 without a magnet.

According to an embodiment, the second structure 2820 may be formed of a magnet 2821 and a conductive coating member 2811 enclosing the magnet 2821 . According to one embodiment, the magnet 2821 may be formed of ferrite.

According to an embodiment, the magnet 2831 of the third structure 2830 may be formed of neodymium, unlike the magnet 2821 of the second structure 2820 .

According to an embodiment, since the magnet 2831 is formed of the neodymium, the magnet 2831 can secure stronger magnetism than ferrite. According to an embodiment, since the magnet 2831 has strong magnetism, the electronic device 100 can better maintain a folded state.

According to one embodiment, the material from which the magnets 2821 and 2831 are formed has been described as ferrite or neodymium, but is not limited thereto. For example, the magnet may be formed of a samarium-cobalt (Sm-Co) magnet or an alnico magnet.

According to one embodiment, the conductive coating member 2811 may be formed of nickel (Ni), but is not limited thereto. For another example, the conductive member 2811 may be formed of silver, copper, gold, aluminum, iron, graphite, and/or lead. can

According to an embodiment, corrosion may occur when the magnets 2821 and 2831 made of neodymium or ferrite are exposed to air.

According to an embodiment, since the conductive coating member 2811 is formed to surround the magnets 2821 and 2831, the conductive coating member 2811 may prevent corrosion of the magnets 2821 and 2831. By forming the conductive coating member 2811, the electronic device 100 can transmit and/or receive signals of a designated frequency band using the magnet structure.

29 is a graph comparing radiation performance of the first magnet antenna 401 according to the type of the magnet structure 410 of FIG. 28 according to an embodiment.

According to an embodiment, graph 2910 shows radiation efficiency when the first structure 2810 formed of only the conductive member 2811 of FIG. 28 is used as an antenna radiator.

According to an embodiment, a graph 2920 shows radiation efficiency when the second structure 2820 including the magnet 2821 formed of ferrite of FIG. 28 is used as an antenna radiator.

According to an embodiment, a graph 2930 shows radiation efficiency when the third structure 2830 including the magnet 2831 formed of neodymium of FIG. 28 is used as an antenna radiator.

Referring to the graph of FIG. 29 according to an embodiment, the radiation performance of the magnet antenna in the case of not including a magnet (2910) and the case of different types of magnets (2920, 2930) may be substantially the same.

30 is a front view of an electronic device according to some embodiments.

Unlike the electronic device 100 of FIG. 1 , the electronic device 3000 of FIG. 30 may have a second folding axis perpendicular to the first axis.

According to an embodiment, the electronic device 3000 may include a first housing 3001 and a second housing 3002. According to one embodiment, the second housing 3002 can be folded with respect to the first housing 3001 by rotating based on the second axis.

According to an embodiment, the electronic device 3000 may include a plurality of magnet structures 3010. For example, the electronic device 3000 may include a first magnet structure 3011 and a second magnet structure 3012 .

According to one embodiment, the magnet structure 3010 and the magnet 3009 may refer to the magnet structure 410 and the magnet 301 of FIG. 4 . For example, the first magnet structure 3011 may include the first magnet 3009 and a conductive coating member (not shown) formed to surround the surface of the first magnet 3009 . For example, the first magnet structure 3011 may include a magnet formed of ferrite and a conductive coating member formed of nickel.

For example, the second magnet structure 3012 may include a conductive coating member (not shown) formed to surround surfaces of the second magnet 3019 and the first magnet 3019 . For example, the second magnet structure 3012 may include a magnet formed of ferrite and a conductive coating member formed of nickel.

Referring to FIG. 30 according to an embodiment, the first magnet structure 3011 and the second magnet structure 3012 are illustrated as being located inside the first housing 3001, but are not limited thereto. For another example, the first magnet structure 3011 may be located inside the second housing 3002 .

As another example, the first magnet structure 3011 and/or the second magnet structure 3012 may be spaced apart from an edge of the first housing 3001 and positioned inside the first housing 3001 .

According to an embodiment, the electronic device 3000 includes a first magnet structure 3011 and a second magnet structure 3012 to maintain a folded state about the second axis.

According to an embodiment, the electronic device 3000 may use the magnet structure 3010 including a plurality of magnets as an antenna radiator.

