PL219947A2 - - Google Patents

Info

Publication number
PL219947A2
PL219947A2 PL21994779A PL21994779A PL219947A2 PL 219947 A2 PL219947 A2 PL 219947A2 PL 21994779 A PL21994779 A PL 21994779A PL 21994779 A PL21994779 A PL 21994779A PL 219947 A2 PL219947 A2 PL 219947A2
Authority
PL
Poland
Application number
PL21994779A
Other versions
PL118692B2 (en
Inventor
Karol Korczak
Original Assignee
Politechnika Warszawska
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Politechnika Warszawska filed Critical Politechnika Warszawska
Priority to PL21994779A priority Critical patent/PL118692B2/en
Publication of PL219947A2 publication Critical patent/PL219947A2/xx
Publication of PL118692B2 publication Critical patent/PL118692B2/en

Links

PL21994779A 1979-11-28 1979-11-28 Bladed machine PL118692B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL21994779A PL118692B2 (en) 1979-11-28 1979-11-28 Bladed machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL21994779A PL118692B2 (en) 1979-11-28 1979-11-28 Bladed machine

Publications (2)

Publication Number Publication Date
PL219947A2 true PL219947A2 (en) 1980-09-22
PL118692B2 PL118692B2 (en) 1981-10-31

Family

ID=19999669

Family Applications (1)

Application Number Title Priority Date Filing Date
PL21994779A PL118692B2 (en) 1979-11-28 1979-11-28 Bladed machine

Country Status (1)

Country Link
PL (1) PL118692B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11802224B2 (en) 2021-03-22 2023-10-31 Sekisui Chemical Co., Ltd. Adhesive tape, method for fixing electronic device component or on-board device component, and method for producing electronic device or on-board device
US11912905B2 (en) 2021-03-22 2024-02-27 Sekisui Chemical Co., Ltd. Adhesive tape, method for immobilizing electronic device component or on-vehicle device component, method for manufacturing electronic device or on-vehicle device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11802224B2 (en) 2021-03-22 2023-10-31 Sekisui Chemical Co., Ltd. Adhesive tape, method for fixing electronic device component or on-board device component, and method for producing electronic device or on-board device
US11912905B2 (en) 2021-03-22 2024-02-27 Sekisui Chemical Co., Ltd. Adhesive tape, method for immobilizing electronic device component or on-vehicle device component, method for manufacturing electronic device or on-vehicle device

Also Published As

Publication number Publication date
PL118692B2 (en) 1981-10-31

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