RU2002113088A - POLYIMIDE COPOLYMER AND METAL LAMINATE CONTAINING IT - Google Patents

POLYIMIDE COPOLYMER AND METAL LAMINATE CONTAINING IT

Info

Publication number
RU2002113088A
RU2002113088A RU2002113088/04A RU2002113088A RU2002113088A RU 2002113088 A RU2002113088 A RU 2002113088A RU 2002113088/04 A RU2002113088/04 A RU 2002113088/04A RU 2002113088 A RU2002113088 A RU 2002113088A RU 2002113088 A RU2002113088 A RU 2002113088A
Authority
RU
Russia
Prior art keywords
polyimide copolymer
metal foil
metal laminate
phenyleneoxy
polyimide
Prior art date
Application number
RU2002113088/04A
Other languages
Russian (ru)
Other versions
RU2238285C2 (en
Inventor
Дзенг-Тайн ЛИН
Хироюки СЕКИНЕ
Александр Львович РУСАНОВ
Любовь Борисовна ЕЛЬЧИНА
Галина Валентиновна КАЗАКОВА
Яков Семенович Выгодский
Original Assignee
Ниппон Мектрон, Лимитед
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ниппон Мектрон, Лимитед filed Critical Ниппон Мектрон, Лимитед
Publication of RU2002113088A publication Critical patent/RU2002113088A/en
Application granted granted Critical
Publication of RU2238285C2 publication Critical patent/RU2238285C2/en

Links

Claims (11)

1. Полиимидный сополимер, который содержит сополимер диангидрида изопропилиден-бис-(4-фениленокси-4-фталевой кислоты) и 6-амино-2-(п-аминофенил) бензимидазола.1. A polyimide copolymer that contains a copolymer of isopropylidene bis- (4-phenyleneoxy-4-phthalic acid) dianhydride and 6-amino-2- (p-aminophenyl) benzimidazole. 2. Полиимидный сополимер, который содержит сополимер двух типов диангидридов тетракарбоновых кислот, состоящих из диангидрида изопропилиден-бис-(4-фениленокси-4-фталевой кислоты) и диангидрида 3,3’,4,4’-бензофенонтетракарбоновой кислоты и 6-амино-2-(п-аминофенил) бензимидазола.2. A polyimide copolymer that contains a copolymer of two types of tetracarboxylic acid dianhydrides consisting of isopropylidene bis- (4-phenyleneoxy-4-phthalic acid dianhydride) and 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride and 6-amino 2- (p-aminophenyl) benzimidazole. 3. Способ получения полиимидного сополимера, который включает проведение реакции диангидрида изопропилиден-бис-(4-фениленокси-4-фталевой кислоты) или двух типов диангидридов тетракарбоновых кислот, состоящих из диангидрида изопропилен-бис-(4-фениленокси-4-фталевой кислоты) и диангидрида 3,3’,4,4’-бензофенонтетракарбоновой кислоты, с 6-амино-2-(п-аминофенил) бензимидазолом в полярном растворителе с образованием таким образом полиамидокислоты с последующим проведением реакции дегидратирующей циклизации.3. A method of producing a polyimide copolymer, which includes the reaction of isopropylidene bis- (4-phenyleneoxy-4-phthalic acid dianhydride) or two types of tetracarboxylic acid dianhydrides consisting of isopropylene bis- (4-phenyleneoxy-4-phthalic acid dianhydride) and 3,3 ', 4,4'-benzophenonetetracarboxylic acid dianhydride, with 6-amino-2- (p-aminophenyl) benzimidazole in a polar solvent, thereby forming a polyamido acid followed by a dehydrating cyclization reaction. 4. Способ получения полиимидного сополимера по п.3, где полярным растворителем является м-крезол.4. The method of producing the polyimide copolymer according to claim 3, where the polar solvent is m-cresol. 5. Способ получения полиимидного сополимера по п.3, где реакцию проводят в присутствии катализатора на основе бензойной кислоты.5. The method for producing the polyimide copolymer according to claim 3, wherein the reaction is carried out in the presence of a benzoic acid catalyst. 6. Полиимидный сополимер по п.1, используемый для сцепления с металлической фольгой.6. The polyimide copolymer according to claim 1, used for coupling with a metal foil. 7. Полиимидный сополимер по п.2, используемый для сцепления с металлической фольгой.7. The polyimide copolymer according to claim 2, used for coupling with a metal foil. 8. Металлический ламинат, содержащий металлическую фольгу, уложенную на одну сторону слоя полиимидного сополимера по п.1.8. A metal laminate comprising a metal foil laid on one side of a polyimide copolymer layer according to claim 1. 9. Металлический ламинат, содержащий металлическую фольгу, уложенную на одну сторону слоя полиимидного сополимера по п.2.9. A metal laminate comprising a metal foil laid on one side of a polyimide copolymer layer according to claim 2. 10. Металлический ламинат, содержащий металлическую фольгу, уложенную по обеим сторонам полиимидного сополимера по п.1 соответственно.10. A metal laminate comprising a metal foil laid on both sides of a polyimide copolymer according to claim 1, respectively. 11. Металлический ламинат, содержащий металлическую фольгу, уложенную по обеим сторонам полиимидного сополимера по п.2 соответственно.11. A metal laminate comprising a metal foil laid on both sides of a polyimide copolymer according to claim 2, respectively.
RU2002113088A 1999-10-18 2000-10-11 Polyimide copolymer and metallic laminate comprising thereof RU2238285C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/294691 1999-10-18
JP29469199 1999-10-18

