RU2014148700A - COPPER COATING ELECTRODEPOSITION METHOD - Google Patents
COPPER COATING ELECTRODEPOSITION METHOD Download PDFInfo
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- RU2014148700A RU2014148700A RU2014148700A RU2014148700A RU2014148700A RU 2014148700 A RU2014148700 A RU 2014148700A RU 2014148700 A RU2014148700 A RU 2014148700A RU 2014148700 A RU2014148700 A RU 2014148700A RU 2014148700 A RU2014148700 A RU 2014148700A
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- current density
- copper
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- sulfuric acid
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Abstract
Способ электроосаждения медных покрытий из электролита, содержащего сульфат меди и серную кислоту, с использованием реверсивного тока, отличающийся тем, что для интенсификации процесса получения медного покрытия и обеспечения равномерного распределения толщины покрытия на участках с повышенной и пониженной плотностью тока задают отношение произведения катодной плотности тока и длительности катодного импульса к произведению анодной плотности тока и длительности анодного импульса, равным величине отношения значений поляризуемости при катодном и анодном направлении тока, и процесс электроосаждения ведут при концентрации пентагидрата сульфата меди 150-250 г/л и концентрации серной кислоты 50-80 г/л.The method of electrodeposition of copper coatings from an electrolyte containing copper sulfate and sulfuric acid, using a reverse current, characterized in that to intensify the process of obtaining a copper coating and ensure uniform distribution of the coating thickness in areas with increased and reduced current density, the ratio of the product of the cathode current density and the duration of the cathode pulse to the product of the anode current density and the duration of the anode pulse equal to the ratio of the polarizability values in the cathodic and anodic direction of the current, and the electrodeposition process is carried out at a concentration of copper sulfate pentahydrate of 150-250 g / l and a concentration of sulfuric acid of 50-80 g / l.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2014148700A RU2014148700A (en) | 2014-12-03 | 2014-12-03 | COPPER COATING ELECTRODEPOSITION METHOD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2014148700A RU2014148700A (en) | 2014-12-03 | 2014-12-03 | COPPER COATING ELECTRODEPOSITION METHOD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2014148700A true RU2014148700A (en) | 2016-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2014148700A RU2014148700A (en) | 2014-12-03 | 2014-12-03 | COPPER COATING ELECTRODEPOSITION METHOD |
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| Country | Link |
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| RU (1) | RU2014148700A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2630994C1 (en) * | 2016-06-28 | 2017-09-15 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) | Method of copper coatings electrolytic deposition |
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2014
- 2014-12-03 RU RU2014148700A patent/RU2014148700A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2630994C1 (en) * | 2016-06-28 | 2017-09-15 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) | Method of copper coatings electrolytic deposition |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA91 | Application withdrawn (on applicant's request) |
Effective date: 20160530 |