PL2642544T3 - Układ obejmujący aktuator piezoelektryczny i elastyczną płytkę z obwodem drukowanym - Google Patents

Układ obejmujący aktuator piezoelektryczny i elastyczną płytkę z obwodem drukowanym

Info

Publication number
PL2642544T3
PL2642544T3 PL12161026T PL12161026T PL2642544T3 PL 2642544 T3 PL2642544 T3 PL 2642544T3 PL 12161026 T PL12161026 T PL 12161026T PL 12161026 T PL12161026 T PL 12161026T PL 2642544 T3 PL2642544 T3 PL 2642544T3
Authority
PL
Poland
Prior art keywords
assembly
circuit board
flexible circuit
piezo actuator
piezo
Prior art date
Application number
PL12161026T
Other languages
English (en)
Inventor
Holger Gruhler
Gerd Ohmayer
Original Assignee
Grieshaber Vega Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grieshaber Vega Kg filed Critical Grieshaber Vega Kg
Publication of PL2642544T3 publication Critical patent/PL2642544T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/1071—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
PL12161026T 2012-03-23 2012-03-23 Układ obejmujący aktuator piezoelektryczny i elastyczną płytkę z obwodem drukowanym PL2642544T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12161026.5A EP2642544B1 (de) 2012-03-23 2012-03-23 Anordnung aus einem Piezoaktor und einer flexiblen Leiterplatte

Publications (1)

Publication Number Publication Date
PL2642544T3 true PL2642544T3 (pl) 2015-03-31

Family

ID=45954360

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12161026T PL2642544T3 (pl) 2012-03-23 2012-03-23 Układ obejmujący aktuator piezoelektryczny i elastyczną płytkę z obwodem drukowanym

Country Status (4)

Country Link
US (1) US9093644B2 (pl)
EP (1) EP2642544B1 (pl)
CN (1) CN103327740B (pl)
PL (1) PL2642544T3 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180081529A (ko) * 2015-11-25 2018-07-16 후지필름 소노사이트, 인크. 고주파 초음파 트랜스듀서 어레이를 포함하는 의료 기기
DE102018107853B3 (de) * 2018-04-03 2019-07-04 Semikron Elektronik Gmbh & Co. Kg Schalteinrichtung und Verfahren zur Herstellung einer Schalteinrichtung
DE102020216448A1 (de) 2020-12-22 2021-10-28 Carl Zeiss Smt Gmbh Optisches system, lithographieanlage und verfahren zum herstellen eines optischen systems

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518752A (en) * 1967-07-28 1970-07-07 Western Electric Co Method of and apparatus for loading semiconductor devices
JP3610762B2 (ja) * 1997-04-15 2005-01-19 株式会社村田製作所 圧電振動体の支持構造及びこの圧電振動体の支持構造を有する圧電トランス、ジャイロ並びに積層圧電体部品
JP4408974B2 (ja) 1998-12-09 2010-02-03 株式会社東芝 超音波トランスジューサ及びその製造方法
DE10126655A1 (de) * 2001-06-01 2002-12-05 Endress & Hauser Gmbh & Co Kg Leiterplatte mit mindestens einem elektronischen Bauteil
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP4839099B2 (ja) 2006-03-03 2011-12-14 オリンパスメディカルシステムズ株式会社 マイクロマシンプロセスにより製造された超音波振動子、超音波振動子装置、その体腔内超音波診断装置、及びその制御方法
JP5318703B2 (ja) * 2008-09-08 2013-10-16 日本発條株式会社 圧電素子の電気的接続構造、圧電アクチュエータ、ヘッドサスペンション、及び導電性部材の電気的接続構造
JP5138571B2 (ja) * 2008-12-25 2013-02-06 日本発條株式会社 圧電素子の配線接続部構造、圧電アクチュエータ、及びヘッドサスペンション
JP4907675B2 (ja) * 2009-01-15 2012-04-04 日本発條株式会社 圧電素子の配線接続部構造、圧電アクチュエータ、及びヘッドサスペンション
US8189301B2 (en) * 2009-04-24 2012-05-29 Magnecomp Corporation Wireless microactuator motor assembly for use in a hard disk drive suspension, and mechanical and electrical connections thereto
JP5611645B2 (ja) * 2010-04-13 2014-10-22 株式会社東芝 超音波トランスデューサおよび超音波プローブ
JP2013527702A (ja) * 2010-04-29 2013-06-27 リサーチ・トライアングル・インスティチュート 微小機械加工された超音波変換子との接続を形成するための方法、および関連する装置

Also Published As

Publication number Publication date
US9093644B2 (en) 2015-07-28
EP2642544B1 (de) 2014-10-01
US20140055007A1 (en) 2014-02-27
CN103327740B (zh) 2017-09-05
EP2642544A1 (de) 2013-09-25
CN103327740A (zh) 2013-09-25

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