RU2792017C1 - Method for manufacturing a node of a waveguide distribution system of complex configuration - Google Patents

Abstract

FIELD: three-dimensional structures manufacturinmg.

SUBSTANCE: invention can be used in the manufacture of three-dimensional structures from thin-walled parts, namely the nodes of the waveguide-distribution system in devices of radio-electronic equipment, by soldering by immersion in a salt melt. Petals are made on one of the parts to be joined, and grooves on the other. The parts are fixed by installing the petals in the grooves and turning them around. The solder is formed in the form of a tape-foil with its subsequent annealing and etching, after which perforation is performed, commensurate with the size of the petals. The soldered parts are etched. The foil tape is laid on the end surfaces of parts made with petals, followed by its bending on the side surfaces of the parts. After soldering, the assembly is washed to remove flux residues and the final cleaning is carried out in an ultrasonic unit.

EFFECT: reduction of local mechanical stresses in the places of soldering of the petals under temperature differences and vibration effects, as well as in ensuring stable electrical contact at the joints of the surfaces of the parts to be joined.

3 cl, 6 dwg

Description

The invention relates to general mechanical engineering and can be used in the manufacture of one-piece three-dimensional structures from thin-walled parts, in particular, units of a wave-and-distribution system (for example, a distributor) in devices of radio-electronic equipment (REE) of various types of basing.

From the prior art, a method is known for connecting flat parts to each other (RF Patent No. 2414982, publ. 03/27/2011, IPC: B21D 39/03, B21D 47/04), which includes cutting out two flat parts of the required configuration from a sheet blank in the form of a flat plate and connecting them together to form a three-dimensional structure. Each flat part is made with a central groove located at the junction with another part, having a width equal to the thickness of the sheet blank and a length equal to half the length of the flat part in which the groove is made, and in one flat part the central groove is made in its upper part, and in the other - at the bottom. At the end of one of the flat parts, an end groove is made with a width equal to the thickness of the sheet blank, and at the end of the other flat part, a protrusion with a length equal to twice the thickness of the sheet blank, and the connection of the flat parts to each other is carried out by installing one of them into the other along the central grooves and deformation of the protrusion of one part in the end groove of the other.

This method is applicable mainly when connecting two flat parts with their installation along the central grooves and deformation of the protrusion of one part in the end groove of the other without creating, for example, a waveguide channel of the waveguide distribution system.

From the prior art, a method is known for soldering waveguide devices of complex configuration made of aluminum alloys (RF Patent No. 2691433, publ. and fixation of solder in the soldering points, preheating of the assembly, soldering in a flux bath, removal of flux residues and quality control of soldered units. At the same time, soldering is carried out with a solder of the Al-Si-Ge system, and the said solder is first annealed at a temperature of 370 ° C ± 10 ° for 10-15 minutes, it is held at room temperature for at least 30 minutes and the solder is formed to obtain a workpiece of a given shape .

The closest in technical essence and achieved results to the proposed technical solution is a method for assembling thin-walled parts for soldering in molten salts (RF Patent No. 2236332, publ. parts, laying solder and immersing parts in molten salts. At the same time, petals are preliminarily made on one of the parts to be connected, and grooves on the other, respectively, the soldered parts are fixed by placing the petals in the grooves and turning the protruding petals, the solder is laid with fixation on the petals, while using dosed solder.

The disadvantage of this method is that the solder is laid with fixation on the petals, which leads to the occurrence of local mechanical stresses in the places of soldering of the petals during temperature changes and vibration effects. In addition, stable electrical contact at the joints after soldering is not ensured.

The technical problem solved by the creation of this invention lies in the occurrence of local mechanical stresses in the places of soldering of the petals during temperature changes and vibration effects, as well as in the instability of electrical contact at the joints of the surfaces of the parts to be joined.

The technical result, to which the claimed invention is directed, is to reduce local mechanical stresses in the places of soldering of the petals during temperature changes and vibration effects, as well as to ensure stable electrical contact at the joints of the surfaces of the parts to be joined.

