RU2420547C2 - Method of producing binder for prepreg (versions), binder for prepreg (versions), pregreg and article - Google Patents

Abstract

FIELD: chemistry.

SUBSTANCE: binder is obtained through the following steps. High-molecular epoxy resin is dissolved in a true solution of solid epoxy resin with solubility parametre in a ketone solvent not less than 23 MPa^1/2. Phosphorus-containing epoxy resin is dissolved in the ketone solvent. The obtained solution of the phosphorus-containing epoxy resin is added to a mixture prepared from at least one liquid epoxy resin based on bis-phenol A. A latent hardener and an accelerator are added to said mixture. The solution of high-molecular epoxy resin is mixed with a mixture prepared from at least one liquid epoxy resin, the phosphorus epoxy resin, hardener and accelerator.

EFFECT: invention enables to obtain binder with improved adhesion-cohesion characteristics and a prepreg with high combustion resistance.

39 cl, 3 tbl, 4 ex

Description

FIELD OF THE INVENTION

The present invention relates to methods for preparing a binder for a prepreg and to binders for a prepreg obtained by these methods.

State of the art

Currently, there are many binders for non-combustible prepregs using phosphorus-containing epoxy resins, and methods for producing such binders. See, for example, RF patent No. 2126426 (publ. 02.20.1999); RF patent application No. 2006114699 (publ. 10.12.2007, based on international application WO 2005/040277) and 2006126793 (publ. 10.03.2008, based on international application WO 2005/073266); US patents No. 6524709 (publ. 25.02.2003) and 6933050 (publ. 23.08.2005); application for US patent No. 2003/0069356 (publ. 04/10/2003), 2006/0160931 (publ. 07/20/2006), 2006/0258824 (publ. 16.11.2006), 2008/0166511 (publ. 10.07.2008), 2009 / 0008127 (publ. 08.01.2009); Japanese Patent Application Laid-open No. 2001-329047 (publ. 11/27/2001), 2003-119346 (publ. 04/23/2003), 2005-277457 (publ. 02.10.2003), 2006-028201 (publ. 02.02.2006), 2006-077202 (publ. 23.03.2006), 2007-302746 (publ. 22.11.2007), 2008-214427 (publ. 18.09.2008); Korean patent application No. 2002-0060316 (publ. July 18, 2002), 2004-0066267 (publ. July 27, 2004); and international application WO No. 2008/144252 (published on November 27, 2008).

All these documents describe the preparation of a binder for a prepreg when a solution of a phosphorus-containing epoxy resin having an epoxy equivalent of 200-1500 g / equiv (for example, 200-400 g / equiv or 250-1000 g / eq or 300-1500 g / eq) and a phosphorus content in the range of 0.02-15% (for example, 1.2-4% or 2-5% or 0.02-10% or 0, 2-15% or 0.5-3.5%) by weight. The disadvantage of all these documents is their lack of a description of such a technology that would ensure complete dissolution of the high molecular weight resin (for example, Diaplast, which is practically insoluble in all known solvents), in the presence of a true solution of solid Diane resin such as ED-8 in any ketone solvent.

SUMMARY OF THE INVENTION

Therefore, there is a need to develop such methods for preparing a binder for the prepreg and such binders for the prepreg, which would circumvent this drawback and provide the possibility of complete dissolution of the high molecular weight resin in the presence of a true solution of solid diane resin in a ketone solvent. As a result, the effective solubility parameter of a liquid epoxy resin type ED-8 is aligned with the solubility parameter of a high molecular weight epoxy resin of the Diaplast type, and the subsequent combination of such a solution of combined epoxy resins with liquid phosphorus-containing epoxy resins results in a compound with increased combustion resistance.

