PL3703476T3 - Układ chłodzący mający główne i pomocnicze urządzenia chłodzące do chłodzenia urządzenia elektronicznego - Google Patents

Układ chłodzący mający główne i pomocnicze urządzenia chłodzące do chłodzenia urządzenia elektronicznego

Info

Publication number
PL3703476T3
PL3703476T3 PL19315013.3T PL19315013T PL3703476T3 PL 3703476 T3 PL3703476 T3 PL 3703476T3 PL 19315013 T PL19315013 T PL 19315013T PL 3703476 T3 PL3703476 T3 PL 3703476T3
Authority
PL
Poland
Prior art keywords
cooling
primary
electronic device
arrangement
devices
Prior art date
Application number
PL19315013.3T
Other languages
English (en)
Inventor
Christophe Maurice Thibaut
Patrick-Gilles Maillot
Henryk KLABA
Original Assignee
Ovh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovh filed Critical Ovh
Publication of PL3703476T3 publication Critical patent/PL3703476T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by monitoring or safety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49219—Compensation temperature, thermal displacement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL19315013.3T 2019-02-28 2019-02-28 Układ chłodzący mający główne i pomocnicze urządzenia chłodzące do chłodzenia urządzenia elektronicznego PL3703476T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19315013.3A EP3703476B1 (en) 2019-02-28 2019-02-28 Cooling arrangement having primary and secondary cooling devices for cooling an electronic device

Publications (1)

Publication Number Publication Date
PL3703476T3 true PL3703476T3 (pl) 2022-09-19

Family

ID=65904354

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19315013.3T PL3703476T3 (pl) 2019-02-28 2019-02-28 Układ chłodzący mający główne i pomocnicze urządzenia chłodzące do chłodzenia urządzenia elektronicznego

Country Status (7)

Country Link
US (1) US11533830B2 (pl)
EP (1) EP3703476B1 (pl)
KR (1) KR102566628B1 (pl)
CN (1) CN111629558A (pl)
CA (1) CA3071331A1 (pl)
DK (1) DK3703476T3 (pl)
PL (1) PL3703476T3 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11889664B2 (en) * 2021-06-24 2024-01-30 Baidu Usa Llc Thermal management system with phase change and auxiliary cooling systems
US11711908B1 (en) * 2022-03-18 2023-07-25 Baidu Usa Llc System and method for servicing and controlling a leak segregation and detection system of an electronics rack
DE102022112003A1 (de) 2022-05-13 2023-11-16 Connaught Electronics Ltd. Steuergeräteanordnung mit in einem Kanalsystem einer Leiterplatteneinheit angeordnetem Wärmeübertragungsmaterial und Verfahren zum Herstellen einer Steuergeräteanordnung
CN221653078U (zh) * 2024-01-12 2024-09-03 台达电子工业股份有限公司 散热组件、及电路系统

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US7975156B2 (en) * 2008-10-21 2011-07-05 Dell Products, Lp System and method for adapting a power usage of a server during a data center cooling failure
US6968709B2 (en) * 2003-12-01 2005-11-29 International Business Machines Corporation System and method for cooling multiple logic modules
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
JP2005228237A (ja) 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器
US8051897B2 (en) 2005-11-30 2011-11-08 International Business Machines Corporation Redundant assembly for a liquid and air cooled module
US20070153474A1 (en) 2005-12-29 2007-07-05 Jesper Alexander Andersen Cooling system and method of use
US7436666B1 (en) * 2006-08-08 2008-10-14 Sun Microsystems, Inc. Thermal caching for liquid cooled computer systems
CN101193526A (zh) * 2006-11-20 2008-06-04 沈国忠 大功率电子器件散热方法和使用该方法的散热装置
US8395896B2 (en) 2007-02-24 2013-03-12 Hewlett-Packard Development Company, L.P. Redundant cooling systems and methods
US20080266726A1 (en) 2007-04-27 2008-10-30 Vance Murakami Cooling system for electrical devices
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
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TW201011540A (en) * 2008-09-12 2010-03-16 Acer Inc Data backup system and method thereof
DE112009002245B4 (de) * 2008-09-15 2022-03-10 Eaton Intelligent Power Limited Überwachungssystem zum Überwachen und Steuern des Zustands oder der Betätigung von Komponenten wie etwa Schaltern, Stromkreisunterbrechern, elektrischen Schaltpaneelen und anderen Elementen für eine elektrische Steuerung und einen Schaltungsschutz
US20130205822A1 (en) 2010-07-06 2013-08-15 Peter Heiland System and method for cooling a computer system
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Also Published As

Publication number Publication date
EP3703476B1 (en) 2022-07-20
US20200281098A1 (en) 2020-09-03
US11533830B2 (en) 2022-12-20
DK3703476T3 (da) 2022-08-15
CN111629558A (zh) 2020-09-04
CA3071331A1 (en) 2020-08-28
EP3703476A1 (en) 2020-09-02
KR102566628B1 (ko) 2023-08-11
KR20200105429A (ko) 2020-09-07

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