RU2783417C1 - Machining module and a machine system with a device for determining the profile of the tool, and a method for determining the profile of the tool - Google Patents

Abstract

FIELD: mechanical engineering.

SUBSTANCE: machining module of the machine tool system for machining contains a part holder designed to accommodate the part to be machined, a part holder control device made with the ability to control and change the position of the part holder in the machining module, a tool holder designed to accommodate a tool containing an end section used for machining the part, a tool holder control device made with the ability to control and change the position of the tool holder in the machining module, a measuring device for determining the profile of the tool installed in the tool holder, containing an optical system for determining the profile of the end section of the tool installed in the holder, while the optical system is installed on the part holder.

EFFECT: accuracy of determining the profile of the end section of the tool is accelerated and increased.

19 cl, 20 dwg

Description

The field of technology to which the invention belongs

The present invention relates to the field of machine tools. The present invention also relates to the field of optically determining the position of a machining tool in situ in a machining module, and in particular in a machine tool system. The present invention also relates to the field of optical in situ profiling of a machining tool in a machining module, and in particular in a machine tool system. In particular, it is a question of the machine tool system constituting a machine tool that performs machining by removing material, in particular, in the stage of machining rotation parts (turning, bar turning, etc.), including a CNC machine system ( CNC).

State of the art

In the field of machine tools, there is a need to know exactly the position of the machining tool mounted in the tool holder. It is also useful to know how the wear of a specified tool develops. This information is useful to ensure that the range of machining parameters is consistent with the machining plan developed during machine setup.

The production of parts by means of machining modules (machine systems), in particular shears, automatic lathes, turn-mill centers, milling machines, machining centers and multi-position automatic machines, usually contains three separate stages.

In the first stage, or setup (or presetting) stage, the operator (for example, a bar turner) determines and checks on the machining module the machining plan, that is, the sequence of operations and spindle movements necessary to obtain the required machined part. The operator seeks, for example, to obtain the most efficient machining plan possible, that is, a plan that allows the machining of a given part in a minimum of operations, and to avoid collisions of the machining tools with each other and their collisions with the part. The operator selects the tools to be used and checks the quality of the resulting parts, such as the condition of the surfaces, compliance with tolerances, etc.

In the second stage, or manufacturing stage, a series of parts are produced on a processing module that has been pre-configured to the parameters that were determined during setup. This stage is the only production stage; often, its execution in time goes on 24/7, while the processing module is supplied with raw material through a feeder or through a short billets (work in progress) loader.

It may happen that the production of a series of parts is interrupted, for example, to replace worn-out machining tools, to manufacture a different type of part on the same machining module, to service a machine tool, etc., and subsequently resume production. In this kind of situation, a startup phase may be necessary to apply the settings that were defined earlier during setup. The startup phase is faster than the setup.

During the start-up phase, it is often necessary to replace the machining tools installed on the machine with another set of tools suitable for the machining to be carried out. The position accuracy and level of wear of these tools determine the quality of the machining, but these parameters are difficult to reproduce during successive starts.

In addition, at the manufacturing stage, when new parts are machined, and in particular in the case of long production periods, it is possible that a slow change (drift) in the relative position of the tool holder and the workpiece holder may occur - a change caused, in particular, by thermal expansion of the components machine. Moreover, information about the wear of the end portion of the tool used for machining, which defines the cutting zone and contains one or more cutting edges, is critical to maintaining the quality of the machining. The development of this wear, which is generally called the wear rate, but which in reality covers various processes, sometimes present in combination, is often not controlled in any way, and if controlled, then with the help of an auxiliary installation, which requires additional time for such control, as well as for removing/reinstalling the tool in the machining module.

As a result, in the machining process, not only the use of worn tools that are unsuitable for the required machining of the part, and even breakage of the cutting tool, but also wear control in a specialized system separate from the machine module lead to effects that negatively affect the productivity and profitability of production systems. .

It is important to be able to save machining parameters that meet the exact specifications of the workpiece, optimizing the percentage of production time of the machining tool, and also optimizing the time of use of each tool. In practice, the instructions that control the machining tool are not amended, or are made in exceptional cases, while during the time of use the tip of the tool is subject to a progressive change in profile, which changes the geometry and position of the cutting edges.

There are many options for the evolution of the wear profile of a machining tool during its use; for example, we can mention relief wear (a wear strip on the front surface), wear in the form of notches, in the form of dimples, wear in the form of plastic deformation (deepening or protrusion), formation of build-up on the edge, wear in the form of chips outside the cutting zone, chipping of the cutting edges, wear in the form of thermal cracking, cutting edge failure, etc.

It would be useful to evaluate the wear of a machining tool not only by the loss of material in the cutting zone of the tool, but also by monitoring the evolution of the profile shape in order to anticipate the type of wear expected, and therefore correct one or more of the various machining and/or positioning parameters in the machine tool system in depending on the type of future wear. For example, in the case of serrated wear, you can choose to change the depth of cut, while in the case of plastic deformation, you can decide to increase the intensity of spraying the tool with coolant.

According to some empirical solutions, it is recommended to change the tool after processing a given number of parts. Such solutions not only do not optimize the economic efficiency of the technological tool, especially in the case of special tools that are expensive or difficult to obtain, but moreover, they do not insure against premature tool breakage, or against the detrimental effect of its wear on the quality of the manufactured parts.

There are systems for evaluating or measuring wear of a cutting tool by means of sensors (contact) or non-contact (visual, laser or electric field sensors) to confirm the integrity or acceptability of the use of a cutting tool (for example, for milling or drilling). Such checks are carried out outside the machining process and the processing module, which results in a period of downtime when the production of products is stopped, which is incompatible with the requirements of long production periods. Methods of this kind are described in US 2006021208, CA 2071764 A1, US 2014233839 and FR 2952196.

Additionally, there may be mentioned monitoring systems for tool breakage recognition based on the measurement by means of sensors of the signals transmitted by the machine system, in particular the results of acoustic measurements or measurements of forces (forces, torques, effective power, etc.) in mechanical assemblies, such as like cam levers or machine spindles. By comparing the detected signal (vibration, noise, pressure, …) with a reference signal previously stored in the control system during a normal machining cycle, an alarm can be triggered if the recorded signal deviates too much from the reference signal.

US 2018111240 discloses a solution in which a non-contact measuring device uses a light barrier extending between a light emitter and a light receiver to detect the position of a rotating processing tool. Due to the close relative position of the active part of the tool, as well as the emitter and photodetector elements, this technology requires protective means, in particular so that the light emitter and photodetector elements are not damaged by oil and chips that are present near the tool. In addition, this system allows you to know whether the tool has touched the light barrier or not, but does not provide information about the exact position or profile of the end section of the tool.

Patent document FR 2645782 describes a system for monitoring tool breakages in a machining center equipped with a CNC machining system. Two video cameras form images of the tool before and after machining, and image comparison allows you to detect tool anomalies. Document EP 3021183 proposes a device integrated into a machine tool system for monitoring and correcting the position of the cutting edge of a tool placed in a tool holder by means of a video camera. However, these devices need to refer to an additional reference system in the machine system, namely, to the reference system characterizing the video camera, which allows you to determine the position of the video camera in the machine system, and from there - the relative position of each of the nodes of the machine system. A device of this kind potentially generates additional errors regarding the position of the tool, in particular with respect to the workpiece.

EP 0377374 proposes a system for determining the position of a machining tool relative to a machine tool. A camera is used that compares two perpendicular images of a template whose position is known with the corresponding successive images of the instrument system.

EP 2426555 discloses an apparatus for detecting the movement of a cutting tool relative to a workpiece. The device contains a video camera, which is fixedly installed in the part of the machine system, which also contains the workpiece to be processed, installed in the chuck, and the tool holder.

You can also refer to the patent document JPH 07246547, which uses a detection system to determine the coordinates of the tool, which consists of a reflector mounted on the shaft of the holder of the cutting tool, and a measuring device containing laser interferometers to determine the coordinates of the tool.

From the foregoing, it follows that there is a need for an improved (more regular, faster and/or more accurate) definition of the profile of the end section (active machining area) of the tool, which is used in machining by removing material.

Disclosure of invention

One object of the present invention is to provide a processing module capable of determining the profile of the end portion of a tool mounted in a tool holder of the processing module.

Another object of the invention is to be able to quickly determine the position or profile, or both the position and profile of the end section of the tool installed in the holder. Therefore, the aim is to propose a solution that makes it possible to determine the profile (position) of the end section of the tool without removing the tool from the tool holder, so as not only not to waste time, but above all not to change the position of the tool in the holder, and the tool holder in the machine system.

Yet another object of the present invention is to provide a processing module free from the limitations of known processing modules.

According to the invention, the above tasks are solved, in particular, by means of a processing module of a machine tool system for machining, comprising:

- a workpiece holder designed to receive a workpiece to be machined,

- a workpiece holder control device configured to control and change the position of the workpiece holder in the processing module,

- a holder designed to receive a tool containing an end section used for machining a part installed in the part holder,

- a tool holder control device configured to control and change the position of the tool holder in the processing module,

- a measuring device for determining the profile of a tool installed in the tool holder, containing an optical system for determining the profile of the end section of the tool installed in the holder, while the optical system is installed on the workpiece holder.

This solution has, in particular, the advantage over the prior art in that the means for detecting and measuring the end of the tool are located in situ in the processing module, and therefore in the machine system. One of the advantages of this design is based on the fact that the measurement and imaging of the tool end is performed locally, where machining operations are performed, while the final result of the measurement or image actually corresponds to the instantaneous real shape/geometry/position of the tool end without artifacts. Accordingly, if the tool experiences deformation caused by the local temperature of the processing module, then this thermal change is taken into account, but if you turn to the measuring module separately from the machine system, the tool will cool down and the measurement result will contain an artifact caused by temperature change. Other advantages are based on the fact that since the optical system is attached to the workpiece holder, the spatial reference of the workpiece holder to the tool holder as a whole serves as the reference of the optical system to the tool as it is "seen" by the optical system: this prevents the measurement artifact caused by the change reference system, which occurs if the tool/tool holder is installed in a measuring module separate from the machine system.