To achieve this technical result, the first object of the present invention provides a method for producing a binder for the prepreg, which consists in: dissolving a high molecular weight epoxy resin in a true solution of solid epoxy resin with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 ; dissolving the phosphorus-containing epoxy resin in a ketone solvent; introducing the resulting solution of a phosphorus-containing epoxy resin into a mixture of at least one bis-phenol A liquid epoxy resin; add latent hardener and accelerator to this mixture; combine a solution of high molecular weight epoxy resin with a mixture of at least one liquid epoxy resin, phosphorus-containing epoxy resin, hardener and accelerator, resulting in a binder for the prepreg.

In another object of the present invention, to obtain the same result, another method for producing a binder for the prepreg is proposed, which consists in: dissolving a high molecular weight epoxy resin in a true solution of solid epoxy resin with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 ; dissolving the phosphorus-containing epoxy resin in a ketone solvent; add a latent hardener and accelerator to this solution of phosphorus-containing epoxy resin; combine said solution of high molecular weight epoxy resin with said solution of phosphorus-containing epoxy resin with a hardener and an accelerator, resulting in the said binder for the prepreg. In this embodiment of the method, as can be seen from a comparison of both of these objects, the step of introducing a solution of phosphorus-containing epoxy into a mixture of at least one bis-phenol A-based liquid epoxy is optional.

A feature of both of these objects is that ED-8 epoxy resin in a concentration of about 25 m.h. can be used as the said true solution of solid epoxy resin. (mass parts) to about 68 m.h. per 100 m.h. ketone solvent, and mix the resulting mass until complete dissolution of the above epoxy resin.

In this case, as mentioned high molecular weight epoxy resin, a pre-crushed diaplast epoxy resin, 1 m.h. which is added in from about 4 m.h. up to about 8 mph the above true solution of solid epoxy resin and then continuously mix the resulting mixture until complete dissolution of the epoxy resin Diaplast. Stirring can be carried out at a speed of from about 500 to about 1200 rpm for at least six hours.

Another feature of both of these objects is that the phosphorus-containing epoxy resin in solution in a ketone solvent can have a concentration of about 230 m.h. up to about 900 mph resin per 100 m.h. a solvent with a mass epoxy equivalent of from about 350 g / eq to about 450 g / eq and a phosphorus content of from about 2.8% to about 6.8% by weight. Here, the ketone solvent may be methyl ethyl ketone or acetone. In addition, an additional feature of both objects is that approximately 100 mph from a preheated mixture of liquid epoxy resins, you can add from about 42 m.h. up to about 46 mph a solution of phosphorus-containing epoxy resin, from about 2 m.h. up to about 8 mph hardener and from about 0.5 m.h. up to about 2.5 mph accelerator. As a liquid epoxy resin, you can use the epoxy resin ED-22, ED-20 and (or) ED-16, and the preliminary heating of the liquid epoxy resins can be carried out to a temperature of from about 50 ° to about 70 ° C.

The remaining objects of the present invention are a prepreg, in the manufacture of which a binder is used, obtained respectively by the first and second of the mentioned process variants, as well as an article made using such a prepreg.

Detailed Description of Embodiments

The present invention will be further described in detail using examples of its implementation, which serve only illustrative purposes and in no way limit the scope of the present invention defined only by the attached claims.

The diaplast epoxy resin referred to below is the product of the interaction of diphenylolpropane with epichlorohydrin with a molecular weight of approximately (35 ± 5) · 10 ³ and has the empirical formula (C ₁₂ H ₁₉ O ₂ ) _n OH, where n = 110-150.

A binder for the prepreg according to any of the embodiments of the present invention is obtained by a method in which, at the first stage, a high molecular weight epoxy resin (for example, Diaplast) is dissolved in a true solution of solid epoxy resin (for example, ED-8) in a concentration of from about 25 m.p. (mass parts) to about 68 m.h. per 100 m.h. ketone solvent. Such a solvent may be, for example, methyl ethyl ketone or acetone. For this, crushed ED-8 epoxy resin (about 18-22 mph) is introduced into a ketone solvent (about 38-42 mph), the suspension obtained is mixed until the ED-8 epoxy is completely dissolved, and pre-crushed epoxy resin is added Diaplast (1 part by weight from about 4 parts to about 8 parts by weight of the obtained ED-8 resin solution), and then the resulting mixture is continuously stirred until the Diaplast epoxy is completely dissolved. Such mixing is carried out in a mixer at a speed of about 500-1200 rpm for at least six hours.

