PL82483B2 - - Google Patents
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- Publication number
- PL82483B2 PL82483B2 PL15982772A PL15982772A PL82483B2 PL 82483 B2 PL82483 B2 PL 82483B2 PL 15982772 A PL15982772 A PL 15982772A PL 15982772 A PL15982772 A PL 15982772A PL 82483 B2 PL82483 B2 PL 82483B2
- Authority
- PL
- Poland
- Prior art keywords
- bath
- amount
- copper plating
- sulfate
- brightening
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 8
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 7
- 238000005282 brightening Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 235000013024 sodium fluoride Nutrition 0.000 claims description 4
- 239000011775 sodium fluoride Substances 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 229910021653 sulphate ion Inorganic materials 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 0.4 g / l Chemical compound 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- MMCPOSDMTGQNKG-UJZMCJRSSA-N aniline;hydrochloride Chemical compound Cl.N[14C]1=[14CH][14CH]=[14CH][14CH]=[14CH]1 MMCPOSDMTGQNKG-UJZMCJRSSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000001011 safranin dye Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
Pierwszenstwo: Zgloszenie ogloszono: 30.05.1973 Opis patentowy opublikowano: 25.11.1975 82483 KI. 48a,5/18 MKP- C23b 5/18 CZYTELNIA Urzedu PaUKno-^ego Twórcy wynalazku; Maria Swierkowska-Lis, Jerzy Psikus, Zygmunt Kapusta Uprawniony z patentu tymczasowego: Mera-ZAP Zaklady Automatyki Przemyslowej im. Juliana Marchlewskiego, Ostrów Wielkopolski, (Polska) Kapiel siarczanowa do miedziowania z polyskiem o dzialaniu wyblyszczajacym Przedmiotem wynalazku jest kapiel siarczanowa do miedziowania z polyskiem o dzialaniu wyblyszczaja¬ cym.Znane kapiele siarczanowe do galwanicznego miedziowania z polyskiem o dzialaniu wyblyszczajacym zawieraja wodne roztwory siarczanu miedziowego, kwasu siarkowego i fluorku sodowego oraz jako dodatki blaskotwórcze tiomocznik i jego pochodne, chlorowodorek aniliny, melasa, barwniki safraninowe, pirydyne.Wada tych kapieli jest mala zdolnosc wyrównywania podloza i przede wszystkim brak plastycznosci powloki.Inna wada tych kapieli jest duza ilosc i róznorodnosc substancji blaskotwórczych, które dodawane systema¬ tycznie w czasie pracy utrudniaja jej kontrole analityczna.Celem wynalazku jest usuniecie tych wad i niedogodnosci. Zadanie techniczne prowadzace do osiagniecia tego celu polega na opracowaniu skladu takiej kapieli z mala iloscia substancji blaskotwórczych, która przy wysokim polysku zapewni duza plastycznosc powloki miedziowej.Istota wynalazku jest kapiel siarczanowa do miedziowania z polyskiem o dzialaniu wyblyszczajacym, która oprócz znanych skladników jak: siarczan miedziowy, kwas siarkowy i fluorek sodowy zawiera jako dodatki blaskotwórcze jednoczesnie trójetanoloamine w ilosci 0,2-0,5 g/l i tiomocznik w ilosci 0,01 -0,03 g/l.Zaleta kapieli wedlug wynalazku jest uzyskanie pokrycia blyszczacego o duzej plastycznosci i gladkosci lepszej od podloza. Dalsza zaleta tej kapieli jest mala ilosc i róznorodnosc substancji blaskotwórczych oraz ich latwosc dozowania. Kapiel ta pozwala na pokrywanie przedmiotów w granicach gestosci pradu od 3 do 10 A/dcm2, co w efekcie daje zwiekszenie wydajnosci procesu.Przyklad. Kapiel siarczanowa do miedziowania z polyskiem zawiera w dowolnej kolejnosci: siarczan miedziowy w ilosci 250,0 g/l kwassiarkowy 60,0g/l fluoreksodowy 5,0 g/l oraz dodatki blaskotwórcze: trójetanoloamina wilosci 0,4 g/l tiomocznik 0,01 g/l2 82483 Warunki pracy kapieli: Temperatura 22° C Gestosc pradu katodowego 8 A/dcm2 Proces miedziowania przeprowadza sie przy pomocy ruchomej katody. Przy miedziowaniu elementów stalowych nalezy uprzednio nalozyc powloke niklowa lub miedziowa z kapieli cyjankalicznej o grubosci 0,5-2,0 mikronów. PL PLPriority: Application announced: May 30, 1973 Patent description was published: November 25, 1975 82483 KI. 48a, 5/18 MKP- C23b 5/18 READING ROOM OF THE PAUKno's Office of the Inventor; Maria Swierkowska-Lis, Jerzy Psikus, Zygmunt Kapusta The holder of a temporary patent: Mera-ZAP Zaklady Automatyki Przemysłowej im. Juliana Marchlewski, Ostrów Wielkopolski, (Poland) Sulfate bath for copper plating with a polishing effect The subject of the invention is a sulfate bath for copper plating with a polishing effect with a polishing effect. Known sulfate baths for electroplating copper plating with a polishing effect of copper sulphate contain aqueous solutions, sulfuric acid and sodium fluoride and as brightening additives thiourea and its derivatives, aniline hydrochloride, molasses, safranin dyes, pyridines. The disadvantage of these baths is the low ability to level the base and, above all, the lack of plasticity of the coating. Another disadvantage of these baths is the large amount and variety of brightening substances which are added systematically during the work, make it difficult to control analytically. The object of the invention is to eliminate these drawbacks and inconveniences. The technical task leading to the achievement of this goal is to develop the composition of such a bath with a small amount of brightening substances, which, with a high gloss, will ensure high plasticity of the copper coating. The essence of the invention is a sulfate bath for copper plating with a polishing effect, which, in addition to the known ingredients such as: copper sulfate , sulfuric acid and sodium fluoride also contain triethanolamine in the amount of 0.2-0.5 g / l and thiourea in the amount of 0.01-0.03 g / l as brightening additives. The advantage of the bath according to the invention is to obtain a glossy coating with high plasticity and better than the ground. A further advantage of this bath is the small amount and variety of brightening substances and their easy dosing. This bath allows you to cover objects within the current density from 3 to 10 A / dcm2, which in turn increases the efficiency of the process. Sulfate bath for copper plating with gloss contains in any order: cupric sulfate in the amount of 250.0 g / l, acid sulfur 60.0 g / l, sodium fluoride 5.0 g / l and brightening additives: triethanolamine, 0.4 g / l, thiourea 0.01 g / l2 82483 Operating conditions of the bath: Temperature 22 ° C Cathode current density 8 A / dcm2 The copper plating process is carried out using a moving cathode. When coppering steel elements, a nickel or copper coating with a cyanide bath with a thickness of 0.5-2.0 microns should be applied first. PL PL
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL15982772A PL82483B2 (en) | 1972-12-28 | 1972-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL15982772A PL82483B2 (en) | 1972-12-28 | 1972-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL82483B2 true PL82483B2 (en) | 1975-10-31 |
Family
ID=19961152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL15982772A PL82483B2 (en) | 1972-12-28 | 1972-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL82483B2 (en) |
-
1972
- 1972-12-28 PL PL15982772A patent/PL82483B2/pl unknown
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