RU2222074C1 - Method for manufacturing hybrid electronic module - Google Patents

Abstract

FIELD: assembling microelectronic equipment using three-dimensional chip components as source objects. SUBSTANCE: proposed method involves use of high-reliability and low-cost electronic components in assembling electronic equipment and limited manufacture of lacking components by commonly used technology. Use is made of high-reliability methods for interconnections as well as mechanization and automation of production processes employing standard process equipment. EFFECT: enhanced yield of modules using smaller chips at improved performance characteristics. 15 cl, 9 dwg

Description

Technical field
This invention relates to the field of assembly technology of microelectronic equipment using bulk electronic components as initial objects, and more particularly, to a method for manufacturing a hybrid electronic module.

State of the art
Variants of hybrid integrated circuit designs are well known from the literature (see, for example, "Designing and Calculation of Large Hybrid Integrated Circuits, Microassemblies and Equipment Based on Them" edited by B. F. Vysotsky, Moscow, Radio and Communication, 1981 .).

 Unpacked electronic components are placed and mechanically mounted on a heat-conducting printed circuit board. Contacting with the PCB layout is done by welding the wire lead to the contact pad of the electronic component on the one hand and to the contact pad of the printed circuit board on the other hand. It is also possible to solder the ball leads formed on the electronic component directly to the pads of the printed circuit board. Passive components can be applied to a printed circuit board using thin-film or thick-film technology. Interconnects are performed by thin-film technology using photolithography methods. The entire assembly is enclosed in a sealed enclosure with rigid external leads. The hybrid integrated circuit is monitored and trained after final assembly and cannot be repaired.

 The advantage of this design is the reduction in the volume of electronic equipment by several times compared to the use of packaged components mounted on conventional printed circuit boards. The disadvantages are low productivity and reliability due to the use of welding and soldering for interconnects, relatively low packing density, intense thermal operation, the use of untrained electronic components.

 The known design of the memory module of the American company Cubic Memory, in which the initial component is a layer consisting of four crystals of dynamic memory. This layer is scribed from a semiconductor wafer with a diameter of 8 inches, polished to a thickness of 0.2 ... 0.3 mm. Each such layer is covered with an insulating polyimide film, in which windows are opened by photolithography at the points of contact pads of the crystals. Conductors are applied to the surface of the layer, connecting the crystals with each other and forming the external contact zones of each layer. It is possible to apply a second insulating film, open windows in it and apply secondary conductors, since in memory circuits it is necessary to connect in parallel a large number of pads located in the same plane. The layers are connected using a conductive composition with vertical volumetric buses having access to the lower layer, forming the output contacts of the module, oriented to the surface mounting of the module. The design uses layers not only with all four suitable crystals, but also with three. CAD provides all the layout options for layers at any location of suitable crystals. The layers are not electrically heated, but are controlled on a heated table.

 The disadvantages of this design is that it focuses only on the production of "clean" memory, does not provide for a controller, isolation capacitors for power supply and other components of the "strapping", that is, the design is not universal. In addition, the desire to make the module lower in height led to the loss of more than 70% of suitable crystals, which were not included in the “fours” and “threes” of suitable layers. The design is expensive to manufacture (at the level of on-board equipment) and has low reliability indicators due to the lack of electrothermalization of the layers before assembly into the module.

 The technical solution according to the patent SU 1753961 A H 01 L 21/50 from 07.20.89, "Hybrid multi-level electronic module" is also known.

 The contact pads of the open-circuit microcircuits are located on the surface of each of the boards and are connected by conductors that are connected to the corresponding output contacts of this board, the corresponding conclusions of each of the boards are external outputs of the module, the switching of the boards together is made by one-piece electrical installation, and the heat sink is made in the form of a comb, between the ribs of which the boards are installed, the module case is made monolithic of a sealing material. In addition, the module contains switching boards with planar leads, which are the external leads of the module, the output contacts of the boards are made in the form of rigid beams, the switching boards are made in the form of flexible printed circuit boards, and their conclusions are placed around the perimeter of the rigid frames, in addition, the boards consist of individual parts connected by their output contacts. Patch printed circuit boards are placed on the edges of the module.

