RU2622234C1 - Device for stabilizing temperature of electronic products - Google Patents

Abstract

FIELD: electricity.

SUBSTANCE: device for stabilizing the temperature of electronic products is proposed by installing posistors on a copper plate connected to an electronic product by means of a heat-conducting layer. Herewith the terminals of the posistors and the copper plate are connected to a galvanic isolation device connected to a temperature control circuit. A significant difference of the proposed device is the presence of posistors on the copper plate, heating the copper plate with the electronic product, and also the fact that the terminals of the posistors and the copper plate are connected to the galvanic isolation device connected to the temperature control circuit, thereby providing thermal stabilization.

EFFECT: increasing the efficiency of the device, increasing the reliability of the equipment in the entire range of its operating temperatures, and increasing the stability of the operating device characteristics.

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Description

The invention relates to electrical equipment for ensuring the performance of electronic products in on-board equipment by thermal stabilization of the housing surface of electronic products.

It is known that electronic products used in electronic devices for various purposes are operable in a certain temperature range. At the same time, they must ensure operability in more severe conditions at low temperatures. In this regard, there is a need for thermal stabilization of electronic products, especially in complex equipment, i.e. not only heat removal from thermally loaded circuit elements, but if necessary, their heating to operating temperature.

It is known a device [1] for stabilizing the temperature of electronic components, comprising a board on which at least one integrated circuit is installed with its contact side, requiring thermal stabilization, on the opposite side of which there is a flat radiator, a heating element mounted on a platform made in the central part of the radiator on its outer surface, a temperature control circuit, electrically connected to the heating element, and a temperature sensor located on the working surface STI board.

The disadvantage of this system is the lack of reliability of the device in the entire range of operating temperatures, high energy consumption for heating the radiator, low thermal conductivity between the heating element and the radiator.

Achievable technical result is to increase the efficiency of the device, increase the reliability of the equipment in the entire range of its operating temperatures and increase the stability of the operating characteristics of the device.

The problem is solved due to the fact that in the device for stabilizing the temperature of electronic products containing a copper plate for placing electronic products on it, a temperature control circuit and a temperature sensor electrically connected to it, located on the surface of an electronic product requiring thermal stabilization, according to the invention on a copper plate connected to the electronic product by means of a heat-conducting layer, posistors are installed, the terminals of the resistors and a copper plate are connected to the devices galvanic isolation which is connected with the temperature control circuit.

A significant difference between the proposed device is the presence on the copper plate of the posistors heating the copper plate with an electronic product, thereby providing thermal stabilization.

Another significant difference of the proposed device is that the terminals of the posistors and the copper plate are connected to a galvanic isolation device connected to a temperature control circuit, thereby ensuring thermal stabilization.

In FIG. 1 shows a diagram of a device.

The proposed device contains a copper plate (3) for placing an electronic product (1) on it, a temperature control circuit (6), a temperature sensor (2), resistors (4), a galvanic isolation device (5), a heat-conducting layer (7).

A device for stabilizing the temperature of electronic products works as follows.

When the temperature inside the electronic product (1), determined using a temperature sensor (2), is lower than the permissible operating temperature of the electronic product (1), the signal from the temperature control circuit (6) turns on the device (5) for galvanic isolation supplying the resistors (4) during operation of which the copper plate (3) is heated, which during heating releases heat from its surface, transferring sufficient heat to heat the electronic product (1) connected to the copper plate (3) by means of heat oprovodyaschego layer.

After the temperature inside the block body warms up to the required value determined using the temperature sensor (2), the temperature control circuit (6) turns off the galvanic isolation device (5), and the electronic product (1) enters the operating mode.

The temperature control circuit (6) can be performed on a standard element base or implemented by software and is designed to control the voltage supplied to the galvanic isolation device (5).

To ensure timely switching on and off of the galvanic isolation device (5), a temperature sensor (2) is provided, located on the body of the electronic product (1) and electrically connected to the temperature control circuit (6).

The posistors (4) are connected to the base of the copper plate (3) by soldering, resulting in maximum heat exchange between them. During heating, the copper plate (3) generates heat from its surface.

To connect the electronic product (1) with a copper plate (3), a heat-conducting layer (7) is used, which can be used hot melt adhesive or heat-conducting paste.

Thus, the use of the claimed design of the temperature stabilization device, which provides for the placement of an electronic product that requires thermal stabilization, on a copper plate heated by posistors, can improve the reliability of the equipment in the entire range of its operating temperatures, increase the stability of the operating characteristics of electronic products and get the ability to control speed and temperature heating, which accordingly increases the efficiency of the thermal stabilization device and the whole paratus as a whole.

Information sources

1. RF patent No. 2529852, IPC G12B 15/00, 2012 (prototype).

Claims (1)

A device for stabilizing the temperature of electronic products, containing a copper plate for placing electronic products on it, a temperature control circuit and a temperature sensor electrically connected to it, located on the surface of the electronic product requiring thermal stabilization, characterized in that on the copper plate connected to the electronic product by means of a heat-conducting layer, posistors are installed, posistor leads and a copper plate are connected to a galvanic isolation device connected to the circuit th temperature control.

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