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Application filed by Wyzsza Szkola InzynierskafiledCriticalWyzsza Szkola Inzynierska
Priority to PL94301910ApriorityCriticalpatent/PL173103B1/en
Publication of PL301910A1publicationCriticalpatent/PL301910A1/en
Publication of PL173103B1publicationCriticalpatent/PL173103B1/en
Moisture-curable epoxy resin composition used as adhesive, sealant, capping agent, and coating composition, uses oxazolidine compound as latent curing agent