PL407052A1 - Method for curing of epoxy resin using the bis(heptaisooctylaluminosilsesquioxane) - Google Patents
Method for curing of epoxy resin using the bis(heptaisooctylaluminosilsesquioxane)Info
- Publication number
- PL407052A1 PL407052A1 PL407052A PL40705214A PL407052A1 PL 407052 A1 PL407052 A1 PL 407052A1 PL 407052 A PL407052 A PL 407052A PL 40705214 A PL40705214 A PL 40705214A PL 407052 A1 PL407052 A1 PL 407052A1
- Authority
- PL
- Poland
- Prior art keywords
- epoxy resin
- curing
- bis
- heptaisooctylaluminosilsesquioxane
- octylethylsilsesquioxane
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Przedmiotem wynalazku jest sposób utwardzania żywicy epoksydowej z wykorzystaniem bis(heptaizooktyloglinosilseskwioksanu), jako środka utwardzającego polegający na tym, że do żywicy epoksydowej wprowadza sięThe subject of the invention is a method of curing epoxy resin with the use of bis (hepta-octylethylsilsesquioxane) as a curing agent in that epoxy resin is introduced into the epoxy resin
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL407052A PL222763B1 (en) | 2014-02-03 | 2014-02-03 | Method for curing of epoxy resin using the bis(heptaisooctylaluminosilsesquioxane) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL407052A PL222763B1 (en) | 2014-02-03 | 2014-02-03 | Method for curing of epoxy resin using the bis(heptaisooctylaluminosilsesquioxane) |
Publications (2)
Publication Number | Publication Date |
---|---|
PL407052A1 true PL407052A1 (en) | 2015-08-17 |
PL222763B1 PL222763B1 (en) | 2016-09-30 |
Family
ID=53786605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL407052A PL222763B1 (en) | 2014-02-03 | 2014-02-03 | Method for curing of epoxy resin using the bis(heptaisooctylaluminosilsesquioxane) |
Country Status (1)
Country | Link |
---|---|
PL (1) | PL222763B1 (en) |
-
2014
- 2014-02-03 PL PL407052A patent/PL222763B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PL222763B1 (en) | 2016-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB201621052D0 (en) | Napthol-based epoxy resin additives for use in well cementing | |
TWI800019B (en) | resin composition | |
CR20160500A (en) | ANTI-OX40 ANTIBODIES AND METHODS OF USE | |
DK3372674T3 (en) | Method for making platelets using agitator with reciprocating agitator motion | |
HUE043170T2 (en) | Epoxy resin composition | |
SG10201903565YA (en) | Thermosetting resin composition | |
DK3310838T3 (en) | Epoxy resin composition | |
DK3218396T3 (en) | PROCEDURE FOR THE PRODUCTION OF HIGH AFFINITY ANTIBODIES | |
SG11201703924SA (en) | Curable epoxy resin composition | |
TWI799393B (en) | resin composition | |
SG11201606206VA (en) | Resin composition for optical component, and optical component produced by using the resin composition | |
MA41308A (en) | EPOXY RESIN COMPOSITION | |
PL407052A1 (en) | Method for curing of epoxy resin using the bis(heptaisooctylaluminosilsesquioxane) | |
TH174994B (en) | Method for finishing the resin pressed parts | |
TH1801000597B (en) | Kit for attaching additional components to process equipment. | |
TH1601003811A (en) | Method of producing mixtures (Mate) Acrylic Resin | |
SG11201606212RA (en) | Resin composition for optical component, and optical component produced by using the resin composition | |
TH1401006065B (en) | Precision alignment methods and precision alignment devices for optical components | |
TH1601001709A (en) | Anti-PDL1 Antibody mixed formula (Anti-PDL1 Antibody) | |
TH1501007811A (en) | Nitrile rubber composition | |
TH1501007810B (en) | Nitrile rubber composition | |
TH1501003795A (en) | Equipment for assembling the backlight set | |
TH1501001414A (en) | Fuel supply equipment | |
TH1501006304B (en) | electronic components | |
TH1401006843B (en) | Structure for fixing resin components. |