In fact, said measuring device forms a unit for measuring the profile and therefore the wear of the tool, which is integrated into the machining module. Such an arrangement allows tool wear to be monitored in situ, ie in the machining module itself, and therefore without removing the tool from the tool holder and without contact with the tool. To this end, said measuring device is placed in the processing module, in particular in the vicinity of the tool holder. In addition, it is clear that the placement of an optical system designed to observe the end portion of the tool installed in the tool holder directly on the workpiece holder, i.e. element of the workpiece holder, improves performance in particular in terms of processing time (the optical system is already positioned to define the tool tip) and in terms of accuracy (the position of the optical system on the workpiece holder is exactly known and unchanged), since no error, related to determining the relative position of the optical system and the workpiece holder, is not added to the determination of the relative position of the optical system and the end of the tool.

In this text, the expression "part holder" should be understood as "a module of the machine tool system containing elements that provide placement (installation), retention (in particular, clamping) and removal of the part to be machined, as well as movement of the specified part in the space of the processing module of the machine tool system ". This workpiece holder is also generically referred to as a "material spindle". Also, in this text, the expression "tool holder" should be understood as "a module of the machine tool system containing elements that provide placement (installation), retention (in particular, clamping) and removal of one or more machining tools, as well as movement of the specified tool(s). ) in the space of the processing module of the machine tool system”.

Thus, there is no need to base the decision to change the cutting tool and/or to change the cutting parameters only on mathematical models representing the law that governs the wear of the cutting tool, and possibly on experimental curves that are not always available, or at least exist for a certain parameter range. Thanks to the invention, it will be possible to expand the investigated range, and therefore the library of experimental curves, by embedding, for example, in a database of profile measurement results obtained with the processing module in accordance with the present invention.

Therefore, it is possible to optimize the usage time specifically for each tool, even for rows of similar tools. For example, it will be possible to shorten the tool life if its wear development parameters exceed a set limit, in particular because the tool wear development is actually less favorable than according to the theoretical wear model, or to extend the tool life if its wear development parameters are not exceed the established limit, because tool wear is actually less dangerous than according to the theoretical wear model.

According to one embodiment, the optical system is part of a measuring optical device, configured to determine, in one operation of imaging by the optical system, the relative position of the workpiece holder and the tool holder in three coordinates. In particular, the optical system forms an image of the tool holder, for example, a certain area of the tool holder, and also, according to one possibility, the optical system forms an image of a target mounted on the tool holder and forming a base element for reading positions.

The present invention also relates to a machine tool system comprising a processing module as discussed herein, the machine tool system further comprising a tool wear monitoring device that can calculate tool profile deviation based on data received by said device. The device uses a processing module to analyze the condition of the tool, and in particular its wear.

Therefore, it is clear that, based on the measuring device and on the obtained data on the condition of the tool performing machining, it is possible to analyze the condition of the tool, the degree of wear and/or the trend of changing shape, in particular where it concerns the cutting zone.

The invention also relates to:

- the method of determining the position of the tool,

- the method of determining the profile of the tool, and,

a method for detecting tool wear in a machine tool system, wherein the tool is mounted in a tool holder in a processing module comprising a workpiece holder and a tool holder.

These methods will be discussed and described further in the detailed description of the invention.

Brief description of the drawings

Embodiments of the present invention are discussed in the description, illustrated by the accompanying drawings, among which:

fig. 1 is a perspective view of a processing module according to one embodiment of the invention;

fig. 2 is a perspective and enlarged view of fragment II from FIG. 1 showing another tool mounted in a tool holder;

fig. 3 shows a perspective view and an enlarged view, which is visible in detail III of FIG. 2 the end portion of a tool which has been used to machine the part and which is shown as being damaged after wear;

fig. 4 shows the use of the processing module's optical system to determine the position and/or profile of a tool mounted in a tool holder;

fig. 5 is a perspective and exploded view of a tool holder equipped with a three-dimensional target;

fig. 6 depicts the use of the optical system of the processing module to measure in space the position of the tool holder relative to the workpiece holder (which is also called the material spindle);

fig. 7 is another axonometric view corresponding to FIG. 6;

fig. 8 shows the optical arrangement between the tool holder and the workpiece holder in a three-axis adjustment step by means of a three-dimensional target;

fig. 9 shows a part of FIG. 6 corresponding to a tool holder with a three-coordinate target (when viewed in the IX direction of FIG. 6, i.e. in the Z direction) as the optical system "sees" the target when the latter is oriented in the direction of the optical system;

fig. 10, 11 and 12 are three views illustrating the construction of a three-coordinate target according to the invention, respectively, frontal view, axonometric view and sectional view; and fig. 13 and 14 show a perspective view of a second target structure corresponding to FIG. 10, 11 and 12 according to the embodiment;

fig. 15A and 15B illustrate the processing of an image formed by the second pickup system of the optical system;

fig. 16 is another axonometric view corresponding to FIG. 4, and showing the use of the optical device of the processing module to determine the profile of the end portion of the tool;

fig. 17 is a perspective view of part of a processing module in accordance with another embodiment of the invention;

fig. 18 is a perspective view of an embodiment of a tool holder carrying a series of tools arranged vertically, with each tool oriented along a horizontal axis about which, once mounted, the tool can be rotated; and

fig. 19 is a perspective view of a processing module according to another embodiment of the invention.

Implementation of the invention

According to FIG. 1, the processing module 300 includes a workpiece holder 320 and a tool holder 310. The workpiece holder 320 may be removably attached to the processing module 300, in particular by releasable attachment means. As seen in FIG. 1, a part to be machined 322 is removably mounted in a workpiece holder 320 (in this case, an unfinished bar or workpiece is shown). Part holder 320 includes a so-called material spindle containing a collet, chuck, rotating sleeve, or platform (pallet) or platform holder (palletholder). The main direction of the workpiece holder 320 corresponds to the Z direction. The tool holder 310 can be removably attached to the processing module 300, in particular by releasable attachment means. As seen in FIG. 1, a tool 312 (a tap or cutter is shown in a simplified manner) is removably mounted in the tool holder 310 . The tool holder 310 contains, for example, a spindle, a carriage or clamp, or again a screw-cutting die. The main direction of the tool holder 310 corresponds to the X direction. In the processing unit 300, the vertical direction corresponds to the Y direction, with the three directions Z, Y, and Z forming an orthogonal axis system.

The tool holder controller 302 can control the position and change the position of the tool holder 310 in the processing module 300. In the field of mechanical manufacturing and in this text, the term "control" means all hardware and software elements whose function is to issue movement instructions to all elements of the machine tool system . The processing module 300 also includes a control device (not shown) of the workpiece holder 320.

The processing module 300 further includes a measuring device 304 to determine the position as well as the profile of the processing tool 312 mounted in the tool holder 310. To this end, the specified measuring device 304 contains an optical system 100 for determining the profile of the end section 313 of the processing tool 312, installed in the tool holder 310 (see Fig. 4, 6 and 8). In FIG. 1 shows the optical axis O of the optical system 100 extending from the entrance pupil 102 of the optical system. In FIG. 1, the optical axis O is parallel to the Z direction or the main direction of the workpiece holder 330 . As shown in FIG. 1, the optical axis O is preferably also orthogonal to the direction of the X axis of the tool holder 310. According to the invention, as shown in FIG. 1, an optical system 100 is mounted on the part holder 320, at least all elements of the sensor device of the optical system 100, and lighting elements that can be detached from the sensor device of the optical system 100, and therefore placed elsewhere in the processing module 300.

As will be explained below, the optical system 100 is an imaging system, that is, an optical system capable of forming a profile image of a processing tool by means of a shooting system that is included in the optical system 100. Specifically, the optical system 100 includes a set of optical elements and an imaging system . An imaging system of this type is capable of capturing photographic and/or video images, and is, for example, a video camera or still camera, in particular a digital still camera. In the context of the present invention, an optical system 100 is considered that operates in conjunction with one or more light sources. It is also understood that the imaging system belonging to the optical system 100 according to the invention forms an image sensor. The light source or light sources associated with the imaging system of the optical system 100 form a generator or generators of electromagnetic radiation, or light radiation, which may be monochromatic or may cover a certain range of wavelengths in the form of a combination of series of monochromatic electromagnetic radiation (multichrome radiation). According to one embodiment, said light source or light sources is(are) no laser light source(s), and the imaging system of the optical system 100 according to the invention forms an image sensor that does not contain a laser emitter or is not associated with a laser emitter. .

In this text, the term "tool tip" means the tip of the tool, which includes the zones used for machining, and therefore the cutting zone or zones, which include the cutting edges formed by the intersections of active surfaces and edges. Fig. 2 is an enlarged view of the end portion 313 of the machining tool 312. In FIG. 3, an example of wear on the end portion 313 of the tool (other than that shown in FIG. 2) can be observed as a wear zone 313a, which is divided into a front surface (cutting face) and a back surface (relief face).

In this text, the expression "profile of the end section" means either a two-dimensional (2D) representation of the end section, or a three-dimensional (3D) representation of the end section. For example, said profile may comprise a line corresponding to the contour of the end section of the tool projected onto a plane, or a line of intersection with a plane, in particular with a plane orthogonal to the optical axis O of the optical system 100. Also, said profile may form a three-dimensional shape of the end section 313 of the tool (for example , small insert), including the cutting edge or edges. Also, this profile may correspond to the spatial shape of the end section 313 of the tool, represented by a series of lines like a topographic profile.