The above ratio of the concentrations of solid and high molecular weight epoxy resins is taken based on the solubility parameter taking into account the strength of hydrogen bonds (for the definition and meaning of the solubility parameter, see, for example, the definition and meaning of the solubility parameter, see, for example, Barton AFM Chem. Rev. 1975. V75. P731-753, and Van Krevelen DWFuel. 1965. V44. P236; and also in the "Encyclopedia of Polymers." - M .: Sov. Encyclopedia, 1972. - S. 1044.). This solubility parameter is 20 for acetone, 19 for methyl ethyl ketone, about 23 for ED-8 resin, and 21.5 for Diaplast. In solvents with a medium hydrogen bond (for example, ED-8), a polymer with a strong hydrogen bond (for example, Diaplast) does not dissolve.

When dissolving in a ketone solvent an epoxy resin of type ED-8 with a relatively low molecular weight, the overall effective solubility parameter increases, which contributes to the subsequent dissolution of the ultra-high molecular weight resin. The result is a solution of ultra-high molecular weight epoxy resin (for example, Diaplast) with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 .

In a second step, a solution of a phosphorus-containing epoxy resin in a ketone solvent is prepared. For this, a phosphorus-containing epoxy resin, for example, such as one of those mentioned in the aforementioned Japanese application No. 2003-206392 or US application No. 2009/0008127, the structural formulas of which are given below, are dissolved in a ketone solvent (methyl ethyl ketone or acetone) at a concentration of about 230-900 m.ch. resin per 100 m.h. solvent. The result is a phosphorus-containing epoxy resin with a mass epoxy equivalent of from about 350 g / eq to about 450 g / eq and a phosphorus content of from about 2.8% to about 6.8% by weight.

The next step, mandatory in the first embodiment of the method of the present invention, in the second embodiment is optional. At this stage, the resulting phosphorus-containing epoxy solution is introduced into a mixture consisting of at least one bis-phenol A liquid epoxy resin. Such liquid epoxy resins may be ED-22, ED-20 or ED-16 epoxy. This mixture of liquid epoxy resins (at least one of them) is preheated to about 50-70 ° C in order to lower the viscosity (increase fluidity) of these resins. Then at about 100 mph This preheated mixture of liquid epoxy resins is injected with approximately 42-46 m.h. a prepared solution of phosphorus-containing epoxy resin.

After that, in the next step, approximately 2-8 m.h. latent hardener (for example, powder, which can be taken as dicyan diamide) and about 0.5-2.5 m.h. an accelerator (for example, one of the imidazoles, for example curezol C17Z (2-heptadicylimidazole or curezol C2E4MZ (2-ethyl1-4 methylimidazole) or the Dyhard Mia 5 amine adduct based on 2-methylimidazole.

In that embodiment of the present invention, in which this step is optional, a latent hardener and accelerator are introduced directly into the phosphorus-containing epoxy resin solution.

Finally, at the last stage, a solution of a high molecular weight epoxy resin (for example, Diaplast) in a true solution of a solid epoxy resin (for example, ED-8) is combined with a solution of a phosphorus-containing epoxy resin with a hardener and an accelerator (in or without a preheated mixture of liquid epoxy resins mixtures), resulting in the aforementioned binder for the prepreg.

Example 1

(a) Pour 40 mph into the reactor acetone and enter 20 m.h. crushed resin ED-8. Turn on the mixer, mix the mixture until the ED-8 is completely dissolved and add 10 m.h. crushed resin Diaplast with a rotating mixer at a speed of 500-1200 rpm. Stirring is continued for 6-7 hours.

