PT3618993T - Dispositivo de soldadura por brasagem e processo para realização de uma união de soldadura por brasagem em componentes, mediante utilização de materiais de aderência para a união provisória dos componentes - Google Patents
Dispositivo de soldadura por brasagem e processo para realização de uma união de soldadura por brasagem em componentes, mediante utilização de materiais de aderência para a união provisória dos componentesInfo
- Publication number
- PT3618993T PT3618993T PT187229927T PT18722992T PT3618993T PT 3618993 T PT3618993 T PT 3618993T PT 187229927 T PT187229927 T PT 187229927T PT 18722992 T PT18722992 T PT 18722992T PT 3618993 T PT3618993 T PT 3618993T
- Authority
- PT
- Portugal
- Prior art keywords
- components
- connection
- producing
- adhesive material
- soldering device
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017109747.3A DE102017109747A1 (de) | 2017-05-05 | 2017-05-05 | Verfahren zum Herstellen einer Lötverbindung |
DE202017105174 | 2017-08-28 |
Publications (1)
Publication Number | Publication Date |
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PT3618993T true PT3618993T (pt) | 2021-09-07 |
Family
ID=62116885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT187229927T PT3618993T (pt) | 2017-05-05 | 2018-05-07 | Dispositivo de soldadura por brasagem e processo para realização de uma união de soldadura por brasagem em componentes, mediante utilização de materiais de aderência para a união provisória dos componentes |
Country Status (12)
Country | Link |
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US (1) | US11491567B2 (pt) |
EP (1) | EP3618993B1 (pt) |
KR (1) | KR102227913B1 (pt) |
CN (1) | CN110678288B (pt) |
CA (1) | CA3060017C (pt) |
ES (1) | ES2886212T3 (pt) |
HU (1) | HUE056153T2 (pt) |
MY (1) | MY190675A (pt) |
PT (1) | PT3618993T (pt) |
RU (1) | RU2743182C1 (pt) |
SG (1) | SG11201909928PA (pt) |
WO (1) | WO2018202919A1 (pt) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10763193B2 (en) * | 2018-10-30 | 2020-09-01 | Hamilton Sundstrand Corporation | Power control modules |
DE102019213511A1 (de) * | 2019-09-05 | 2021-03-11 | Rehm Thermal Systems Gmbh | Reflow-Lötanlage zum kombinierten Konvektionslöten und Kondensationslöten |
CN110756943A (zh) * | 2019-09-20 | 2020-02-07 | 西安中车永电电气有限公司 | 一种提高焊接质量的底板结构及其焊接方法 |
CN111843085B (zh) * | 2020-09-07 | 2024-03-12 | 贵州永红散热器有限责任公司 | 一种提高管嘴与筋板翻边孔焊合率的方法及工装 |
Family Cites Families (21)
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US4801069A (en) * | 1987-03-30 | 1989-01-31 | Westinghouse Electric Corp. | Method and apparatus for solder deposition |
US5175410A (en) * | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | IC package hold-down fixture |
JP2854782B2 (ja) * | 1993-05-12 | 1999-02-03 | 株式会社日立製作所 | 電子部品の固定方法、回路基板の製造方法及び回路基板 |
DE4416539C1 (de) * | 1994-05-10 | 1995-07-20 | Emitec Emissionstechnologie | Verfahren zum Beloten von metallischen Strukturen mit einem reversibel unterschiedliche Zustände aufweisenden Haftmaterial |
US5881453A (en) * | 1994-05-17 | 1999-03-16 | Tandem Computers, Incorporated | Method for mounting surface mount devices to a circuit board |
JP3397313B2 (ja) * | 1999-12-20 | 2003-04-14 | 富士通株式会社 | 半導体装置の製造方法及び電子部品の実装方法 |