The optical system 100 is configured to determine the profile of the end portion 313 of the machining tool 312 when the tool holder 310 is in the measuring working position shown in FIG. 4. In the indicated measuring working position, the tool holder 310 and the workpiece holder 320 are close to each other. In said measuring operating position, the optical axis O of the optical system 100 may intersect the end portion 313 of the tool 312, or the tool 312 itself, or at least be close enough to the tool 312 that the tool 312 is within the field of view of the optical system 100. In other words, in this case, in the measuring operating position, the end of the tool holder 310 is in line with the exit (or entrance pupil 102) of the optical system 100. This means that the path of the light beam from the optical system 100 intersects the end of the tool holder 310 and/or the end or more general view - the end section 313 of the tool 312.

In some cases, in the measuring working position, the shortest distance between the end portion 313 of the processing tool 312 and the Z-axis of the tool holder is less than 50 cm, or even less than 30 cm, and sometimes less than 15 cm. For example, in the measuring working position, the shortest distance between the end portion 313 processing tool 312 and the Z axis of the workpiece holder is from 5 cm to 50 cm inclusive, sometimes from 5 cm to 30 cm inclusive, or from 20 cm to 30 cm inclusive, or from 5 cm to 15 cm inclusive.

In some cases, the specified measuring operating position corresponds to the position for installing the tool 312 in the tool holder 310; therefore, the profile can be measured as soon as the tool 312 is installed.

Also, in the measuring working position, the X-axis of the tool holder 310 may have different orientations relative to the optical axis O of the optical system 100:

- in some cases, the X-axis of the tool holder 310 is orthogonal to the direction of the optical axis O of the optical system 100, as shown in FIG. 1 so that the optical system 100 "sees" one side of the end portion and the tip of the tool 312,

- in some cases, the X-axis of the tool holder 310 coincides with the direction or is parallel to the direction of the optical axis O of the optical system 100 (this situation is not shown in the drawings), so that the optical system 100 "sees" only the tip of the tool 312,

- in other cases, the X-axis of the tool holder 310 is inclined relative to the optical axis O of the optical system 100 (this situation, when the angle between the X and O axes is not equal to zero and is not equal to 90°, is not shown in the drawings).

In fact, depending on the machine system that contains the processing module 300 according to the invention, the orientation of the tool holder 310 and its X-axis can be changed, in particular in the case of a machine system with five or six movement axes of the tool holder 310.

In FIG. 4 shows one embodiment of an optical system 100. The optical system 100 includes a first imaging system 110 configured such that its rear focal plane can intersect the end portion 313 of the processing tool 312 at a specified measuring operating position. In addition, the first imaging system 110 includes a first imaging system 112 that is capable of capturing an image of the end portion 313 of the processing tool 312 at a specified measuring operating position. In FIG. 1-4 also shows a side light 140 located proximate the tool holder 310, and optionally mounted on the tool holder 310, to provide side illumination of the end portion 313 of the tool 312 in the measurement working position.

Another type of illuminator or additional illuminators independent of each other or complementary may be provided.

According to one embodiment (see FIGS. 1, 7 and 16), the optical device 10 further comprises a front illuminator 104 oriented parallel to the optical axis O of the optical system 100 in the direction of the tool holder 310. This illuminator 104 may be positioned proximate the optical system 100. The illuminator 104 is oriented in the direction of the tool 312 to provide forward illumination of the end portion 313 of the processing tool 312 at the measuring working position. In particular, as shown in FIG. 1, 7 and 16, this front illuminator is an annular light source surrounding the entrance pupil 102 of the optical system 100, with the axis of the front illuminator 104 coinciding with the optical axis O of the optical system 100. This front illuminator 104 provides good illumination of the surface of the end portion 313 of the instrument , which "sees" the optical system 100.

According to one embodiment (see FIGS. 1 and 16), the optical device 10 further comprises a back light 106 oriented in the direction of the optical system 100. This back light 106 is installed to provide rear (back) illumination of the end section with respect to the optical system 100 313 tool 312 at the measuring working position. In particular, as shown in FIG. 1 and 16, the axis of this rear illuminator coincides (preferably located in one line) with the optical axis O of the optical system 100. In the measuring working position (see Fig. 16), the end section 313 of the tool is located between the entrance pupil 102 of the optical system 100 and the rear illuminator 106 so that the tool end portion 313 is illuminated from behind, which increases the image contrast of the contour area of the end portion 313 that the optical system 100 "sees".

The optical system 100 also includes a second imaging system 120 with a second imaging system 112, and allows capturing an image of the end portion 313 of the processing tool 312 at the measuring working position. To this end, the optical path of the first imaging system 110 and the optical path of the second imaging system 120 have a common section that is directed forward and originates from the object observed by the optical system 100, in this case from the end section 313 of the tool 312 (see Fig. 4 and 16). At a different measurement position, which will be discussed with reference to FIG. 6 and 8, the common area originates from the target 200 mounted on the tool holder 310, which forms the observed object that the optical system 100 "sees". Hereinafter, the term "observed object" means specifically either the end section 313 of the processing tool 312, or target 200. At the measuring operating position, the first imaging system 110 is facing in the direction of the observed object and forms a survey system centered with the observed object, and the second imaging system 120 corresponds to an optical path 126 that meets the optical path 116 of the first imaging system 110 (which is centered with observed object) and forms a survey system that is offset relative to the observed object, relative to the optical axis O of the optical system 100, and relative to the common area of the optical paths 116 and 126, which is centered with the observed object. The optical axis O is aligned with the median beam of the common section of the first optical path 116 and the second optical path 126. In this common section, the segments of the first optical path 116 and the second optical path 126 are mutually parallel, but do not necessarily coincide with each other.

In a common area of the optical paths 116 and 126, the optical beams at least partially merge with each other, or are simply parallel to each other. The second imaging system 120, which is offset, has a portion of the optical path 126 (inside the second imaging system 120) which is preferably parallel to the optical axis O. filming system 110; while its centering is carried out by a specialized optical module 128 containing a catoptric (reflective) optical system, such as a mirror 129. first filming system 110).

In addition, the optical system 100 includes an optical module 128 (for example, with a catoptric optical system, such as a mirror 129) located between the first imaging system 110 and the second imaging system 120, and configured to deflect a portion of the light rays passing through at least a portion one of the survey systems (first or second) in the direction of another of the survey systems (first or second). The optical system 100 is designed so that the optical path from the observed object (from the end section 313 of the tool 312 in Fig. 4 and 16 and from the target 200 in Fig. 6 and 8) passes through at least part of one of the imaging systems - the first imaging system 110 or the second survey system 120 (the first survey system in FIGS. 4, 6, 8 and 16) before reaching the other of said survey systems (the second survey system in FIGS. 4, 6, 8 and 16).

Also, in accordance with the presented diagram, the first filming system 110 and the second filming system 120 are arranged parallel to each other. Also, in accordance with the presented scheme, the first imaging system 110 is mounted directly on the workpiece holder 320, and the second imaging system 120 is offset relative to the optical axis of the first imaging system 110, but the reverse may also be applicable, namely, there may be a scheme in which the second the camera system 120 is mounted directly on the workpiece holder 320, with the second camera system 120 being eccentric with respect to the first camera system 110.

Thus, it is clear that when the first imaging system 110 is centered on the observed object, the second imaging system 120 also "sees" the observed object, and can also form an image of the observed object. As will be further understood, this image can be used to determine the position of the processing tool 312 and to determine the profile of the end portion of the tool 312.

Thus, according to one embodiment of the invention, a method is provided for determining the position of a machining tool 312 mounted in a tool holder 310 in a machining module 300, which includes a workpiece holder 320 and a tool holder 310—a method comprising:

i) in the processing module 300, a measuring device 304 is provided, containing an optical system 100 for determining the profile of the end portion 313 of the tool 312 installed in the tool holder 310, while in the measuring device, the optical system 100 is mounted on the workpiece holder 320;

ii) install the tool 312 in the tool holder 310: this step determines the position of the tool 312 relative to the tool holder 310;

iii) setting the tool holder 310 relative to the workpiece holder 320 to the measuring working position (for example, in accordance with the diagram of Fig. 4): this step allows you to position the tool 312, and in particular the end section 313 of the tool 312 or another part of the tool 312 so that to be visible to the optical system 100;

iv) turn on the measuring device 304, and

v) through the optical system 100 determine the position of the tool 312 in the processing module 300

Here again, it should be noted that in the case of the device according to the invention of the processing module 300 shown in the drawings, the optical system 100 is mounted on the holder 320 parts. Therefore, it is clear that as a result of the formation of the image of the tool 312 (in particular its end section 313) by the optical system 100, it is possible to determine not only the relative position of the tool 312 (its end section 313) and the workpiece holder 320, but also the relative position of the tool holder 310 and holder 320 details.

In accordance with the first possibility related to the specified method of determining the position of the processing tool, when the measuring device 304 is turned on, the first imaging system 110 and therefore the first imaging system 112 is used, which forms one (or more) image(s) of the end section 313 of the tool 312 The analysis of this image and, in particular, the position of the zone of sharp focus of the image (obtained, for example, by means of the diagram of Fig. 4) in the X direction and relative to the edge of the tool, as the first imaging system 110 "sees", allows you to determine the distance of the tool 312 relative to the optical system 100, and hence the position of the end section 313 along the Z axis. This image allows you to view the cutting edge or edges (as a projection), as it is "sees" the first imaging system 110. This view allows you to define as a position, in particular, relative to edges, and geometry (the shape of the line or lines on the image corresponding to the cutting edge or edges).

In accordance with the second possibility related to the specified method of determining the position of the processing tool (alternative to the mentioned first possibility or supplementing the first possibility), when the measuring device 304 is turned on, the second survey system 120 and therefore the second imaging system 122 is used, which forms one (or more) images (th) end section 313 of tool 312. Analysis of this image and, in particular, the position of the sharp focus area of the image (obtained, for example, by means of the scheme of Fig. 4) in the X direction and relative to the edge of the tool, as the first imaging system "sees" 110 allows you to determine the distance of the tool 312 relative to the optical system 100, and therefore the position of the end section 313 along the Z axis. This image also allows you to consider the cutting edge or edges (in projection) as the second imaging system 120 “sees” it. consideration allows us to determine how position, in particular with respect to the edge, and geometry (the shape of the line or lines in the image that correspond to the cutting edge or edges).