 The advantage of this solution is the placement of patch boards along the edges of the module, as well as a design option for the composite board. The disadvantages include the implementation of the output contacts of the boards in the form of rigid beams pressed into a polymer; the bulkiness of the heat sink, consisting of a comb with the location of the ribs between the boards; the use of soldering for external board connections, which reduces the reliability of the module.

 There is also known a technical solution according to the author's certificate of the USSR 1266459 A1 H 05 K 7/06 of 11/15/84 "Block of electronic equipment and method of its manufacture."

 A method of manufacturing a block includes making grooves in the side walls of the base of the microboards, forming conductors on the end sides of the micro boards and in the grooves of the side bases of the micro boards, assembling the micro boards in a bag and connecting the conductors in the grooves of the side walls of the bases of the respective micro boards. The method also provides for the formation of conductors on the end sides of the microboards and in the grooves of the side walls of the bases of the microboards, which is produced simultaneously by vacuum deposition, and the electrical connection of the conductors in the grooves of the sides of the bases of the microplates is carried out by vacuum deposition followed by tinning. Vacuum deposition of conductors in the grooves of the side walls of the bases of the microboards is carried out over the entire surface of the side walls of the bases with subsequent grinding of the sprayed layer between the grooves.

 The advantage of this method can be considered the formation of in-depth conductors, which increases the possible current load when using the unit, as well as the use of vacuum spraying in the manufacture of microplates. The disadvantages include the complex and expensive technology for the personal production of microboards with in-depth figured grooves at the ends; decrease in packing density due to the use of polymer microplates even for individual electronic components; the use of soldering to connect microplates in the block.

 There is also a technical solution according to the author's certificate of the USSR 934893 N 05 K 1/14 dated 03/14/80, "Electronic equipment block".

 A block of electronic equipment containing a circuit board, microcards with leads parallel to the ends and electrically connected to the circuit board, the terminals for connecting each microcircuit to the circuit board are located on one of the ends of the microcircuit, on the other ends of which are the terminals for connecting the microcircuits to each other . A design variant of the block with polished faces for opening the beam leads and further spraying of metal film conductors along the faces of the block is shown, which is the undoubted advantage of this technical solution.

 The disadvantages include the mandatory presence of beam terminals, pressed into a polymer, which reduces the packing density and significantly increases the number of interconnects; the option of heat removal from the electronic components that make up the unit is not presented.

 A technical solution is known according to international application PCT / SU90 / 00022 (international publication number WO 91/11824) H 01 L 25/04; G 11 C 17/00 of January 24, 1990. "Three-dimensional electronic unit and method for its manufacture."

 A method of manufacturing a three-dimensional electronic unit includes the placement of electronic elements in the carrier, the electrical connection of electronic elements to the output contacts of the carrier, the placement of carriers in the block parallel to each other, the switching of carriers along the side surfaces of the block, and the preliminary grouping of electronic elements according to the principle of the least number of output contacts on the carrier , orientation of electronic elements relative to each other, their preliminary fixation, manufacture of carriers with approx by attaching electronic elements in them, electrically isolating unprotected conductive zones of electronic elements, except contact pads, cleaning contact pads and terminal contacts of carriers from organic contaminants and oxide films, applying electronic elements and carriers to conductors on the surface, electrical connection of carrier terminal contacts on the block surface sealing the assembled unit. It is also envisaged to place the carriers in the block with a gap and solder them using the capillary effect, ensuring their mechanical and electrical connection.

 The advantages of this solution are a comprehensive approach to the implementation of a three-dimensional design, the option of connecting carriers along the faces of the block, the deposition of conductors by the method of vacuum deposition of metal films, as well as the design option when one of the carriers consists of separate parts, connected electrically and mechanically by the contacts located on their surfaces. The disadvantages include the lack of the option of using electronic elements and carriers with the location of contact pads directly on their end surfaces, which could significantly increase the packing density and reduce the number of interconnects. The presence of soldered contacts between carriers reduces the reliability parameters of their connection. The composite carrier consists of individual parts interconnected by soldering as well.

 This technical solution is the closest analogue of the present invention.

 In particular, the article "Technology" in the collection "Electronics: Past, Present, and Future" edited by B.F. Vysotsky, Moscow, Mir, 1980, p. 253.