DE102004058285A1 (de) * | 2004-12-02 | 2006-06-08 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verbindungsmaterial zum Positionieren von Lotmaterial, Verfahren zur Herstellung eines Wabenkörpers und entsprechender Wabenkörper |
US20090085227A1 (en) * | 2005-05-17 | 2009-04-02 | Matsushita Electric Industrial Co., Ltd. | Flip-chip mounting body and flip-chip mounting method |
JP4864591B2 (ja) * | 2006-08-08 | 2012-02-01 | 神港精機株式会社 | はんだ付け方法およびはんだ付け装置 |
US20080173700A1 (en) * | 2007-01-22 | 2008-07-24 | Mehlin Dean Matthews | System and method for solder bonding |
JP5242200B2 (ja) * | 2008-03-13 | 2013-07-24 | 日本碍子株式会社 | 異種材料接合体の製造方法 |
JP5378078B2 (ja) * | 2009-06-19 | 2013-12-25 | 株式会社東芝 | 半導体装置の製造方法 |
JP5424201B2 (ja) * | 2009-08-27 | 2014-02-26 | アユミ工業株式会社 | 加熱溶融処理装置および加熱溶融処理方法 |
JP5807221B2 (ja) * | 2010-06-28 | 2015-11-10 | アユミ工業株式会社 | 接合構造体製造方法および加熱溶融処理方法ならびにこれらのシステム |
US8603860B2 (en) * | 2011-10-24 | 2013-12-10 | Taiwan Semiconductor Manufacturing Company, L.L.C. | Process for forming packages |
US8684256B2 (en) | 2011-11-30 | 2014-04-01 | Component Re-Engineering Company, Inc. | Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing |
CN104148759A (zh) * | 2014-08-07 | 2014-11-19 | 托伦斯精密机械(上海)有限公司 | 真空钎焊方法 |
CA2967727C (en) | 2014-12-09 | 2019-05-28 | Pink Gmbh Thermosysteme | Heat transfer device for producing a soldered connection of electrical components |
EP3095544B1 (de) * | 2015-05-21 | 2018-09-19 | Airbus Defence and Space GmbH | Verfahren zum verbinden von teilen aus schwer lötbaren materialien |
EP3357629B1 (en) * | 2015-09-30 | 2021-01-27 | Origin Company, Limited | Solder paste for reduction gas, and method for producing soldered product |
US10842300B2 (en) * | 2018-04-19 | 2020-11-24 | Carl Reid | Mountable container |
-
2018
- 2018-05-07 KR KR1020197036021A patent/KR102227913B1/ko active IP Right Grant
- 2018-05-07 WO PCT/EP2018/061727 patent/WO2018202919A1/de active Application Filing
- 2018-05-07 CN CN201880029659.6A patent/CN110678288B/zh active Active
- 2018-05-07 US US16/610,966 patent/US11491567B2/en active Active
- 2018-05-07 HU HUE18722992A patent/HUE056153T2/hu unknown
- 2018-05-07 EP EP18722992.7A patent/EP3618993B1/de active Active
- 2018-05-07 ES ES18722992T patent/ES2886212T3/es active Active
- 2018-05-07 CA CA3060017A patent/CA3060017C/en active Active
- 2018-05-07 SG SG11201909928P patent/SG11201909928PA/en unknown
- 2018-05-07 MY MYPI2019006103A patent/MY190675A/en unknown
- 2018-05-07 RU RU2019134659A patent/RU2743182C1/ru active
- 2018-05-07 PT PT187229927T patent/PT3618993T/pt unknown
Also Published As
Publication number | Publication date |
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CN110678288B (zh) | 2021-11-26 |
KR102227913B1 (ko) | 2021-03-17 |
CN110678288A (zh) | 2020-01-10 |
KR20200004375A (ko) | 2020-01-13 |
CA3060017C (en) | 2021-10-19 |
US11491567B2 (en) | 2022-11-08 |
RU2743182C1 (ru) | 2021-02-15 |
SG11201909928PA (en) | 2019-11-28 |
MY190675A (en) | 2022-05-10 |
HUE056153T2 (hu) | 2022-01-28 |
WO2018202919A1 (de) | 2018-11-08 |
EP3618993B1 (de) | 2021-07-07 |
US20200101549A1 (en) | 2020-04-02 |
EP3618993A1 (de) | 2020-03-11 |
CA3060017A1 (en) | 2018-11-08 |
ES2886212T3 (es) | 2021-12-16 |
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