(b) Heat the resins ED-20 and ED-16 at a temperature of 60 ± 10 ° C and prepare a mixture of resins, for which pour 60 mph into the reactor. resins ED-20 and 10 m.h. resin ED-16 and mix at a speed of 50-100 rpm for 1 hour. Cool the mixture to 35-40 ° C, enter 38 m.h. An 80% solution of phosphorus-containing epoxy in methyl ethyl ketone with a weight epoxy equivalent of 450 g / equiv and a phosphorus content of 3.8% and 6 m.h. powder latent hardener, for example finely dispersed (with a particle diameter of about 2-5 microns) dicyandiamide, mix in the reactor with a stirrer speed of 50-100 rpm for 2 hours.

(c) Add a solution of solid resins ED-8 and Diaplast in acetone to the reactor, continue stirring for 2 hours, then introduce 2.5 m.h. latent imidazole catalyst and mix the mixture of all components with a stirrer speed of 50-100 rpm for 2 hours.

Example 2

Perform steps (a) and (b) from Example 1.

(c) Then enter into the reactor a solution of solid resins ED-8 and Diaplast in acetone and continue stirring for 2 hours.

(d) After this, enter 1 m.h. catalyst chemical and structural formulas:

C ₆ H ₃ Cl ₂ NH-CO-N (CH ₃ ) ₂

Stir the mixture of components in the reactor with a stirrer speed of 50-100 rpm for 3 hours.

Example 3

Perform steps (a) and (b) from Example 1.

(c) Introduce into the reactor a solution of solid resins ED-8 and Diaplast in acetone and continue stirring for 2 hours.

(d) After this, enter 1 m.h. catalyst chemical and structural formulas:

C ₆ H ₅ NH-CO-N (CH ₃ ) ₂

Stir the mixture of all components in the reactor with a stirrer speed of 50-100 rpm for 4 hours.

Example 4

Perform step (a) of Example 1. Then, add the calculated amount of one of the catalysts listed in Examples 1-3 to the solution and continue stirring for 2 hours. Then perform step (b) of Example 1.

(c) Introduce into the reactor a solution of solid resins ED-8 and Diaplast and catalysts in acetone. Stir the mixture of all components in the reactor with a stirrer speed of 50-100 rpm for 3 hours.

On all compositions prepared by one of the methods in examples 1-4, samples are taken and the viscosity and gelatinization times are determined, which should fall within the range of values shown in table 1.

Table 1 Characteristic Example 1 Example 2 Example 3 Example 4 1.1 * 1.2 ** 2.1 2.2 3.1 3.2 4.1 4.2 Dynamic viscosity at 25 ° С, mPas 460 570 430 550 410 580 540 610 Gelatinization time at 120 ° С, min 23 26 twenty 24 22 26 21 24 The glass transition temperature of the cured composition, ° C 125 128 126 130 125 129 126 128 * 1.1, 2.1,3.1, 4.1 - characteristics of freshly prepared compositions. ** 1.2, 2.2, 3.2, 4.2 - characteristics of the compositions after 90 days of storage at a temperature of 25 ± 5 ° C.

A binder obtained in accordance with any of the claimed methods can be used for gluing, for example, steel and composite materials. Moreover, such a binder in its adhesive-cohesive characteristics during shear and fracture energy exceeds the known analogues by about 2 times. When using a prepreg based on, for example, carbon fibers, this binder, due to good rheology (viscosity from about 430 mPa to about 610 mPa), provides high quality impregnation of monofilaments with the realization of their elastic strength characteristics in the composite material due to the high bond strength at the fiber / matrix interface (cured binder) of approximately 85-95 MPa.

The present invention also provides a long-lived (90 days at 25 ± 5 ° C and 12 months at a temperature of -5 to -18 ° C) prepreg, obtained on the basis of the epoxy binder of the present invention and various textile filler forms in the form of fabrics, bundles, multi-axial threading cloths, including carbon, glass, basalt and synthetic fibers. In such a prepreg, the epoxy binder is 42-55 wt.%, And the fibrous filler is 45-58 wt.%.