Also, according to one embodiment of the invention, a method is provided for determining the profile of a machining tool 312 mounted in a tool holder 310 in a machining module 300, which includes a workpiece holder 320 and a tool holder 310, a method comprising:

i) in the processing module 300, a measuring device 304 is provided, containing an optical system 100 for determining the profile of the end portion 313 of the tool 312 installed in the tool holder 310, while in the measuring device, the optical system 100 is mounted on the workpiece holder 320;

ii) install the tool 312 in the tool holder 310: this step determines the position of the tool 312 relative to the tool holder 310;

iii) setting the tool holder 310 relative to the workpiece holder 320 to the measuring working position (for example, in accordance with the diagram of Fig. 4): this step allows you to position the tool 312, and in particular the end section 313 of the tool 312 or another part of the tool 312 so that to be visible to the optical system 100;

iv) turn on the measuring device 304, and

v) through the optical system 100 determine the profile of the end section 313 (or other part) of the tool 312 installed in the holder 310 of the tool.

In accordance with the first possibility related to the specified method of determining the profile of the processing tool 312, when the measuring device 304 is turned on, the first survey system 110 and therefore the first imaging system 112 is used, which forms one (or more) image(s) of the end section 313 of the tool 312. Analysis of this image makes it possible to determine the edge of the tool as it is "seen" by the first imaging system 110. This refers to the edge, i. the contour of the end portion 313 of the tool 312 as viewed as a projection in the (X, Y) plane orthogonal to the Z direction, which is itself parallel to the optical axis O of the optical system. Thus, the shape (in this case, the contour line) of the specified edge of the tool 312 provides information about the geometry of the end portion 313 of the tool 312 installed in the holder 310 during image acquisition. This image also makes it possible to view the cutting edge or edges (as a projection) as seen by the first imaging system 110. Such a view makes it possible to determine both the position, in particular with respect to the edge, and the geometry (shape of the line or lines in the image that match the cutting edge or edges).

In accordance with the second possibility related to the specified method of determining the profile of the processing tool 312 (alternative to the mentioned first possibility or supplementing the first possibility), when the measuring device 304 is turned on, the second survey system 120 and therefore the second imaging system 122 is used, which generates one (or more) image(s) of the end section 313 of the tool 312. Analysis of this image allows you to determine the edge of the tool, as it is "seen" by the second imaging system 120. This refers to the edge, i.e. the contour of the end portion 313 of the tool 312 as viewed as a projection in the (X, Y) plane orthogonal to the Z direction, which is itself parallel to the optical axis O of the optical system. Thus, the shape (in this case, the contour line) of the specified edge of the tool 312 provides information about the geometry of the end portion 313 of the tool 312 installed in the holder 310 during image acquisition. This image also makes it possible to view the cutting edge or edges (as a projection) as seen by the second imaging system 120. Such a view makes it possible to determine both the position, in particular with respect to the edge, and the geometry (the shape of the line or lines in the image that match the cutting edge or edges).

This method of defining the profile of the tool 312, in particular, allows the angular orientation of the tool 312 to be determined with respect to the X-axis of the tool holder and, therefore, relative to the workpiece holder 320 at the measuring working position, and also allows checking the correct orientation of the tool 312 relative to the workpiece holder at the measuring working position. Also, this method of determining the profile of the tool 312 makes it possible to assign a profile and check that the tool 312 installed in the holder matches the required tool (the detected profile corresponds to the expected predefined profile), and therefore allows you to prevent the installation of the wrong tool in the holder 310.

In FIG. 8 shows an optical device 10 comprising an optical system 100 and a three-dimensional (3D) target 200 adapted, according to one embodiment, to cooperate with the optical system to perform a three-dimensional (3D) measurement of the position of the target 200 relative to the optical system 100. As will be further explained, said measurement also provides a measurement of the position of the tool holder 310 (on which the target 200 is located) relative to the workpiece holder 320 that carries the optical system 100, and based on said measurement data, obtains the position data of the tool 312 (mounted in the holder 310) relative to the workpiece 322 ( mounted in holder 320). In fact, in this measuring operating position, the target 200 is oriented in the direction of the optical system 100 parallel to the main axis, forming a horizontal main direction Z. To this end, at the output of the optical system 100, the optical path O is orthogonal to the active surface 202 of the target 200.

Further, according to FIG. 8, 10, 11 and 12, the target 200 will be discussed. The target 200 is in the form of a sleeve, in this case the shape of a cylinder of circular cross section (but may be square or otherwise), one side of which forms an active surface 202 for making measurements. Therefore, to perform measurements, this active surface 202 is rotated in the direction of the optical system 100, in particular, in the direction of the entrance pupil 102 of the optical system 100, while the Z axis corresponding to the main direction (horizontal in the drawings) separates the active surface 202 from the entrance pupil 102 optical system 100.

The active surface area 202 of the target 200 is divided between the first structure 210 and the second structure 220. The first structure 210 includes a flat base surface 212 that is smooth and is divided between a first region 214 that is diffusely reflective and a second region 216 that is specularly reflective. In general, said flat base surface 212 is divided between at least one region whose surface has reflective properties corresponding to first reflection parameters and a second region whose surface has reflective properties corresponding to second reflection parameters that differ from the first reflection parameters. In one embodiment, the first portion 214 is coated with a diffusely reflective layer, such as a barium sulfate BaSO ₄ layer, and the second portion 216 is provided as a specularly reflective layer, such as a chromium layer. In the depicted embodiment, the second section 216 is composed of a plurality of localized island-shaped circular zones 217 that are located within the first section 214, which is solid. In general, the second section 216 is divided into a series of local zones 217 located within the first section 214. In accordance with one possibility, the local zones 217 of the second section 216 are formed from islands or segments distributed within the first section 214. Said local zones 217 may be different species, for example, may take the form of segments or "islands" of a different shape than circular. These local zones 217 together form a geometric figure - one of the following list: quadrilateral, parallelogram, rectangle, square, rhombus, regular polygon and circle. This geometric figure can be a figure with central symmetry. In FIG. 10 and 11, twenty-four circular local areas 217 are arranged in a square pattern. The purpose of the first structure 210 is to accurately recognize the center C3 using standard video tools. In the case of a figure of the "square" type, two diagonals C1 and C2 of the specified square intersect in its center. It should be noted that in the measuring working position, as shown in FIG. 6-12, base surface 212 is arranged parallel to the X and Y directions, respectively forming a vertical direction (axis) and a transverse horizontal direction (axis) in the case of the depicted arrangement.

The second structure 220 includes a surface 222 that is inclined relative to the base surface 212; while this inclined surface 222 is practically flat, and the median plane of this inclined surface forms with the base surface 212 an acute angle α lying in the range of 10° - 80° inclusive, for example, an angle of 20° - 30° inclusive, and preferably an angle of the order of 25 ° (see Fig. 12).

According to one embodiment, this sloped surface 222 is not smooth, but contains terrain elements 224 that create surface irregularities that are either random or have a predetermined geometry, for example, together form a lattice or grid of lines, thus constituting a structured lattice (not shown) or a structured grid of lines (see Fig. 13). Also, according to one embodiment, the sloped surface 222 of the second structure 220 is striated, in particular, the sloped surface 222 of the second structure 220 is covered with one of the following: an etched mesh, a structured grating, or a grid of reflective lines 225.

The relief elements 224 of this kind may be in the form of protrusions or in the form of depressions, i.e. may be offset back relative to the median plane of the inclined surface 222, particularly in the form of a slight roughness or any other surface irregularity. Such features 224 may be present over the entire area of sloped surface 222. Features of this kind may be uniformly distributed over the entire area of sloped surface 222. For example, these features 224 may form a configuration that defines a lattice or grid pattern, or more generally case, a structured surface or a rough surface that gives good scattering of the light reflected from the inclined surface 222. The area of the inclined surface 222 of the second structure 220, for example, is covered with one of the following: an etched mesh or a structured grating, in which the distance (pitch) between elements lies in the range of 5-100 µm inclusive, in particular in the range of 5-50 µm inclusive, including 8-15 µm inclusive, for example, has the order of 10 µm.

For example, this sloped surface 222 is made of unpolished silicon or ceramic, or unpolished metal or glass, or any other material on which a structure can be formed, while the elements 224 of the relief can be obtained by photolithography, by machining with removal shavings, by directly forming a pattern (letter), or in any other way that allows you to form a structure. Said relief elements 224 form, for example, depressions and/or protrusions, which are respectively spaced back from the median plane and/or moved forward beyond the median plane by a few microns or a few tens of microns, in particular by 0.5-50 µm. .

According to another embodiment, as shown in FIG. 14, the area of the sloped surface 222 is smooth and contains a grid of lines of chrome plating or other material that provides mirror reflection to said lines of chrome plating, which form mirror elements 225. Said mirror elements 225 in the form of lines are parallel to each other. In the measuring position, said mirror elements 225 in the form of lines or strips are arranged parallel to the Y, Z plane, so that along the inclined surface in the Z direction, said lines follow one another (the same is observed if moving in the X direction). The substrate forming the small plate of the second structure 220 may be made of various materials, including glass or silicon, with a diffusely reflective layer on the sloped surface 222 made of, for example, barium sulfate BaSO ₄ interleaved with mirror elements 225, or alternatively, which covers the entire inclined surface, while the mirror elements 225 are located on top of this diffusely reflective layer. Mirror elements 225 of this kind can be evenly distributed over the entire area of the inclined surface 222. According to an exemplary embodiment, these mirror elements 225 in the form of lines form a grid with a pitch of 25 μm. In this case, these lines (in particular, from a chromium coating) have a width of 12.5 μm equal to the width of the gaps between the lines or areas of diffuse reflection, which also have the form of lines or stripes with a width of 12.5 μm. In accordance with another embodiment, a pitch of 10 µm or more is used, in general a pitch in the range of 5-50 µm. It should be noted that the reflective elements 225 that alternate with the rest of the diffuse reflection surface may have a shape other than solid lines or segments forming stripes; in particular, it can be broken lines, figures such as stripes, circles, triangles or any other geometric shapes.

