RU2288555C2 - Thermal heat sink - Google Patents

Abstract

FIELD: cooling and heat-transfer systems for computer processors.

SUBSTANCE: proposed heat sink is assembled of thermal modules. Heat sink basic module is its base. Needle-type stems of heat sink are disposed on base in staggered or in-line manner. Each stem has two or three additional concatenated thermal modules. Surface area of the latter is much smaller than that of base thermal module. Hot junctions of top thermal modules of each stem are protruded through certain distance forward relative to heat-liberating piece of equipment.

EFFECT: enhanced quality of heating and heat-transfer process.

1 cl, 2 dwg

Description

The invention relates to cooling and heat sink systems, for example, to devices for cooling a computer processor.

Known metal heat sink [1, 2], containing the base and the alternating metal rods emanating from it. In the process of heat transfer in a metal heat sink, the heat is unevenly distributed over the volume of the structure (in particular, due to the low heat conductivity of the heat sink material, the base is very hot and the rods are slightly heated), which does not allow achieving sufficiently efficient heat transfer to the environment.

The closest to the invention in terms of technical nature and the achieved result is a thermoelectric semiconductor device for heat removal and thermal stabilization of microassemblies [3], where a thermopile made of cascades of thermomodules is used as the main executive body. The disadvantage of this device is the inefficient removal of heat from the thermal battery to the environment due to the small heat transfer area of the thermal battery.

The purpose of the invention is the improvement of the cooling process and heat sink.

This is achieved by the fact that in a thermoelectric heat sink made of thermal modules, the heat sink base is a basic thermal module, needle-shaped heat sink rods are located on the base in a staggered or corridor order, each rod consists of an optimal number (2 or 3) of additional cascading ones thermal modules having an area much smaller than the base thermal module.

The use of thermal modules as the starting material from which the cooling heat sink is created makes it possible to solve the problem of uneven distribution of heat in the heat sink and significantly improve the efficiency of cooling devices by changing the temperature gradient in the heat sink and lowering the base temperature while increasing the temperature of the rods.

Figure 1 shows the design of thermoelectric heat sink. The design of the thermoelectric heat sink is a set of alternating thermal modules forming the base 1 (basic thermal module) and rods 2 (additional thermal modules). Cold junctions of the thermal modules forming the base of the heat sink are in contact with the heat transfer object, and hot junctions at the location of each rod are located under the cold junctions of the lower thermal module of each rod. Each rod consists of an optimal number (2 or 3) of thermal modules cascaded one above the other. The cold junctions of the upper thermal module of each rod are located above the hot junctions of the lower thermal module of each rod. Hot junctions of the upper thermal modules of each rod are advanced a certain distance forward from the heat transfer object. Thus, at the tips of the junctions, due to cascade heat transfer, a highly heated zone is formed, which ensures a high radiation intensity, since the radiation energy increases to a fourth degree with increasing temperature. In addition, the efficiency of conduction and convection into the environment is increased by increasing the temperature difference between the medium and the heat sink.

Using the presented device will improve the efficiency of heat transfer and reduce the dimensions of the heat sink, and, thereby, increase the intensity of the cooling systems.

Example. The proposed device was used to cool a computer processor (type AMD). They made a prototype thermoelectric heat sink. An ICE-71 type thermal module was used as the base of the heat sink, the heat sink rods were made of thermal modules of the TV-17-0.6-1.0 type. Figure 2 presents the design of a device for cooling a computer processor using thermoelectric heat sink: 1 - computer case; 2 - processor; 3 - the base of the heat sink; 4 - heat sink rods; 5 - fan; 6 - power source. Tests of the device showed that the use of thermoelectric heat sink provides deeper (10-15 ° C) cooling of the processor compared to the known means of cooling the processor.

The possibility of increasing heat transfer through the use of radiation, conduction, and convection at high temperatures has the potential for discrete heat sources, such as powerful semiconductor components (thyristors, diodes, transistors, etc.).

Information sources

1. Dulnev G.N., Tarnovsky E.A. Heat transfer of radiators in natural convection. Engineering Physics Journal., Ed. AN BSSR, Minsk, No. 2 1960.

2. Case V.M. Needle surfaces for heat transfer. Perev. from English., CCTI, M., 1956.

3. Patent RU 96109278 A, 08/10/1998.

Claims (1)

Thermoelectric heat sink made of thermal modules, characterized in that the heat sink base is a basic thermal module, needle-shaped heat sink rods are located on the base in a checkerboard or corridor order, each rod consists of an optimal number (2 or 3) of additional thermal modules cascaded on top of each other, having an area much smaller than the base thermal module, while the hot junctions of the upper thermal modules of each rod are advanced some distance ahead of the object heat.

Images