PL3910095T3 - Układ rozprowadzania płynu procesowego do chemicznej i/lub elektrolitycznej obróbki powierzchni obracalnego podłoża - Google Patents

Układ rozprowadzania płynu procesowego do chemicznej i/lub elektrolitycznej obróbki powierzchni obracalnego podłoża

Info

Publication number
PL3910095T3
PL3910095T3 PL20173988T PL20173988T PL3910095T3 PL 3910095 T3 PL3910095 T3 PL 3910095T3 PL 20173988 T PL20173988 T PL 20173988T PL 20173988 T PL20173988 T PL 20173988T PL 3910095 T3 PL3910095 T3 PL 3910095T3
Authority
PL
Poland
Prior art keywords
chemical
surface treatment
distribution system
process fluid
electrolytic surface
Prior art date
Application number
PL20173988T
Other languages
English (en)
Inventor
Andreas Gleissner
Franz Markut
Original Assignee
Semsysco Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semsysco Gmbh filed Critical Semsysco Gmbh
Publication of PL3910095T3 publication Critical patent/PL3910095T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • Chemically Coating (AREA)
PL20173988T 2020-05-11 2020-05-11 Układ rozprowadzania płynu procesowego do chemicznej i/lub elektrolitycznej obróbki powierzchni obracalnego podłoża PL3910095T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20173988.5A EP3910095B1 (en) 2020-05-11 2020-05-11 Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate

Publications (1)

Publication Number Publication Date
PL3910095T3 true PL3910095T3 (pl) 2022-05-23

Family

ID=70681709

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20173988T PL3910095T3 (pl) 2020-05-11 2020-05-11 Układ rozprowadzania płynu procesowego do chemicznej i/lub elektrolitycznej obróbki powierzchni obracalnego podłoża

Country Status (9)

Country Link
US (1) US20230193503A1 (pl)
EP (1) EP3910095B1 (pl)
JP (1) JP2023510024A (pl)
KR (1) KR20220123464A (pl)
CN (1) CN115427614A (pl)
PL (1) PL3910095T3 (pl)
PT (1) PT3910095T (pl)
TW (1) TW202146713A (pl)
WO (1) WO2021228604A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220396896A1 (en) * 2020-12-21 2022-12-15 Ebara Corporation Plating apparatus and plating solution agitating method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US6254742B1 (en) * 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US6572755B2 (en) * 2001-04-11 2003-06-03 Speedfam-Ipec Corporation Method and apparatus for electrochemically depositing a material onto a workpiece surface
JP2004531885A (ja) * 2001-04-24 2004-10-14 アプライド　マテリアルズ　インコーポレイテッド 電気化学的機械的研磨のための導電性研磨物品
JP4310085B2 (ja) * 2002-07-31 2009-08-05 株式会社荏原製作所 電解加工方法及び装置
US7645364B2 (en) * 2004-06-30 2010-01-12 Lam Research Corporation Apparatus and method for plating semiconductor wafers
US8795480B2 (en) * 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
DE102010033256A1 (de) * 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
US8188575B2 (en) * 2010-10-05 2012-05-29 Skyworks Solutions, Inc. Apparatus and method for uniform metal plating
US8968533B2 (en) * 2012-05-10 2015-03-03 Applied Materials, Inc Electroplating processor with geometric electrolyte flow path
US10364505B2 (en) * 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US10781527B2 (en) * 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating

Also Published As

Publication number Publication date
EP3910095A1 (en) 2021-11-17
JP2023510024A (ja) 2023-03-10
WO2021228604A1 (en) 2021-11-18
EP3910095B1 (en) 2022-03-16
CN115427614A (zh) 2022-12-02
KR20220123464A (ko) 2022-09-06
US20230193503A1 (en) 2023-06-22
PT3910095T (pt) 2022-04-14
TW202146713A (zh) 2021-12-16

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