RU2335821C1 - 3d electronic module - Google Patents

Abstract

FIELD: electrical engineering.

SUBSTANCE: 3D electronic module incorporating standard encased components and/or PCBs with caseless active and passive components, an outer heat sink system and outer output terminals. Note that encased components and the aforesaid PCBs feature double-side outputs arrangement and are located between the printed switching PCBs arranged in parallel and furnished with plated holes. The connecting PCB abuts, with its end face surfaces, on the aforesaid plated holes, the said connecting PCB having an electrical and mechanical connection to the switching PCBs. The switching PCB and the connecting PCB accommodates the 3D connectors, the latter being interconnected to form a cubic and/or tubular 3D cell made up of a set of 3D cells forming a plug-and-socket connection. The active element heat sink system represents a tubular 3D cell furnished with coaxially-arranged heat-sink lines wherein the active elements are in thermal contact with the pipe walls.

EFFECT: multi-purpose design, higher-density module featuring higher reparability and heat-sink properties.

19 dwg

Description

The invention relates to electronics and can be used in a complex of on-board equipment of aircraft when assembling modules containing a large number of electrical connections for combining them, to solve the problems of creating a reliable three-dimensional electronic module by increasing the universality of the design and the density of the modules, the heat sink efficiency while maintaining high maintainability .

A technical solution is known - a three-dimensional flexible electronic module (RF Patent No. 2119276, Н05К 3/36, publ. 09/20/1998), consisting of unpacked electronic components, housing electronic components and microplates with unpacked active and passive electronic components. The module may include various sensors and transceiver systems. Unpackaged electronic components, enclosed electronic components and microboards, in addition to internal connections, are electrically connected to each other by flexible corrugated switching boards with a variable cross-section. Each heat-generating component is equipped with a heat sink having thermal contact with the external flexible shell of the module. The disadvantage of this technical solution is the lack of electrical integrity of the design and the inevitability of short circuits, which affects the reliability of the three-dimensional electronic module. Uneven placement of components reduces the density of the layout of the entire device. Since each heat-generating component is equipped with a heat sink having thermal contact with the shell, the heat removal length is sufficiently large, which reduces the efficiency of the heat sink. The use of flexible patch boards does not provide the universality and maintainability of the device due to the insufficient distribution of manufacturing technology of flexible boards and low mechanical rigidity, which reduces the reliability of the three-dimensional electronic module as a whole.

The closest technical solution (prototype) is a three-dimensional electronic module (RF Patent No. 2176134, Н05К 7/02, publ. 11/20/2001), containing standard packaged components and / or microboards with active and passive components, an external heat sink system and external outputs moreover, the enclosed components and these microcards have a two-sided arrangement of terminals and are located between parallel placed printed circuit boards with metallized holes, between parallel placed and printed circuit boards with end surfaces thereon, there is a connecting board having an electrical and mechanical connection with the printed circuit boards, the inserted heat sink comb partially covers the housing of the housing component or the base of said microplate and contains at least one protrusion or plane having thermal contact with an external heat sink system, while the housing of the packaged component and the base of the specified microplate are made of a heat-conducting mat rial. The disadvantage of the prototype is the inseparability of the connection of printed circuit boards with connection boards and, therefore, low versatility and maintainability of the module. The following disadvantages are the low efficiency of heat removal to the external environment, which is a consequence of the increase in the length of the heat removal path, as well as the low density of the modules and the low reliability of the device itself.

The technical result of the invention is the creation of a reliable three-dimensional electronic module, which is achieved by increasing the versatility of the design, more dense placement of the modules with high maintainability, increasing the efficiency of heat removal.

The technical result is achieved by the fact that a three-dimensional electronic module containing standard packaged components and / or microcards with open-type active and passive components, an external heat sink system and external terminals, moreover, the packaged components and these microcards have two-sided terminal arrangement and are located between parallel printed circuit boards with metallized holes, between parallel printed circuit boards, end faces They have a connection board that is electrically and mechanically connected to the printed circuit boards, a three-dimensional electrical connector is formed on the printed circuit board and on the connection board, while the three-dimensional electrical connectors of the connection boards and connection boards are interconnected to form a cubic and / or tubular a three-dimensional cell, forming from a set of three-dimensional cells a three-dimensional detachable electrical connection, an external active heat sink system the elements is provided by a tubular three-dimensional cell equipped with coaxially arranged heat sink pipes, where the active elements have thermal contact with the pipe walls.