This article provides evidence that the area occupied by internal interconnects in a semiconductor crystal exceeds the area occupied by logic elements and grows disproportionately with an increase in the total area of the crystal. So, in a monolithic crystal with an area of 2 cm ^{2, the} area occupied by interconnects as a percentage is 3 times larger than in a crystal with an area of 0.5 cm ² . In absolute terms, the area occupied by interconnects in a large crystal is 4 times higher, and in a small crystal it is 1.3 times larger than the area occupied by logic elements. From this we can conclude that a large crystal composed of four small crystals will have even smaller area than a single monolithic crystal.

 Due to the fact that the degree of integration currently achieved in the production of ICs has reached its technological limit (the technological norm is a fraction of a micrometer) and a further decrease in this norm will lead to the abandonment of traditional photolithography, which will inevitably lead to the re-equipment of the entire microelectronic industry with technological equipment, many developers follow the path of simply increasing the area of the semiconductor crystal. But at the same time, the percentage of yield of suitable crystals on the plate drops sharply (several times) due to the fact that the probability of a defect entering a large crystal is many times greater than the probability of a defect entering a small crystal. Calculations and experiments showed that with a decrease in the crystal area by 4 times, the yield on a semiconductor wafer increases by 8.2 times, while the assembly cost of a hybrid module replacing a large crystal does not exceed only 15% of the cost of its electronic components. It may be appropriate to introduce electronic components into the hybrid module, which cannot be implemented in a monolithic design with other components (for example, powerful resistors or large capacitors). In most cases, it is possible to obtain the best characteristics of the hybrid module when using electronic components made using various technologies using various materials (silicon, sapphire, gallium arsenide, ferrogarnet, ceramics, etc.), which is fundamentally impossible in a monolithic design.

SUMMARY OF THE INVENTION
The basis of this invention is the following. In the new design and manufacture of integrated circuits, or during their modernization, instead of unreliable and expensive large (LSI) and ultra-large (VLSI) integrated circuits, which are currently being implemented on monolithic semiconductor substrates, it is proposed to design and manufacture hybrid modules consisting of existing highly reliable and cheap small-sized bulk unpacked components, as well as from manufactured missing guaranteed volumetric unpacked components. Crystals isolated from semiconductor wafers are used as active components, and bulk components are used as passive components. In this case, traditional technologies for the manufacture of components are used, as well as well-known interconnect methods, not inferior in reliability parameters to the methods used in replaceable similar monolithic circuits. Thus, it seems possible to manufacture hybrid modules that, in terms of technical and economic indicators and reliability parameters, exceed the parameters of similar monolithic LSIs and VLSIs.

 The main objective of this invention is to develop a technological process for the assembly of electronic equipment, allowing the transition from design and production of complex LSI and VLSI, made on a monolithic substrate, to methods of assembly of their hybrid counterparts with a significant improvement in the technical and economic characteristics of electronic equipment.

 The problem is solved in that a method of manufacturing a hybrid electronic module (hereinafter referred to as the module), including the manufacture of the initial small-sized open-frame electronic components, their oriented placement relative to each other, the electrical connection of the components with each other and with the external terminals, sealing the resulting assembly, its functional control and the packaging according to the invention provides for the implementation of preliminary full input control of the existing components used and manufacturing guaranteed fit of the missing components (hereinafter - the components). Guaranteed suitable components should be understood as components that have undergone electrotraining (ETT) or diagnostics with subsequent functional control and are recognized as suitable.

 Initially, an insulating layer is applied locally to all electrically exposed surfaces of existing and manufactured components, except for contact pads. Existing active components, as a rule, already have an insulating layer of silicon dioxide with a thickness of 0.5 ... 1 μm deposited on the front surface of the component (surface containing the active zone), with the exception of contact pads. In this case, additional coating with an insulating layer of chips formed on the front surface of the component is mandatory, and the end and back surfaces of the components are coated.

