RU2032250C1 - Method for manufacturing class-metal package of hybrid integrated circuit - Google Patents

Abstract

FIELD: electronic engineering. SUBSTANCE: package is evacuated in chamber to 10^-2-10^-4 mm Hg, chamber is washed with inert gas, evacuation is repeated to reduce pressure to 10^-2-10^-4 mm Hg; package is filled with argon base gas mixture, held at gage pressure of 0.4 to 0.5 kgf/sq.cm; projections, 0.4 to 0.5 mm long, are made on package on side of welded joint; internal surfaces of package covers are coated with high-conductivity material at distance equal to width of package bezel over perimeter. EFFECT: facilitated procedure, improved reliability. 2 cl, 5 dwg

Description

 The invention relates to electronic equipment and can be used in the manufacture of miniature hybrid integrated circuits with an increased degree of reliability of the LF and HF ranges in metal-glass cases sealed by laser welding.

Hybrid Integrated Circuit Chassis enclosures may have the following requirements:
- the volume of buildings excluding external findings of 0.1-1 cm ³ ;
- case height less than 2 mm;
- the possibility of placement in the cases of circuits low and high ranges;
- An increased degree of reliability of the cases, allowing the operation of hybrid integrated circuits in all climatic conditions, in acid and alkaline environments for 10-15 years.

 There are various methods of manufacturing cases of hybrid integrated circuits (OST 11.073.025-74. Integrated hybrid microcircuits. Design. Assembly and protection of microcircuits).

 The most fully meet the above requirements are metal-glass cases with a planar arrangement of external terminals corresponding to type 4 (GOST 17467-88. Integrated microcircuits. Main dimensions).

 In FIG. 1 shows the design of the housing 4130.40-1 TBO.410.018TU; in FIG. 2 is a view A in FIG. 1; figure 3 - body design with a height of 2.2-2.4 mm; figure 4 - body design with a height of 1.7-2 mm; figure 5 - cover metal-glass housing with local application of a conductive coating.

 In FIG. Figures 1-5 show frame 1, cover 2, capillary 3, terminal 4, plug 5 and coating zone 6.

 To ensure a high degree of reliability of hybrid integrated circuits (OST4. GO. 010.009-84. Electronic modules of the first and second levels of electronic components. Design.) The internal volume of the housing must be filled with an inert gas or dry nitrogen. However, the currently developed gas filling process is carried out through a plug (Fig. 3) or through a previously made special hole in the housing, which then must also be sealed. This filling method for miniature enclosures of integrated circuits is either completely unacceptable, or requires a lot of labor, a long execution cycle, and leads to an increase in size.

 Since the minimum distance from the laser welding zone to the metal-glass junction, providing a high degree of tightness of the body, must be at least 0.5 mm, the height of such bodies can not be less than 2.2-2.4 mm (figure 4).

 In addition, parts of metal-glass cases sealed by laser welding are made of 29KN nickel-plated Kovar alloy and therefore have low electrical conductivity, which does not allow expanding the scope of use of miniature cases in the frequency range (RF receivers, transmitters, generators, etc.) .

 The aim of the invention is to develop a method of manufacturing a miniature metal-glass case of a hybrid integrated circuit sealed by laser welding, having high performance and a smaller filling cycle, expanding the scope of the case in the frequency range and reducing its height.

For this, the filling of the bodies is carried out through one of the non-welded sides of the body, followed by its evacuation in the chamber to 10 ^-2 - 10 ^-4 mm Hg, washing the chamber with an inert gas, such as argon, and re-evacuation to 10 ^-2 - 10 ^-4 mm Hg and its subsequent filling with a gas medium based on argon, after which the bodies are kept in the chamber under excess pressure up to 0.4-0.6 kgf / cm ² for 5-10 minutes. Another difference is that they use a gaseous medium consisting of,% by volume:
Argon 70-80
Helium 20-30
In addition, the inner surface of the housing covers is covered locally at a distance equal to the width of the housing frame around the perimeter of a material having high electrical conductivity, for example silver.

 Special protrusions up to 0.5 mm long are also performed on the body at the location of the metal-glass junction.

 The proposed manufacturing method is illustrated by the following example.

 The frame design of the manufactured miniature metal-glass case of the hybrid integrated circuit sealed by laser welding in the area of the metal-glass junction is shown in Fig. 4, and the place of local deposition of a conductive coating is shown in Fig. 5.

Based on the conditions for ensuring a minimum distance to the metal-glass junction of 0.5 mm, a special protrusion is provided on the side of the metal-glass junction along the lid at a distance of at least 0.5 mm, which allows reducing the frame thickness to 1.5 cm, and taking into account the thickness of the lids to get a body height of 1.7-2 mm maximum, a product with a volume of 0.1 to 1.0 cm ³ . For placement in the cases of hybrid ICs of the high frequency range (receivers, transmitters, generators, etc.) and preserving the requirements of the minimum dimensions, the internal manufacturing cycle, as a whole, is reduced by 2-3 times.

Claims (2)

1. METHOD FOR MANUFACTURING A METAL-GLASS CASE OF A HYBRID INTEGRATED MICROSCheme, including making a frame and covers, assembling a case, coating the surface of the frame and covers with nickel, sealing the case by laser welding and filling the case with gas mixture, characterized in that when manufacturing the frame and covers on the side of the frame projections with a length of 0.4-0.5 mm are made of the weld, after coating the surface with nickel, the inner surface of the housing covers are covered at a distance equal to the width of the housing frame, around the perimeter of the mat ialom having high electrical conductivity such as silver, and a seal housing carried on one side thereof, whereupon the housing is evacuated in the chamber to 10 ^{- 2} - 10 ^{- 4} Torr, the chamber is flushed with an inert gas, then evacuated again to housing 10 ^{- 2} - 10 ^{- 4} mm Hg, the body is filled through its free side with a gas mixture based on argon, after filling the body with a gas mixture, the body is kept in the chamber under an overpressure of 0.4 - 0.6 kgf / cm ² for 5 - 30 minutes 2. The method according to claim 1, characterized in that when filling the body using a gas mixture of argon and helium in the following ratio,%:
Argon - 70 - 80
Helium - 20 - 30

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