PL89909B1 - - Google Patents
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- PL89909B1 PL89909B1 PL17339974A PL17339974A PL89909B1 PL 89909 B1 PL89909 B1 PL 89909B1 PL 17339974 A PL17339974 A PL 17339974A PL 17339974 A PL17339974 A PL 17339974A PL 89909 B1 PL89909 B1 PL 89909B1
- Authority
- PL
- Poland
- Prior art keywords
- bath
- nickel
- boron
- ammonium
- alkali metal
- Prior art date
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 8
- 229910052783 alkali metal Inorganic materials 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 150000001340 alkali metals Chemical class 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- AUTNMGCKBXKHNV-UHFFFAOYSA-P diazanium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [NH4+].[NH4+].O1B([O-])OB2OB([O-])OB1O2 AUTNMGCKBXKHNV-UHFFFAOYSA-P 0.000 claims description 5
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 239000000615 nonconductor Substances 0.000 claims description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 claims 1
- 230000000536 complexating effect Effects 0.000 claims 1
- 229910021653 sulphate ion Inorganic materials 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 150000002927 oxygen compounds Chemical class 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- 239000001509 sodium citrate Substances 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- XXSPKSHUSWQAIZ-UHFFFAOYSA-L 36026-88-7 Chemical compound [Ni+2].[O-]P=O.[O-]P=O XXSPKSHUSWQAIZ-UHFFFAOYSA-L 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- -1 alkali metal tetraborate Chemical class 0.000 description 1
- 230000003113 alkalizing effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical class [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- NVIFVTYDZMXWGX-UHFFFAOYSA-N sodium metaborate Chemical compound [Na+].[O-]B=O NVIFVTYDZMXWGX-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Description
Przedmiotem wynalazku jest kapiel do chemicznego niklowania, zwlaszcza nieprzewodników elektrycznosci, W procesie pokrywania wyrobów z tworzyw sztucznych i innych nieprzewodzacych pradu elektrycznego materialów stosuje sie nakladanie wstepnej warstwy metalu z kapieli nieelektrolitycznych. Zazwyczaj w takim przypadku stosuje sie chemiczne miedziowanie lub chemiczne niklowanie. Kapiele do chemicznego niklowania w stosunku do kapieli do chemicznego miedziowania wykazuja te zalete, ze sa bardziej trwale, a powloka z nich otrzymana jest mniej podatna na utlenianie, co umozliwia miedzy innymi przerwy w procesie produkcyjnym bez pózniejszych zaklócen.Przy niklowaniu wyrobów z tworzyw sztucznych nalezy stosowac mozliwie niskie temperatury w celu zapobiezenia ewentualnym odksztalceniom wyrobów pod wplywem podwyzszonej temperatury. ¦ Znane kapiele do chemicznego niklowania pracuja zazwyczaj w temperaturze 80 do 97 C, która stwarza ryzyko odksztalcania sie wyrobów.Znane sa równiez kapiele pracujace w nizszych temperaturach, które jednak wykazuja te wade, ze otrzymywane z nich powloki niklowe sa ciemne, niekiedy czarne, wskutek obecnosci wtracen tlenków niklu w powloce. Obecnosc tych wtracen pogarsza przewodnictwo elektryczne powloki, co w pewnym stopniu utrudnia jej pogrubianie na drodze elektrolitycznej, a ponadto wtracenia takie mechanicznie oslbiaja powloke, co objawia sie zmniejszeniem przyczepnosci powloki do podloza. Dla unikniecia tego niekorzystnego zjawiska do kapieli dodaje sie kwas borowy lub czteroboran metali alkalicznych, na przyklad Na2 B407.1QHa0. W wyniku przeprowadzonych prac stwierdzono, ze wspomniane wyzej korzystne dzialanie wywieraja równiez metaborany metali alkalicznych i amonu, jak równiez czteroboran amonowy. » Przedmiotem wynalazku jest kapiel do bezpradowego niklowania, zwlaszcza nieprzewodników elektrycz¬ nosci w której sklad wchodza chlorek albo siarczan niklawy, zwiazek kompleksujacy, podfosfóryn metalu alkalicznego lub niklawy, i zwiazki alkalizujace. Jako zwiazek kompleksujacy stosuje sie sole kwasu cytrynowego.Kapiel wedlug wynalazku charakteryzuje sie, tym, ze zawiera równiez rozpuszczalny w wodzie tlenowy zwiazek boru, nie wykazujacy zdolnosci redukdyjnjnych, przy czym stosunek ilosciowy boru do niklu2 89909 znajdujacych sie kapieli, i - iony w gramoatomach jest zawarty w granicach 0,005 do 3,5, zas bezwzgledna stezenie boru jako pierwiastka zawarte jest w granicach od 0,01 do 2 g w jednym litrze kapieli. Tlenowe zwiazki boru rozpuszczalne w wodzie i nie wykazujace wlasnosci redukcyjnych stanowia zwiazki takie jak meta-borany metali alkalicznych i amonu oraz czteroboran amonowy. « v . "..