PT2136958T - Processo e máquina para o processamento de peças de trabalho - Google Patents
Processo e máquina para o processamento de peças de trabalhoInfo
- Publication number
- PT2136958T PT2136958T PT87165759T PT08716575T PT2136958T PT 2136958 T PT2136958 T PT 2136958T PT 87165759 T PT87165759 T PT 87165759T PT 08716575 T PT08716575 T PT 08716575T PT 2136958 T PT2136958 T PT 2136958T
- Authority
- PT
- Portugal
- Prior art keywords
- workpiece
- machining
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007012816A DE102007012816B4 (de) | 2007-03-16 | 2007-03-16 | Verfahren und Vorrichtung zur Werkstückbearbeitung |
Publications (1)
Publication Number | Publication Date |
---|---|
PT2136958T true PT2136958T (pt) | 2016-10-12 |
Family
ID=39608225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT87165759T PT2136958T (pt) | 2007-03-16 | 2008-03-17 | Processo e máquina para o processamento de peças de trabalho |
Country Status (6)
Country | Link |
---|---|
US (1) | US8525076B2 (pt) |
EP (1) | EP2136958B1 (pt) |
JP (1) | JP5666141B2 (pt) |
DE (1) | DE102007012816B4 (pt) |
PT (1) | PT2136958T (pt) |
WO (1) | WO2008113535A1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2760161A1 (en) * | 2009-04-27 | 2010-11-04 | Echelon Laser Systems, Lp | Staggered laser-etch line graphic system, method and articles of manufacture |
DE102009044316B4 (de) * | 2009-10-22 | 2015-04-30 | Ewag Ag | Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens |
DE102010011508B4 (de) * | 2010-03-15 | 2015-12-10 | Ewag Ag | Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung |
DE102011106097B4 (de) * | 2011-06-09 | 2017-02-16 | Cero Gmbh | Verfahren und Vorrichtung zum Bearbeiten eines Werkstückes |
DE102013217783A1 (de) * | 2013-09-05 | 2015-03-05 | Sauer Gmbh Lasertec | Verfahren zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, Laserwerkzeug, Lasermaschine, Maschinensteuerung |
KR20190052516A (ko) * | 2017-11-08 | 2019-05-16 | 삼성전자주식회사 | 표면 검사 장치 |
WO2021130962A1 (ja) * | 2019-12-26 | 2021-07-01 | 株式会社ニコン | ビーム加工装置 |
DE102023109575B3 (de) | 2023-04-17 | 2024-04-11 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Erstellen einer aus Musterpunkten bestehenden Musterfigur in einem Werkstück, Bearbeitungsvorrichtung sowie Computerprogrammprodukt |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749840A (en) * | 1986-05-16 | 1988-06-07 | Image Micro Systems, Inc. | Intense laser irradiation using reflective optics |
US4801352A (en) * | 1986-12-30 | 1989-01-31 | Image Micro Systems, Inc. | Flowing gas seal enclosure for processing workpiece surface with controlled gas environment and intense laser irradiation |
US4904340A (en) * | 1988-10-31 | 1990-02-27 | Microelectronics And Computer Technology Corporation | Laser-assisted liquid-phase etching of copper conductors |
DE3916264A1 (de) * | 1989-05-18 | 1990-11-22 | Diehl Gmbh & Co | Einrichtung zur strahlfuehrung bei der laser-werkstueckbearbeitung |
ES2054166T3 (es) * | 1989-07-14 | 1994-08-01 | Maho Ag | Procedimiento y maquina herramienta para producir espacios huecos en piezas macizas por medio de rayo laser. |
US5225650A (en) * | 1989-07-14 | 1993-07-06 | Maho Aktiengesellschaft | Process and device for the manufacture of cavities in workpieces through laser beams |
US5262613A (en) * | 1991-09-24 | 1993-11-16 | General Laser, Inc. | Laser retrofit for mechanical engravers |
US5368900A (en) * | 1991-11-04 | 1994-11-29 | Motorola, Inc. | Multistep laser ablation method for making optical waveguide reflector |
DE4209933C2 (de) * | 1992-03-27 | 1994-08-11 | Foba Formenbau Gmbh | Verfahren für den Formabtrag an einem Werkstück durch Laserstrahlverdampfung des Werkstoffes mit einem cw-Nd:YAG-Laser |
US5546187A (en) * | 1995-03-15 | 1996-08-13 | Hughes Aircraft Company | Self-referencing laser-based ultrasonic wave receiver |
US6156220A (en) * | 1997-03-10 | 2000-12-05 | Ohlig; Albert H. | System and method for optically aligning films and substrates used in printed circuit boards |
EP1117503B1 (de) * | 1998-09-30 | 2003-11-26 | Lasertec GmbH | Verfahren und vorrichtung zur materialabtragung aus einer fläche eines werkstücks |
DE10032981A1 (de) * | 2000-07-10 | 2002-01-24 | Alltec Angewandte Laser Licht | Verfahren zur Materialbearbeitung mittels Laser |
DE10317822B4 (de) * | 2003-04-16 | 2005-04-14 | Concept Laser Gmbh | Verfahren zum flächigen, schichtweisen Abtragen von Materialbereichen eines Werkstückes |
JP4527003B2 (ja) * | 2005-05-24 | 2010-08-18 | 三菱電機株式会社 | レーザ加工装置 |
JP4392388B2 (ja) * | 2005-06-20 | 2009-12-24 | 日立ビアメカニクス株式会社 | 穴明け方法及び穴明け装置 |
JP4711774B2 (ja) * | 2005-08-09 | 2011-06-29 | 日立ビアメカニクス株式会社 | 平板状ワークの加工方法 |
-
2007
- 2007-03-16 DE DE102007012816A patent/DE102007012816B4/de active Active
-
2008
- 2008-03-17 US US12/531,587 patent/US8525076B2/en active Active
- 2008-03-17 JP JP2009553960A patent/JP5666141B2/ja not_active Expired - Fee Related
- 2008-03-17 WO PCT/EP2008/002105 patent/WO2008113535A1/de active Application Filing
- 2008-03-17 PT PT87165759T patent/PT2136958T/pt unknown
- 2008-03-17 EP EP08716575.9A patent/EP2136958B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP2136958B1 (de) | 2016-07-06 |
DE102007012816B4 (de) | 2009-12-03 |
WO2008113535A1 (de) | 2008-09-25 |
JP5666141B2 (ja) | 2015-02-12 |
DE102007012816A1 (de) | 2008-09-18 |
EP2136958A1 (de) | 2009-12-30 |
US8525076B2 (en) | 2013-09-03 |
US20100147815A1 (en) | 2010-06-17 |
JP2010521314A (ja) | 2010-06-24 |
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