The essence of the invention lies in the fact that in the proposed three-dimensional electronic module, the connection of the patch board and the connection board is detachable, which allows to achieve high versatility and maintainability of the device. The module contains standard packaged components and / or microcards with open-type active and passive components, moreover, the packaged components and these microcards have a two-sided pin arrangement and are located between parallel printed circuit boards with metallized holes. Between the end faces of the printed circuit boards parallel to them, there is a connection board that is electrically and mechanically connected to them, a three-dimensional electrical connector is formed on the printed circuit board and the connection board, the three-dimensional electrical connectors of the connection boards and connection boards being interconnected to form cubic and / or tubular three-dimensional cells, and many of the three-dimensional cells form a three-dimensional split electrical connection. This design solution allows to increase the density of the modules in the device. The three-dimensional electronic connector has, in comparison with the prototype, a reduced heat sink length in which the external heat sink of the active elements is ensured by the fact that the tubular three-dimensional cell is provided with coaxially arranged heat sink pipes, where the active elements have thermal contact with the pipe walls, which ensures high heat sink and reliability of the device as a whole.

The invention is illustrated by drawings, where:

figure 1 - circuit board in isometry;

figure 2 - spatial arrangement of the connectors in isometry (printed circuit board is not conventionally shown);

figure 3 - connection board in isometry;

4 is a cubic three-dimensional module in isometry;

5 is a connection of the first board with the second board;

6 is a connection of a third board with a second board;

7 is a connection of the fourth board with the first and third boards;

Fig - connection of the fifth board with the first and third boards;

Fig.9 - connection of the sixth board with the first and third boards;

figure 10 - connection of the first cubic cell with the second cubic cell;

11 - connection of the first and second cubic cells with the third and fourth cubic cells;

Fig - connection of the first, second, third, fourth cubic cells with the fifth, sixth, seventh, eighth cubic cells;

Fig - the first tubular three-dimensional cell;

Fig - connection of the first tubular cell with a second tubular cell;

Fig - connection of the first, second tubular cells with a third, fourth tubular cells;

Fig - connection of the first, second, third, fourth tubular cells with a fifth, sixth, seventh, eighth tubular cells;

Fig - three-dimensional electronic tubular module with a local enlarged view (the housing is not shown conventionally);

Fig. 18 is a perspective view of a three-dimensional tubular module;

Fig is a cross section of a three-dimensional tubular module with a local enlarged view.

The drawings indicate the following notation:

1 - three-dimensional electronic module;

2 - standard housing elements;

3 - microboards;

4 - open-shell active components (fuel elements);

5 - unpacked passive components;

6 - external heat sink system;

7 - external findings;

8 - printed circuit board;

8-1 - the first board in the cell - switching board;

8-3 - the third board in the cell is a switching board;

9 - metallized holes;

10 - end surface of the connection board;

11 - a connecting board;

11-2 - the second board in the cell is a connection board;

11-4- the fourth board in the cell is a connection board;

11-5 - the fifth board in the cell is a connection board;

11-6 - the sixth board in the cell - the connection board;

12 - electrical and mechanical connection of the connecting board with the switching board;

13 - three-dimensional electrical connector;

14 - multilayer board;

15 - structurally integral connector;

16 - socket structurally integral connector;

17 - plug structurally integral connector;

18 is a first connector circuit board;

19 - one of the layers of a multilayer board;

20 - the second connector of the circuit board;

21 - the third connector of the circuit board;

22 - the fourth connector of the circuit board;

23 - fifth connector circuit board;

24 - the sixth connector of the circuit board;

25 - plane of the circuit board;

26 - end surface of the circuit board;

27 - electrical connection between electrical connectors inside the patch and inside the connection board;

28 is a three-dimensional electrical connector formed on a connection board;

29 - double-sided board;

30 - electrical connector on the connection board;

31 - opposite sides of the board;

32 - plane of the connection board;

33 - cubic three-dimensional cell;

33-1 - the first cubic three-dimensional cell;

33-2 - the second cubic three-dimensional cell;

33-3 - the third cubic three-dimensional cell;

33-4 - the fourth cubic three-dimensional cell;

33-5 - the fifth cubic three-dimensional cell;

33-6 - the sixth cubic three-dimensional cell;

33-7 - the seventh cubic three-dimensional cell;

33-8 - the eighth cubic three-dimensional cell;

34 - tubular three-dimensional cell;

34-1 - the first tubular three-dimensional cell;

34-2 - the second tubular three-dimensional cell;

34-3 - the third tubular three-dimensional cell;

34-4 - the fourth tubular three-dimensional cell;

35 - a lot of three-dimensional cells;

36 - electrical connection of many three-dimensional cells;

37 - coaxial location of the heat sink pipe;

38 - heat sink pipe;

39 - thermal contact with the walls of the heat sink pipe;

40 - walls of the heat sink pipe;

41 - L-shaped design;

42 - C-shaped design;

43 - pipe-like construction;

44 - bowl-shaped design;

45 - casing of a cubic three-dimensional cell;

46 - heat sink pipe.

