RU173929U1 - COOLING DEVICE FOR HEAT-FUEL ELECTRONIC ELEMENTS - Google Patents

Abstract

The invention relates to devices designed to cool heat-generating electronic elements, including elements of server racks, and can also be used in other electronic devices, including those constructed on the principle of a rack, and to cool any electronic elements that require cooling. A cooling device for heat-generating electronic elements, comprising a cooling circuit in the form of a contour heat pipe, including a radiator in contact with the heat-generating element thermally, an evaporator installed in the base of the radiator, a condenser connected by a steam line and a condensate line to the evaporator, a liquid bus connected to the condenser, and a condenser made in the form of two U-shaped parallel sections of a contour heat pipe finned with radiator bars, thermally detachable in contact with fluid bus using the clamp mechanism, while the clamp mechanism is made in the form of a U-shaped spring element with a condenser of a contour pipe enclosed in it, the spring strips of which are profiled to press the radiator bars of the condenser to the liquid bus, and rulers with holes under the axis and milled samples, welded to the rear wall of the liquid tire, while in the samples of the line spring-loaded cams are made, fixed by axes, interacting with their protrusions as with the ends of the spring strips supper member, and with the outer end face adjacent to the plane of the resilient strips. The technical result consists in ensuring manufacturability, low cost and ease of execution due to the wide use of extruded aluminum profile, providing reliable, simple, automatic thermal contact of the condenser of the contour heat pipe and the liquid bus, which increases the cooling efficiency. 7 c.p. f-ly, 8 ill.

Description

The technical field to which the utility model relates.

The invention relates to devices designed to cool heat-generating electronic elements, including elements of server racks, and can also be used in other electronic devices, including those constructed on the principle of a rack, and to cool any electronic elements that require cooling.

State of the art

Until now, the cooling of the electronic filling of boards, including server racks, is a very big and difficult task. More often it is solved with the help of radiators and air flow created by fans. The severity of the problem is due to the fact that the density of electronic packaging is very high and the volumes of heat output are high. They are suitable for tens of kilowatts despite the fact that the blade height is only 40 mm, and they can be up to 40 pcs in a rack. It's about serial racks.

Typically, small but powerful centrifugal blower fans are installed in the blade. Their number can be from 2 to 4. Radiators are installed on processors and cooled components of the boards and a powerful air stream is driven through them. A powerful flow is needed because the density of the cooling agent, i.e. air is small. It takes up to 7-8 kilowatts of electric power to cool a fully packaged rack.

The heated air is then cooled in the cooling devices built into the racks, or they are cooled with the help of the refrigerated cabinets installed in the room where the racks stand.

The cooling efficiency can be significantly increased, i.e. reduce the cooling power consumption by using a cooling agent with a higher density, such as liquid.

There can be many such agents. The simplest, cheapest and most effective is water.

However, when using liquid as a cooler, a very difficult task arises, how to integrate the liquid as a cooling agent into the electronic infrastructure, including server rack blades.

The prior art solution is based on the use of heat sink modules with its own liquid infrastructure, on the surface of which rectangular recesses are made by milling to arrange contact with electronic components. Moreover, the module itself is made of two parts: the upper and lower, which are connected by vacuum soldering. The electronic boards are mounted on the upper and lower sides of the module, and for the organization of the optimal interface between the surface of the heat sink module and the electronic components there are gaskets made of thermal interface material. The server rack itself, designed for high-performance computing and computer simulation, is already being built from the assembled and prepared for operation heat sink modules. (RU 2522937, G12B 15/00, Н05К 7/20, 07/20/2014).

The disadvantage of this solution is the combination of liquid and electronic circuits in one construct. Any liquid leakage immediately enters the electronic system and destroys it.

Also known from the prior art is the solution US 20130228313 A1, F28D 15/0266, 09/05/2013. This solution describes the design of the cooling device, including elements of the server rack in which the fuel elements are installed, the cooling circuit in the form of a contour heat pipe (CTT ), the evaporator of which is installed in the processor heat sink, is connected to the condenser by means of a steam pipe and a condensate pipe, and the condenser is thermally detachably in contact with the liquid bus.

