PL3353667T3 - Modułowa płyta backplane - Google Patents

Modułowa płyta backplane

Info

Publication number
PL3353667T3
PL3353667T3 PL15770844T PL15770844T PL3353667T3 PL 3353667 T3 PL3353667 T3 PL 3353667T3 PL 15770844 T PL15770844 T PL 15770844T PL 15770844 T PL15770844 T PL 15770844T PL 3353667 T3 PL3353667 T3 PL 3353667T3
Authority
PL
Poland
Prior art keywords
modular backplane
backplane
modular
Prior art date
Application number
PL15770844T
Other languages
English (en)
Inventor
Miroslaw Pierre KLABA
Original Assignee
Ovh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovh filed Critical Ovh
Publication of PL3353667T3 publication Critical patent/PL3353667T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4004—Coupling between buses
    • G06F13/4027—Coupling between buses using bus bridges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F2213/0032—Serial ATA [SATA]

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Multi Processors (AREA)
PL15770844T 2015-09-22 2015-09-22 Modułowa płyta backplane PL3353667T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15770844.7A EP3353667B1 (en) 2015-09-22 2015-09-22 Modular backplane
PCT/EP2015/071801 WO2017050359A1 (en) 2015-09-22 2015-09-22 Modular backplane

Publications (1)

Publication Number Publication Date
PL3353667T3 true PL3353667T3 (pl) 2021-05-31

Family

ID=54199195

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15770844T PL3353667T3 (pl) 2015-09-22 2015-09-22 Modułowa płyta backplane

Country Status (6)

Country Link
US (1) US10261931B2 (pl)
EP (1) EP3353667B1 (pl)
CN (1) CN108027795B (pl)
DK (1) DK3353667T3 (pl)
PL (1) PL3353667T3 (pl)
WO (1) WO2017050359A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230387956A1 (en) * 2022-05-26 2023-11-30 The United States Of America As Represented By The Secretary Of The Navy Backpackable electronic warfare system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811275A (en) * 1986-05-28 1989-03-07 Unisys Corporation Addressing system for an expandable modular electromechanical memory assembly
US4700274A (en) * 1987-02-05 1987-10-13 Gte Laboratories, Incorporated Ring-connected circuit module assembly
US20030101426A1 (en) * 2001-11-27 2003-05-29 Terago Communications, Inc. System and method for providing isolated fabric interface in high-speed network switching and routing platforms
US7218640B2 (en) * 2002-08-30 2007-05-15 Intel Corporation Multi-port high-speed serial fabric interconnect chip in a meshed configuration
US7447273B2 (en) * 2004-02-18 2008-11-04 International Business Machines Corporation Redundancy structure and method for high-speed serial link
CN100479632C (zh) * 2004-12-30 2009-04-15 杭州华三通信技术有限公司 背板布线方法
US8862706B2 (en) * 2007-12-14 2014-10-14 Nant Holdings Ip, Llc Hybrid transport—application network fabric apparatus
US8155520B1 (en) * 2008-04-16 2012-04-10 Cyan, Inc. Multi-fabric shelf for a transport network
CN101315508B (zh) * 2008-05-23 2010-12-22 友达光电股份有限公司 具测试架构的平面显示装置
IT1402168B1 (it) * 2010-06-30 2013-08-28 St Microelectronics Srl Metodo di fabbricazione di un dispositivo elettronico impermeabilizzato e dispositivo elettronico impermeabilizzato
US8751710B2 (en) * 2012-05-08 2014-06-10 Entegra Technologies, Inc. Reconfigurable modular computing device
CN104704682B (zh) * 2012-08-22 2017-03-22 安费诺有限公司 高频电连接器
WO2014063350A1 (zh) * 2012-10-26 2014-05-01 华为技术有限公司 信号传输装置及电子设备
CN103729333A (zh) * 2014-01-20 2014-04-16 烽火通信科技股份有限公司 多路时隙共享的背板总线结构及其实现方法

Also Published As

Publication number Publication date
EP3353667B1 (en) 2020-12-30
WO2017050359A1 (en) 2017-03-30
US10261931B2 (en) 2019-04-16
EP3353667A1 (en) 2018-08-01
CN108027795B (zh) 2021-11-09
US20180349309A1 (en) 2018-12-06
DK3353667T3 (da) 2021-02-01
CN108027795A (zh) 2018-05-11

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PL3353667T3 (pl) Modułowa płyta backplane