According to an embodiment, the wireless communication circuit (not shown) of the electronic device 3000 transmits a signal of a designated frequency band by using the conductive coating member as an antenna radiator by feeding power to the conductive coating member of the first magnet structure 3011. transmit and/or receive. For example, for an antenna using the first magnet structure 3011 as an antenna radiator, refer to the first magnet antennas 401, 701, and 901 using the first magnet structures 410, 710, and 910 of FIGS. 4 to 9. can do.

According to another embodiment, a wireless communication circuit (not shown) of the electronic device 300 transmits a signal of a designated frequency band by using the first magnet structure 3011 and the conductive portion of the first housing 3001 as an antenna radiator. transmit and/or receive. For example, an antenna using the first magnet structure 3011 and the conductive portion of the first housing 3001 as an antenna radiator is the second magnet antennas 1501 and 1701 of FIGS. 15 to 24 and/or the third magnet. Antenna 2401 may be referenced.

According to one embodiment, the magnet structure 3010 of FIG. 30 has been described taking the first magnet structure 3011 as an example, but is not limited thereto. For example, the second magnet structure 3012 may include a magnet formed of ferrite and a conductive coating member formed of nickel surrounding the magnet.

31 illustrates a computer device in accordance with some embodiments.

Unlike the electronic device 100 of FIG. 1 and the electronic device 3000 of FIG. 30 , the electronic device 3100 of FIG. 31 may be formed as a computer device (hereinafter, the electronic device 3100 is referred to as a computer device).

According to one embodiment, the computer device 3100 may include a housing including a first housing 3101 and a second housing 3102 . According to one embodiment, the first housing 3101 and the second housing 3102 may be formed to be rotatable about a first axis by a hinge structure.

According to one embodiment, a part of the housing of the computer device 3100 may be formed as a conductive part. For example, a portion of the edge of the housing of the computer device 3100 may be formed of a conductive portion and a non-conductive portion.

The electronic device 100 of FIG. 1 may be referred to as the material formed of the edge of the housing of the computer device 3100 .

According to one embodiment, the computer device 3100 may include a magnet structure 3110. For example, the magnet structure 3110 may be disposed in a region inside the computer device 3100 adjacent to a conductive portion of an edge of a housing of the computer device 3100 .

According to one embodiment, the magnet structure 3110 may be formed in plurality.

The magnet structure 3110 of the electronic device 3100 of FIG. 31 may refer to the magnet structure 410 of the electronic device 100 of FIG. 4 . For example, the magnet of the magnet structure 3110 may be disposed inside the computer device 3100 so that the first housing 3101 and the second housing 3102 of the computer device 3100 can maintain a folded state. .

According to an embodiment, the magnet structure 3110 may include a first magnet structure 3111, a second magnet structure 3112, a third magnet structure 3113, and/or a fourth magnet structure 3114. there is.

Referring to FIG. 31 according to an embodiment, a first magnet structure 3111 to a fourth magnet structure 3114 are shown, but are not limited thereto. For example, a fifth magnet structure (not shown) may be further included.

According to an embodiment, the first magnet structure 3111 may be formed of a magnet (eg, the magnet 411 of FIG. 5 ) and a conductive coating member (eg, the conductive coating member 412 of FIG. 5 ) surrounding the magnet. can For example, the first magnet structure 3111 may be formed of a conductive coating member formed of nickel and a magnet formed of ferrite.

According to an embodiment, the wireless communication circuit disposed in the computer device 3100 may transmit and/or receive signals of a designated frequency band by using the first magnet structure 3111 as an antenna radiator.

According to another embodiment, the wireless communication circuit of the computer device 3100 transmits a signal of a designated frequency band by feeding power to the conductive coating member of the first magnet structure 3111 and using the conductive coating member as an antenna radiator. and/or receive. For example, for an antenna using the first magnet structure 3111 as an antenna radiator, refer to the first magnet antennas 401, 701, and 901 using the first magnet structures 410, 710, and 910 of FIGS. 4 to 9. can do.

According to another embodiment, the wireless communication circuit may transmit and/or receive signals of a designated frequency band by using the conductive portion of the first housing 3101 as an antenna radiator by feeding power to the conductive portion. For example, an antenna using the first magnet structure 3111 and the conductive portion of the first housing 3101 as an antenna radiator is the second magnet antennas 1501 and 1701 of FIGS. 15 to 24 and/or the third magnet. Antenna 2401 may be referenced.