Next, conductors are applied to the front, back and end surfaces of the components, which are necessary in the future for the electrical connection of the components between themselves and the organization of external contact pads. The thickness of the applied conductors is usually from 2 to 4 μm, and the width of the conductor depends on its current load, while the current density should not exceed 10 A / cm ² . Conductors are applied mainly by vacuum spraying through "free" masks on a commercially available vacuum installations of continuous or semi-continuous action with planetary rotation of the components. A “free” mask (tool) is made mainly of soft magnetic material with a thickness of 50 ... 100 microns by chemical milling or laser method. The material of the conductors is copper with a chromium sublayer or aluminum with a vanadium sublayer. Before applying the conductors, the spraying areas are cleaned of contaminants and oxide films mainly by ion bombardment in a single vacuum cycle with the spraying of conductors.

 Then, using a binder composition, the components are mechanically bonded to the assembly. For the manufacture of a flat assembly, a mechanical connection is made by directly docking the mating end surfaces of the components with gluing them to each other with an adhesive binder. In this case, a device is used that ensures the formation of at least one common plane of the arrangement of the front surfaces of the mating components. In the case when it is necessary to provide some clearance between the mating components, a polymer pressing the components is used as a binder composition. Pressure testing is carried out on any double-action presses or on plastic sealing installations. When the components are mechanically bonded in this embodiment, through holes and grooves are formed in the bonding composition for their subsequent metallization during the deposition of conductors on the surface of the flat assembly and the connection of conductors located on opposite surfaces of the flat assembly. It is also possible that the mechanical connection of the components is carried out on the mating front and back surfaces of the components and / or flat assemblies, forming a three-dimensional hybrid assembly. In this case, using the device, the components are oriented along the conductors located on the end surfaces of the components. But in any case, the binder composition must have high heat-conducting and electrical insulating properties.

 Further, on all surfaces of the assembly, an insulating layer is applied again locally, except for the places of future electrical connections of the components to each other and places of future connections with external terminals. Selective isolation of the surfaces of components and assemblies can be accomplished by spraying an organic dielectric through “free” masks on a serial spray dielectric coating system followed by heat treatment. If a photoresist is used as a dielectric, then it is subsequently thermally submerged. The thickness of the insulating layer in this case is 5 ... 10 μm, which is sufficient to prevent the occurrence of punctures in the insulating layer. Isolation can also be done by applying an inorganic dielectric such as silicon nitride by pyrolytic deposition through "free" masks in commercial pyrolysis units. In this case, a thickness of the insulating layer of 1 μm is sufficient. The option of continuous deposition of an organic dielectric with its subsequent local removal by plasma through “free” masks using plasma-chemical etching plants is also possible. There is a variant of continuous deposition of an insulating layer with its subsequent local removal by traditional methods of photolithography.

 Then, external conductors are applied to the surface of the assembly, electrically connecting the components together and together with the contact pads of the components forming the external contact pads of the assembly. Moreover, a very important factor is that the deposition of conductors on the surfaces of components and assemblies is carried out in any known manner that is not inferior in terms of reliability to the method of connections used in the replaceable monolithic LSI or VLSI. When spraying conductors through "free" masks, the latter can have a relief shape that repeats the profile of the sprayed surface. Conductors on the surface of components and assemblies can be applied by vacuum deposition of a continuous metal layer, followed by photolithography and, for example, the use of laser exposure. There is an option when the conductors on the surface of the components and the assembly are applied by vacuum deposition of a continuous metal layer followed by the removal of white areas of metallization mainly by the laser method in laser processing systems for materials to open adjacent conductors. External conductors are applied in the same ways and on the same equipment as the conductors on the components.

 In the case when the wiring of the conductors on the assembly is quite simple and can be located completely on the surfaces of the assembly, the insulating layer and conductors are not applied to the surface of the components.

 Next, the assembly is thermally contacted with a prefabricated heat transfer agent through a heat-conducting composition. A heat dissipator made of a heat-conducting material (for example, copper or aluminum alloys) must have a profile that matches the profile of the assembly mating with it. As the material of the heat-conducting composition, you can use the standard paste KPT-8, while the gap between the assembly and the heat dissipator should be minimal (almost no more than 0.1 mm).

 After that, the external contact pads of the assembly are electrically connected to the external terminals. The electrical connection of the external contact pads of the assembly with the external terminals of the module is carried out mainly by the method of vacuum deposition of conductors, which also provides high reliability characteristics of the module.

