RU2729169C1 - Device for measuring specific resistance of semiconductor cutting ceramic plates - Google Patents

Abstract

FIELD: monitoring and measuring equipment.SUBSTANCE: invention relates to control and measurement equipment for determining specific resistance of semiconductor replaceable polyhedral cutting plates of oxide-carbide ceramics. A device for measuring specific resistance of cutting ceramic plates, comprising a current source and an Ohmmeter registration means connected to probing electrodes. According to the invention, in the housing of the device there are two channels communicating with the chambers and filled with current-conducting liquid material, into which threaded elements are installed on the outer side, wherein the metal balls are located inside the channels, device housing has a groove accommodating a detachable case made in the form of two parts, a body and a cover, with through square holes to which electrodes are connected, note here that O-rings are installed on outer sides of cover and body of case. Sample of ceramic plate is installed in case.EFFECT: invention is intended for nondestructive determination and control of microstructural parameters of material, which directly affect efficiency of cutting ceramics.1 cl, 4 dwg

Description

The invention relates to the field of control and measurement technology for determining the electrical resistivity of semiconductor replaceable multifaceted cutting plates made of oxide-carbide ceramics for the purpose of non-destructive determination and control of the microstructural parameters of the material that directly affect the performance of the cutting ceramics.

A device for contactless measurement of the resistivity of a semiconductor material (RF Patent No. 2420749, published 10.06.2011) is known, consisting of a signal generator, to the output of which the first coil of the induced signal recorder is connected, to the input of which the second coil is connected. In this case, the first and second coils are placed coaxially, and the measurement object is placed in front of the coils. The distance between the first and second coils is fixed, while the first and second coils are connected to the signal generator and the induced signal recorder by means of a two-channel electronic key additionally introduced into the device, which alternately connects the first and second coils with the signal generator and the induced signal recorder with a given duty cycle. The first and second coils are identical and are made in the form of flat spirals, and their frame and winding are made of non-magnetic materials, for example, plastic and copper wire, respectively.

The disadvantage of this device is the distortion of the induced signal, which affects the quality of its registration by the measuring device when measuring the electrical resistivity of the plates having through holes.

A device for contactless measurement of the specific electrical resistance of silicon raw materials is known (RF Patent No. 2421742, published on 06/20/2011), consisting of a sensor, which is a cylindrical container of non-magnetic material, inside which the object of measurement is located, and on the outer side surface of which the first and second coil, a signal generator, with the output of which the first coil is connected, an induced signal recorder, with the input of which the second coil is connected, the first and second coils are made of non-magnetic material and represent a bifilar coil, and the first and second coils are connected to the signal generator and the recorder of the induced signal through an additionally introduced into the device a two-channel electronic switch, which provides re-commutation with a given duty cycle of the first and second coils between the generator. Inside the sensor, which is a cylindrical container made of nonmagnetic material, on the outer side surface of which the first and second coils are located, the object of measurement is placed in a removable plastic container.

The disadvantage of this device is that its design features in the form of a cylindrical shape of the sensor and magnetic coils provide a minimum measurement error on objects whose shape is closest to cylindrical (for example, silicon raw materials in the form of particles with a fraction size of up to 1 mm, placed in a plastic cylindrical container, for which the device was developed), and do not allow to determine with sufficient accuracy the electrical resistivity of non-cylindrical samples with extended flat surface areas.

Known device for measuring the parameters of semiconductor wafers, which is a camera for measuring the parameters of semiconductor wafers (USSR author's certificate No. 779937, published on November 15, 1980). The camera is made in the form of a short-circuited segment of the transcendental waveguide with a protrusion on one of the wide walls, coupling elements and rods that are installed perpendicular to the wide walls of the short-circuited segment of the transcendental waveguide with the possibility of axial movement in the holes, which are additionally made in the protrusion. Coupling elements are used for input and output of microwave energy. The rod is moved by rotating the nut. The spring, located between the cylindrical glass and the cylindrical bulge, provides a constant pressure of the rod to the surface of the semiconductor wafer under study. To prevent the rods from turning during the rotation of the nuts, keys are inserted into the rods and grooves in the holes of the cylindrical glass. The nuts also serve to fix the axial position of the rods.

The disadvantage of the device is the limitation of the scope of its application for ceramic plates with a high class of surface roughness and plates of large thickness due to a significant decrease in the quality of the output signal when the gap between the measured plate and the measuring device changes, which leads to an error in the data obtained.

Known device for measuring the resistance of semiconductor materials (USSR author's certificate No. 1583814, published on 08/07/1990), which contains a high-frequency generator and a high-frequency voltmeter. The high frequency generator is connected to a voltage divider consisting of a semiconductor sample and a load resistance connected in series. A signal proportional to the resistivity of the semiconductor can be read from both the load resistance and the sample, depending on the range of measured resistivity. In this case, the sample is connected to the measuring circuit by means of a capacitive coupling formed by the plates and a planar capacitor placed on the measuring board, against which the sample is pressed with a locking pin.

The disadvantage of this device is that due to the design features of the device, namely the action of the reactance of the contact capacities, the measurement accuracy of the oxide-carbide ceramic plates decreases.

The closest in technical essence and the achieved result is a device for local control of the resistivity of semiconductors (USSR author's certificate No. 1822972, published on 06/23/1993), consisting of a current source, a flat capacitor with a through hole in the middle, the metal plates of which are separated by a dielectric layer. The upper plate of this capacitor is at the same time the base electrode, the lower plate is connected to the probe electrode, which is located in the hole of the flat capacitor, through the means for recording a pulsed current and a high-resistance resistor, and the distance from the tip of the electrode to the test sample is 0.1 mm. The electrical circuit of the device is closed by a plasma cord in the air gap between the tip of the probe electrode and the surface of the sample, which can be considered as ideal contact to the surface of any semiconductor. The ideality of the contact is characterized by the fact that the spark discharge plasma wets the semiconductor surface, regardless of the quality of its processing, while no mechanical stresses arise.