The use of such a prepreg makes it possible to obtain a product from a composite material by laying out the prepreg followed by molding by any known method providing a specific pressure of 0.5-3 atm (depending on the configuration of the product) and a temperature of 130 ° C for at least 40 minutes and no more than 60 min with a glass transition temperature of at least 125 ° C.

The prepreg obtained on the basis of the binder of the present invention, when using this prepreg with glass fillers, can be used as a dielectric layer formed with the simultaneous bonding of two metal (steel, aluminum) surfaces.

The prepreg, obtained on the basis of the binder of the present invention, when using this prepreg with a carbon tow, can be used as reinforcing pads of highly loaded fiberglass profile building elements made by laying the prepreg, for example, on the surface of the shelves of the pultruded channel with simultaneous bonding in order to increase rigidity fiberglass profile.

Table 2 shows the strength of the adhesive bonding made on the basis of the prepreg, consisting of T10-14 fiberglass (55 wt.%) And the composition according to example 2, as well as the strength of the bonding made of the prepreg, consisting of carbon tows T-700 and adhesive composition according to example 4, and glued to the shelf channel of fiberglass in one technological cycle.

table 2 Type of composition t, ° C Strength at uniform shear, MPa Modulus of elasticity at uniform shear, MPa Fracture energy with uniform shear,
J / cm ³ Resistance to burning (UL94) Adhesive prepreg based on fiberglass T1 0-1 4 +20 34.0 ± 8% 684 ± 9.4% 2,700 ± 34.7% V-0 +60 30 ± 3.2% 704 ± 6% 3.0 ± 7.9% St3 + St3 -60 31.5 ± 4.2% 535 ± 8% 2.5 ± 9.4% Fiberglass plastic + carbon-based adhesive prepreg pad T-700GC +20 35 ± 3.1% 640 ± 3.4% 2.1 ± 3.8% V-0 +60 29 ± 1% 625 ± 10.8% 2.5 ± 9.8% -60 38 ± 4.2% 610 ± 9.2% 3.8 ± 7.2%

Table 3 shows the physicomechanical characteristics of the unidirectional adhesive prepreg lining prepared using the binder of the present invention based on a T700GC carbon tow at (20 ± 5) ° C.

Table 3 Monolayer thickness, mm Density, g / cm ³ Tensile strength, MPa Tensile modulus, GPa Ts, ° C stretching compression shear 0 ° 90 ° 0.2 ± 0.02 1.55-1.59 2450 45 1400 90 140 130

Claims (39)