According to an embodiment that is not shown in the drawings, the sloped surface 222 of the second structure 220 bears concentrated and protruding relief elements 224 in the form of small ridges or teeth, which are distributed in mutually parallel rows, while the relief elements 224 are mutually offset from one row to another, forming a checkerboard pattern. According to another embodiment, which is not shown in the drawings, the sloped surface 222 of the second structure 220 bears raised elements 224 in the form of segments that are parallel to each other and equidistant and correspond to two series intersecting at an angle of 90° to each other. Such a set of relief elements 224 forms a lattice pattern. It should be noted that this grating can be formed by two series of mutually parallel segments that intersect each other at an angle other than 90°. In FIG. 10-13, the sloped surface 222 of the second structure 220 carries embossings 224 which are recessed in a series of segments that are parallel to each other and spaced at equal distances from each other in the X direction: in this case, said embossings 224 form grooves. Therefore, the direction X is orthogonal to the direction of the segments that form the elements 224 relief.

Therefore, in the embodiment shown in FIG. 14, the inclined surface 222 of the second structure 220 is covered with a grid of specular lines 225, namely, mutually parallel solid strips, the surface of which has the property of specular reflection.

Thus, in some of the cases mentioned above, and in particular those illustrated in FIG. 13 and 14, the sloped surface 222 of the second structure 220 has a striated texture.

In accordance with the embodiments presented for the target 200, the sleeve defining the target 200 comprises on its active surface 202 a first structure 210 which occupies the majority of the area of the active surface 202, and within the first structure 210 an area occupied by the second structure 220. B In this situation, the first structure 210 surrounds the second structure 220. More precisely, the local zones 217 of the second section 216 of the first structure 210 form a square that surrounds the second structure 220. In accordance with one possible condition, and in the case of the embodiments of the target 200 presented in the drawings, the first the structure 210 and the second structure 220 are concentric to each other on the active surface 202. Moreover, as in the illustrated embodiments, the first structure 210 defines a window boundary 218 for the body 219 housing the second structure 220, which is placed on a small plate including an inclined surface 222, for example. When the plate is placed in the body 219, the first structure 210, its sloped surface 222 is turned outward from the housing 219, towards the window 218. In this particular case, the second structure 220 is located in the housing 219 so that the sloped surface 222 is set back relative to the base surface of the first structure 210: this means that the inclined surface 222, and hence the second structure 220, are located behind, behind the plane bounded by the base surface 212 (relative to the main direction Z, see Fig. 11) in the housing 219, and are offset back, for example, by 0.05-2 mm, or at a distance of about 0.15 mm. According to another possible option, which is not shown in the drawings, the second structure 220 is located in front of the plane bounded by the base surface 212. According to another possible option, which is also not shown in the drawings, the second structure 220 is located on each side of the plane bounded by the base surface 212, namely, part of the sloped surface 222 is located behind, and the other part of the sloped surface 222 is located in front of the base surface 212.

In order to protect the first structure 210 and the second structure 220 from the environment (dust, oil, shock, etc.), as can be seen in FIG. 12, the target 200 includes a protective plate 230 of a transparent material, in particular glass, covering the first structure 210 and the second structure 220 from the side of the active surface 202. According to one possible embodiment, as shown in FIG. 12, the target 200 contains the following items as a package. The bottom wall 231, on top of which a plate 232 is installed, in the center of which a cutout is made that defines the boundaries of the housing 219, the boundary of which on the side of the active surface 202 is defined by a window 218. From above, the plate 232 is covered by a protective plate 230 that closes the housing 219. All these elements are together surrounded a cylindrical wall 234 that holds the entire target 200. The second structure 220 is, for example, a silicon wafer enclosed in a housing 219 with an inclined surface 222 (which bears relief elements 224 or mirror elements 225) turned in the direction of the active surface 202. The surface the upper plate 232, facing the active surface 202, contains a reflective layer 233 in the form of two zones, as discussed above in relation to the first section 214 (diffuse reflection surface) and the second section 216 (specular reflection surface), in particular in the form of local elements 217).

In addition, the target 200 may be equipped with RFID (Radio Frequency Identification) means (not shown) to enable the storage and reading of a unique identifier and data regarding the target 200, and possibly related to the tool holder 310 (see. 1 and 5) on which the target 200 is supposed to be mounted. The specified data may include: for example, reference information about the tool holder 310 and other information associated with the use of this tool holder (for example, holder serial number, holder type, holder adjustment relative to the center of the material or relative to the workpiece holder 320, the number of times the tool holder is used, and the like). In FIG. 5, 9, and 16, a target 200 (and, where applicable, an RFID chip) is mounted on the clip portion of the tool holder 310.

секунды или быстрее способно выполнять воспроизводимое измерение взаимного положения объектов с погрешностью 1 мкм или менее.Further, according to FIG. 8, an optical system 100 will be considered associated with the target 200 just described, which together form an optical measuring device 10 which allows the measurement of the relative position of two objects in three spatial coordinates, and thus the measurement of the position of the workpiece holder 320 relative to the tool holder 310 , or the position of the workpiece 322 relative to the tool 312. In particular, the orthogonal space is considered in the Cartesian coordinate system (axes) X, Y and Z, which is indicated in the drawings. The optical system 100 is designed to simultaneously capture, in the same sequence of exposures (shootings), both the image of the first structure 210 of the target 200 and the image of the second structure 220 of the target 200. According to the present description, such simultaneous capture of two images is carried out without focusing, which gives high shooting speed. Other properties, related in particular to the design feature of the target 200 discussed above, also make it possible to achieve maximum accuracy. Three-dimensional optical measuring device 10 according to the present invention, for

seconds or faster is capable of performing a reproducible measurement of the relative position of objects with an error of 1 µm or less.

The optical system 100 includes a first imaging system 110 and a second imaging system 120. According to one embodiment, said optical system 100 is configured such that the difference between the focal length of the second imaging system 120 and the focal length of the first imaging system 110 lies between a minimum distance and a maximum distance. the distance separating the base surface 212 from the sloped surface 222. According to another embodiment, the depth of field (DOF1) of the first imaging system 110 is much larger, in particular at least ten times the depth of field (DOF2) of the second imaging system 120. For example, the depth of field DOF1 of the first camera system 110 exceeds the depth of field DOF2 of the second camera system 120 by 10-10000 times, or 100-5000 times. Among the different possible characteristics: DOF1 of the first imaging system 110 is greater than or equal to 0.8 mm, or is in the range of 0.5-5 mm inclusive, or in the range of 0.8-3 mm, inclusive, or in the range of 1-2 mm, inclusive . Also among the different possible characteristics: DOF2 of the second imaging system 120 is less than or equal to 0.1 mm, or is in the range of 5-50 µm inclusive, or in the range of 8-30 µm, inclusive, or in the range of 10-20 µm, inclusive.

According to one embodiment of the invention, the first imaging system 110 is configured such that its rear focal plane F1 can correspond to the base surface 212 of the first structure 210, and the second imaging system 120 is configured such that its rear focal plane F2 can intersect the inclined surface 222 of the three-coordinate target 200 .

When the object observed by the optical system 100 is the target 200, the first imaging system 110 is itself capable, without any adjustment, of focusing on the base surface 212 of the first structure 210 in the range of distances between the target 200 and the first imaging system 110, which can vary within a few millimeters. In parallel, the second imaging system 120 is itself capable, without any adjustment, of focusing on a portion of the sloped surface 222 of the second structure 210 that is at a distance from the second imaging system 120 corresponding to the focal length of the second imaging system 120. According to one possible embodiment, the magnification of the first imaging system 110 is less than that of the second imaging system 120.

According to one possible design, the optical system 100 is configured such that the optical path of the first imaging system 110 and the optical path of the second imaging system 120 have a common area located on the optical axis O of the optical system 100, and including the rear focal plane F1 of the first imaging system 110 and the rear focal plane F2 of the second imaging system 120. In this case, the optical system 100 is preferably constructed such that the optical path that originates from the object passes through at least part of one of the imaging systems (110, 120) before reaching the other from survey systems (120, 110).

According to one exemplary embodiment, the first imaging system 112 of the first imaging system 110 and the second imaging system 122 of the second imaging system 120 are synchronized to simultaneously capture the first image by the first imaging system 110 and the second image by the second imaging system 120. In this case, it is clear that the target and optical system 100 are part of the measuring optical device 10, which is configured to determine the position of the workpiece holder 320 relative to the tool holder 310 in one step of imaging the target 200 by the optical system 100. In this case, in one step of imaging the end portion 313 of the tool mounted in the tool holder 310, by means of the optical system 100, it is possible to determine the profile of the end portion 313 of the tool 312 mounted in the tool holder 310, and in particular, the spatial (3D) profile the end portion 313 of the tool 312 installed in the tool holder 310.

As mentioned above, in order for the first imaging system 110 and the second imaging system 120 to simultaneously "see" the target 200, these systems have a common section of the optical path, which is directed forward and originates from the object monitored by the optical system 100; in this case, from target 200 (see FIGS. 6 and 8), after the target has been placed on the tool holder 310 and the optics 100 on the part holder 320. To this end, in the measuring working position, the first imaging system 110 faces the active surface 202 of the target 200, and forms an imaging system centered with the target 200, while the second imaging system 120 corresponds to the optical path 126, which meets the optical path 116 of the first imaging system. 110 (which is centered with the target 200) and forms a survey system that is offset relative to the target 200 relative to the optical axis O of the optical system 100, and relative to the common portion of the optical paths 116 and 126, which is centered with the target. In other words, the optical path of the imaging system, centered on the target 200, is oriented at a substantially right angle to the reference surface 212.