This solution does not provide reliable, simple, automatic thermal contact of the condenser of the loop heat pipe and the liquid bus, while it is fundamental for the successful functioning of the cooling device.

The closest solution (prototype) is US 20110277967, F28D 15/0266, 11/17/2011. This patent describes the design of a cooling device, including elements of a server rack in which fuel elements are installed, a cooling circuit in the form of a contour heat pipe (CTT ), the evaporator of which is installed in the processor heat sink, is connected to the condenser by means of a steam pipe and a condensate pipe, and the condenser is thermally detachably in contact with the liquid bus.

This solution also does not provide reliable, simple, automatic thermal contact of the condenser of the loop heat pipe and the liquid bus, while it is fundamental for the successful operation of the cooling device, the maximum cooling efficiency is not ensured.

The claimed device eliminates these disadvantages and allows you to achieve the claimed technical result.

Utility Model Disclosure

The technical problem that the proposed solution solves is to configure the device for an extruded profile, to obtain a reliable, simple and efficient cooling device.

The technical result consists in ensuring manufacturability, low cost and ease of execution due to the wide use of extruded aluminum profile, providing reliable, simple, automatic thermal contact of the condenser of the contour heat pipe and the liquid bus, which increases the cooling efficiency.

To solve the problem with the achievement of the claimed technical result, the cooling device of the fuel elements contains a cooling circuit in the form of a contour heat pipe, including a radiator in heat contact with the heat element, an evaporator installed in the base of the radiator, a condenser connected by a steam line and a condensate line to the evaporator, a liquid bus, connected with the capacitor, while the capacitor is made in the form of two U-shaped parallel ribbed radiator bars of the loops of the contour heat pipe, which are detachably thermally in contact with the liquid bus using the clamp mechanism, characterized in that the clamp mechanism is made in the form of a U-shaped spring element with a condenser of the contour pipe enclosed in it, the spring strips of which are profiled to press the radiator bars of the condenser to the liquid the tire, and rulers with holes under the axis and milled samples welded to the rear wall of the liquid tire, while in the samples of the line spring-loaded cams are made, fixing nye axes interacting with their projections both ends of the resilient strips of the spring member, and with the outer end face adjacent to the plane of the resilient strips.

The inner surface of the radiator bars of the condenser is glued with a thermal interface material with a one-sided adhesive layer.

The U-shaped spring element and the radiator bars of the condenser are connected by a pin at the base of the spring element.

The radiator strip is made in the form of an extruded profile with a socket for a condenser tube and a bent thinned tongue attached to the bend.

The liquid tire is equipped with an end splitter with a variable structure.

The spring-loaded cams are made in the form of an extruded profile.

Brief Description of the Drawings

FIG. 1. The scheme of the cooling device.

FIG. 2. Capacitor KTT. View along arrow A.

FIG. 3. Connection of the KTT condenser with radiator bars. View along arrow B.

FIG. 4. The spring element.

FIG. 5. A radiator mounted on a heat sink element.

FIG. 6. The design of the liquid tire.

FIG. 7. Liquid tire with parallel-serial flow structure.

FIG. 8. Liquid bus with parallel-serial flow structure and splitter circuit.

Utility Model Implementation

The device is as follows.

A heat sink 2 is installed on the heat-generating element 1 of the board located in the housing 53 (for example, in the blade housing), for example, a processor 2. A heat exchanger evaporator 3 (KTT) 3 is installed in the base 4 of the heat sink 2 (see FIG. 5).

The evaporator is a tubular body in which a capillary-porous structure is formed, always impregnated with a coolant. When heat is supplied from the base 4 of the radiator, the coolant begins to evaporate, absorbing heat from the base of the radiator and, accordingly, the processor, and the coolant in the form of steam begins to move along the body of the CTT. In the CTT capacitor, it again turns into a liquid.

The CTT condenser, consisting of 2 U-shaped sections 5 of the contour heat pipe, is ribbed by a bar 6, which acts as a radiator (see Fig. 2). The sealing of the condenser in the radiator is shown in FIG. 3. The radiator strip is extruded. The grooves for the radiator tube are already ready in it. To fix the strap, it is necessary to bend the thinned tongue 7 according to FIG. 3.

