RU2523193C2 - Container for soldering - Google Patents

Abstract

FIELD: process engineering.

SUBSTANCE: invention relates to soldering hardware, particularly, to container for soldering to be used in machine building. Said container consists of case and cover. Parts are configured to allow partial fitting of one part into another one at cover closing to form clearance between said parts. Male part is made from material with higher thermal expansion factor than that of female part. Size of clearance is selected to ensure a tight fit between said male and female parts at soldering when the temperature of soldering material interaction with air gases.

EFFECT: reliable isolation of container inner volume at higher temperatures.

3 dwg

Description

The invention relates to the field of soldering and can be used in various fields of engineering, for example, in the automotive, aviation, tool industry, tractor and agricultural engineering.

The main purpose of soldering containers is to isolate the soldering volume from the external environment. Known containers for soldering, comprising a housing and a lid, sealed by welding or rubber seal [1]. Their advantage is the reliability of sealing, and the disadvantages in the first case are the high complexity of sealing and depressurization, as well as the gradual consumption of container and lid materials, in the second case, the inability to heat the entire container to temperatures higher than those allowed for rubber sealing, as a result of which soldering at high temperatures is possible only in the interior of the container.

Closest to the proposed option is a container that includes a housing and a lid, one of these parts partially covering the other, with a shutter between the housing and the lid sealed by backfill [2]. The advantages of this container design are the possibility of multiple use without consuming the material of the container and the lid, the possibility of heating the entire container to the temperature necessary for soldering, as well as the low complexity of sealing and depressurization. However, gas exchange between the internal volume of the container and the external environment is not excluded, which can lead to the penetration of air into the container and the interaction of its components with the brazed material and solder during soldering or during cooling after soldering. As a result, soldering may not occur, or the quality of the joints and the product as a whole may decrease.

The objective of the invention is to improve the quality of soldered joints and products by reliable isolation of the internal volume of the container from the external environment at temperatures above the temperatures of intense interaction of materials of the brazed material and solder with air gases.

The task is achieved in that the partially covered part of the container is made of a material with a greater coefficient of thermal expansion than the coefficient of thermal expansion of the material of the covering part, and the gap value is chosen so as to ensure a tight fit of the surfaces of the covered and covering parts at temperatures of intense interaction of the soldered material with gases air.

Possible design options for containers that implement the idea of the invention are shown in the drawings (Fig. 1 is a general view, Fig. 2 is a variant, Fig. 3 is a variant). Part 1 should be made of a material with a greater coefficient of thermal expansion than the coefficient of thermal expansion of part 2.

The gap δ between the male and female parts is calculated by the formula: δ = (D · α _{Ext Ext Int} -D · α _ext) · (t _nach.vz. -t _0), where

D _externally , D _int - linear dimensions of the female and male parts in a given section;

α _externally , α _int - coefficients of thermal expansion of materials of the covering and covered parts;

t _{beginning inv.} - the temperature of the beginning of the intense interaction of materials of soldered workpieces and solder with air gases;

t ₀ is the temperature at which the workpieces are loaded into the container before soldering.

The installation of soldered workpieces assembled with solder (possibly in a fixture) occurs at room temperature. Then the container closes easily, as there is a gap between male and female surfaces. When heated due to greater thermal expansion of the covered surfaces, the gap decreases and when the temperature of the onset of intensive interaction of materials of the soldered workpieces and solder with air gases is reached, gas exchange with the environment ceases. With further heating and soldering, air cannot enter the container, which creates favorable conditions for soldering. After soldering during cooling below the temperature of the onset of intensive interaction of materials of the soldered workpieces and solder with air gases, the gap reappears and the container is easily disassembled before unloading the brazed parts.

There are various options for the design of the container, differing in the location of the connector between the female and male parts, the shape of the mating surfaces (when using cutting, the most technologically simplest are cylindrical and conical) and the number of these surfaces. Some design options for the container are shown in the drawings (FIG. 2 and FIG. 3).

Information sources

1. Petrunin I.E., Lotsmanov S.N., Nikolaev G.A. Soldering of metals. M .: Metallurgy, 1973. - p.223, figure 115b, c.

2. Petrunin I.E., Lotsmanov S.N., Nikolaev G.A. Soldering of metals. M .: Metallurgy, 1973. - p.223, figure 115a.

Claims (1)

A soldering container containing two parts in the form of a housing and a cover, made with the possibility of partial coverage of one of the parts with another part when closing the lid and forming a gap between them, characterized in that the male part is made of a material with a greater coefficient of thermal expansion than the coefficient of thermal expansion of the material of the female part, and the gap value is selected from the condition of ensuring a tight fit of the surfaces of the male and female parts during the soldering process when the temperature of interaction of the material of the soldered workpiece and solder with air gases.

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