 Next, the module is sealed by crimping with a thermally conductive insulating polymer. In this case, initial crimping is possible with opening of the external contact pads of the assembly and the external terminals of the module, their electrical connection, and then secondary crimping with complete sealing of the module. Apply the same equipment as when applying conductors to flat assemblies. It is also possible to seal the module by vacuum pouring with a heat-conducting electrical insulating compound with its preliminary evacuation at vacuum filling stands.

 Final control of the module is carried out using specialized or universal stands for compliance with the technical conditions for the module.

 The module is packaged in containers that exclude mechanical damage to the module and protect it from static electricity.

List of figures and drawings
In the future, the invention is illustrated by specific examples of its implementation, in which:
figure 1 depicts an enlarged technological route of manufacturing a hybrid electronic module;
figure 2 depicts a local application of the insulating layer on the components using a "free"mask;
FIG. 3 shows an embodiment of applying conductors to the surface of a component;
figure 4 depicts an embodiment of the manufacture of a flat assembly with a mechanical connection of the components on the end surfaces through a significant layer of a binder composition after the secondary local deposition of the insulating layer and the application of external conductors to the assembly;
FIG. 5 shows an embodiment of the manufacture of a flat assembly with direct mechanical connection of the components along the end surfaces after the secondary local deposition of the insulating layer and the application of external conductors to the assembly;
Fig.6 depicts a manufacturing option of a three-dimensional assembly with direct mechanical connection of components and flat assemblies on the front and back surfaces after the secondary local application of the insulating layer and the application of external conductors to the assembly;
FIG. 7 depicts an embodiment of a module using the assembly of FIG. 4;
FIG. 8 depicts an embodiment of a module using the assembly of FIG. 5;
FIG. 9 depicts an embodiment of a module using the assembly of FIG. 6.

Information confirming the possibility of carrying out the invention
To implement the invention, a technological process has been developed, an enlarged route of which is shown in figure 1.

 Initially, a complete input control of existing components intended for use in a hybrid module is carried out. The missing components are manufactured using traditional technologies adopted in the electronics industry (operation 01). Only approved components are guaranteed for assembly. Guaranteed suitable components should be understood as components that have undergone electrical examination or diagnostics with subsequent functional control and are recognized as suitable.

 Then produce a local deposition of the insulating layer on the components (operation 02). In one embodiment of this operation (FIG. 2), the components 1 are fixed on a figured base 2 using, for example, a wax-rosin composition. All surfaces of components 1 not subject to coating with an insulating layer 3, including contact pads 4, are covered with a “free” mask 5 held by a magnetic board 6. The insulating composition 7, which is in a sprayed state, is sucked into the holes made in the base under vacuum 2, and through the grooves 8, due to the swirl effect, settles on the end and partly on the front and back surfaces of the components 1, forming an insulating layer 3. If necessary, the insulation is coated similarly (but without the use of a “free” mask 5) layer 3 and the back surfaces of the components 1.

 The application of conductors on the surface of the components 1 (operation 03) is carried out by the method of vacuum deposition (figure 3). For this, the components 1 are mechanically fixed in a device consisting of a housing 9 and movable clamps 10. At the same time, a single plane of arrangement of the front surface of the components 1 with the surfaces of the housing 9 and clamps 10 is provided. A “free” mask 5 is placed on this single plane, in which holes in the locations of the contact pads 4 and in other places of the future location of the conductors. The "free" mask 5 is held by a magnetic board 6. In the case 9 and in the clamps 10 there are through grooves for forming conductors on the end surfaces of the components 1. In the process of spraying, a metal coating 11 is formed on all open surfaces of the device, including on unprotected "free" mask 5 to the surfaces of the components 1. If necessary, the components 1 are turned over and the conductors are likewise applied to the reverse and secondly to the end surfaces of the components 1. For more efficient deposition of conductors on t The end surfaces of the components 1, it is advisable during the spraying to ensure planetary rotation of the components 1 together with the device. The insulating layer 3 in figure 3 is conventionally not shown.