-' Stwierdzono, ze dodatek metaboranów metali alkalicznych lub among lub czteroboranu amonowego do kapieli zawierajacej sól niklawa jako zródlo niklu, kwas cytrynowy albo cytryniany oraz podfosforyny jako reduktor, umozliwia otrzymywanie jasnych powlok niklowych, bez wtracen tlenkowych; w czasie'okolo 10% krótszym w porównaniu z kapiela bez tego dodatku. « Przyklad I. Sporzadzono kapiel przez rozpuszczenie 50 g chlorku niklawego uwodnionego, 30 g podfosforynu sodowego, 100 g cytrynianu sodowego, 50 g chlorku amonowego I 5 g meta—boranu sodowego\ dopehiono woda do jednego litra i doprowadzono do pl-1^8,5. < W kapieli tej w temperaturze 40°C otrzymano matowe, jasne powloki niklowe na przedmiotach nie przewodzacych pradu elektrycznego, których powierzchnie uprzednio przygotowano w znany sposób, na przyklad przez uczulenie w roztworze chlorku cynawego i zaktywowaniu w roztworze soli palladawych. « Przyklad II. Sporzadzono kapiel, przez rozpuszczenie 50 g chlorku niklawego uwodnionego, 30 g podfosforynu sodowego, 100 g cytrynianu sodowego, 50 g chlorku amonowego i 6 g cztero-boranu amonowego, dopelniono woda do jednego litra i doprowadzono do pH=8,5. Podobnie jak w przykladzie pierwszym, otrzymano równiez matowe, jasne powloki niklowe na przedmiotach z tworzyw sztucznych, których powierz¬ chnie uprzednio przygotowano w znany sposób. ' PLThe subject of the invention is a bath for chemical nickel plating, especially of electric non-conductors. In the process of coating plastic products and other electrically non-conductive materials, a preliminary metal layer from non-electrolytic baths is applied. Typically, in this case, chemical copper plating or chemical nickel plating is used. Chemical nickel plating baths in relation to chemical copper plating baths show the advantage that they are more durable, and the coating obtained from them is less susceptible to oxidation, which allows inter alia interruptions in the production process without further disturbances. use as low temperatures as possible in order to prevent possible deformation of products under the influence of increased temperature. ¦ Known chemical nickel plating baths usually operate at a temperature of 80 to 97 ° C, which poses a risk of deformation of the products. There are also baths operating at lower temperatures, which, however, show the disadvantage that the nickel coatings obtained from them are dark, sometimes black, due to the presence of inclusions of nickel oxides in the coating. The presence of these inclusions deteriorates the electrical conductivity of the coating, which to some extent makes it difficult to thicken it by electrolytic means, and moreover, such inclusions mechanically weaken the coating, which results in a reduction in the adhesion of the coating to the substrate. To avoid this unfavorable effect, boric acid or alkali metal tetraborate, for example Na2 B407.1QHa0, is added to the bath. As a result of the conducted research, it was found that the above-mentioned beneficial effects are also exerted by alkali metals and ammonium metaborates, as well as ammonium tetraborate. The subject of the invention is a bath for electroless nickel plating, in particular of electroconductors, in which the composition includes nickel chloride or sulfate, a complexing agent, alkali metal or nickel hypophosphite, and alkalizing compounds. The salt of citric acid is used as a complexing agent. The bath according to the invention is characterized by the fact that it also contains a water-soluble oxygen compound of boron, which does not show any reductive properties, the quantitative ratio of boron to nickel2 89909 found in the bath, and - ith in gram atoms is from 0.005 to 3.5, and the absolute concentration of boron as an element is from 0.01 to 2 g in one liter of bath. Oxygen compounds of boron, soluble in water and not showing reductive properties, are compounds such as alkali metal and ammonium meta-borates and ammonium tetraborate. «V. "..- 'It was found that the addition of alkali metal metaborates or among or ammonium tetraborate to a bath containing nickel salt as a source of nickel, citric acid or citrates and hypophosphite as a reducing agent, makes it possible to obtain bright nickel coatings, without oxidation inclusions; % shorter than the bath without this additive. "Example I. A bath was made by dissolving 50 g of hydrated nickel chloride, 30 g of sodium hypophosphite, 100 g of sodium citrate, 50 g of ammonium chloride and 5 g of sodium meta-borate, water was taken up to one liter and brought to pl-1 ^ 8.5. <In this bath at a temperature of 40 ° C matte, bright nickel coatings were obtained on non-conductive objects, the surfaces of which were previously prepared in a known manner, for example by sensitization in stannous chloride solution and activation in a palladium salt solution. "Example II. A bath was made by dissolving 50 g of hydrated nickel chloride, 3 0 g of sodium hypophosphite, 100 g of sodium citrate, 50 g of ammonium chloride and 6 g of ammonium tetraborate, made up to one liter with water and adjusted to pH 8.5. As in the first example, also matte, bright nickel coatings were obtained on plastic objects, the surfaces of which were previously prepared in a known manner. 'PL
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL17339974A PL89909B1 (en) | 1974-08-12 | 1974-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL17339974A PL89909B1 (en) | 1974-08-12 | 1974-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL89909B1 true PL89909B1 (en) | 1976-12-31 |
Family
ID=19968583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL17339974A PL89909B1 (en) | 1974-08-12 | 1974-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL89909B1 (en) |
-
1974
- 1974-08-12 PL PL17339974A patent/PL89909B1/pl unknown
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