PL3353667T3 - Modułowa płyta backplane - Google Patents
Modułowa płyta backplaneInfo
- Publication number
- PL3353667T3 PL3353667T3 PL15770844T PL15770844T PL3353667T3 PL 3353667 T3 PL3353667 T3 PL 3353667T3 PL 15770844 T PL15770844 T PL 15770844T PL 15770844 T PL15770844 T PL 15770844T PL 3353667 T3 PL3353667 T3 PL 3353667T3
- Authority
- PL
- Poland
- Prior art keywords
- modular backplane
- backplane
- modular
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4004—Coupling between buses
- G06F13/4027—Coupling between buses using bus bridges
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0032—Serial ATA [SATA]
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi Processors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15770844.7A EP3353667B1 (en) | 2015-09-22 | 2015-09-22 | Modular backplane |
PCT/EP2015/071801 WO2017050359A1 (en) | 2015-09-22 | 2015-09-22 | Modular backplane |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3353667T3 true PL3353667T3 (pl) | 2021-05-31 |
Family
ID=54199195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15770844T PL3353667T3 (pl) | 2015-09-22 | 2015-09-22 | Modułowa płyta backplane |
Country Status (6)
Country | Link |
---|---|
US (1) | US10261931B2 (pl) |
EP (1) | EP3353667B1 (pl) |
CN (1) | CN108027795B (pl) |
DK (1) | DK3353667T3 (pl) |
PL (1) | PL3353667T3 (pl) |
WO (1) | WO2017050359A1 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230387956A1 (en) * | 2022-05-26 | 2023-11-30 | The United States Of America As Represented By The Secretary Of The Navy | Backpackable electronic warfare system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4811275A (en) * | 1986-05-28 | 1989-03-07 | Unisys Corporation | Addressing system for an expandable modular electromechanical memory assembly |
US4700274A (en) * | 1987-02-05 | 1987-10-13 | Gte Laboratories, Incorporated | Ring-connected circuit module assembly |
US20030101426A1 (en) * | 2001-11-27 | 2003-05-29 | Terago Communications, Inc. | System and method for providing isolated fabric interface in high-speed network switching and routing platforms |
US7218640B2 (en) * | 2002-08-30 | 2007-05-15 | Intel Corporation | Multi-port high-speed serial fabric interconnect chip in a meshed configuration |
US7447273B2 (en) * | 2004-02-18 | 2008-11-04 | International Business Machines Corporation | Redundancy structure and method for high-speed serial link |
CN100479632C (zh) * | 2004-12-30 | 2009-04-15 | 杭州华三通信技术有限公司 | 背板布线方法 |
US8862706B2 (en) * | 2007-12-14 | 2014-10-14 | Nant Holdings Ip, Llc | Hybrid transport—application network fabric apparatus |
US8155520B1 (en) * | 2008-04-16 | 2012-04-10 | Cyan, Inc. | Multi-fabric shelf for a transport network |
CN101315508B (zh) * | 2008-05-23 | 2010-12-22 | 友达光电股份有限公司 | 具测试架构的平面显示装置 |
IT1402168B1 (it) * | 2010-06-30 | 2013-08-28 | St Microelectronics Srl | Metodo di fabbricazione di un dispositivo elettronico impermeabilizzato e dispositivo elettronico impermeabilizzato |
US8751710B2 (en) * | 2012-05-08 | 2014-06-10 | Entegra Technologies, Inc. | Reconfigurable modular computing device |
CN104704682B (zh) * | 2012-08-22 | 2017-03-22 | 安费诺有限公司 | 高频电连接器 |
WO2014063350A1 (zh) * | 2012-10-26 | 2014-05-01 | 华为技术有限公司 | 信号传输装置及电子设备 |
CN103729333A (zh) * | 2014-01-20 | 2014-04-16 | 烽火通信科技股份有限公司 | 多路时隙共享的背板总线结构及其实现方法 |
-
2015
- 2015-09-22 DK DK15770844.7T patent/DK3353667T3/da active
- 2015-09-22 PL PL15770844T patent/PL3353667T3/pl unknown
- 2015-09-22 US US15/761,644 patent/US10261931B2/en active Active
- 2015-09-22 CN CN201580083215.7A patent/CN108027795B/zh active Active
- 2015-09-22 WO PCT/EP2015/071801 patent/WO2017050359A1/en active Application Filing
- 2015-09-22 EP EP15770844.7A patent/EP3353667B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3353667B1 (en) | 2020-12-30 |
WO2017050359A1 (en) | 2017-03-30 |
US10261931B2 (en) | 2019-04-16 |
EP3353667A1 (en) | 2018-08-01 |
CN108027795B (zh) | 2021-11-09 |
US20180349309A1 (en) | 2018-12-06 |
DK3353667T3 (da) | 2021-02-01 |
CN108027795A (zh) | 2018-05-11 |
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PL3353667T3 (pl) | Modułowa płyta backplane |