 Next, a mechanical connection of the components 1 to the assembly is performed (operation 04). In one embodiment, a flat assembly 12 is made (Fig. 4) by connecting the components 1 with a binder composition 13 with the arrangement of the components 1 with some clearance between them. Components 1 may have conductors 14 on their surfaces made according to the method indicated in FIG. 3. In the places of the flat assembly 12, free from components 1, through holes 15 are located, which are necessary for further electrical connection of the conductors located on opposite surfaces of the flat assembly 12. Next, an insulating layer 3 is applied to the surface of the flat assembly 12 (operation 05) with the exception of contact pads 4 required for contact with subsequently applied conductors. Outer conductors 16 are applied over the insulating layer 3 (operation 06) according to the method shown in FIG. 3. At the same time, external contact pads 17 are formed on one of the surfaces of the flat assembly 12.

 According to another embodiment of the manufacture of a flat assembly 12 (Fig. 5), the components 1 are mechanically interconnected (operation 04) directly (with a minimum clearance) by a binder composition 13 along their end surfaces. In this embodiment, the presence of through holes 15 is not provided, and all connections between opposite surfaces of the flat assembly 12 are made only through its end surfaces. Similarly to the previous embodiment, the insulating layer 3 is locally applied to the flat assembly 12 (operation 05) and the external conductors 16 (operation 06), and also the external contact pads are formed 17. The insulating layer 3 applied to the components 1 is conventionally shown in FIGS. 4 and 5 not shown.

 The bulk assembly 18 (Fig. 6) may contain both components 1 and flat assemblies 12 with conductors 14 and 16 located on them. Components 1 and / or flat assemblies 12 are mechanically connected (operation 04) on the front and back surfaces with a binder composition 13 with a minimum clearance. Next, the insulating layer 3 is locally applied on the verge of the volumetric assembly 18 (operation 05) except for the places of subsequent contact of the external conductors 16 with the components 1 and / or with the flat assemblies 12, as well as the zones intended for subsequent connection with the external terminals of the module. Next, external conductors 16 are applied on the verge of the bulk assembly 18 (operation 06) with the formation of external contact pads 17. The insulating layer 3 is not conventionally shown in Fig. 6.

 In the case when the wiring of the conductors 16 on a flat 12 or volumetric 18 assembly is quite simple and can be located completely on the surfaces of the assembly, local application of the insulating layer (operation 02) and conductors on the surface of the components (operation 03) is not performed.

 The connection of the flat assembly 12 (operation 08), made according to the embodiment shown in FIG. 4, with the heat transfer 19 (FIG. 7) is made through the heat-conducting electrical insulation composition 20, which provides not only good thermal contact of the flat assembly 12 with the heat transfer 19, but also protects the external conductors 16 of the flat assembly from electrical short circuit to the heat dissipator 19. Next, the flat assembly 12 is electrically connected to the external terminals 21 mainly by vacuum spraying of the external conductors 16. The external water cans 16 can have contact with the contact pads of 4 components 1. Next, they are sealed with polymer material 22 (step 09) to form a standard polymer shell.

 In FIG. Figure 8 shows similar operations performed with a flat assembly made in accordance with figure 5. A distinctive feature is the manufacture of a heat spreader 19 of a stepped shape, repeating the shape of the mating flat assembly 12.

 Figure 9 shows the operations performed with the volumetric assembly 18. In this case, the electrical contacting of the volumetric assembly 18 with the external terminals 21 is performed by connecting with external conductors 16 located along the faces of the volumetric assembly 18. The heat distributor 19 also has a stepped shape in accordance with the configuration of the mated volumetric builds 18.

 Final control of the module (operation 10) is carried out using specialized or universal stands for compliance with the technical conditions for the module.

 The packaging of the module (step 11) is carried out in containers that exclude mechanical damage to the module and protect it from static electricity.

 This invention can be widely used in the assembly of electronic equipment mainly from existing highly reliable and cheap electronic components with limited manufacture of missing components by traditional technologies.

 The implementation of this invention provides an additional large economic effect due to the multiple increase in the percentage of yield on the plate during the transition from the use of large crystals to smaller crystals.

Industrial example
In 1998, the cost of one 256 Mbps Samsung Electronics dynamic memory chip was $ 496. Using a patented solution, a hybrid module with better technical and economic characteristics than a monolithic integrated circuit could be made of 4 crystals with a capacity of 64 Mbps then on sale at a price of $ 25 per crystal. At the same time, it would be possible to get a profit of $ 337 from one hybrid module (taking into account the cost of its assembly), and an annual profit of 185.7 million from just one production line consisting of equipment available at any radio-electronic enterprise Doll.