In particular, as shown in FIG. 6 and 8, the first imaging system 110 faces the active surface 202 of the target 200, in other words, is oriented at right angles to the active surface 202 of the target 200. This means that the optical axis O and the common portion of the optical paths 116 and 126 are centered with the target 200 and is perpendicular to the active surface 202 (and therefore base surface 212) of the target 200. With this configuration, as can be seen in FIG. 6 and 8, the optical axis O and the common portion of the optical paths 116 and 126 are parallel to the main Z direction, and orthogonal to the X and Y transverse directions and the X, Y plane.

According to one embodiment, the focal length of the second imaging system 120 is greater than the focal length of the first imaging system 110. For example, the focal length difference between the second imaging system 120 and the first imaging system 110 is in the range of 0.5 mm to 5 mm, inclusive.

According to one embodiment, the magnification of the first imaging system 110 is less than or equal to that of the second imaging system 120. For example, the magnification of the first imaging system is 0.2-1 (inclusive) of the magnification of the second imaging system 120. For example, the magnification of the first imaging system 110 lies in between 0.3-0.8 (inclusive) or 0.4-0.6 (inclusive) magnifications of the second imaging system, and preferably is approximately 0.5 magnifications of the second imaging system 120.

In the embodiment depicted in FIG. 6 and 8, the optical system 100 also includes the illuminator 140 mentioned above with respect to FIGS. 1-4, which is oriented in the direction of the tool holder 310, and can be directed towards the three-coordinate target 200, while the illuminator 140 is located so as to provide side illumination of the target 200. To this end, this illuminator 140 is located off-center, and tilted relative to the optical path 116+126 of the optical system 100. In particular, the light rays from the illuminator 140 form an angle with the base surface 212 of the target, so that their specular reflection from the reflective surfaces of the target, and in particular, local zones 217, forms reflected light rays, which do not enter the optical system 100. Similarly, when the inclined surface 222 includes mirror elements 225, the reflection of light rays coming from the illuminator 140 from these mirror elements 225 does not enter the optical system 100.

According to one embodiment, the first usable survey system 110 and the second usable survey system 120 are telecentric. Telecentricity is a characteristic of an optical system in which all of the primary beams (the center beam of each beam of beams) that pass through the system are substantially collimated and parallel to the optical axis. In the case of telecentric optics, the concept of the depth of the sharply depicted space is replaced by the concept of the working distance. According to another embodiment, one of the imaging systems: the first system 110 or the second system 120 is not telecentric, or both systems are not telecentric. In the case where both systems are telecentric, they can also be used to measure the geometric characteristics of the machining tool located on the tool holder 310, as discussed above and will be discussed further in this text.

According to one embodiment of the invention, the processing module 300 comprises the target 200 discussed above mounted on a tool holder 310 (see FIG. 1). The target 200 has an active surface 202 that forms a positioning reference that can be located on the optical axis O of the optical system 100 when the tool holder is at a predetermined angular position with respect to the X axis (after rotation, as indicated by the arrow R in Fig. 1 ) and at a predetermined axial position along the X-axis (see FIGS. 6, 7 and 8), thereby creating the initial position of the tool holder 310 relative to the workpiece holder 320. In this initial position, the target 200 is positioned such that the rear focal plane of the optical system 100 can coincide with the active surface 202 of the target. In particular (in addition to other possible options) in the specified initial position, the target 200 is located so that the rear focal plane F1 of the first imaging system 110 of the optical system 100 can coincide with the active surface 202 of the target (see Fig. 12), and so that the rear focal plane F2 of the second imaging system 120 may intersect the sloped surface 222 of the target 200 (the focal length of the second imaging system 120 allows the back focus F2 of the second imaging system 120 to be positioned on the second structure 220 of the target 200).

Further, according to FIG. 1 and 6, a method for three-dimensional optical measurement of distances between the target 200 and the optical system 100 will be discussed in the case of a machine tool system in which the processing module 300 includes an optical device 10. The reference directions X, Y and Z are the reference directions of the machine system, in particular the coordinate system a machine tool system that gives a vertical X direction (or first transverse axis), a main horizontal direction Z (or main axis), and a transverse horizontal Y direction (or second transverse axis). The target 200 is placed on the tool holder 310 (see Fig. 5): the tool holder 310 extends in the main horizontal direction, which corresponds to the X axis, with the possibility of rotation around the X axis. To this end, a part of the tool holder 310, for example, a clamp ) has depressions on its peripheral surface, typically intended to receive a grip/release tool, and into which a target 200, possibly associated with an RFID chip, as previously discussed, can be placed. In addition, the optical system 100 is mounted on a workpiece holder 320 (see FIG. 1) which receives a workpiece 322 to be processed. The workpiece holder 320 extends along its main horizontal direction corresponding to the Z axis and is rotatable about the Z axis. Then, before the machining step, the workpiece holder 320 and the tool holder 310 are placed in a position close to each other so that the tool 312 and the workpiece to be machined are in close proximity to each other, at the relative position measurement position. The location of the target 200 on the tool holder 310 and the location of the optical system 100 on the workpiece holder 320 allows, in a given position for measuring the relative position, the target 200, or rather the base surface 202, to be located on the continuation of the optical axis O of the optical system 100 (it should be noted that the specified optical axis O parallel to the Z direction). Thus, the base surface 202 of the target 200 faces the entrance pupil 102 of the optical system 100.

As shown in FIG. 1, the optical device 10 also includes a third imaging system 130 located on the tool holder 310 and configured to register the orientation of the active surface 202 of the target 200 and/or the angular position of the rotating part of the tool holder 310, in particular with respect to the X axis. positioning of the target 200 is performed before the stage of simultaneous shooting using the optical system 100, according to which:

- the tool holder 310 and the workpiece holder 320 are positioned so that the active surface 202 of the three-coordinate target 200 is on the optical axis O of the optical system 100. In particular, the third imaging system 130 can be used to record the angular position of the target 200 relative to the rotating part of the tool holder 310, and therefore relative to the X axis, which makes it possible to change (if necessary) the angular position of the rotating part of the tool holder 310 (see arrow R in Fig. 1), and thus the position of the target 200 so that the active surface 202 faces the optical system 100. The relative position measurement position is obtained when the target 200 is oriented in the direction of the optical system 100, as discussed above for the case of Figs 6 and 8: in this case, the Z direction passes between the target 200 and the optical system 100.

According to one embodiment of the invention, the optical device 10 further comprises a third imaging system 130 located on the tool holder 310 and configured to determine the angular orientation of the tool holder 310 relative to the X-axis. With the target 200, the third imaging system 130 also allows (or only allows ) determine the orientation of the active surface 202 of the target 200 with respect to the X-axis of the tool holder 310.

When first using the optical device 10 (namely, the optical system 100 and the associated target 200), respectively mounted on the part holder 320 and on the tool holder 310, a preliminary additional step of spatially referencing the position of the target 200 relative to the tool holder 310 (which carries the target 200) in the three directions X, Y, and Z. It should be noted that the parameters of the optical system 100, namely the first imaging system 110 and the second imaging system 120, are known, including their focal lengths. At this stage, it can be noted that when the working space of the processing module 300 is limited and maintained at a constant temperature, its thermal stability determines the stability of the dimensions of the optical device 10 and, therefore, its parameters.

It is worth recalling that the three-dimensional measurement of the relationship between the target 200 and the optical system 100 is used in the case of a machine tool system to ultimately know, in the form of X, Y, and Z coordinates, the spatial relationship between the tool holder 310 and the workpiece holder 320.

In this description, the three directions X, Y, and Z are, for example, the axes of the processing unit 300 of the machine tool system. Thus, the Z direction can be defined as the main axis, namely the main horizontal direction separating the first object (tool holder 310) from the second object (workpiece holder 320). The X direction may be defined as the vertical direction (or more generally the first transverse axis), and the Y direction may be defined as the transverse horizontal direction (or more generally the second transverse axis. In one embodiment, the holder 310 tool rotates about an axis parallel to the X direction.

At this stage of the spatial referencing of the position of the target 200 in three coordinates X, Y and Z (calibration of the optical device 10), for example, in the scheme corresponding to Fig. 6 and 9, the image is taken by means of the optical system 100, which leads, on the one hand, to the formation by the first imaging system 112 belonging to the first image system 110 of a first sharply focused image of the entire active surface 202 of the target 200 with the entire base surface 212, and with on the other hand, to the formation by the second imaging system 122 belonging to the second imaging system 120 of a second image of the entire inclined surface 222 of the target 200 with a single sharply imaged zone in the form of a horizontal strip. Said first image contains an image of local areas 217 which in this case define a square (see FIG. 10) so that processing of the first image yields the diagonals C1 and C2 of the square and makes it possible to determine the center C3 of the square. Accordingly, since the position of the optical axis O in the first image is known, determining the position of the center C3 of the square makes it possible to know in X coordinates and Y coordinates the position of the target 200 relative to the optical axis O, but also, on the one hand, relative to the reference 314 in the X direction on the holder 310 tool, and, on the other hand, with respect to the landmark 316 in the Y direction on the tool holder 310. In fact, as can be seen in FIG. 6 and 9, the X-direction reference uses the surface of the tool holder 310 that is orthogonal to the X-axis, such as formed by a shoulder on the body of the tool holder 310, which appears as a line in the first image, and whose surface forms the X-direction reference 314 ( see Fig. 9). Moreover, as can be seen in FIG. 6 and 9, the overall dimension of the tool holder 310 near the target 200 that is orthogonal to the X axis, and which in the depicted case is the width (parallel to the Y direction) of the tool holder 310 near the target 200, is used as the reference in the Y direction, for example, the diameter when this part of the tool holder 310 is cylindrical with a circular section; this dimension (gauge) forms a landmark 316 in the Y direction.