According to one embodiment, the magnet structure 3110 of FIG. 31 has been described taking the first magnet structure 3111 as an example, but is not limited thereto. For example, the second magnet structure 3112 may include a magnet formed of ferrite and a conductive coating member formed of nickel surrounding the magnet.

32 is a block diagram of an electronic device 3201 within a network environment 3200 according to various embodiments.

Referring to FIG. 32 , in a network environment 3200, an electronic device 3201 (electronic device 100 of FIG. 1 , electronic device 3000 of FIG. 30 , and computer device 3100 of FIG. 31 ) is a first network 3298 ) (eg, a short-range wireless communication network) to communicate with the electronic device 3202, or to communicate with the electronic device 3204 or the server 3208 through a second network 3299 (eg, a long-distance wireless communication network). can According to an embodiment, the electronic device 3201 may communicate with the electronic device 3204 through the server 3208. According to an embodiment, the electronic device 3201 includes a processor 3220, a memory 3230, an input module 3250, an audio output module 3255, a display module 3260, an audio module 3270, a sensor module ( 3276), interface 3277, connection terminal 3278, haptic module 3279, camera module 3280, power management module 3288, battery 3289, communication module 3290, subscriber identification module 3296 , or an antenna module 3297. In some embodiments, in the electronic device 3201, at least one of these components (eg, the connection terminal 3278) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 3276, camera module 3280, or antenna module 3297) are integrated into a single component (eg, display module 3260). It can be.

The processor 3220, for example, executes software (eg, the program 3240) to cause at least one other component (eg, hardware or software component) of the electronic device 3201 connected to the processor 3220. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 3220 transfers instructions or data received from other components (e.g., sensor module 3276 or communication module 3290) to volatile memory 3232. , process commands or data stored in the volatile memory 3232, and store resultant data in the non-volatile memory 3234. According to an embodiment, the processor 3220 may include a main processor 3221 (eg, a central processing unit or an application processor) or an auxiliary processor 3223 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 3201 includes a main processor 3221 and an auxiliary processor 3223, the auxiliary processor 3223 may use less power than the main processor 3221 or be set to be specialized for a designated function. can The auxiliary processor 3223 may be implemented separately from or as part of the main processor 3221 .

The auxiliary processor 3223 may, for example, take the place of the main processor 3221 while the main processor 3221 is in an inactive (eg, sleep) state, or when the main processor 3221 is active (eg, running an application). ) state, together with the main processor 3221, at least one of the components of the electronic device 3201 (eg, the display module 3260, the sensor module 3276, or the communication module 3290) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 3223 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 3280 or communication module 3290). there is. According to an embodiment, the auxiliary processor 3223 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 3201 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 3208). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 3230 may store various data used by at least one component (eg, the processor 3220 or the sensor module 3276) of the electronic device 3201 . The data may include, for example, input data or output data for software (eg, the program 3240) and commands related thereto. The memory 3230 may include a volatile memory 3232 or a non-volatile memory 3234 .

The program 3240 may be stored as software in the memory 3230, and may include, for example, an operating system 3242, middleware 3244, or an application 3246.

The input module 3250 may receive a command or data to be used by a component (eg, the processor 3220) of the electronic device 3201 from an outside of the electronic device 3201 (eg, a user). The input module 3250 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 3255 may output sound signals to the outside of the electronic device 3201 . The sound output module 3255 may include, for example, a speaker or receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 3260 can visually provide information to the outside of the electronic device 3201 (eg, a user). The display module 3260 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 3260 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 3270 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 3270 acquires sound through the input module 3250, the sound output module 3255, or an external electronic device connected directly or wirelessly to the electronic device 3201 (eg: Sound may be output through the electronic device 3202 (eg, a speaker or a headphone).