1. The method of obtaining a binder for the prepreg, which consists in the fact that:
- dissolve the high molecular weight epoxy resin in a true solution of solid epoxy resin with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 ;
- dissolve the phosphorus-containing epoxy resin in a ketone solvent;
- introducing the resulting solution of phosphorus-containing epoxy into a mixture of at least one liquid epoxy resin based on bis-phenol A;
- add latent hardener and accelerator to this mixture;
- combine said solution of high molecular weight epoxy resin with said mixture of at least one liquid epoxy resin, phosphorus-containing epoxy resin, hardener and accelerator, resulting in the said binder for the prepreg. 2. The method according to claim 1, in which the ED-8 pre-ground epoxy resin in a concentration of from about 25 m.h. is used as the said true solid epoxy resin solution. (mass parts) to about 68 m.h. per 100 m.h. ketone solvent, and mix the resulting mass until complete dissolution of the above epoxy resin. 3. The method according to claim 2, in which as the mentioned high molecular weight epoxy resin use pre-crushed epoxy resin Diaplast, 1 m.h. which is added in from about 4 m.h. up to about 8 mph the above true solution of solid epoxy resin and then continuously mix the resulting mixture until complete dissolution of the epoxy resin Diaplast. 4. The method according to claim 3, in which said mixing is carried out at a speed of from about 500 to about 1200 rpm for at least six hours. 5. The method according to claim 1, wherein said phosphorus-containing epoxy resin in said solution in a ketone solvent has a concentration of from about 230 m.h. up to about 900 mph resin per 100 m.h. a solvent with a mass epoxy equivalent of from about 350 g / equiv to about 450 g / equiv and a phosphorus content of from about 2.8 wt.% to about 6.8 wt.%. 6. The method according to claim 1 or 5, wherein said ketone solvent is methyl ethyl ketone or acetone. 7. The method according to claim 5, in which approximately 100 m.h. from a preheated mixture of at least one liquid epoxy resin is added from about 42 m.h. up to about 46 mph the above solution of phosphorus-containing epoxy resin, from about 2 m.h. up to about 8 mph said hardener and from about 0.5 m.h. up to about 2.5 mph accelerator. 8. The method according to claim 7, in which, as the at least one liquid epoxy resin, epoxy resin ED-22, ED-20 and (or) ED-16 is used. 9. The method according to claim 7 or 8, in which the preliminary heating of said liquid epoxy resins is carried out to a temperature of from about 50 ° C to about 70 ° C. 10. The method according to claim 1, in which as the mentioned hardener using a powder hardener. 11. A method of obtaining a binder for the prepreg, which consists in the fact that:
- dissolve the high molecular weight epoxy resin in a true solution of solid epoxy resin with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 ;
- dissolve the phosphorus-containing epoxy resin in a ketone solvent;
- add a latent hardener and accelerator to this solution of phosphorus-containing epoxy resin;
- combine said solution of high molecular weight epoxy resin with said solution of phosphorus-containing epoxy resin with a hardener and accelerator, resulting in the said binder for the prepreg. 12. The method according to claim 11, in which the ED-8 pre-ground epoxy resin in a concentration of from about 25 m.h. is used as said true solid epoxy resin solution. (mass parts) to about 68 m.h. per 100 m.h. ketone solvent, and mix the resulting mass until complete dissolution of the above epoxy resin. 13. The method according to item 12, in which as the aforementioned high molecular weight epoxy resin use pre-crushed epoxy resin Diaplast, 1 m.h. which is added in from about 4 m.h. up to about 8 mph the above true solution of solid epoxy resin and then continuously mix the resulting mixture until complete dissolution of the epoxy resin Diaplast. 14. The method according to item 13, in which said mixing is carried out at a speed of from about 500 to about 1200 rpm for at least six hours. 15. The method according to claim 11, in which said phosphorus-containing epoxy resin in said solution in a ketone solvent has a concentration of from about 230 m.h. up to about 900 mph resin per 100 m.h. a solvent with a mass epoxy equivalent of from about 350 g / equiv to about 450 g / equiv and a phosphorus content of from about 2.8 wt.% to about 6.8 wt.%. 16. The method according to claim 11 or 15, in which said ketone solvent is methyl ethyl ketone or acetone. 17. The method according to claim 11, in which the resulting solution of a phosphorus-containing epoxy resin is introduced into a mixture of at least one bis-phenol A-based liquid epoxy resin, with approximately 100 m.h. from a preheated mixture of at least one liquid epoxy resin add from about 42 m.h. up to about 46 mph the above solution of phosphorus-containing epoxy resin, from about 2 m.h. up to about 8 mph said hardener and from about 0.5 m.h. up to about 2.5 mph accelerator. 