The disadvantages of the device are that, due to the design features of the electrodes of the measuring device, when examining a sample of an oxide-carbide ceramic plate, the current will flow exclusively over the surface of the sample under study, as well as the need to preliminary determine the characteristics of the injection current, which is different for different semiconductor materials, due to with the derivation of the specific electrical resistance from the amplitude of the current pulse.

The technical result is the creation of a device for determining and monitoring the microstructural parameters of the material, which affect the performance of cutting oxide-carbide ceramics.

The technical result is achieved by the fact that two cylindrical threaded channels are made in the device body, communicating with the chambers and filled with a conductive liquid material, into which threaded elements are installed from the outside, while metal balls are inside the channels, a rectangular groove is made in the device body , in which a split case is installed, made in the form of two parts, a body and a lid, with through square holes to which the electrodes are connected, while on the outer sides of the lid and the case of the case, there are sealing rings, the test sample of the ceramic cutting plate is installed in the case.

A device for measuring the resistivity of semiconductor cutting ceramic plates is illustrated by the following figures: FIG. 1 - sectional view of the device body; fig. 2 - sectional pencil case; fig. 3 - General view of the device in section; fig. 4 is a diagram of the device operation, where:

1 - case;

2 - pencil case;

3 - channel;

4 - groove;

5 - case body;

6 - hole in the case of the case;

7 - a sealing gasket;

8 - case cover;

9 - hole in the case cover;

10 - screw;

11 - probing electrodes;

12 - Ohmmeter;

13 - a sealing ring;

14 - threaded element;

15 - metal ball;

16 - camera;

17 - test sample;

18 - liquid conductive material.

The device is made of a dielectric material, for example, of organic glass and consists of two interconnected parts - the case 1 (Fig. 1) and the case 2 (Fig. 2). In the body 1, two channels 3 of a cylindrical shape with threads are made, located at an angle of at least 90 degrees to the lateral surfaces of the protruding part of the body and extending from the rectangular groove 4 through to the upper part of the body. Channels 3 form communicating chambers 16 filled with conductive liquid material 18. Metal balls 15 are placed in channels 3. The rectangular case 2 includes a case 5 with a hole in the case 6 of a square shape in the center, along the perimeter of which sealing gaskets 7 are rigidly fixed. made of elastic waterproofing material, for example, rubber, and the case cover 8 is rectangular with a square hole in the case cover 9 in the center. The case of the case 5 and the lid of the case 8 are connected to each other by screws 10. The probing electrodes 11 (Fig. 4), made in the form of copper contacts, are connected to the case 2 for connecting the Ohmmeter 12. On the outer surfaces of the case 5 and the case cover 8, removable sealing rings 13 made of elastic waterproofing material, for example rubber. Threaded elements 14 (Fig. 3) made of a dielectric material, for example, organic glass, close the channels 3 in the upper part.

The testing process is as follows. The test sample 17, for example, a plate of oxide-carbide ceramic, is inserted between the case of the case 5 and the lid of the case 8. The parts of the case are connected by screws 10, fixing the position of the test specimen 17 of the ceramic cutting plate in such a way that the plate forms two chambers 16 in the case, the tightness of which provided with O-rings 13. After that, the case together with the sample is placed in the groove 4 in the housing 1 of the measuring device. Through the channels 3 on the upper part of the housing 1 of the measuring device, first in one, and then in the second channel 3, a liquid conductive material 18 is poured, for example, an alloy of indium, gallium and tin, which fills the chambers 16 in the case 2 and contacts the test sample 17 throughout its square on both sides. To provide the required pressure of the liquid conductive material, metal balls 15 are placed in the channels 3. The metal balls 15 create the required pressure in the channels 3 by their gravity, since the sliding fit does not allow them to completely submerge in the liquid. The tightness of the channels 3 of the measuring device is ensured by the installation of threaded elements in them 14. An ohmmeter 12 is connected to the copper conductive probing electrodes 11, which is a current source and a means of recording the resistivity of the test sample 17. On the scale of the Ohmmeter 12, the obtained value of the resistivity is recorded, which makes it possible to indirectly determine microstructural parameters and porosity of the test sample of oxide-carbide cutting ceramics, affecting its physical and mechanical properties and performance. To retest, it is necessary to disconnect the Ohmmeter 12, turn the device upside down with the probing electrodes 11, take out the case 2 and replace the test sample 17 without leakage of the liquid conductive material 18, falling into channels 3 under the force of gravity.

A device for measuring the resistivity of semiconductor oxide-carbide ceramic cutting plates allows you to accurately determine the value of the resistivity and the physical and mechanical properties of the test plate without violating its geometry and working condition.

Claims (1)

A device for measuring the resistivity of semiconductor cutting ceramic plates, containing a current source and recording means An ohmmeter connected to the probe electrodes, characterized in that the device housing has two cylindrical threaded channels communicating with the chambers and filled with a conductive liquid material, into which threaded elements are installed on the outer side, while the metal balls are inside the channels, a rectangular groove is made in the device body, into which a detachable case made in the form of two parts, a body and a cover, with through square holes, to which the electrodes are connected, is installed, while O-rings are installed on the outer sides of the lid and the case of the case, and the sample of the ceramic cutting plate is installed in the case.

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