RU1838361C - Compound and a method of its making - Google Patents

Abstract

Usage: for sealing electronic equipment containing high-voltage functional blocks, rectifiers, stabilizers. SUMMARY OF THE INVENTION: the compound comprises, by weight: oligodienurethane epoxide 90-110; titanium organorganic oligomer (CH3) (CbH5) L-5ON} 4 20-30; iso-methyltetrahydrophthalic anhydride 3-7; ethylene glycol vinyl glycidyl ether 8-12. Prepared by mixing oligodienurethane epoxide with organosilicon oligomer. pre-mixed with ethylene glycol vinyl glycidyl ether, followed by the addition of isomethyltetrahydrophthalic anhydride and evacuation of the resulting composition at 3 ° -EO Cu pressure of 0.6-1.3 kPa, with all of these components being preheated at 80-90 ° C. 2 s.p. crystals, 2 tab. what

Description

The invention relates to the field of producing compounds used for sealing electronic equipment containing parts sensitive to mechanical stress, including high-voltage functional units, rectifiers, stabilizers, operated under severe conditions.

The aim of the invention is to ensure the stability of the duration of the edges of the pulse voltage and increase the electric strength under vacuum conditions, increase elasticity.

This goal is achieved due to the fact that the compound contains, m.h.: oligodienurethaneepoxide - 90-100. organotitanium-silicon oligomer 20-30, isomethyltetrahydrophthalic anhydride - 3-7, ethylene glycol vinyl glycidyl ether - 8-12. .

The method for preparing the compound is based on mixing oligodienurate enepoxide (TU 38 103410-85) and an organotitanium oligomer (TU-6-02-933-74) and heating to 85t5 ° C. holding and evacuating, ethylene glycol vinyl glycidyl ether and organosilicon oligomer are additionally heated), then they are mixed, then this mixture is introduced into oligodienurethane epoxide preheated to 851 5 ° C and mixed.

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after which iso-methyltetrahydrophthalic anhydride, preheated to 35 ± 5 ° C, is introduced into the mixture, mixed, then the mixture is evacuated at a pressure of 0, 3 kPa and a temperature of 15 to 30 minutes and kept for 16 hours.

An unknown combination of TMTT with vinyl glycidyl ether showed mutual affinity and interaction with each other. The resulting product, reacting with PDI, forms a block copolymer of a regular structure from previously known blocks.

The cured block copolymer is a regular mesh structure with a constant cell size, which ensures stable duration of the pulse voltage fronts in high-voltage devices and preserves the electrical strength under vacuum conditions. The high elasticity of the obtained composition led to a decrease in the internal stress of the system and the absence of microcracking, which made it possible to preserve the electric strength under rarefaction conditions.

In the table. Compositions of the invention are shown.

The indicated range is chosen due to the fact that with increasing amounts of titanium of the organosilicon oligomer, the viability of the composition decreases, and with a decrease, the required elasticity is not achieved. With a decrease in vinyl glycidyl ether, the ethylene glycol compound is viscous, the removal of air bubbles is not ensured, with an increase in viability, the elasticity decreases.

With a decrease in isomethyltetrahydrophthalic anhydride, the compound does not cure, and with an increase due to the low viability of the compound, it is impossible to carry out the sealing process.

Compounding Technologies

All components are heated to temperature. Weighed portions of the organosilane titanium oligomer and ethylene glycol vinyl glycidyl ether are thoroughly mixed, then the mixture is introduced into oligodienurethane epoxide and mixed thoroughly. Isomethyltetrahydrophthalic anhydride was added to the mixture, and after thorough mixing, the mixture was evacuated at a pressure of 0.6-1.3 kPa for 30 minutes. The compound is cured at 8515 ° C. for 16 hours

Table 2 shows the comparative properties of the analogue and the claimed compound.

Claims (2)

1. The compound, including oligodien-urethane epoxid, is organosilicon; oligomer of the formula TKtOSKCHaXCeHsJb OH} d, isomethyl tetrahydrophthalic anhydride, characterized in that it further comprises ethylene glycol vinyl glycidyl ether in the following ratio, wt. Oligodienurethaneepoxide 90-100 Organosilicon oligomer of the specified formulas 20-30 iso-methyltetrahydrophthalic anhydride 5 0 5 0 0 5 3-7 8-12 Ethylene glycol viniglycidyl ether, 2. A method of producing a compound by mixing oligodienurethane epoxide with an organotitanium silicone titer of the formula 5 T ((eHzXCbH5) 2-50H} 4 and the subsequent addition of isomethyltetrahydrophthalic anhydride and evacuating the resulting composition at 80-90 ° C and a pressure of 0.6-1 , 3 kPa, due to the fact that the organosilicon oligomer is pre-mixed with ethylene glycol vinyl glycidyl ether, all of these components being preheated at 80-90 ° C. Table 1 table 2