The three-dimensional electronic module 1 (Figs. 4, 16-19) contains standard packaged components 2 (Figs. 1, 3, 4) and microplates 3 with open-type active 4 (Figs. 1, 3, 4, 17) and passive components 5 ( figure 1, 3, 4). Module 1 (Fig. 4, 16-19) contains an external heat sink system 6 (Fig. 19) and external terminals 7, wherein the packaged components 2 (Figs. 1, 3, 4) and these microboards 3 have a two-sided arrangement of terminals and are located between parallel printed printed circuit boards 8 (Fig.1, 4) with metallized holes 9 (Fig.3). Between the parallel printed circuit boards 8 (FIGS. 1, 4), the end surfaces 10 (FIG. 3) there is a connecting board 11 (FIGS. 3, 4) having electrical and mechanical connection 12 (FIGS. 5-9) with printed patch boards 8 (Fig.1, 4). On the printed circuit board 8, a three-dimensional electrical connector 13 is formed, consisting of a multilayer board 14 (Fig. 1) and a structurally integral connector 15 (Figs. 1, 2, 4) located in three mutually perpendicular directions. Moreover, the structurally integral connector 15 located on the patch board 8 (Figs. 1, 4) consists of electrically and mechanically interconnected parts of the socket 16 (Figs. 1, 2) and plug 17. On the patch board 8 (Figs. 1, 4) one connector 18 (Fig. 1, 2) is formed in one of the layers 19 (Fig. 1) of the multilayer board 14, the second 20 (Fig. 1, 2) is perpendicular to the first connector 18 is also formed in one of the layers 19 (Fig. 1 ) multilayer boards 14, and the electrical connectors 15 (1, 2, 4) intersect on different layers 19 (1) of the board 8 (1, 4). The third 21 (figure 1, 2), fourth 22, fifth 23, sixth 24 connectors on the patch board 8 (figure 1, 4) are perpendicular to the plane 25 (figure 1) of the board 8 (figure 1, 4) switching and are located in four places symmetrically, sockets 16 (Fig.1, 2) - on the one hand, and plugs 17 - on the other hand. The first 18 and second 20 connectors on the circuit board 8 (Fig. 1, 4) are arranged so that from one end 26 (Fig. 1) of the circuit board 8 (Fig. 1, 4), a socket 16 (Fig. 1, 2) of the electric connector 15 (figure 1, 2,4), from the other end 26 (figure 1) - plug 17 (figure 1, 2). The electrical connection 27 (figure 2) between the electrical connectors 15 (figure 1, 2, 4) inside the circuit board 8 (figure 1, 4) is carried out depending on the circuitry solutions. On two-sided 29 (FIG. 3) connection board 11 (FIGS. 3, 4), a three-dimensional electrical connector 28 (FIG. 3) is formed, where two connectors 30 are installed in metallized holes 9 on opposite sides 31 of the connection board 27 (FIG. 2) perpendicular to the plane 32 (Fig. 3) of the board 11 (Figs. 3, 4), where on one side a socket 16 (Figs. 1, 2) of a structurally integral connector 15 (Figs. 1, 2, 4) is installed, and on the other side - plug 17 (Fig.1, 2). The electrical connection between the electrical connectors 15 (FIGS. 1, 2, 4) inside the connection board 11 (FIGS. 3, 4) is carried out depending on the circuitry solutions. Three-dimensional electrical connectors 13 (FIGS. 1, 4) are connected to a three-dimensional electrical connector 28 (FIG. 3) to form a cubic 33 (FIGS. 4, 9) and / or tubular 34 (FIGS. 13, 16, 17) of a three-dimensional cell, forming from a set of three-dimensional cells 35 (Fig. 4) a three-dimensional detachable electrical connection 36 (Figs. 10, 11). The external heat sink system 6 (Fig. 19) of the active elements 4 (Figs. 1, 3, 4, 17) is provided by the fact that the tubular 34 (Figs. 13, 16, 17) three-dimensional cell is provided with a coaxial 37 (Fig. 19) located heat sinks pipes 38, where the active elements have thermal contact 39 with the walls 40 of the heat sink pipe 38.

