RU2558217C1 - Method for heat removal from heat-generating electronic components in form of electromagnetic energy based on gunn-effect diodes - Google Patents

Abstract

FIELD: heating.

SUBSTANCE: thermoelectric device is developed, which consists of a thermal module, the hot junctions of which represent Gunn diodes intended for conversion of thermal energy supplied from cold junctions in the form of electrical current to electromagnetic energy removing the heat from the cooled device to atmosphere. Such method has advantages in comparison to common thermal modules with hot and cold junctions so that there can be obtained a lower temperature on a cold junction because parasitic conductive transfer is reduced from the side of the hot junction, which is much less heated due to the fact that some part of energy is removed in the form of electromagnetic waves but not converted to heat on a hot junction.

EFFECT: improvement of a cooling process of heat-generating electronic components; use of the presented invention will allow improving heat transfer efficiency and reducing dimensions of a heat sink, and therefore, increasing operation intensity of cooling systems.

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Description

The invention relates to methods of cooling and heat removal, for example, to methods of cooling a computer processor.

Known thermoelectric heat sink [1], made of thermal modules, in which the base of the heat sink is a basic thermal module, the heat sink rods of the needle type are located on the base in a checkerboard or corridor order, each rod consists of the optimal number of additional thermal modules located cascading one above the other, having an area significantly smaller than the base thermal module.

The purpose of the invention is the improvement of the cooling process of fuel electronic components.

To achieve this goal, a thermoelectric device consisting of a thermal module has been developed, the hot junctions of which are Gunn diodes designed to convert thermal energy received from cold junctions in the form of electric current into electromagnetic energy that removes heat from the cooled device to the environment. This method has advantages over conventional thermal modules with hot and cold junctions in that it is possible to obtain a lower temperature on the cold junction, since the parasitic conductive transfer from the hot junction is reduced, which heats up much less due to the fact that part of the energy goes away in the form electromagnetic waves rather than being converted to heat by a hot junction. An additional advantage is the speed of the heat removal process in the form of electromagnetic radiation. The energy of electromagnetic waves is directly proportional to the frequency of the waves. Therefore, to increase the efficiency of heat dissipation, it is advisable to use such materials of p-type and n-type semiconductor branches, which are used in Gunn diodes with the highest frequency of emission of electromagnetic waves.

Figure 1 shows the design of a thermoelectric device that implements the claimed method.

The design of the thermoelectric device is a thermal module 1 in the form of a heat sink base, on which series-connected Gunn diodes 2 are used as heat sink needle pins, while the current flowing on one of the junctions will generate electromagnetic waves, and not heating, as in a conventional thermal module, moreover, in another spa, thermal energy will be absorbed in accordance with the Peltier effect.

Using the present invention will improve the efficiency of heat transfer and reduce the dimensions of the heat sink, and thereby increase the intensity of the cooling systems.

The possibility of increasing heat transfer through the use of electromagnetic wave radiation has the potential for discrete heat sources, for example, powerful semiconductor components (diodes, transistors, thyristors, etc.).

Literature

1. Thermoelectric heat sink: US Pat. 2288555 ROS. Federation, IPC N05K 7/20 / Ismailov T.A., Gadzhiev H.M., Nezhvedilov T.D., Gafurov K.A .; applicant and patent holder “Dagestan State Technical University” - No. 2003124400/28; declared 02/10/2005, publ. 11/27/2006.

Claims (1)

A method of heat removal from heat-generating electronic components in the form of electromagnetic energy based on Gunn diodes, which is used to remove heat from a thermal module adjacent to the electronic component by cold junctions, characterized in that the hot junctions of the thermal module are Gunn diodes designed to convert thermal energy received from cold junctions in the form of an electric current, into the energy of electromagnetic waves, which removes heat from a cooled electronic component to the environment.