RU2440702C1 - System of air cooling of heat release electronic modules - Google Patents

Abstract

FIELD: electricity.

SUBSTANCE: system of air cooling of electronic modules comprises a tight heat exchanger body with ribbed walls at the outer side, a chamber for arrangement of heat release electronic modules, an air duct for cooling air flow, besides, ribbed walls are made as hollow ribs with formation of chambers for arrangement of electronic modules, where heat-stressed elements of the electronic modules have thermal contact with the inner wall of the chamber, the electric connection between the electronic modules is arranged by flexible printed circuit boards and/or electric connectors, and the outer space between hollow ribs forms an air duct for cooling air flow.

EFFECT: development of a noiseless efficient and reliable system of air cooling of electronic modules arranged in a tight body with provision of electronic modules protection against electromagnetic noise.

2 dwg

Description

The invention relates to heat exchange equipment for cooling electronic modules and can be used, for example, in a computer cooling system.

A technical solution is known (Patent for a utility model of the Russian Federation No. 79366, H05K 7/20, G12B 15/02, publ. 2008.12.27), in which an air cooling system for computer equipment located in computer racks installed in a closed room at a distance from it side walls, comprising a screen dividing the volume into “cold” and “hot” corridors, and fan cooling modules installed therein, the system having at least one overpressure valve installed between the “cold” and “hot” corridors in space, his one of computer equipment and limiting the pressure differential between the "cold" and "hot" corridors a predetermined value. Moreover, the overpressure valve is a louvre grille. Moreover, the screen is placed in the ceiling of a closed volume.

The following disadvantages of the analogue were revealed: the presence of moving elements (fan blades) reduces the reliability of the device; the presence of "cold" and "hot" corridors provides a closed flow of air, which reduces the efficiency of heat dissipation from the device, a working fan located inside the device also leads to electromagnetic interference and noise.

The closest technical solution (prototype) is a cooling system for fuel blocks (RF Patent No. 2043704, Н04В 1/036, publication date: 1995.09.10, patent holder: Branch No. 22 of the Technotorn Organization), which contains a sealed heat exchanger body with finned walls with external and internal sides, a chamber for accommodating heat-generating units, located in the Central part of the internal volume of the sealed enclosure-heat exchanger, and a fan for forced convection of cooling air, and the chamber for placement the fuel units is adapted to form a sealed enclosure with the walls of the heat exchanger-side channels for cooling air flows, communicating with it, and a fan for forced convection of cooling air located on placing fuel inlet chamber blocks to form a vent for the cooling air flow.

The disadvantages of this technical solution: cooled flows act on the walls of the chamber, which leads to heating of the cooling stream; from the heating elements to the walls of the sealed enclosure, heat is transferred by air, which dramatically reduces the efficiency of heat removal; a rotating fan element reduces the reliability of the device; a working fan located inside the device also leads to electromagnetic interference and noise.

The technical result of the invention is the creation of a silent, efficient and reliable air cooling system of electronic modules located in a sealed enclosure, while protecting the electronic modules from electromagnetic interference.

The technical result is achieved in that the air cooling system of the electronic modules, comprising a sealed housing-heat exchanger with finned walls on the outside, a chamber for accommodating the heat-generating electronic modules, an air duct for the flow of cooling air, and the finned walls are made in the form of hollow ribs with the formation of chambers for placement electronic modules, where the heat-loaded elements of electronic modules have thermal contact with the inner wall of the chamber, the electrical connection between the electronic and the modules are made of flexible printed circuit boards and / or electrical connectors, and the external space between the hollow ribs forms an air duct for the flow of cooling air.

The proposed device is illustrated by the drawings shown in figures 1, 2.

Figure 1 shows a General view of the device. Figure 2 shows a cross section of a device, where:

1 - housing;

2 - heat exchanger;

3 - wall;

4 - cover;

5 - a hollow rib;

6 - camera;

7 - electronic module;

8 - heat-loaded element;

9 - flexible printed circuit board;

10 - electrical connector;

11 - non-loaded element;

12 - duct.

The air cooling system of the electronic modules contains a sealed enclosure 1 (Fig.1, 2). The housing 1 consists of the following components: two heat exchangers 2 with finned walls 3 from the outside and two covers 4.

In the heat exchanger 2, the ribbed walls are made in the form of hollow ribs 5 with the formation of chambers 6 for placement of electronic modules 7, where the heat-loaded elements 8 of the electronic modules 7 have thermal contact with the inner wall of the chamber 6, the electrical connection between the electronic modules 7 is made by flexible printed circuit boards 9 and / or electrical connectors 10. In this case, the non-heat-loaded elements 11 are located on the other side with respect to the heat-loaded elements 8. The external space between the hollow ribs 5 forms an air duct 12 d For a stream of cooling air.

The air cooling system of the electronic modules 7 uses air flows created by the Archimedean force in the external space between the hollow ribs 5, which contributes to silent and efficient cooling of the electronic modules 7. The heat-loaded elements 8 of the electronic modules 7 have thermal contact with the inner wall of the chamber 6, which facilitates efficient transmission heat from heat-loaded elements 8. A closed sealed housing 1 and the location of each electronic module 7 in its chamber 6 contributes to effective protection from electromagnetic interference.

When working, the electronic modules 7 emit a certain amount of heat and, depending on the operating mode and ambient temperature, the temperature of the electronic modules 7 stabilizes at a certain level.

From the above it follows that the air cooling system of electronic modules is industrially applicable and solves the technical problem: it improves the cooling efficiency and reliability of the device, works silently and provides protection against electromagnetic interference.

Claims (1)

An air cooling system for electronic modules, comprising a sealed enclosure-heat exchanger with finned walls on the outside, a chamber for accommodating heat-generating electronic modules, an air duct for the flow of cooling air, characterized in that the finned walls are made in the form of hollow ribs with the formation of chambers for accommodating electronic modules, where the heat-loaded elements of the electronic modules have thermal contact with the inner wall of the chamber, the electrical connection between the electronic modules is flexible printed circuit boards and / or electrical connectors, and the external space between the hollow ribs forms an air duct for the flow of cooling air.

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