RU2383077C1 - Flat multilayer capacitor - Google Patents

Abstract

FIELD: electricity.

SUBSTANCE: invention is related to capacitors of permanent capacitance. According to invention, internal electrodes of capacitor have S-shaped form, besides one of plates of subsequent S-shaped electrode is arranged between two planes of plates of previous S-shaped electrode, space between electrodes is filled with dielectric, outer electrodes are formed by connection of end surfaces of S-shaped electrodes so that all layers of dielectric are arranged between various heteropolar electrodes, and electric leads are connected to outer electrodes.

EFFECT: reduced labour intensiveness of capacitors manufacturing and their increased reliability.

2 dwg

Description

The invention relates to capacitors of constant capacity.

Known multilayer ceramic capacitor (patent No. US 2003/0041427 A ₁ , HATTORI KOL, HO1G 4/30, 06.03.2003) containing a layered body comprising ceramic layers, on the inner and opposite sides of which external electrodes are formed. The internal electrodes are located in a layered body, placed in steps and connected to external electrodes with the formation of an electric circuit that, when connected to a power source, accumulates electric charges on the surface of the electrodes. The mechanical strength of the connection of the internal electrodes with the external, external electrodes with the contact pads of the printed circuit board, as well as the moisture protection of the contact bridle is ensured by coating the external electrodes with copper, nickel or an alloy based on them, which in turn is coated with a layer of tin or solder.

The disadvantage of this design is the presence of a complex combined electrode, consisting of thin plates or films located mutually perpendicular inside the volume and on the outer side surfaces. This increases the complexity of manufacturing products and reduces the reliability of the design.

The high complexity of manufacturing is due to the presence of a three-layer external electrode. In its manufacture, at least three technological operations are necessary. In addition, soldering in a node of four (three external and one internal) electrodes reduces the reliability of the design.

The mutually perpendicular arrangement of the internal and external electrodes imposes additional restrictions on the choice of electrode material. Due to the small thickness of the electrode, the joints of mutually perpendicular electrodes will have low mechanical strength and this can lead to rupture within the capacitor operating temperatures. Based on this, the temperature coefficients of linear expansion of the materials of the internal and external electrodes should be close or equal.

The technical result is aimed at reducing the complexity of manufacturing and increasing the reliability of capacitors.

The technical result is achieved by the fact that a flat multilayer capacitor contains internal electrodes in the form of parallel-located plates separated by a dielectric layer, external electrodes and electrical leads, while the internal electrodes are S-shaped, one of the plates of the subsequent S-shaped electrode is located between two the planes of the plates of the previous S-shaped electrode, the space between the electrodes is filled with a dielectric, the external electrodes are formed by connecting the end surfaces of the S-shaped electrodes electrodes so that all layers of the dielectric are located between bipolar electrodes, and the electrical leads are connected to external electrodes.

A distinctive feature of the prototype is that the internal electrodes are S-shaped, with one of the plates of the subsequent S-shaped electrode located between two planes of the plates of the previous S-shaped electrode, the space between the electrodes is filled with a dielectric, the external electrodes are formed by connecting the end surfaces S- shaped electrodes so that all layers of the dielectric are located between bipolar electrodes, and electrical leads are connected to external electrodes.

Figure 1 shows the layout of the internal electrodes of the proposed capacitor.

Figure 2 shows the connection diagram.

The capacitor (figure 1) contains at least two sections of S-shaped electrodes 1. The space between the plates of the S-shaped electrodes is filled with a dielectric 2.

In accordance with the scheme (figure 2) adjacent adjacent S-shaped electrodes 1 are biased in opposite directions and separated by a dielectric layer 2. External electrodes 3 are formed by connecting the end surfaces of S-shaped electrodes on opposite sides of the capacitor, and the terminals 4 are connected to external electrodes .

In accordance with the proposed arrangement of internal S-shaped electrodes, an infinite increase in the number of parallel plates in the capacitor structure is achieved.

For the case under consideration, when the first plate of the subsequent S-shaped electrode is placed between two planes of the plates of the previous one, sintering ensures the solidity of the structure. The offset of the S-shaped electrodes in opposite directions allows you to get a parallel connection of adjacent plates in the design of the capacitor.

Thus, the proposed design of the internal electrodes and their relative position allows to obtain a flat multilayer capacitor.

Claims (1)

A flat multilayer capacitor containing internal electrodes in the form of parallel plates separated by a dielectric layer, external electrodes and electrical leads, characterized in that the internal electrodes are S-shaped, one of the plates of the subsequent S-shaped electrode being located between two planes of the plates of the previous one S-shaped electrode, the space between the electrodes is filled with a dielectric, the external electrodes are formed by connecting the end surfaces of the S-shaped electrodes so that all the dielectric layers are located between bipolar electrodes, and the electrical leads are connected to external electrodes.

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