In parallel, a second image is processed, an example of which is seen in FIG. 15A. By analyzing the local contrast of this second image (see Fig. 15B, which shows contrast curves depending on the position in X coordinates), the X0 position of the sharpened area of the second image in the vertical X direction is determined. This analysis is performed by an algorithm that makes it possible to determine the sharpest pixels in an image. Since the inclination of the ramp 222 is known, a correspondence curve between X and Z of a given ramp 222 specific to the target 200 can be derived. Through this mapping curve, knowing the position X0 (see FIGS. 15A and 15B) allows the Z0 position of the ramp to be derived from this. 222 on the optical axis O, and hence the Z position of the target 200 relative to the optical system 100. In addition, the Z position of the optical system 100 relative to the workpiece holder 320 is known from the data of a ruler (not shown), which is located along the X axis. on the part holder 320 which carries the optical system 100. Similarly, the Z-position of the target 200 relative to the reference 314 of the tool holder 310 is known.

By repeatedly performing this operation, each time changing the Z-coordinate distance of the workpiece holder 320 relative to the tool holder 310 (for example, by moving the tool holder 310 back and forth), it is thus possible to reconstruct the three-dimensional image of the inclined surface 222 of the target 200, and obtain a reference base, forming a map of the Cartesian coordinates of the sloped surface 222 of the target 200 relative to the tool holder 310. Ultimately, it's all about the active surface 202 of the target 200 (base surface 212 and ramp 222), which is spatially referenced in the three X, Y, and Z directions relative to the tool holder 310.

Then, whenever necessary in the operations of using the processing module 300 equipped with the target 200 and the optical system 100, a proper measurement can be performed without disassembling the system between measurement points in order to maintain the measurement accuracy of the spatial reference that was explained above. For this purpose, for example, the circuit of FIG. 6. If necessary, rotate the tool holder 310 about its axis of rotation, which is parallel to the X axis (see arrow R in FIG. 1) to center the target 200 with the optical system 100. , on the one hand, to the formation by the first imaging system 112 belonging to the first imaging system 110 of a first sharply focused image of the entire active surface 202 of the target 200 with the entire base surface 212, and, on the other hand, to the formation by the second imaging system 122 belonging to the second imaging system 120, the second image of the entire inclined surface 222 of the target 200 with only one sharply depicted zone in the form of a horizontal strip corresponding to the focal length of the second imaging system 120. Analysis of the first image makes it possible, as mentioned above, to determine the center C3 of the square formed by local elements 217, and yet In order to determine the position of the target 200 relative to the optical axis O, and also relative to the tool holder 310, in X and Y way. Analysis of the second image, and in particular the position of the sharply imaged area of the second image (as in Fig. 6) in the X direction, makes it possible to determine this position in Z coordinates, and therefore the distance of the target 200 relative to the optical system 100. In fact, with regard to the second image Since the Z position of each image pixel of the ramp 222 relative to the references 314 and 316 of the tool holder 310 is known, it is possible to measure the Z position of the target 200 and hence the tool holder 310 very quickly.

From the foregoing, it should be understood that in this way, solely by analyzing the two images formed by the optical system 100, without wasting time for adjusting or focusing the optical system 100, it is possible to very quickly measure the position of the target 200 relative to the optical system 100 in the X, Y and Z coordinates, and thus the positions of the tool holder 310 relative to the workpiece holder 320. This is possible due to the fact that the position of the optical system 100 relative to the workpiece holder 320 in X, Y and Z coordinates is known. (stylus), which in the first stage of binding along the X coordinate comes into contact with the end of the probe on the optical system 100 on the one hand, and with the part holder 320 on the other side, which gives the distance in the X direction between the optical system 100 and the part holder 320. By performing these stylus contact steps again after positioning the axis of the tool holder 310 parallel to the Z axis of the workpiece holder, the distance in the Z direction between the optical system 100 and the tool holder 310 can be obtained. In the case of thermal changes, such as thermal expansion of various components in a machine tool system, this measurement procedure makes it possible to eliminate the effect of thermal expansion.

This procedure can be used to determine the position or profile of the end portion 313 of the tool 312 installed in the tool holder 310 through the optical system 100, as will be discussed below. The process is carried out in accordance with the above description regarding the spatial reference of the position of the target 200 in three coordinates X, Y and Z relative to the optical system 100 with the difference that instead of the target 200 on the optical axis O of the optical system, the end section 313 of the tool 312 is located (see Fig. .4 and 16). In this case, it is understood that when the measuring device 304 is turned on, the imaging system 110 and the imaging system 120 are used together (in particular, they are used simultaneously), and therefore the first imaging system 112 and the second imaging system 122 form one (or more) images( th) of the end portion 313 of the instrument 312. In fact, at the measurement position, the end portion 313 is positioned such that the rear focal plane F1 of the first imaging system 110 of the optical system 100 may coincide with part of the surface of the end portion 313, and such that the rear focal plane F2 the second imaging system 120 may intersect part of the surface of the end portion 313. Therefore, the focal length of the second imaging system 120 allows the back focus F2 of the second imaging system 120 to be placed on a portion of the surface of the end portion 313.

It is clear that the image recorded by the second imaging system 120 makes it possible, by means of a zone of sharp focus, to obtain accurate information about the distance along the Z axis of the position of the end portion 313 of the tool 312 relative to the optical system 100 (and, therefore, the workpiece holder 320), and the image recorded by the first shooting system 110 is an image of the entire visible surface of the end portion 313 of the tool 312, with all or most of the image in sharp focus. This image of the end section 313, registered by the first imaging system 110, allows you to build a map of the end section 313 of the tool 312, containing the image of the edge line of the end section 313 of the tool 312, which is visible in the projection along the Z axis, and forms a profile or part of the profile of the end section 313.

Therefore, according to the third possibility regarding the method of determining the profile of the tool 312, as described above, at the time of turning on the measuring device 304, the first imaging system 110 is used, and therefore the first imaging system 112, which forms one (or more) images ( th) end portion 313 of tool 312. Analysis of said image makes it possible to determine the edge of the tool as it is "seen" by the first imaging system. This is the edge, i.e. the contour of the end portion 313 of the tool 312 as seen in projection onto a plane (X, Y) orthogonal to the Z direction, which is itself parallel to the optical axis O of the optical system. Thus, the shape (in this case a line) of the edge of the tool 312 as determined from the image captured by the first imaging system 110 provides information about the geometry of the end portion 313 of the tool 312 mounted in the holder 310 at the time the image was captured. This image also makes it possible to view the cutting edge or edges (in projection) as they are "seen" by the first imaging system 110. Such a consideration is carried out in relation to both the position, in particular with respect to the edge, and the geometry (image shape of the line corresponding to the cutting edge) .

It will be understood that said imaging operations of the end portion 313 of the tool 312 may be repeated several times after the tool holder 310 is rotated about the X axis, in particular a few degrees or 10° to 20°, in order to register different images of the end portion 313 with the optical system 100. seen from different angles. All of these images enable a three-dimensional (3D) reconstruction of the shape (profile) of the end section 313 of the tool 312.

According to one embodiment of the invention, a method for determining the wear of a machining tool 312 in a machine tool system is also provided, which uses the above-described method for determining the tool profile (in accordance with one or other embodiments discussed above), which provides information (comprising at least one image ) representing the profile of the end section 313 of the tool in the first state, and which further contains the following steps, in which:

vi) performing machining operations using the tool 312, thereby obtaining a tool 312, in which the end section 313 has a modified profile (second state or new profile),

vii) setting the tool holder 310 relative to the workpiece holder 320 to the indicated measuring position (for example, according to the diagram of Fig. 4),

viii) turn on the measuring device 304,

ix) using the optical system 100, the modified profile of the end portion 313 of the tool 312 installed in the tool holder 310 is determined (for example, to check the position and/or orientation of the cutting profile, or, for example, to check the properties of the cutting tool, and therefore that the condition of the cutting tool meets the requirements for further machining), and

x) determine the degree of wear of the tool on the original profile and the modified profile of the end section 313.

In this case, comparing the information associated with the image (or images) of the end portion 313 of the tool in the first state and the second state makes it possible to determine, track or qualify tool wear, including wear rate, wear type, wear rate, and the like. This procedure makes it possible, for example, to construct a wear curve when images are acquired in parallel with the use of a tool, in particular for the first tool in a series of identical tools. For each new tool from such a series of identical tools, the wear curve can be rebuilt from the information associated with the recorded images, or an already established wear curve can be adapted to form a wear table for a given type of tool. Thus, when using the nth tool from a series of identical tools, the imaging can be done less often, and in any case by comparison with previously obtained wear curves or a wear table to see the trend and predict the future wear of a given tool, which makes it possible with one on the other hand to modify the machine system settings accordingly for new parts being made with the same tool or for new machining passes that have yet to be performed on that part, and on the other hand to plan/decide whether to change the tool for the next part or not.

This method also serves to qualify the condition of the tool (good, bad) by checking and confirming (or not confirming) that after machining operations, the reshaped tool has a new geometry that still meets the requirements of the specifications.

Moreover, the use of this method for detecting wear of the tool 312 also specifically allows determining the angular orientation of the reshaped tool 312 with respect to the X-axis of the tool holder and therefore with respect to the workpiece holder 320 at the measuring position, and also allows to confirm that the tool 312 with a modified profile in the measuring position is in the desired orientation relative to the holder 310 of the tool. Using this tool 312 wear detection method also makes it possible to set a profile, and check that the tool 312 installed in the holder matches the expected tool (the detected profile corresponds to the expected and specified profile), and therefore allows you to prevent the tool from being installed in the tool holder 310 in inappropriate condition.