18. The method according to 17, in which at least one liquid epoxy resin is used, the epoxy resin is ED-22, ED-20 and (or) ED-16. 19. The method according to 17 or 18, in which the preliminary heating of said liquid epoxy resins is carried out to a temperature of from about 50 ° C to about 70 ° C. 20. The method according to claim 11, in which as the mentioned hardener use a powder hardener. 21. A binder for the prepreg obtained by combining a solution of high molecular weight epoxy resin in a true solution of solid epoxy resin with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 and a mixture of at least one liquid epoxy resin with a solution of phosphorus-containing epoxy resin in ketone solvent with added latent hardener and accelerator. 22. The binder for the prepreg according to item 21, in which as the above-mentioned high molecular weight epoxy resin used pre-crushed epoxy resin Diaplast, taken at a concentration of 1 m.h. from about 4 mph up to about 8 mph the above true solution of solid epoxy resin, which is used as a pre-crushed epoxy resin ED-8 in a concentration of from about 25 m.h. up to about 68 mph per 100 m.h. solvent. 23. The binder for the prepreg according to item 21, in which the aforementioned phosphorus-containing epoxy resin in said solution in a ketone solvent has a concentration of from about 230 m.h. up to about 900 mph resin per 100 m.h. a solvent with a mass epoxy equivalent of from about 350 g / equiv to about 450 g / equiv and a phosphorus content of from about 2.8 wt.% to about 6.8 wt.%. 24. The binder for the prepreg according to item 21 or 23, in which said ketone solvent is methyl ethyl ketone or acetone. 25. The binder for the prepreg according to item 23, in which approximately 100 m.h. from a preheated mixture of at least one bis-phenol-A-based liquid epoxy resin is added from about 42 m.h. up to about 46 mph the above solution of phosphorus-containing epoxy resin, from about 2 m.h. up to about 8 mph said hardener and from about 0.5 m.h. up to about 2.5 mph said accelerator. 26. The binder for the prepreg according to item 21, in which as the at least one liquid epoxy resin is used epoxy resin ED-22, ED-20 and (or) ED-16. 27. The binder for the prepreg according to item 21, in which the preliminary heating of the aforementioned liquid epoxy resins is carried out to a temperature of from about 50 ° to about 70 ° C. 28. The binder for the prepreg according to item 21, in which said hardener is powdered. 29. A binder for the prepreg obtained by combining a solution of high molecular weight epoxy in a true solution of solid epoxy with a solubility parameter in a ketone solvent of at least 23 MPa ^1/2 and a solution of a phosphorus-containing epoxy in a ketone solvent with added latent hardener and accelerator. 30. The binder for the prepreg according to clause 29, in which the previously crushed Diaplast epoxy resin taken at a concentration of 1 m.h. is used as the high molecular weight epoxy resin. from about 4 mph up to about 8 mph the above true solution of solid epoxy resin, which is used as a pre-crushed epoxy resin ED-8 in a concentration of from about 25 m.h. up to about 68 mph per 100 m.h. solvent. 31. The binder for the prepreg according to clause 29, in which the aforementioned phosphorus-containing epoxy resin in said solution in a ketone solvent has a concentration of from about 230 m.h. up to about 900 mph resin per 100 m.h. a solvent with a mass epoxy equivalent of from about 350 g / equiv to about 450 g / equiv and a phosphorus content of from about 2.8 wt.% to about 6.8 wt.%. 32. The binder for the prepreg according to clause 29 or 31, wherein said ketone solvent is methyl ethyl ketone or acetone. 33. The binder for the prepreg according to claim 31, wherein said phosphorus-containing epoxy resin solution is introduced into a pre-heated mixture of at least one bis-phenol A liquid epoxy resin, after which said hardener and accelerator are added. 34. The binder for the prepreg according to clause 33, in which from about 42 parts by weight of about 100 parts by weight of a mixture of at least one bis-phenol A liquid epoxy resin are added. up to about 46 mph the above solution of phosphorus-containing epoxy resin, from about 2 m.h. up to about 8 mph said hardener and from about 0.5 m.h. up to about 2.5 mph said accelerator. 35. The binder for the prepreg according to clause 29, in which as the at least one liquid epoxy resin is used, the epoxy resin ED-22, ED-20 and (or) ED-16. 36. The binder for the prepreg according to clause 29, in which the preliminary heating of the aforementioned liquid epoxy resins is carried out to a temperature of from about 50 ° to about 70 ° C. 37. The binder for the prepreg according to clause 29, in which said hardener is powdered. 38. A prepreg, in the manufacture of which a binder is used according to any one of paragraphs.21-37 or obtained by the method according to any one of claims 1 to 20. 39. A product made using the prepreg according to clause 38.