RU2012109025A - SILVER BASIS - Google Patents
SILVER BASIS Download PDFInfo
- Publication number
- RU2012109025A RU2012109025A RU2012109025/02A RU2012109025A RU2012109025A RU 2012109025 A RU2012109025 A RU 2012109025A RU 2012109025/02 A RU2012109025/02 A RU 2012109025/02A RU 2012109025 A RU2012109025 A RU 2012109025A RU 2012109025 A RU2012109025 A RU 2012109025A
- Authority
- RU
- Russia
- Prior art keywords
- silver
- zinc
- silver basis
- basis
- components
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adornments (AREA)
- Die Bonding (AREA)
Abstract
Припой на основе серебра, содержащий медь и цинк, отличающийся тем, что он дополнительно содержит индий при следующем соотношении компонентов, мас.%:Silver-based solder containing copper and zinc, characterized in that it additionally contains indium in the following ratio of components, wt.%:
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2012109025/02A RU2496625C1 (en) | 2012-03-11 | 2012-03-11 | Silver-base solder |
EA201200633A EA020433B1 (en) | 2012-03-11 | 2012-05-24 | Silver-based solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2012109025/02A RU2496625C1 (en) | 2012-03-11 | 2012-03-11 | Silver-base solder |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2012109025A true RU2012109025A (en) | 2013-09-20 |
RU2496625C1 RU2496625C1 (en) | 2013-10-27 |
Family
ID=49182830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2012109025/02A RU2496625C1 (en) | 2012-03-11 | 2012-03-11 | Silver-base solder |
Country Status (2)
Country | Link |
---|---|
EA (1) | EA020433B1 (en) |
RU (1) | RU2496625C1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57127595A (en) * | 1981-01-30 | 1982-08-07 | Tanaka Kikinzoku Kogyo Kk | Silver solder |
JP2003112288A (en) * | 2001-10-03 | 2003-04-15 | Mitsubishi Heavy Ind Ltd | Silver solder material |
RU2367553C1 (en) * | 2008-04-30 | 2009-09-20 | Федеральное государственное образовательное учреждение высшего профессионального образования "Сибирский федеральный университет" | Solder alloys on basis of silver |
-
2012
- 2012-03-11 RU RU2012109025/02A patent/RU2496625C1/en not_active IP Right Cessation
- 2012-05-24 EA EA201200633A patent/EA020433B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EA201200633A1 (en) | 2013-09-30 |
EA020433B1 (en) | 2014-11-28 |
RU2496625C1 (en) | 2013-10-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20170312 |