RU2104328C1 - Способ безэлектролизного нанесения металлического покрытия на поверхность изделия из ароматического полиамида и изделие из ароматического полиамида с металлическим покрытием - Google Patents
Способ безэлектролизного нанесения металлического покрытия на поверхность изделия из ароматического полиамида и изделие из ароматического полиамида с металлическим покрытием Download PDFInfo
- Publication number
- RU2104328C1 RU2104328C1 RU93058523A RU93058523A RU2104328C1 RU 2104328 C1 RU2104328 C1 RU 2104328C1 RU 93058523 A RU93058523 A RU 93058523A RU 93058523 A RU93058523 A RU 93058523A RU 2104328 C1 RU2104328 C1 RU 2104328C1
- Authority
- RU
- Russia
- Prior art keywords
- metal
- aromatic polyamide
- product
- coating
- silver
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67440291A | 1991-03-25 | 1991-03-25 | |
US674,402 | 1991-03-25 | ||
PCT/US1992/002140 WO1992016589A1 (fr) | 1991-03-25 | 1992-03-25 | Revetement autocatalytique de surfaces d'aramide |
US674402 | 1996-07-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
RU93058523A RU93058523A (ru) | 1996-10-10 |
RU2104328C1 true RU2104328C1 (ru) | 1998-02-10 |
Family
ID=24706452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU93058523A RU2104328C1 (ru) | 1991-03-25 | 1992-03-25 | Способ безэлектролизного нанесения металлического покрытия на поверхность изделия из ароматического полиамида и изделие из ароматического полиамида с металлическим покрытием |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100199656B1 (fr) |
CA (1) | CA2106877C (fr) |
RU (1) | RU2104328C1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2723118C2 (ru) * | 2015-08-27 | 2020-06-08 | Амперетекс Гмбх | Способ и оборудование для изготовления токопроводящих волокон и элементарных нитей |
-
1992
- 1992-03-25 KR KR1019930702873A patent/KR100199656B1/ko not_active IP Right Cessation
- 1992-03-25 CA CA002106877A patent/CA2106877C/fr not_active Expired - Lifetime
- 1992-03-25 RU RU93058523A patent/RU2104328C1/ru active
Non-Patent Citations (1)
Title |
---|
РСТ, заявка, 9000634, кл. C 23 C 18/20, 1990. * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2723118C2 (ru) * | 2015-08-27 | 2020-06-08 | Амперетекс Гмбх | Способ и оборудование для изготовления токопроводящих волокон и элементарных нитей |
Also Published As
Publication number | Publication date |
---|---|
CA2106877A1 (fr) | 1992-09-26 |
CA2106877C (fr) | 2001-08-21 |
KR100199656B1 (ko) | 1999-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5399382A (en) | Electroless plated aramid surfaces | |
JP3296491B2 (ja) | 無電解メッキされたアラミド表面および該表面を製造するための方法 | |
US5549972A (en) | Silver-plated fibers of poly(p-phenylene terephthalamide) and a process for making them | |
US5466485A (en) | Process for batch-plating aramid fibers | |
JP3882197B2 (ja) | アラミド表面に無電解メッキする方法 | |
EP1130154B1 (fr) | Procédé pour produire une fibre conductrice | |
US5279899A (en) | Sulfonated polyamides | |
RU2104328C1 (ru) | Способ безэлектролизного нанесения металлического покрытия на поверхность изделия из ароматического полиамида и изделие из ароматического полиамида с металлическим покрытием | |
JP4560750B2 (ja) | 金属被覆繊維とその用途 | |
US5773089A (en) | Process for treating aramid surfaces to be plated |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC4A | Invention patent assignment |
Effective date: 20081215 |