The sensor module 3276 detects an operating state (eg, power or temperature) of the electronic device 3201 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 3276 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 3277 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 3201 to an external electronic device (eg, the electronic device 3202). According to one embodiment, the interface 3277 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 3278 may include a connector through which the electronic device 3201 may be physically connected to an external electronic device (eg, the electronic device 3202). According to one embodiment, the connection terminal 3278 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 3279 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 3279 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 3280 may capture still images and moving images. According to one embodiment, the camera module 3280 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 3288 may manage power supplied to the electronic device 3201 . According to one embodiment, the power management module 3288 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 3289 may supply power to at least one component of the electronic device 3201 . According to one embodiment, the battery 3289 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 3290 is a direct (eg, wired) communication channel or wireless communication channel between the electronic device 3201 and an external electronic device (eg, the electronic device 3202, the electronic device 3204, or the server 3208). Establishment and communication through the established communication channel may be supported. The communication module 3290 may include one or more communication processors that operate independently of the processor 3220 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 3290 is a wireless communication module 3292 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 3294 (eg, a cellular communication module). : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 3298 (eg, a short-range communication network such as Bluetooth, wireless fidelity direct, or infrared data association (IrDA)) or a second network 3299 (eg, It may communicate with the external electronic device 3204 through a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 3292 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 3296 within a communication network such as the first network 3298 or the second network 3299. The electronic device 3201 may be identified or authenticated.

The wireless communication module 3292 may support a 5G network after a 4G network and a next-generation communication technology, such as NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 3292 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 3292 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beamforming, or large scale antenna may be supported. The wireless communication module 3292 may support various requirements defined for the electronic device 3201, an external electronic device (eg, the electronic device 3204), or a network system (eg, the second network 3299). According to an embodiment, the wireless communication module 3292 is configured to provide peak data rate (eg, 20 Gbps or more) for eMBB realization, loss coverage (eg, 164 dB or less) for mMTC realization, or URLLC for realizing URLLC. U-plane latency (eg, downlink (DL) and uplink (UL) 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 3297 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 3297 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to an embodiment, the antenna module 3297 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 3298 or the second network 3299 is selected from the plurality of antennas by, for example, the communication module 3290. can be chosen A signal or power may be transmitted or received between the communication module 3290 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 3297 in addition to the radiator. According to various embodiments, the antenna module 3297 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 3201 and the external electronic device 3204 through the server 3208 connected to the second network 3299. Each of the external electronic devices 3202 or 3204 may be the same as or different from the electronic device 3201 . According to an embodiment, all or part of operations executed in the electronic device 3201 may be executed in one or more external electronic devices among the external electronic devices 3202, 3204, or 3208. For example, when the electronic device 3201 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 3201 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 3201 . The electronic device 3201 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 3201 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 3204 may include an internet of things (IoT) device. Server 3208 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 3204 or server 3208 may be included in the second network 3299. The electronic device 3201 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of this document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (eg, first) component is said to be "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits. can be used A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document describe one or more instructions stored in a storage medium (eg, internal memory 3236 or external memory 3238) readable by a machine (eg, electronic device 3201). It may be implemented as software (eg, the program 3240) including them. For example, a processor (eg, the processor 3220) of a device (eg, the electronic device 3201) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a machine-readable storage medium (e.g. CD-ROM (compact disc read only memory)), or through an application store (e.g. Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components. . According to various embodiments, one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Additionally or alternatively, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

According to various embodiments, an electronic device includes a housing including a first housing and a second housing rotatably connected to the first housing by a hinge structure about a first axis; a magnet structure disposed inside the housing, the magnet structure including a magnet and a conductive coating member enclosing a surface of the magnet; and a wireless communication circuit electrically connected to the conductive coating member, wherein the magnet is disposed such that the first housing and the second housing are maintained in a folded state, and the wireless communication circuit comprises: By feeding power to a portion of the conductive coating member of the magnet structure, a signal of a designated first frequency band may be transmitted and/or received using the conductive coating member as an antenna radiator.

According to one embodiment, a portion of an edge of the first housing includes a conductive portion, the conductive portion of the first housing is electrically connected to the wireless communication circuit, and the wireless communication circuit is connected to the conductive portion. By supplying electricity, a signal of a designated second frequency band distinct from the first frequency band may be transmitted and/or received by using the conductive portion of the first housing as an antenna radiator.

According to one embodiment, further comprising a first conductive connection member electrically connecting the wireless communication circuit and the conductive coating member of the magnet structure, wherein the wireless communication circuit, through the first conductive connection member By directly feeding power to the coating member, signals of the designated first frequency band may be transmitted and/or received using the conductive coating member of the magnet structure as the antenna radiator.