The technical result is achieved by the fact that the method for manufacturing a node of a waveguide distribution system of a complex configuration includes fixing soldered parts, laying solder and immersing parts in a salt melt, while petals are first made on one of the connected parts, and grooves on the other, respectively, fixing the soldered parts is carried out by installing petals into the grooves and reversal of the protruding petals. The method differs from the prototype in that it includes four stages, while at the first stage soldered parts of the assembly are made from a flat sheet blank, at the second stage the solder is prepared by forming it into a sheet flat blank in the form of a foil tape with a thickness S, followed by its annealing at a temperature of 540-545°C for 30 minutes and etching, after which perforation is performed in the solder foil tape, commensurate with the size of the petals and / or perforation is performed directly with the petals of the part in which they are made, and then the soldered parts are etched, while the time between the end of the pickling operation of soldered parts and the start time of the soldering operation is no more than 120 hours. The soldering and soldering by immersing the parts in the salt melt is carried out at the third stage, while the foil tape is laid on the end surfaces of the parts made with petals, followed by its bending on the side surfaces of the parts, while the height of the foil tape bending on the side surfaces parts is determined empirically, after which the foil tape and soldered parts are fixed. At the fourth stage, the unit is washed in order to remove flux residues and control of washing and workmanship, while the unit is washed at a temperature of 60-80 ° C for 60-70 minutes with final washing in an ultrasonic unit according to a standard technical process, followed by washing control, wherein the time between the completion time of the soldering operation and the start time of the flux removal operation is not more than 20 minutes.

The essence of the proposed method is illustrated by drawings, where:

Fig. 1 - general view of the assembly of the wave-distributing system;

Fig. 2 - thin-walled parts with petals and grooves, which are part of the assembly of the wave-distributing system;

Fig. 3 - view A of Fig. 1;

Fig. 4 - thin-walled part with petals and solder on its side surfaces;

Fig. 5 - view B of FIG. 4;

Fig. 6 - solder in the form of a foil tape.

The manufactured assembly of the waveguide distribution system of complex configuration, for example, in the form of a part of a rectangular waveguide, contains thin-walled (soldered) parts 1 (Fig. 1, 2, 4) and parts 2 (Fig. 1, 2, 3) of the required configuration with petals 3 (Fig. . 1, 2, 3, 4) and grooves 4 (Fig. 2), as well as solder 5 (Fig. 1, 2, 4, 5, 6) in the form of a foil tape.

The manufacture of this node of the waveguide distribution system by the proposed method is carried out in four stages.

First stage.

From a sheet flat workpiece, for example, by cutting, thin-walled (soldered) parts 1, 2 of the required configuration with petals 3 of rectangular shape in plan on one part 1 and proportional grooves 4 of rectangular shape in plan on another part 2.

The role of the first stage of the method is to manufacture soldered parts of the wave-distributing system assembly of the required configuration with the possibility of their subsequent fixation to each other.

Second phase.

Solder 5 is prepared by forming it into a workpiece in the form of a technological part, for example, by plastic deformation - rolling in the form of a foil tape (Fig. 6) with a thickness S (Fig. 5), followed by annealing to remove hardening at a temperature of 540-545 °C for 30 minutes and pickling. After that, perforation 6 is performed in the solder foil 5 (Fig. 6), commensurate with the size of the petals 3, and/or the perforation is performed directly with the petals 3 of the part 1. Then, the etching operation of the parts 1, 2 is performed to ensure the soldering quality.

The time between the completion time of the etching operation of parts 1, 2 and the start time of the soldering operation is no more than 120 hours.

The thickness S of the solder foil-tape 5, formed by the plastic deformation method, is empirically determined in the process of performing perforation by one of the indicated methods and is a dispenser of the amount of solder 5 used to ensure a uniform soldered seam during its subsequent melt.

The role of the second stage of the method is to prepare and form solder 5 in the form of a technological part, followed by its annealing and etching, its perforation operation, as well as the etching of parts 1, 2 before the soldering operation.

Third stage.

The solder 5 is laid (placed) in the form of a foil tape on the end surfaces of parts 1 made with petals 3, followed by a bend of the foil tape on the side surfaces 7 (Fig. 5) of parts 1.

The height (Fig. 5) of the bend of the solder foil tape 5 on the side surfaces 7 of parts 1 is determined empirically and is selected from the condition:

H≥60S,

where H is the height of the bend of the solder foil-tape 5 on the side surfaces 7 of parts 1;

S is the thickness of the rolled foil tape of the solder billet 5. Next, the parts to be soldered 1, 2 are fixed by placing petals 3 of parts 1 in the grooves 4 of parts 2, followed by deformation of the protruding part of the petals 3 by the method of their angular turn (Fig. 3).

The assembled unit is fixed, for example, in a technological device, heated in a heating furnace, and then immersed in a salt melt to perform soldering.

As is known, about 70-80% of product failures are associated with the impact of vibration and mechanical loads, and the greatest danger is caused by vibration effects that occur at resonant frequencies, when the natural frequency of the product coincides with the frequency of external mechanical influences. Difficult dynamic and climatic conditions of operation of REA systems, combined with stringent requirements for the reliability of their operation, impose serious restrictions on the role of the stages of manufacturing devices of a wave-distribution system of complex configuration.

The role of the third stage of the method is to level local mechanical stresses, for which the solder 5 is mechanically fixed on the parts 1, the assembly is assembled with the deformation of the protruding part of the petals 3 by the method of their angular rotation, and the assembled assembly is subsequently soldered in the molten salt.