On the inner plane of the strips 6 glued thermal interface material 8 with a thickness of 0.2 mm The material is glued, since one side of it is made with an adhesive layer. The function of this gasket is to reduce the thermal resistance of the joint and the friction resistance in the joint. Since the material 8 performs an antifriction function, its thickness should be significant, but at the same time minimal, at the level of 0.2 mm. A spring element 9 is put on the radiator bars 6 (see Fig. 4). The spring element consists of two halves connected together by screws 36. The spring strips 10 are slightly curved. Radius grooves 37 mean the beginning of the compression zone of the strips 6. Element 9 is worn on the radiator strips 6 so that the planes 12 of the element 9, entering the space between the elements 7, are in contact with the planes 11 of the radiator strips 6.

Holes 13 are made in the slats 6, holes 14 are made in the spring element 9. After putting the spring element on the radiator bars, they are connected with a pin 15 (see Fig. 1). Using the corners 16 (see. Fig. 4) the entire structure of the radiator CTT is attached to the blade body (see. Fig. 1). The fastening of the CTT radiator to the housing can be carried out using known means, for example, using screws 54.

At the rear of the rack, behind the blade, a fluid bus 17 is installed on the centerline of the CTT capacitors. The number of tires is determined by the heat removed and can range from one to four.

The fluid bus design is shown in FIG. 6. It is a flat pipe 18, consisting of 2 halves connected together. The connection of the halves can be performed by any known method, for example by welding. The ends of the halves are welded into the fitting 19, supplying and discharging coolant, for example, through an external water supply system. Fluid movement is indicated by arrows. It has an opposite direction in the halves to ensure uniform heating of the tire in height. Flat tire halves are extruded aluminum.

A ruler 20 is welded to the rear tire end, a cross-section of which is shown in a top view of BB. The line is also manufactured using aluminum extrusion technology. In the manufacturing line, a through hole 21 is made under the axis 22 (see Fig. 1). In line 20, samples 23 are machined before welding, the ends of which are shown in FIG. 6.

Cams 24 are installed in the sample 23 of the ruler 20 and fixed in it by the axes 22. Each axis 22 is made in half the length of the ruler for ease of installation. The cams thus have a rotational degree of freedom in the horizontal plane, in addition, the ruler 20 and the cam 24 are connected by a tension spring 25 (see Fig. 1). In the absence of a blade in the rack, the position of the cam 24 under the action of the spring 25 is shown by a dashed line.

The cam profile 24 is shown in FIG. 1. It has three characteristic protrusions 26, 27 and 28. The purpose of the protrusion 28 is clear from the figure, put the cam in the position of the dash-dotted line with the blade extended. The protrusion 26 is designed to interact with the end face 29 of the spring element (see Fig. 4) when installing the blade in its slot. The protrusion 27, interacting with the spring strips 10 of the spring element 9, carries out the pressing of the radiator bars 6 to the liquid tire 17.

In this case, the cam profile is also obtained by extruding aluminum in the form of a ruler, which remains to be cut into equal segments.

The fluid bus construct is attached to the rack frame, depending on the rack construct.

Before installing the liquid tire in the rack frame, it is retrofitted with missing elements.

The inner surface of the radiator bars 6 of the condenser is glued with a thermal interface material 8 with a single-sided adhesive layer.

The U-shaped spring element 9 and the radiator bars 6 of the condenser are connected by a pin 15 at the base of the spring element.

The radiator strip 6 is made in the form of an extruded profile with a socket for a condenser tube and a bent thinned tongue 7 attached to the bend.

The liquid tire 17 is equipped with an end splitter with a variable structure.

The spring-loaded cams 24 are made in the form of an extruded profile.

The device operates as follows.