According to one embodiment, a printed circuit board (PCB) on which the wireless communication circuit is disposed; a non-conductive structure disposed between the PCB and the first housing inside the electronic device; and a second conductive connection member disposed along the non-conductive structure and electrically connecting the first conductive connection member and the conductive coating member of the magnet structure, wherein the wireless communication circuit comprises the first conductive connection member. And by feeding power to the conductive coating member through the second conductive connection member, a signal of the designated first frequency band may be transmitted and/or received using the conductive coating member of the magnet structure as the antenna radiator.

According to an embodiment, the conductive coating member of the magnet structure may be formed of nickel, and the magnet of the magnet structure may be formed of ferrite or neodymium.

According to an embodiment, the magnet structure further includes a conductive extension member electrically connected to the conductive coating member, and a conductive pattern member electrically connected to the conductive extension member, The wireless communication circuit, by feeding power to the conductive coating member, uses the conductive coating member, the conductive extension member electrically connected to the conductive coating member, and the conductive pattern member together as the antenna radiator for the designated first frequency band. It is possible to transmit and / or receive a signal of.

According to an embodiment, the magnet structure further includes a protruding portion protruding from the edge of the first housing toward the inside of the electronic device, and the wireless communication circuit is formed on the protruding portion of the magnet structure. By feeding power to the conductive coating member, signals of the designated first frequency band may be transmitted and/or received by using the magnet structure formed with the protrusion as the antenna radiator.

According to various embodiments of the present disclosure, a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure, a portion of an edge of the first housing A magnet structure including a conductive portion and disposed in an area adjacent to the conductive portion of the edge of the first housing inside the housing, the magnet structure surrounding a magnet and a surface of the magnet (enclosing) including a conductive coating member; and a wireless communication circuit electrically connected to the conductive coating member, wherein the magnet is disposed such that the first housing and the second housing are maintained in a folded state, and the conductive coating of the magnet structure A member and the conductive portion of the edge of the first housing are electrically connected, and the wireless communication circuit supplies power to a portion of the conductive coating member, thereby providing a first electrical path including the conductive coating member and the conductive portion. It is possible to transmit and / or receive a signal of the third frequency band designated based on.

According to an embodiment, the conductive portion of the first housing includes a first area exposed to the outside of the electronic device, and a second area extending from a middle of the first area toward the inside of the first housing; , It may further include a third conductive connection member disposed on the second region and electrically connecting the conductive coating member and the conductive portion of the magnet structure.

According to one embodiment, the designated third frequency may be a frequency band within 2.4 GHz or 2.5 GHz or may include a frequency band within 5.0 GHz to 5.8 GHz.

According to one embodiment, a switching module including at least one lumped element electrically connected to the conductive coating member of the magnet structure is further included, and the conductive coating member is electrically connected to the wireless communication circuit through the switching module. can be connected

According to various embodiments, an electronic device may include a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure; A part of the edge includes a conductive portion, and a magnet structure disposed in an area adjacent to the conductive portion of the edge of the first housing inside the housing, the magnet structure comprising a magnet and the magnet including a conductive coating member enclosing the surface of; and a wireless communication circuit disposed on a printed circuit board (PCB) and electrically connected to the conductive coating member, wherein the magnet may maintain a folded state in which the first housing and the second housing are folded. A portion of the conductive coating member of the magnet structure is electrically connected to the conductive portion of the edge of the first housing, and another portion is electrically connected to the ground of the PCB, and the wireless communication circuit , By feeding power to a portion of the conductive portion, a signal of a fourth frequency band designated based on a second electrical path including the conductive portion and the conductive coating member electrically connected to the ground may be transmitted and/or received. .

According to one embodiment, a switching module including at least one lumped element electrically connected to the conductive coating member of the magnet structure is further included, and the conductive coating member is electrically connected to the wireless communication circuit through the switching module. can be connected

According to an embodiment, the conductive coating member of the magnet structure is formed of nickel, and the magnet of the magnet structure is formed of ferrite or neodymium.