Fourth stage.

Flushing of the assembly is performed to remove flux residues and control of flushing and workmanship. Rinsing of the unit is carried out, for example, in running water at a temperature of 60-80°C for 60-70 minutes with final washing in an ultrasonic unit according to a typical technical process, followed by washing control.

The time between the end time of the soldering operation and the start time of the flux removal operation is no more than 20 minutes.

The role of the fourth stage of the method is to exclude the occurrence of corrosion processes in which flux residues can act as a catalyst.

An example of using the proposed method is a distributor assembled from thin-walled parts made of AMtsN2 sheet 0.5 mm thick.

This distributor consists of parts 1 and 2, made of a flat sheet blank, fixed and soldered together. At the same time, parts 1 are made with petals 3, and parts 2, respectively, with grooves 4 for fixing the parts between themselves by installing petals 3 of parts 1 into the grooves 4. At the same time, the solder foil tape 5 with thickness S is preliminarily laid and fixed on the end surfaces of the parts 1 .

Solder foil tape 5 is made, for example, from SIL-1C 0.5 alloy TU 1-9-555-77, by plastic deformation - rolling, followed by annealing at a temperature of 540-545 ° C for 30 minutes to remove work hardening with the purpose of imparting plasticity necessary for the operations of fixing them on parts 1 and subsequent etching of the solder foil-tape 5.

In the solder foil 5, perforation 6 is performed, for example, by punching, commensurate with the size of the petals 3 and / or perforation is performed directly with the petals 3 of the part 1.

To ensure the quality of soldering, the operation of etching soldered parts 1, 2 is performed.

The solder foil tape 5 is laid on the end surfaces of parts 1, made with petals 3, with the tapes installed on the petals 3, followed by the height H bending of the solder foil tape 5 on the side surfaces 7 of parts 1.

Fixation of the solder foil tape 5 and soldered parts 1, 2 is performed by installing petals 3 of parts 1 in grooves 4 of parts 2, followed by deformation of the protruding part of the petals 3 by the method of their angular turn.

Soldering of this design of the distributor is carried out with immersion in the molten salt with preheating in the heating furnace. After the soldering operation is completed, the assembly is flushed to remove flux residues.

Thus, the proposed method for manufacturing a node of a waveguide distribution system of a complex configuration provides greater efficiency in comparison with known solutions due to the fact that the method is carried out in several main stages and is based on the use of solder in the form of a special foil tape made from it and the execution of soldered parts of a certain configuration with subsequent operations for their installation and fastening before soldering, which eliminates the occurrence of local mechanical stresses in the places of soldering of the petals during temperature changes, vibration effects, ensuring tightness over the entire contact of the surface of the parts to be joined, ensuring electrical contact along the entire contact of the docking of the surface of the parts to be connected.

Claims (6)

1. A method for manufacturing a waveguide-distribution system assembly made of thin-walled parts, including fixing the parts to be soldered to form a three-dimensional structure, laying the solder and soldering by immersing the parts in a salt melt, while petals are first made on one of the parts to be connected, and on the other, respectively proportionate grooves, and fixation of the soldered parts is carried out by installing the petals in the grooves and turning the protruding petals, characterized in that the method includes four stages, while at the first stage the soldered parts of the assembly are made from a flat sheet workpiece, at the second stage the preparation of the solder is performed by forming it into a sheet flat workpiece in the form of a foil tape with a thickness S, followed by its annealing at a temperature of 540-545 ° C for 30 minutes and etching, after which perforation is performed in the solder foil tape, commensurate with the petals of the parts, and then the soldered parts are etched , while the time between the completion time of the operation of herbs soldering parts and the start time of soldering is no more than 120 hours, soldering and soldering is carried out at the third stage, while the solder foil-foil is laid on the end surfaces of the parts made with petals, followed by its bending on the side surfaces of the parts, after which brazed parts are fixed, and at the fourth stage, the assembly is washed to remove flux residues and control of washing and workmanship, while washing the assembly is carried out at a temperature of 60-80 ° C for 60-70 minutes with final washing in an ultrasonic unit, followed by flushing control, wherein the time between the completion time of the soldering operation and the start time of the flux removal operation is not more than 20 minutes. 2. A method for manufacturing a waveguide-distribution system assembly according to claim 1, characterized in that the solder is formed in the form of a foil tape by plastic deformation by rolling, and the perforation in the foil tape is performed by punching or directly with the petals of the part. 3. A method for manufacturing a waveguide-distribution system assembly according to claim 1, characterized in that the height of the bend of the foil tape on the side surfaces of the parts is selected from the condition: H≥60S, where H is the height of the bend of the solder foil-ribbon on the side surfaces of the parts; S is the thickness of the solder foil.

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