PL2471028T3 - Sposób wykonania urządzenia zawierającego układ wykorzystujący częstotliwość radiową, oraz urządzenie otrzymane tym sposobem - Google Patents

Sposób wykonania urządzenia zawierającego układ wykorzystujący częstotliwość radiową, oraz urządzenie otrzymane tym sposobem

Info

Publication number
PL2471028T3
PL2471028T3 PL10741993T PL10741993T PL2471028T3 PL 2471028 T3 PL2471028 T3 PL 2471028T3 PL 10741993 T PL10741993 T PL 10741993T PL 10741993 T PL10741993 T PL 10741993T PL 2471028 T3 PL2471028 T3 PL 2471028T3
Authority
PL
Poland
Prior art keywords
manufacturing
rfid circuit
corresponding device
rfid
circuit
Prior art date
Application number
PL10741993T
Other languages
English (en)
Inventor
Arek Buyukkalender
Nizar Lahoui
Sébastien Gaspari
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of PL2471028T3 publication Critical patent/PL2471028T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07767—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Radar Systems Or Details Thereof (AREA)
PL10741993T 2009-08-28 2010-08-12 Sposób wykonania urządzenia zawierającego układ wykorzystujący częstotliwość radiową, oraz urządzenie otrzymane tym sposobem PL2471028T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09305796A EP2293228A1 (fr) 2009-08-28 2009-08-28 Procédé de réalisation d'un dispositif comprenant un circuit radiofréquence, dispositif obtenu et module pour la mise en oeuvre du procédé
PCT/EP2010/061792 WO2011023570A1 (fr) 2009-08-28 2010-08-12 Procede de realisation d'un dispositif comprenant un circuit radiofrequence, et dispositif obtenu
EP10741993.9A EP2471028B1 (fr) 2009-08-28 2010-08-12 Procede de realisation d'un dispositif comprenant un circuit radiofrequence, et dispositif obtenu

Publications (1)

Publication Number Publication Date
PL2471028T3 true PL2471028T3 (pl) 2016-05-31

Family

ID=41693099

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10741993T PL2471028T3 (pl) 2009-08-28 2010-08-12 Sposób wykonania urządzenia zawierającego układ wykorzystujący częstotliwość radiową, oraz urządzenie otrzymane tym sposobem

Country Status (4)

Country Link
EP (2) EP2293228A1 (pl)
ES (1) ES2576301T3 (pl)
PL (1) PL2471028T3 (pl)
WO (1) WO2011023570A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104615039B (zh) * 2014-09-22 2017-09-26 中国电子科技集团公司第四十一研究所 一种usb接口控制的可扩展的多路射频开关装置
CN107912065B (zh) * 2015-06-23 2020-11-03 立联信控股有限公司 具有至少一个用于无接触地传输信息的接口的智能卡坯件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4015717B2 (ja) * 1995-06-29 2007-11-28 日立マクセル株式会社 情報担体の製造方法
EP1031939B1 (en) 1997-11-14 2005-09-14 Toppan Printing Co., Ltd. Composite ic card
FR2777141B1 (fr) 1998-04-06 2000-06-09 Gemplus Card Int Transpondeur
DE20110585U1 (de) 2001-06-11 2001-11-15 Cubit Electronics GmbH, 99099 Erfurt Kontaktloser Transponder
EP1821241A3 (en) * 2006-02-15 2008-07-23 Assa Abloy AB Hybrid frequency contactless transponder unit, module for and method of manufacturing
ATE507538T1 (de) * 2006-06-01 2011-05-15 Murata Manufacturing Co Hochfrequenz-ic-anordnung und zusammengesetzte komponente für eine hochfrequenz-ic-anordnung

Also Published As

Publication number Publication date
EP2471028A1 (fr) 2012-07-04
EP2471028B1 (fr) 2015-10-07
EP2293228A1 (fr) 2011-03-09
WO2011023570A1 (fr) 2011-03-03
ES2576301T3 (es) 2016-07-06

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