According to various embodiments of the present disclosure, an electronic device includes a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure, and an edge of the first housing. A part of includes a conductive part, and a magnet structure disposed in an area adjacent to the conductive part of the edge of the first housing inside the housing, the magnet structure comprising a magnet and including a conductive coating member enclosing the surface; and a wireless communication circuit disposed on a printed circuit board (PCB) and electrically connected to the conductive coating member, wherein the magnet may maintain a folded state in which the first housing and the second housing are folded. Both ends of the conductive portion of the first edge of the first housing are electrically connected to the PCB, and the magnet structure is electrically connected to a portion of the conductive portion of the first edge of the first housing. And, the wireless communication circuit, by feeding power to the conductive portion of the first housing, a fifth frequency band designated based on a third electrical path including the conductive portion and the conductive coating member electrically connected to the conductive portion. A signal may be transmitted and/or received.

According to an embodiment, the conductive coating member of the magnet structure may be formed of nickel, and the magnet of the magnet structure may be formed of ferrite or neodymium.

According to an embodiment, the conductive portion of the first housing includes a first area exposed to the outside of the electronic device, and a second area extending from a middle of the first area toward the inside of the first housing; , It may further include a third conductive connection member disposed on the second region and electrically connecting the conductive coating member and the conductive portion of the magnet structure.

According to one embodiment, the designated fifth frequency may be a frequency band within 2.4 GHz or 2.5 GHz or may include a frequency band within 5.0 GHz to 5.8 GHz.

According to one embodiment, a switching module including at least one lumped element electrically connected to the conductive coating member of the magnet structure is further included, and the conductive coating member is electrically connected to the wireless communication circuit through the switching module. can be connected

Claims (20)

