PL2231893T3 - Method and system for galvanizing by plasma evaporation - Google Patents

Method and system for galvanizing by plasma evaporation

Info

Publication number
PL2231893T3
PL2231893T3 PL08851624T PL08851624T PL2231893T3 PL 2231893 T3 PL2231893 T3 PL 2231893T3 PL 08851624 T PL08851624 T PL 08851624T PL 08851624 T PL08851624 T PL 08851624T PL 2231893 T3 PL2231893 T3 PL 2231893T3
Authority
PL
Poland
Prior art keywords
galvanizing
plasma
plasma evaporation
zone
treatment zone
Prior art date
Application number
PL08851624T
Other languages
Polish (pl)
Inventor
Brande Pierre Vanden
Original Assignee
Advanced Galvanisation Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Galvanisation Ag filed Critical Advanced Galvanisation Ag
Publication of PL2231893T3 publication Critical patent/PL2231893T3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32513Sealing means, e.g. sealing between different parts of the vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32743Means for moving the material to be treated for introducing the material into processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32788Means for moving the material to be treated for extracting the material from the process chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32889Connection or combination with other apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/327Arrangements for generating the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332Coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334Etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating With Molten Metal (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

The invention relates to a method and a system for the plasma treatment of successive substrates comprising one or more steel products in which the substrates are transported, one after another, through at least one plasma treatment zone, characterized in that the electric power for generating the plasma in the treatment zone is varied according to the area of the substrate is present in this treatment zone when the substrate is running through this zone.
PL08851624T 2007-11-19 2008-11-07 Method and system for galvanizing by plasma evaporation PL2231893T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
BE2007/0556A BE1017852A3 (en) 2007-11-19 2007-11-19 METHOD AND INSTALLATION OF GALVANIZATION BY PLASMA EVAPORATION
PCT/EP2008/065168 WO2009065745A1 (en) 2007-11-19 2008-11-07 Method and system for galvanizing by plasma evaporation
EP08851624A EP2231893B1 (en) 2007-11-19 2008-11-07 Method and system for galvanizing by plasma evaporation

Publications (1)

Publication Number Publication Date
PL2231893T3 true PL2231893T3 (en) 2011-12-30

Family

ID=39672101

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08851624T PL2231893T3 (en) 2007-11-19 2008-11-07 Method and system for galvanizing by plasma evaporation

Country Status (11)

Country Link
US (2) US9222162B2 (en)
EP (1) EP2231893B1 (en)
JP (1) JP5432168B2 (en)
KR (1) KR101644475B1 (en)
CN (1) CN101910447B (en)
AT (1) ATE511554T1 (en)
AU (1) AU2008328006B2 (en)
BE (1) BE1017852A3 (en)
BR (1) BRPI0820277B1 (en)
PL (1) PL2231893T3 (en)
WO (1) WO2009065745A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2491601A (en) * 2011-06-07 2012-12-12 Leclancha S A Drying process for cost effective production of Li-accumulators
CN104480418A (en) * 2014-12-12 2015-04-01 苏州工业职业技术学院 Tinplating method and tinplating device of photovoltaic welding belt
CN104818469A (en) * 2015-01-09 2015-08-05 凌嘉科技股份有限公司 Film coating system having tray cooling function
CN107923030A (en) * 2015-08-18 2018-04-17 塔塔钢铁荷兰科技有限责任公司 Method and apparatus for cleaning and coating sheet metal strip
CN109468600B (en) * 2018-12-25 2021-03-05 合肥鑫晟光电科技有限公司 Sputtering system and deposition method
EP4200461A4 (en) * 2020-08-21 2024-09-18 Applied Materials, Inc. PROCESSING SYSTEM FOR TREATING A FLEXIBLE SUBSTRATE AND METHOD FOR MEASURING AT LEAST ONE OF A PROPERTY OF A FLEXIBLE SUBSTRATE AND A PROPERTY OF ONE OR MORE COATINGS ON THE FLEXIBLE SUBSTRATE
EP4084040A1 (en) * 2021-04-29 2022-11-02 voestalpine Stahl GmbH Method and devices for plasma treatment
DE102021127116A1 (en) * 2021-10-19 2023-04-20 Thyssenkrupp Steel Europe Ag Process for coating a flat steel product with low susceptibility to paint craters
EP4438765A1 (en) * 2023-03-27 2024-10-02 voestalpine Stahl GmbH Method and device for plasma heating of the internal walls of a vacuum furnace

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BE795116A (en) * 1972-02-08 1973-05-29 Cockerill EVAPORATION BATH FEEDING PROCESS
JPH07110991B2 (en) * 1989-10-02 1995-11-29 株式会社日立製作所 Plasma processing apparatus and plasma processing method
EP0577766B1 (en) * 1991-04-04 1999-12-29 Seagate Technology, Inc. Apparatus and method for high throughput sputtering
JPH0850715A (en) * 1994-01-28 1996-02-20 Komag Inc Magnetic recording medium with low noise,high coercive forceand excellent squareness and formation of magnetic recordingmedium
JP2665202B2 (en) * 1995-05-31 1997-10-22 九州日本電気株式会社 Semiconductor wafer processing equipment
US6432281B2 (en) * 1995-12-20 2002-08-13 Recherche Et Developpement Due Groupe Cockerill Sambre Process for formation of a coating on a substrate
BE1010420A3 (en) * 1996-07-12 1998-07-07 Cockerill Rech & Dev Method for forming a coating on a substrate and installation for implementing the method.
US6572738B1 (en) * 1999-05-25 2003-06-03 Unaxis Balzers Aktiengesellschaft Vacuum treatment system and process for manufacturing workpieces
FR2800098B1 (en) * 1999-10-26 2002-03-01 Lorraine Laminage STEEL SHEET HAVING A COATING COMPRISING A MAIN LAYER OF ZINC-CHRONE ALLOY, THE PREVIOUS PHASE OF WHICH HAS A DELTA AND / OR DZETA STRUCTURE
EP1178134A1 (en) 2000-08-04 2002-02-06 Cold Plasma Applications C.P.A. Process and apparatus for the continuous plasma treatment of metallic substrates
EP1182272A1 (en) 2000-08-23 2002-02-27 Cold Plasma Applications C.P.A. Process and apparatus for continuous cold plasma deposition of metallic layers
JP4630443B2 (en) * 2000-10-23 2011-02-09 キヤノン株式会社 Film formation method by sputtering
TW200816881A (en) * 2006-08-30 2008-04-01 Noritsu Koki Co Ltd Plasma generation apparatus and workpiece processing apparatus using the same

Also Published As

Publication number Publication date
WO2009065745A1 (en) 2009-05-28
JP2011503358A (en) 2011-01-27
US11268185B2 (en) 2022-03-08
BRPI0820277B1 (en) 2019-03-19
AU2008328006A1 (en) 2009-05-28
US20100272918A1 (en) 2010-10-28
BE1017852A3 (en) 2009-09-01
KR20100102102A (en) 2010-09-20
US20160186308A1 (en) 2016-06-30
CN101910447A (en) 2010-12-08
EP2231893B1 (en) 2011-06-01
CN101910447B (en) 2012-07-04
BRPI0820277A2 (en) 2015-05-26
EP2231893A1 (en) 2010-09-29
KR101644475B1 (en) 2016-08-03
JP5432168B2 (en) 2014-03-05
ATE511554T1 (en) 2011-06-15
AU2008328006B2 (en) 2013-05-23
US9222162B2 (en) 2015-12-29

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