PL2873032T3 - Warstwa transpondera i sposób jej wytwarzania - Google Patents
Warstwa transpondera i sposób jej wytwarzaniaInfo
- Publication number
- PL2873032T3 PL2873032T3 PL13745342T PL13745342T PL2873032T3 PL 2873032 T3 PL2873032 T3 PL 2873032T3 PL 13745342 T PL13745342 T PL 13745342T PL 13745342 T PL13745342 T PL 13745342T PL 2873032 T3 PL2873032 T3 PL 2873032T3
- Authority
- PL
- Poland
- Prior art keywords
- producing same
- transponder layer
- transponder
- layer
- producing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012212332.6A DE102012212332A1 (de) | 2012-07-13 | 2012-07-13 | Transponderlage und Verfahren zu deren Herstellung |
PCT/EP2013/002075 WO2014009022A1 (de) | 2012-07-13 | 2013-07-12 | Transponderlage und verfahren zu deren herstellung |
EP13745342.9A EP2873032B1 (de) | 2012-07-13 | 2013-07-12 | Transponderlage und verfahren zu deren herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2873032T3 true PL2873032T3 (pl) | 2019-05-31 |
Family
ID=48917484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL13745342T PL2873032T3 (pl) | 2012-07-13 | 2013-07-12 | Warstwa transpondera i sposób jej wytwarzania |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150356395A1 (pl) |
EP (2) | EP2873032B1 (pl) |
DE (1) | DE102012212332A1 (pl) |
ES (2) | ES2713094T3 (pl) |
PL (1) | PL2873032T3 (pl) |
WO (1) | WO2014009022A1 (pl) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10204297B2 (en) * | 2014-10-06 | 2019-02-12 | Itire, Llc | Smart tag assembly for mounting on an object to be tracked |
JP6546711B1 (ja) * | 2019-04-10 | 2019-07-17 | 株式会社エスケーエレクトロニクス | 非接触情報担体 |
US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
DE10120687A1 (de) * | 2001-04-27 | 2002-10-31 | Siemens Ag | Verkapseltes organisch-elektronisches Bauteil, Verfahren zu seiner Herstellung und seine Verwendung |
FR2828570B1 (fr) * | 2001-08-09 | 2003-10-31 | Cybernetix | Procede de fabrication de cartes a puce sans contact et/ou mixte |
DE10220239A1 (de) * | 2002-05-06 | 2003-12-04 | Orga Kartensysteme Gmbh | Chipkarte und Verfahren zu deren Herstellung |
DE10229902A1 (de) * | 2002-07-03 | 2004-01-15 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von elektrisch leitfähigen Verbindungen auf Chipkarten |
DE102005058101B4 (de) * | 2005-12-05 | 2019-04-25 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
DE102006054449A1 (de) * | 2006-11-16 | 2008-05-21 | Smartrac Ip B.V. | Transpondereinheit |
DE102007022615A1 (de) * | 2007-05-15 | 2008-11-20 | Infineon Technologies Ag | Kontaktloses Übertragungssystem und Verfahren zum Herstellen desselben |
TW200905574A (en) * | 2007-07-03 | 2009-02-01 | Textilma Ag | Rfid transponder chip module with connecting means for an antenna, textile tag with an rfid transponder chip module, and use of an rfid transponder chip module |
WO2011103508A1 (en) * | 2010-02-19 | 2011-08-25 | Cubic Corporation | Smartcard interconnect |
-
2012
- 2012-07-13 DE DE102012212332.6A patent/DE102012212332A1/de not_active Ceased
-
2013
- 2013-07-12 PL PL13745342T patent/PL2873032T3/pl unknown
- 2013-07-12 EP EP13745342.9A patent/EP2873032B1/de not_active Not-in-force
- 2013-07-12 EP EP18196937.9A patent/EP3447688B1/de active Active
- 2013-07-12 WO PCT/EP2013/002075 patent/WO2014009022A1/de active Application Filing
- 2013-07-12 ES ES13745342T patent/ES2713094T3/es active Active
- 2013-07-12 ES ES18196937T patent/ES2807256T3/es active Active
- 2013-07-12 US US14/414,182 patent/US20150356395A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP3447688A1 (de) | 2019-02-27 |
EP2873032A1 (de) | 2015-05-20 |
US20150356395A1 (en) | 2015-12-10 |
EP3447688B1 (de) | 2020-05-27 |
EP2873032B1 (de) | 2018-12-12 |
WO2014009022A1 (de) | 2014-01-16 |
ES2807256T3 (es) | 2021-02-22 |
DE102012212332A1 (de) | 2014-01-16 |
ES2713094T3 (es) | 2019-05-17 |
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