The Assembly of the three-dimensional electronic module 1 (Fig.4, 16-19) is performed in the following sequence:

- assembly of patch boards 8 (Fig. 1,4) with the formation of a three-dimensional electrical connector 13 with the installation of connectors 15 (Figs. 1, 2, 4) on different layers 19 (Fig. 1) and perpendicular to the plane 25 of the board 8 (Fig. 1.4) in three directions with the installation of standard packaged components 2 (Fig. 1, 3, 4) and / or microcircuit 3 with open-frame active 4 (Fig. 1, 3, 4, 17) and passive 5 (Fig. 1, 3, 4) components depending on circuitry solutions;

- assembly of the connecting board 11 (Fig.3, 4) with the formation of a one-dimensional electrical connector 28 (Fig.3) with the installation of connectors 15 (Fig.1, 2, 4) in two opposite end sides 26 (Fig.1) perpendicular to the plane 32 (FIG. 3) boards with the installation of standard packaged components 2 (FIGS. 1, 3, 4) and / or microcircuits 3 with active 4 (FIGS. 1, 3, 4, 17) and passive 5 (FIG. 1, 3, 4) components depending on circuitry solutions;

- assembly of a three-dimensional cubic electronic module 1 (figure 4, 16-19). The circuit board 11-2 (FIGS. 5-9, 13) is connected to the circuit board 8-1 switching to form a L-shaped structure 41 (FIG. 5). To the circuit board 11-2 (FIGS. 5-9, 13), a connecting circuit board 8-3 is installed (FIGS. 6-9, 13) with the formation of a C-shaped structure 42 (FIG. 6). To the circuit board 8-1 (FIGS. 5-9, 13) the switching circuit and to the circuit board 8-3 (Figs. 6-9, 13) the circuit board, a circuit board 11-5 (Fig. 8, 9) is connected in the form of a tube-like structure 43 ( 7, 16, 17) with the formation of the tubular cell 34 (Fig.13, 16, 17). A circuit board 11-5 (Fig. 8, 9) is connected to the circuit board 8-1 (FIGS. 5-9, 13) switching and to the circuit board 8-3 (FIGS. 6-9, 13) switching to form a bowl-shaped structure 44 ( Fig. 8). The circuit board 11-6 (Fig. 9) is connected to the circuit board 8-1 (Figs. 5-9, 13) of the switching circuit and to the circuit board 8-3 (Figs. 6-9, 13) of the circuit board to form a cubic cell structure 33 (Fig. .4, 9) functionally complete unit. The cubic cell 33-1 (FIGS. 10-12) is connected to the next cubic cell 33-2. Two cubic cells 33-1, 33-2 are connected to the next two cubic cells 33-3 (11, 12), 33-4. Four cubic cells 33-1 (Figs. 10-12), 33-2, 33-3 (Figs. 11, 12), 33-4 are connected to the following four cubic cells 33-5 (Figs. 12), 33-6 , 33-7, 33-8.

If necessary, heat sinks apply tubular electronic cells 34 (Fig.13, 16, 17). The three-dimensional tubular electronic cell 34 is assembled by analogy with the cubic electronic cell 33 (Figs. 4, 9) (the first three connections).

- assembly of two three-dimensional tubular electronic cells 34-1 (Fig. 14, 15), 34-2, and then the assembly of four three-dimensional tubular electronic cells 34-1, 34-2, 34-3 (Fig. 15), 34-4 .

- assembly of a three-dimensional tubular electronic module 1 (Fig. 4, 16-19) without a housing and assembly of a three-dimensional tubular electronic module 1 with a housing 45 (Fig. 18, 19) and with a heat sink tube 46.

The above constructive solution allows, firstly, to more densely place the modules, secondly, to ensure its high maintainability, thirdly, to increase the efficiency of heat removal, fourthly, to increase the universality of the design and to obtain a reliable three-dimensional electronic module.

Thus, it follows from the foregoing that the claimed invention is industrially applicable and solves the technical problem.

Claims (1)

A three-dimensional electronic module comprising standard packaged components and / or microboards with active and passive enclosures, an external heat sink system and external leads, the packaged components and said microboards having two-way terminals and located between parallel printed circuit boards with metallized holes, between parallel placed by printed circuit boards end surfaces to them is located connecting ATA having an electrical and mechanical connection with printed circuit boards, characterized in that a three-dimensional electrical connector is formed on the printed circuit board and on the connection board, wherein the three-dimensional electrical connectors of the circuit boards and connection boards are interconnected to form a cubic and / or tubular three-dimensional a cell forming a three-dimensional detachable electrical connection from a plurality of three-dimensional cells, an external heat removal system of active elements provides tsya dimensional tubular cell provided with a heat-coaxially arranged pipes, wherein the active elements are in thermal contact with the tube walls.

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