Publications (2)

Publication Number Publication Date
RU2002113088A true RU2002113088A (en) 2003-11-10
RU2238285C2 RU2238285C2 (en) 2004-10-20

Family

ID=17811068

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2002113088A RU2238285C2 (en) 1999-10-18 2000-10-11 Polyimide copolymer and metallic laminate comprising thereof

Country Status (9)

Country Link
US (1) US6489436B1 (en)
EP (1) EP1229081B1 (en)
JP (1) JP4433655B2 (en)
KR (1) KR100556069B1 (en)
CN (2) CN1219808C (en)
DE (1) DE60016963T2 (en)
RU (1) RU2238285C2 (en)
TW (1) TW526223B (en)
WO (1) WO2001029136A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3982296B2 (en) 2002-03-27 2007-09-26 日本メクトロン株式会社 New polyimide copolymer
WO2004018545A1 (en) * 2002-08-20 2004-03-04 Nippon Mektron, Limited Novel polyimide copolymer and metal laminate comprising the same
US7071282B2 (en) * 2003-06-03 2006-07-04 General Electric Company Benzimidazole diamine-based polyetherimide compositions and methods for making them
CN1305933C (en) * 2004-12-07 2007-03-21 长春人造树脂厂股份有限公司 Preparation method of polyimide
JP2010105258A (en) * 2008-10-30 2010-05-13 Unimatec Co Ltd Method of manufacturing tubular polyimide belt
CN102838745B (en) * 2012-09-19 2014-11-26 中国科学院长春应用化学研究所 Preparation method of polyimide foam
CN103992478B (en) * 2014-05-29 2018-09-11 江苏尚莱特医药化工材料有限公司 Heat safe solvable fusible polyimide resin and preparation method thereof
CN104130412B (en) * 2014-07-11 2017-03-08 西南科技大学 A kind of N replaces polybenzimidazoles acid imide and preparation method thereof
JP7079076B2 (en) 2016-08-10 2022-06-01 日鉄ケミカル&マテリアル株式会社 Polyimide precursor and the polyimide resulting from it
CN112679733A (en) * 2020-12-11 2021-04-20 东华大学 Polyimide containing N-substituted bis-benzimidazole and polyimide film, and preparation method and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247165A (en) * 1962-11-15 1966-04-19 Minnesota Mining & Mfg Polyimides
JPS451832B1 (en) * 1966-06-30 1970-01-21
JPH06104542A (en) * 1992-09-17 1994-04-15 Shin Etsu Chem Co Ltd Metal base wiring board
US5290909A (en) * 1993-05-28 1994-03-01 Industrial Technology Research Institute Polyimide composition for polyimide/copper foil laminate
US6355357B1 (en) * 1998-12-21 2002-03-12 Sony Chemicals Corp. Flexible printed board, polyamic acid and polyamic acid varnish containing same
US6133408A (en) * 1999-01-15 2000-10-17 Wirex Corporation Polyimide resin for cast on copper laminate and laminate produced therefrom

Similar Documents

Publication Publication Date Title
RU2002113088A (en) POLYIMIDE COPOLYMER AND METAL LAMINATE CONTAINING IT
KR100963376B1 (en) Method for preparing polyimide and polyimide prepared by the same method
KR100981852B1 (en) Process for production of polyimide film having high adhesiveness
JP6788357B2 (en) Polyimide film, multilayer polyimide film, coverlay, and flexible printed wiring board
JP2006188025A (en) Copper-clad laminate
KR20070034007A (en) Polyimide Laminate and Manufacturing Method Thereof
KR20070037512A (en) Polyimide film having high adhesiveness and method for producing same
JP2000202970A (en) Polyimide-coated film
KR100573514B1 (en) Novel polyimide copolymer and metal laminate comprising the same
JP4009918B2 (en) Polyimide film, method for producing the same, and metal laminate using the same
JP3786157B2 (en) Polyimide film with improved adhesion, process for producing the same, and laminate
KR100673339B1 (en) Roll of metal film/aromatic polyimide film composite web
RU2238285C2 (en) Polyimide copolymer and metallic laminate comprising thereof
JP2004531608A5 (en)
US5578696A (en) Heat resistant adhesive film, an adhesion structure, and method of adhesion
JP2003103738A (en) Multi-layer polyimide film, polyimide laminate and polymer light guide path
JP4974068B2 (en) Polyimide film, method for producing the same, and flexible circuit board
EP1348728A8 (en) Film-formable polyimide copolymer
JP4193461B2 (en) Heat-sealable polyimide and laminate using the polyimide
JPH07278298A (en) Preparation of polyamide acid solution and polyimide
JP2001164006A5 (en)
CN104211881A (en) Organic-inorganic hybrid material film and making method thereof
JP2766640B2 (en) New polyimide copolymer and its production method
CN110756063A (en) Preparation and imidization method of polyimide hollow fiber membrane
KR960017730A (en) Process for preparing soluble polyimide copolymer