In electronic devices,
a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure;
a magnet structure disposed inside the housing, the magnet structure including a magnet and a conductive coating member enclosing a surface of the magnet; and
Including a wireless communication circuit electrically connected to the conductive coating member,
The magnet is disposed so that the first housing and the second housing can maintain a folded state,
The wireless communication circuit transmits and/or receives signals of a designated first frequency band by using the conductive coating member as an antenna radiator by feeding power to a portion of the conductive coating member of the magnet structure. The method of claim 1,
A portion of an edge of the first housing includes a conductive portion,
The conductive portion of the first housing is electrically connected to the wireless communication circuit,
The wireless communication circuit transmits and / or receives a signal of a designated second frequency band distinct from the first frequency band by using the conductive portion of the first housing as an antenna radiator by feeding power to the conductive portion, electronic device. The method of claim 1,
Further comprising a first conductive connection member electrically connecting the wireless communication circuit and the conductive coating member of the magnet structure,
The wireless communication circuit transmits a signal of the designated first frequency band using the conductive coating member of the magnet structure as the antenna radiator by directly feeding power to the conductive coating member through the first conductive connection member, and/or or a receiving, electronic device.
The method of claim 1,
a printed circuit board (PCB) on which the wireless communication circuit is disposed;
a non-conductive structure disposed between the PCB and the first housing inside the electronic device; and
A second conductive connection member disposed along the non-conductive structure and electrically connecting the first conductive connection member and the conductive coating member of the magnet structure;
The wireless communication circuit feeds power to the conductive coating member through the first conductive connection member and the second conductive connection member, thereby using the conductive coating member of the magnet structure as the antenna radiator of the designated first frequency band. An electronic device that transmits and/or receives signals. The method of claim 1,
The conductive coating member of the magnet structure is formed of nickel,
The electronic device of claim 1, wherein the magnet of the magnet structure is formed of ferrite or neodymium. The method of claim 1,
The magnet structure further includes a conductive extension member electrically connected to the conductive coating member, and a conductive pattern member electrically connected to the conductive extension member,
The wireless communication circuit, by feeding power to the conductive coating member, uses the conductive coating member, the conductive extension member electrically connected to the conductive coating member, and the conductive pattern member together as the antenna radiator for the designated first frequency An electronic device that transmits and/or receives signals of a band. The method of claim 1,
The magnet structure further includes a protrusion protruding from an edge of the first housing toward an inside of the electronic device,
The wireless communication circuit transmits and/or receives signals of the designated first frequency band by using the magnet structure formed with the protrusion as the antenna radiator by feeding power to the conductive coating member formed on the protrusion of the magnet structure. to do, electronic devices. In electronic devices,
a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure, a portion of an edge of the first housing including a conductive portion;
A magnet structure disposed inside the housing in a region adjacent to the conductive portion of the edge of the first housing, the magnet structure comprising a magnet and a conductive coating member enclosing a surface of the magnet. (conductive coating member) included; and
Including a wireless communication circuit electrically connected to the conductive coating member,
The magnet is disposed so that the first housing and the second housing can maintain a folded state,
The conductive coating member of the magnet structure and the conductive portion of the edge of the first housing are electrically connected,
The wireless communication circuit transmits and / or receives a signal of a third frequency band designated based on a first electrical path including the conductive coating member and the conductive portion by feeding power to a portion of the conductive coating member, the electronic Device. The method of claim 8,
The conductive portion of the first housing includes a first region exposed to the outside of the electronic device and a second region extending from a middle of the first region toward the inside of the first housing,
The electronic device further includes a third conductive connection member disposed on the second region and electrically connecting the conductive coating member and the conductive portion of the magnet structure. The method of claim 8,
The designated third frequency is a frequency band within 2.4 GHz or 2.5 GHz or includes a frequency band within 5.0 GHz to 5.8 GHz, the electronic device. The method of claim 8,
A switching module including at least one lumped element electrically connected to the conductive coating member of the magnet structure;
The electronic device, wherein the conductive coating member is electrically connected to the wireless communication circuit through the switching module. In electronic devices,
a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure, a portion of an edge of the first housing including a conductive portion;
A magnet structure disposed inside the housing in a region adjacent to the conductive portion of the edge of the first housing, the magnet structure comprising a magnet and a conductive coating member enclosing a surface of the magnet. (conductive coating member) included; and
A wireless communication circuit disposed on a printed circuit board (PCB) and electrically connected to the conductive coating member,
The magnet is disposed so that the first housing and the second housing can maintain a folded state,
A part of the conductive coating member of the magnet structure is electrically connected to the conductive part of the edge of the first housing, and another part is electrically connected to the ground of the PCB;
The wireless communication circuit transmits a signal of a fourth frequency band designated based on a second electrical path including the conductive portion and the conductive coating member electrically connected to the ground by feeding a portion of the conductive portion and/or or a receiving, electronic device. The method of claim 12,
The designated fourth frequency is a frequency band within 2.5 GHz of 2.4 GHz or includes a frequency band within 5.0 GHz to 5.8 GHz, the electronic device. The method of claim 12,
A switching module including at least one lumped element electrically connected to the conductive coating member of the magnet structure;
The electronic device, wherein the conductive coating member is electrically connected to the wireless communication circuit through the switching module. The method of claim 12,
The conductive coating member of the magnet structure is formed of nickel,
The electronic device of claim 1, wherein the magnet of the magnet structure is formed of ferrite or neodymium. In electronic devices,
a housing including a first housing and a second housing rotatably connected to the first housing about a first axis by a hinge structure, a portion of an edge of the first housing including a conductive portion;
A magnet structure disposed inside the housing in a region adjacent to the conductive portion of the edge of the first housing, the magnet structure comprising a magnet and a conductive coating member enclosing a surface of the magnet. (conductive coating member) included; and
A wireless communication circuit disposed on a printed circuit board (PCB) and electrically connected to the conductive coating member,
The magnet is disposed so that the first housing and the second housing can maintain a folded state,
Both ends of the conductive portion of the first edge of the first housing are electrically connected to the PCB,
The magnet structure is electrically connected to a portion of the conductive portion of the first edge of the first housing,
The wireless communication circuit transmits a signal of a fifth frequency band designated based on a third electrical path including the conductive portion and the conductive coating member electrically connected to the conductive portion by feeding power to the conductive portion of the first housing. An electronic device that transmits and/or receives. The method of claim 16
The conductive coating member of the magnet structure is formed of nickel,
The electronic device of claim 1, wherein the magnet of the magnet structure is formed of ferrite or neodymium. The method of claim 16
The conductive portion of the first housing includes a first region exposed to the outside of the electronic device and a second region extending from a middle of the first region toward the inside of the first housing,
The electronic device further includes a third conductive connection member disposed on the second region and electrically connecting the conductive coating member and the conductive portion of the magnet structure. The method of claim 16
The designated fifth frequency is a frequency band within 2.4 GHz or 2.5 GHz or includes a frequency band within 5.0 GHz to 5.8 GHz, the electronic device. The method of claim 16
A switching module including at least one lumped element electrically connected to the conductive coating member of the magnet structure;
The electronic device, wherein the conductive coating member is electrically connected to the wireless communication circuit through the switching module.