RU2331138C1 - Integrated circuit case - Google Patents

Abstract

FIELD: physics.

SUBSTANCE: invention is used in electronic technology, during the designing of planar ceramic-metal cases. The essence of the invention consists in that the integrated circuit case incorporates a ceramic base and structure of planar conclusions, whose ends are soldered to bonding pads and isolating plates of a multi-output frame. The frame contains four corners connected from the external part by means of external plates the central part of which contains groups of planar conclusions which are made in the form of strips with increment; equal to increment of the location of the bonding pads, isolating plates, soldered to the corners.

EFFECT: creation of a reliable integration circuit case, which provides integrity of external conclusions when carrying out the assembly operations of the entrance control.

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Description

The invention relates to electronic equipment, in particular to microelectronic design, and can be used in the design of planar metal-ceramic buildings.

A case of an integrated microcircuit is known, containing a ceramic base with an integrated circuit placed on it, protected from the influence of external destabilizing factors by a cover, as well as the structure of external terminals, which in one case are fixed with a special plate, and in the other case remain free relative to the edges of the base (1).

A multi-chip module case is also known, including a substrate made in one piece with a base, external terminals connected to external contact pads. However, the ends of the external terminals remain free and are formed in accordance with the selected method of mounting the housing of the multi-chip module (2).

Closest to the claimed invention in terms of features (prototype) is an integrated circuit case containing a multilayer ceramic base with contact pads, an integrated circuit mounted between the heat-conducting and insulating layers is mounted in the mounting hole of the base, the case is also equipped with a structure of external terminals, the ends of which are relatively free edges of the base (3).

All of the above-mentioned case designs have disadvantages associated with the manufacturing technology of these case designs, especially multi-pin cases with a small contact pitch, namely, the probability of damage to the ends of the terminals and violation of the pitch of their location.

In existing productions of microcircuit cases, in the process of moving the integrated microcircuit along the process line, the manufactured cases are placed in a special satellite container to prevent mechanical damage to the terminals. The use of satellite packaging in the technological process of its manufacture and monitoring the electrical parameters of the integrated circuit in a planar metal-ceramic case leads to the necessity of introducing the operations of packing (after separation of the technological frame) and unloading (before packaging for shipment to the consumer), which complicates the possibility of automation of the process and leads to a rise in price productions.

The problem solved by the present invention is to eliminate these drawbacks and create an integrated circuit housing that can maintain the integrity of the conclusions during technological operations, which will contribute to reliability and lower cost of products.

To solve this problem, in the proposed housing of the integrated circuit containing a ceramic base with contact pads placed on its surface and the structure of planar leads, in accordance with the invention and in contrast to the prototype, the body is equipped with a rectangular multi-pin insulating frame consisting of corners of outer plates interconnected on which groups of planar findings are placed, made in the form of strips with a step equal to the step of the location of the contact pads of the base, and insulating plates n, soldered to the corners on the base side, while the ends of the planar leads are fixed to insulating plates and contact pads by soldering.

The invention is illustrated by drawings, which depict:

figure 1 is a transverse section of the housing;

figure 2 - the case of the integrated circuit in plan, view A;

figure 3 - the body of the integrated circuit, the stub lines of the outer plates;

figure 4 - external leads with an outer plate, view B.

The housing of the integrated circuit contains a ceramic base 1 and the structure of the planar leads 2. The ends of the leads 2 are soldered to the contact pads 3 of the base 1 and the insulating plates 4 of the multi-lead frame 5.

The multi-output frame 5 comprises corners 6 connected to the outer side by outer plates 7. On the inner side, insulating plates 4 of dielectric material are soldered to the corners 6.

The technological process of manufacturing this housing provides for operations associated with preliminary alignment of the base of the housing and multi-output frames with subsequent soldering of leads to insulating plates and contact pads of the base.

The prefabricated multi-pin frame 5 is made in the form of a single closed structure of a metal sheet with a thickness of 0.2 mm. Four corners are formed by special processing, which are interconnected by external plates 7, as well as four groups of strips of external terminals 2.

The spacing of the strips of the external terminals in the group is equal to the spacing of the contact pads 3 of the base 1 and is 0.5 mm. The width of the output strip is 0.27 mm.

The outer plates 7, which can be called technological, are connected to the corners 6 by thin jumpers, which facilitate the separation of the outer plates after the entire complex of technological and control operations, release the fixed ends of the external terminals for subsequent installation. The execution of the housing of the integrated circuit as a whole with a multi-output frame increases the rigidity of the entire structure of the housing, and also ensures the integrity of the external conclusions during manufacturing, testing and during assembly operations and input control operations.

Information sources

1. US patent No. 5034568, cl. H01L23 | 02, 1991

2. RF patent No. 2091906, cl. H01L23 | 03, 1991

3. Patent UK Patent Application GB No. 2098001A, cl. H01L13 | 02, 1992

Claims (1)

An integrated circuit housing containing a ceramic base with contact pads and a structure of planar leads located on its surface, characterized in that the case is equipped with a rectangular isolating multi-lead frame, consisting of interconnected corners of the outer plates, on which there are groups of planar leads made in the form strips with a step equal to the step of the location of the contact pads of the base, and insulating plates soldered to the corners from the side of the base, while the ends of the planar leads fixed to insulating plates and pads by soldering.

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