To begin with, liquid tires and CTTs are fully assembled and installed in place. Then they install the blades in their nests and begin to push them all the way. All cams 24 are in the dashed line position. When approaching the standard position, the ends 29 of the spring strips 10 run onto the protrusions 26 of the cams 24 and begin to turn them in the direction of the arrow. Gradually, the protrusions 27 also interact with the strips 10 and begin to straighten them, pressing against the liquid tire. The spring strips 10 transmit their force along the entire length of the radiator bars 6 and press them to the liquid bus through the thermal interface gaskets 8. The maximum pressing force will be in the position shown in FIG. 1. This is the equilibrium position for the cams 24, when the force developed in the spring strips 10 is maximum and is applied to the protrusion 27 in the direction strictly perpendicular to the plane of the spring strips 10.

With the further advancement of the blade to the stop of the protrusion 26 in the ruler 20, the equilibrium position is violated, the direction of the force acting on the spring element 9 from the side of the cam 24 deviates from the perpendicular and a component appears, directed towards the ruler 20, which keeps the blade from self-extension. In this case, the pressing force is slightly reduced, but this decrease is very insignificant and can be neglected.

The thermal interface material of the gasket 8 is made on the basis of graphite, has a very low coefficient of friction and reduces the forces exerted on the blade to extend or push it.

In FIG. 7 shows a liquid tire, which can be made with two rows of rectangular holes, consisting of an extruded pipe 38, inlet and outlet fittings 39 and end caps 40, divided into four sections, where the flow runs in parallel in four channels in one direction and also in four channels back, this is a scheme for uniform heating of the pipe. To reduce the number of inputs and outputs, the bus can be equipped with a splitter (see Fig. 8), consisting of an adapter 41 and halves 42 and 43, organizing a fluid movement system and reducing the number of inputs and outputs to one.

The liquid tire can be made both with conical planes and with perpendicular planes. The internal structure of the pipe is determined by the amount of heat removed, the requirements for a temperature gradient along the pipe, the requirements for hydraulic resistance, the number of inputs and outputs, mechanical strength, manufacturing technology, etc.

In general, evaluating the claimed solution, we can note its manufacturability, low cost and ease of execution due to the wide use of extruded aluminum profile, providing reliable, simple, automatic thermal contact of the condenser of the contour heat pipe and the liquid bus, which increases the heat sink efficiency, the liquid and electronic are separated in space part of the internal contents of the rack, the widest possible universalization is achieved, providing cooling of the components of any board, provides enhanced convenience of maintenance, prevention and repair.

Claims (8)

1. The cooling device of the heat-generating electronic elements, containing a cooling circuit in the form of a contour heat pipe, including a radiator in contact with the heat-generating element thermally, an evaporator installed in the base of the radiator, a condenser connected by a steam line and a condensate line to the evaporator, a liquid bus connected to the condenser, when this condenser is made in the form of two U-shaped parallel sections of a contour heat pipe finned with radiator strips, thermally detachable contacting with a liquid bus using the clamp mechanism, characterized in that the clamp mechanism is made in the form of a U-shaped spring element with a condenser of a contour pipe enclosed in it, the spring strips of which are shaped to press the radiator bars of the condenser to the liquid bus, and rulers with holes for the axis and milled samples welded to the rear wall of the liquid tire, while in the samples of the line spring-loaded cams are made, fixed by axes, interacting with their protrusions as with the ends of the springs scaffold strips of the spring element, and with the outer plane of the spring strips adjacent to the end face. 2. The cooling device according to claim 1, characterized in that the inner surface of the radiator bars of the condenser is glued with a thermo-interface material with a one-sided sticky layer. 3. The cooling device according to claim 1, characterized in that the U-shaped spring element and the radiator bars of the condenser are connected by a pin at the base of the spring element. 4. The cooling device according to claim 1, characterized in that the radiator strip is made in the form of an extruded profile with a socket for a condenser tube and a bent thinned tongue attached to it. 5. The cooling device according to claim 1, characterized in that the liquid tire is equipped with an end splitter with a variable structure. 6. The cooling device according to claim 1, characterized in that the liquid tire is made of extruded aluminum. 7. The cooling device according to claim 1, characterized in that the ruler is made of extruded aluminum. 8. The cooling device according to claim 1, characterized in that the spring-loaded cams are made in the form of an extruded profile.

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