PL64595Y1 - Reinforced chipboard - Google Patents

Reinforced chipboard

Info

Publication number
PL64595Y1
PL64595Y1 PL116970U PL11697007U PL64595Y1 PL 64595 Y1 PL64595 Y1 PL 64595Y1 PL 116970 U PL116970 U PL 116970U PL 11697007 U PL11697007 U PL 11697007U PL 64595 Y1 PL64595 Y1 PL 64595Y1
Authority
PL
Poland
Prior art keywords
layers
reinforced
chipboard
chips
glass fiber
Prior art date
Application number
PL116970U
Other languages
Polish (pl)
Other versions
PL116970U1 (en
Inventor
Piotr Borysiuk
Marek Jabłoński
Aleksander Zado
Marcin Zbieć
Original Assignee
Szko & Lstrok A G & Lstrok Own
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Szko & Lstrok A G & Lstrok Own filed Critical Szko & Lstrok A G & Lstrok Own
Priority to PL116970U priority Critical patent/PL64595Y1/en
Publication of PL116970U1 publication Critical patent/PL116970U1/en
Publication of PL64595Y1 publication Critical patent/PL64595Y1/en

Links

Landscapes

  • Laminated Bodies (AREA)

Description

Opis wzoru Przedmiotem wzoru u zytkowego jest wzmocniona p lyta wiórowa. We wzorze u zytkowym Ru-55536 opisana jest p lyta ocieplajaco - usztywniaj aca, w której rdze n zawiera warstwy kszta ltuj ace wewn atrz kanaliki powietrzne, a powierzchnie kszta ltuj ace poszczególne kanaliki zawieraj a pow loki powoduj ace zwi ekszenie oporu cieplnego. Pow loki powoduj ace zwi eksze- nie oporu cieplnego stanowi a paski z folii refleksyjnej pokrywaj ace powierzchnie elementów fa ldowych z wy laczeniem poziomych pasm ich styku. Celem wzoru u zytkowego jest skonstruowanie p lyty wiórowej o korzystnych parametrach wy- trzyma lo sciowych, a szczególnie wytrzyma losci na zginanie statyczne i modu lu sprezysto sci, przy zachowaniu niezmienionej g esto sci oraz budowy i niezmienionych parametrach wytwarzania p lyty. Wzmocniona p lyta wiórowa zbudowana z warstw wiórów charakteryzuje si e tym, ze warstwy wiórów przedzielone s a siatk a z w lókna szklanego, a pomi edzy warstwami w lókna szklanego znajduje sie warstwa wiórów. Wzmocniona p lyta wiórowa ma zwi ekszon a wytrzyma losc na rozci aganie prosto- pad le do p laszczyzn i mo ze by c stosowana zarówno w meblarstwie, jak i w budownictwie do wytwa- rzania elementów konstrukcyjnych nara zonych na dzia lanie napr eze n zginaj acych. Wzmocniona p lyta wiórowa jest przedstawiona schematycznie na za laczonym rysunku, na któ- rym pokazano p lyt e w przekroju poprzecznym. Wzmocniona p lyta wiórowa stanowi warstwy zaklejonych wiórów 1 przedzielone siatk a z w lókna szklanego 3. Pomiedzy siatkami z w lókna szklanego 3 znajduj a si e zaklejone warstwy wiórów 2. Wzmocniona p lyta wiórowa mo ze mie c siatk e z w lókna szklanego 3 wprowadzon a w stref e warstwy zewn etrznej na powierzchni p lyty, albo w warstwie srodkowej p lyty lub w obu warstwach równo- cze snie. W procesie formowania wzmocnionej p lyty wiórowej klej nanosi si e na wióry drzewne, z których nast epnie formowana jest odpowiednio warstwa zewn etrzna, warstwa srodkowa i nast epna warstwa zewn etrzna. Siatk e z w lókna szklanego 3 wprowadza si e w postaci ta smy bez ko nca. PL PLDescription of the pattern The subject of the utility pattern is a reinforced chipboard. The functional pattern Ru-55536 describes a warming and stiffening plate, in which the core contains layers forming air channels inside, and the surfaces shaping individual channels contain coatings that increase thermal resistance. The coatings increasing the thermal resistance consisted of strips of reflective foil covering the surfaces of the fold elements, excluding the horizontal bands of their contact. The purpose of the utility pattern is to construct a chipboard with favorable strength parameters, especially static bending strength and modulus of elasticity, while maintaining unchanged density, structure and parameters of the board's production. A reinforced chipboard made of layers of chips is characterized by the fact that the layers of chips are separated by a mesh of glass fiber, and between the layers of glass fiber there is a layer of chips. Reinforced chipboard has an increased tensile strength perpendicular to the planes and can be used both in the furniture industry and in construction for the production of structural elements exposed to bending stresses. The reinforced particle board is shown schematically in the attached drawing, which shows the board in cross-section. The reinforced chipboard consists of layers of glued chips 1 separated by a mesh of glass fiber 3. Between the mesh of glass fiber 3 there are glued layers of chips 2. The reinforced chipboard may have a mesh of glass fiber 3 inserted into the zone of the outer layer on the disc surface, either in the disc's middle layer or in both layers at the same time. In the process of forming the reinforced chipboard, the adhesive is applied to the wood chips, which are then formed into the outer outer layer, the middle layer and the next outer outer layer, respectively. The glass fiber mesh 3 is introduced in the form of an endless strip. PL PL

Claims (1)

1. Zastrze zenie ochronne Wzmocniona p lyta wiórowa zbudowana z warstw wiórów, znamienna tym, ze warstwy wiórów /1/ przedzielone s a siatk a z w lókna szklanego /3/, a pomi edzy warstwami z w lókna szklanego /3/ znaj- duje si e warstwa wiórów /2/. Rysunek Departament Wydawnictw UP RP PL PL1. Protective claim Reinforced chipboard made of layers of chips, characterized in that the chip layers / 1 / are separated by a mesh of glass fiber / 3 /, and between the layers of glass fiber / 3 / there is a layer of chips / 2 /. Drawing Department of Publishing UP RP PL PL
PL116970U 2007-08-13 2007-08-13 Reinforced chipboard PL64595Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL116970U PL64595Y1 (en) 2007-08-13 2007-08-13 Reinforced chipboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL116970U PL64595Y1 (en) 2007-08-13 2007-08-13 Reinforced chipboard

Publications (2)

Publication Number Publication Date
PL116970U1 PL116970U1 (en) 2009-02-16
PL64595Y1 true PL64595Y1 (en) 2009-09-30

Family

ID=42984289

Family Applications (1)

Application Number Title Priority Date Filing Date
PL116970U PL64595Y1 (en) 2007-08-13 2007-08-13 Reinforced chipboard

Country Status (1)

Country Link
PL (1) PL64595Y1 (en)

Also Published As

Publication number Publication date
PL116970U1 (en) 2009-02-16

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Legal Events

Date Code Title Description
LAPU Decisions on the lapse of rights of protection of utility model

Effective date: 20100813