According to one embodiment of the invention, a machine tool system is provided equipped as described with a processing module, the machine tool system notably also comprising a tool wear monitor 306 (see FIG. 1) that can calculate tool profile deviation based on information from the device 304 to determine the profile of the tool 312. In particular, in this machine system, the specified device 306 for monitoring tool wear, if the deviation of the profile of the end section 313 of the tool 312 exceeds the specified deviation, allows a modified profile (new profile) of the end section 313 tool 312 installed in the tool holder 310, which was determined by the measuring device 304, to be used for conversion of machining parameters. The machining parameters contain, in particular, information for moving the tool holder 310, which is transmitted to the tool holder controller 302. In particular, if the profile deviation exceeds the deviation threshold, then the information associated with the new tool profile is used to recalculate the machining parameters containing the changed information for moving the tool holder 310, which is transmitted to the specified tool holder controller 302. The tool holder controller 302 receives this modified information, which allows machining operations to be adapted depending on the measurement results of the tool profile by the measuring device 304.

The previous descriptions and explanations have been given for an embodiment of the processing module 300 with the tool holder 310 extending along the X axis, which is horizontal, with the Y axis of the processing module 300, which is vertical, with the processing tool 312 rotating about an axis parallel to the X axis, and a tool holder 310 that is movable along the X axis. According to another embodiment of the invention illustrated in FIG. 17, a machining unit 300 is used with a tool holder 310 extending along the X-axis, which is vertical, with a Y-axis of the machining unit 300, which is horizontal, also with a machining tool 312 rotating about an axis parallel to the X-axis, and a tool holder 310 which can move along the x-axis. According to another embodiment of the invention shown in FIG. 18 and 19, a processing module 300 is used with a tool holder 310' that carries a series of tools 312, 312', 312', 312'' parallel to each other and aligned in the (vertical) Y direction. Each tool 312, 312', 312', 312'' of said row of tools is oriented along the X-axis, which is horizontal, each tool 312, 312', 312', 312'' is rotatable (along arrow A) about an axis parallel to the X-axis by means of a rotating assembly (e.g., a spindle) that belongs a tool holder 310' that carries one of the tools 312, 312', 312', 312''; wherein the tool holder 310' is movable along the X-axis and along the Y-axis, and preferably also rotatable about the vertical Y-axis (arrow B). This embodiment allows continuous machining by switching from one of the tools 312, 312', 312', 312'' to another. In this case, the tool holder 310' is also equipped with (at least one) target 200, possibly associated with an RFID chip, as described above. In this case, shown in FIG. 18, two targets 200 are located on the rear side of the tool holder 310', which does not rotate about an axis parallel to the X axis. Although not shown, a target 200 could be provided for each tool a tool holder assembly (eg, spindle) 310' that carries one of the tools 312, 312', 312', 312''.

List of reference symbols used in the drawings

X Vertical direction (first transverse axis)

Y Lateral horizontal direction (second transverse axis)

Z Main horizontal direction separating the first object from the second object (major axis)

C1 Diagonal

C2 Diagonal

C3 Center

α Angle of slope

R Arrow showing rotation of tool holder and target

10 Optical device

100 Optical system

About optical axis

102 Entrance pupil of the optical system

104 Ring front light

106 Rear light

110 First filming system

DOF1 Depth of field of the first imaging system

F1 Rear focal plane of the first imaging system

112 First imaging system

116 Optical path of the first imaging system

120 Second camera system

F2 Rear focal plane of the second imaging system

DOF2 Depth of field of the second imaging system

122 Second imaging system

126 Optical path of the second imaging system

128 Optical module with catoptric optical system

129 Mirror

130 Third camera system

140 Illuminator (side illumination)

200 Three-coordinate target

202 Active surface

210 First structure

212 Reference surface

214 First section (with diffuse reflection surface)

216 Second section (with mirror reflection surface)

217 Local zones

218 Window

219 Corps

220 Second structure

222 Incline

224 Relief elements

225 Mirror elements

230 Transparent protective plate

231 Bottom wall

232 Top plate

233 Reflective layer

234 Cylindrical wall

300 Processing module

302 Tool holder control

304 Tool profiling device

306 Tool wear monitor

308 Part holder control

310 Tool holder

310' Multi-spindle tool holder

312 Tool

312' Tool

312ʺ Tool

312ʺ' Tool

313 Tool end

313A Wear zone

314 Reference X on the tool holder

316 Y-guide on tool holder

320 Part holder or material spindle

322 Workpiece (material)

Claims (49)

1. The processing module of the machine tool system for machining, containing: - a workpiece holder designed to accommodate the workpiece to be machined, - a workpiece holder control device configured to control and change the position of the workpiece holder in the processing module, - a tool holder designed to accommodate a tool containing an end section used for machining a part installed in the part holder, - a tool holder control device configured to control and change the position of the tool holder in the processing module, - a measuring device for determining the profile of a tool installed in the tool holder, containing an optical system for determining the profile of the end section of the tool installed in the tool holder, while the optical system is installed on the workpiece holder. 2. Processing module according to claim. 1, characterized in that the optical system is configured to determine the specified profile when the tool holder is in the measuring working position. 3. Processing module according to claim. 2, characterized in that the optical system contains the first imaging system, designed so that its rear focal plane in the measuring working position can cross the end section of the tool. 4. Processing module according to claim 1, characterized in that the optical system comprises an optical axis (O) orthogonal to the direction of the X-axis of the tool holder. 5. The processing module according to claim 1, characterized in that the optical system is a part of a measuring optical device configured to determine the relative position of the workpiece holder and the tool holder in three coordinates in one operation of obtaining an image by the optical system. 6. The processing module according to claim 5, characterized in that the measuring optical device is also configured to determine the profile of the end section of the tool installed in the tool holder, in one operation of obtaining an image of the end section of the tool installed in the tool holder by the optical system. 7. Processing module according to claim 5, characterized in that the measuring optical device further comprises a front illuminator oriented parallel to the optical axis (O) of the optical system in the direction of the tool holder. 8. Processing module according to claim. 5, characterized in that the measuring optical device further comprises a rear light oriented in the direction of the optical system. 9. The processing module according to claim 1, characterized in that it additionally contains a target, which is part of an optical device, is mounted on a tool holder, and contains an active surface that forms a reference position for positions when moving along the optical axis (O) of the optical system, when the tool holder is at a predetermined angular position relative to its axis (X) and at a predetermined axial position along its axis (X), and thus the position of the tool holder is linked to the position of the workpiece holder. 10. The processing module according to claim 9, characterized in that the target rearranges a three-coordinate target containing on the active surface: a first structure forming a flat base surface, and - a second structure containing a surface inclined relative to said flat base surface, wherein said optical system comprises a first imaging system and a second imaging system, wherein the difference between the focal length of the second imaging system and the focal length of the first imaging system lies in the interval between the minimum distance and the maximum distance separating the base surface from the inclined surface. 11. Processing module according to claim 9, characterized in that said optical measuring device further comprises an illuminator oriented in the direction of the tool holder, said illuminator being positioned so as to provide side illumination of a three-dimensional target. 12. The processing module according to claim. 1, characterized in that the optical system contains the first shooting system and the second shooting system, while: - the depth of field of the first imaging system is at least ten times greater than the depth of field of the second imaging system, and - the optical system is constructed so that the optical path of the first imaging system and the optical path of the second imaging system have a common area located on the optical axis (O) of the optical system and containing the rear focal plane of the first imaging system and the rear focal plane of the second imaging system. 13. The processing module according to claim 10, characterized in that: - the optical system comprises the first imaging system and the second imaging system, wherein: - the depth of field of the first imaging system is at least ten times greater than the depth of field of the second imaging system, and - the optical system is constructed so that the optical path of the first imaging system and the optical path of the second imaging system have a common area located on the optical axis (O) of the optical system, and containing the rear focal plane of the first imaging system and the rear focal plane of the second imaging system, and: the first imaging system is configured such that its rear focal plane can correspond to the base surface of the first structure, and - the second imaging system is designed so that its rear focal plane can intersect the inclined surface of the three-coordinate target. 14. The processing module according to claim 1, characterized in that the optical device further comprises a third imaging system located on the tool holder and configured to determine the angular orientation of the tool holder relative to its axis (X). 15. A machine tool system comprising the processing module described in claim 1 and further comprising a tool wear monitoring device configured to calculate the deviation of the tool profile from the data transmitted by the measuring device. 16. The machine tool system according to claim 15, characterized in that the specified device for tracking tool wear, when the deviation of the tool profile exceeds the specified deviation, allows using the modified profile of the end section of the tool installed in the tool holder, detected by the measuring device, to recalculate the machining parameters , including data for the movement of the tool holder, which is transmitted to the control device of the tool holder. 17. A method for determining the position of a tool installed in a tool holder in a processing module containing a part holder and a tool holder, comprising the steps of: i) in the processing module, a measuring device is provided, containing an optical system for determining the profile of the end section of the tool installed in the tool holder, while the optical system is mounted on the workpiece holder; ii) install the tool in the tool holder; iii) place the tool holder in relation to the workpiece holder in the measuring working position; iv) turn on the measuring device, and v) by means of an optical system, the position of the tool in the processing module is determined. 18. A method for determining the profile of a tool installed in a tool holder in a processing module containing a workpiece holder and a tool holder, comprising the steps of: i) in the processing module, a measuring device is provided, containing an optical system for determining the profile of the end section of the tool installed in the tool holder, while the optical system is mounted on the workpiece holder; ii) install the tool in the tool holder; iii) place the tool holder in relation to the workpiece holder in the measuring working position; iv) turn on the measuring device, and v) by means of an optical system, the profile of the end section of the tool installed in the tool holder is determined. 19. A method for determining tool wear in a machine tool system, which uses the method for determining the tool profile described in claim 18, and which further comprises the following steps, in which: vi) performing machining operations using the specified tool, thereby obtaining a tool in which the end section has a modified profile; vii) positioning the tool holder relative to the workpiece holder in the specified measuring operating position; viii) include a measuring device, ix) determining the modified profile of the end portion of the tool installed in the tool holder; and x) determine the degree of tool wear according to the original profile and the modified profile of the end section of the tool.

Images