RU2001110013A - Low temperature soldering flux - Google Patents
Low temperature soldering fluxInfo
- Publication number
- RU2001110013A RU2001110013A RU2001110013/02A RU2001110013A RU2001110013A RU 2001110013 A RU2001110013 A RU 2001110013A RU 2001110013/02 A RU2001110013/02 A RU 2001110013/02A RU 2001110013 A RU2001110013 A RU 2001110013A RU 2001110013 A RU2001110013 A RU 2001110013A
- Authority
- RU
- Russia
- Prior art keywords
- low temperature
- soldering flux
- temperature soldering
- water
- hydrochloric acid
- Prior art date
Links
- 230000004907 flux Effects 0.000 title claims 2
- 238000005476 soldering Methods 0.000 title 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N HCl Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L Zinc chloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims 2
- 235000019270 ammonium chloride Nutrition 0.000 claims 2
- QDHHCQZDFGDHMP-UHFFFAOYSA-N monochloramine Chemical compound ClN QDHHCQZDFGDHMP-UHFFFAOYSA-N 0.000 claims 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 235000005074 zinc chloride Nutrition 0.000 claims 2
- 239000011592 zinc chloride Substances 0.000 claims 2
- VYWQTJWGWLKBQA-UHFFFAOYSA-N [amino(hydroxy)methylidene]azanium;chloride Chemical compound Cl.NC(N)=O VYWQTJWGWLKBQA-UHFFFAOYSA-N 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 235000011167 hydrochloric acid Nutrition 0.000 claims 1
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2001110013/02A RU2204466C2 (en) | 2001-04-12 | 2001-04-12 | Flux for low-temperature soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2001110013/02A RU2204466C2 (en) | 2001-04-12 | 2001-04-12 | Flux for low-temperature soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2001110013A true RU2001110013A (en) | 2003-05-10 |
| RU2204466C2 RU2204466C2 (en) | 2003-05-20 |
Family
ID=20248411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2001110013/02A RU2204466C2 (en) | 2001-04-12 | 2001-04-12 | Flux for low-temperature soldering |
Country Status (1)
| Country | Link |
|---|---|
| RU (1) | RU2204466C2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104646867A (en) * | 2015-01-30 | 2015-05-27 | 铜陵新鑫焊材有限公司 | Copper gas welding solvent and preparation method thereof |
| CN113681199B (en) * | 2021-07-31 | 2024-01-09 | 浙江大学山东工业技术研究院 | High-performance inorganic soldering flux without strong acid and preparation method thereof |
-
2001
- 2001-04-12 RU RU2001110013/02A patent/RU2204466C2/en not_active IP Right Cessation
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