Claims (15)

1. A method of manufacturing a hybrid electronic module, including the manufacture of the initial small-sized open-frame electronic components, their oriented placement relative to each other, the electrical connection of the components with each other and with the external terminals, sealing the resulting assembly, its functional control and packaging, characterized in that it is preliminarily carried out full incoming control of existing components used and produce the missing guaranteed components that are suitable, initially for all Electrically unprotected surfaces of existing and manufactured components, in addition to the contact pads, locally apply an insulating layer, then conductors are applied to the front, back and end surfaces of the components, which are necessary for the electrical connection of the components between themselves and the organization of external contact pads, and then using a bonding composition the components are mechanically bonded into the assembly, then an insulating layer is applied locally again on all assembly surfaces except for the places where damaging the electrical connections of the components to each other and places of future connections with external terminals, then apply external conductors to the assembly surface, connecting the components electrically to each other and together with the component pads forming the external contact pads of the assembly, all conductors on the surface of the components and assembly are applied by any in a known manner that is not inferior in terms of reliability to the method of connections used in the replaceable monolithic integrated circuit, heat ntakt assembly premanufactured teplorastekatelem through the thermal interface composition, after which electrically connect the external contact pad assembly with external terminals, in conclusion produce sealing, finishing and packaging of suitable control unit in a protective container. 2. The method of manufacturing the module according to claim 1, characterized in that the selective isolation of the surfaces of the components and the assembly is carried out by spraying an organic dielectric through "free" masks, followed by heat treatment. 3. The method of manufacturing the module according to claim 1, characterized in that the selective isolation of the surfaces of the components and the assembly is carried out by applying an inorganic dielectric by pyrolytic deposition through "free" masks. 4. The method of manufacturing the module according to claim 1, characterized in that the selective isolation of the surfaces of the components and the assembly is carried out by continuous deposition of an organic dielectric followed by heat treatment and its local removal by plasma etching through “free” masks. 5. The method of manufacturing the module according to claim 1, characterized in that the selective isolation of the surfaces of the components and the assembly is carried out by continuous deposition of the insulating layer, followed by its local removal by photolithography methods. 6. The method of manufacturing the module according to claim 1, characterized in that the mechanical connection of the components is carried out on the mating end surfaces, forming a flat hybrid assembly. 7. The method of manufacturing the module according to claim 1, characterized in that the mechanical connection of the components is carried out on the mating front and back surfaces of the components and / or flat assemblies, forming a three-dimensional hybrid assembly. 8. A method of manufacturing a module according to claims 1 and 7, characterized in that the conductors on the surface of the components and the assembly are applied by vacuum spraying through "free" masks, while the masks can have a relief shape. 9. A method of manufacturing a module according to claims 1 and 8, characterized in that the conductors on the surface of the components and the assembly are applied by vacuum deposition of a continuous metal layer with subsequent photolithography and using the laser exposure method. 10. A method of manufacturing a module according to claims 1 and 8, characterized in that the conductors on the surface of the components and the assembly are applied by vacuum deposition of a continuous metal layer with the subsequent removal of white areas of metallization mainly by the laser method until the neighboring conductors open. 11. A method of manufacturing a module according to claim 1, characterized in that the mechanical connection of the components during the formation of a flat assembly or bulk assembly is carried out by a binder heat-conducting electrical insulation composition. 12. A method of manufacturing a module according to claims 1 and 6, characterized in that through mechanical connection of the components along the mating end surfaces in the binder composition, through holes and grooves are formed for their subsequent metallization during deposition of conductors on the surface of a flat assembly and connection of conductors located on opposite surfaces of the flat assembly. 13. A method of manufacturing a module according to claim 1, characterized in that the electrical connection of the external contact pads of the assemblies with the external terminals of the module is carried out mainly by the method of vacuum deposition of conductors. 14. A method of manufacturing a module according to claim 1, characterized in that the module is sealed by crimping with a thermally conductive insulating polymer. 15. A method of manufacturing a module according to claim 1, characterized in that the module is sealed by vacuum filling with a heat-conducting electrical insulating compound with its preliminary evacuation.

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