PL121202B1 - Hot-melt adhesive - Google Patents

Hot-melt adhesive Download PDF

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Publication number
PL121202B1
PL121202B1 PL21620779A PL21620779A PL121202B1 PL 121202 B1 PL121202 B1 PL 121202B1 PL 21620779 A PL21620779 A PL 21620779A PL 21620779 A PL21620779 A PL 21620779A PL 121202 B1 PL121202 B1 PL 121202B1
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PL
Poland
Prior art keywords
weight
vinyl acetate
parts
average molecular
hot
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Application number
PL21620779A
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Polish (pl)
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PL216207A1 (en
Inventor
Jan Mosiomosiewski
Elzbieta Wrzesien
Original Assignee
Inst Ciezkiej Syntezy Orga
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Publication date
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Priority to PL21620779A priority Critical patent/PL121202B1/en
Publication of PL216207A1 publication Critical patent/PL216207A1/xx
Publication of PL121202B1 publication Critical patent/PL121202B1/en

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Description

Opis patentowy opublikowano: 30.11.1984 121202 Int. Cl.» C09J3/14 C08L 23/08 CZYUI-NIA Hurtll Patt^iS00 */• * I* - Twórcy wynalazku: Jan Mosio-Mosiewski, Elzbieta Wrzesien Uprawniony z patentu: Instytut Ciezkiej Syntezy Organicznej „Blachownia", Kedzierzyn-Kozle (Polska) Klej topliwy Przedmijotem wynalazku jest klej topliwy sto¬ sowany glównie w introligatorstwie do klejenia grzbietów wkladów przy oprawie bezszyciowej.Kleje topliwe, sa to substancje termoplastyczne, zawierajace 100% suchej masy.Cecha charakterystyczna tych klejów jest to, ze topia sie w temperaturach* od 150 do 200°C. Na ogól w sklad kleju topliwego wchodzi polimer ter¬ moplastyczny, decydujacy o jego wytrzymalosci, srodek zwiekszajacy przyczepnosc, zmiekczacz, na- pelniacz i antyutleniacz. Najczesciej stosowanymi w produkcji klejów topliwyeh polimerami sa: po¬ lietylen, polioctan winylu, kopolimery etylenu z , octanem winylu.Polioctan winylu jako skladnik klejów topli¬ wyeh wykazuje szereg wad. Polimer ten w tem¬ peraturach zblizonych do 0°C staje sie kruchy.Powoduje to koniecznosc uzupelniania skladu kle¬ ju zywicami naturalnymi i plastyfikatorami w ce¬ lu zapewnienia odpowiedniej elastycznosci zlacza.Przyklad kleju opartego na kopolimerze etylen- -octan winylu przedstawiono w japonskim opisie patentowym nr 7 721048. Klej ten sklada sie z kopolimeru etylen-octan winylu, kopolimeru cy- klopenten-bezwodnik maleinowy-alfa metylostyren- 1,3 pentadien oraz z zywicy.Istote wynalazku stanowi klej skladajacy sie z 30—35 czesci wagowych kopolimeru etylen-octan winylu o zawartosci 27—29 procent wagowych octanu winylu, 8—12 czesci wagowych polipropy* 10 15 lenu ataktycznego o sredniej masie czasteczkowej 10 000, 7—13 czesci wagowych wosku polietyleno¬ wego o sredniej masie czasteczkowej 5000, 45—50 czesci wagowych adduktu maleinowego kalafonii talowej o zawartosci 8—12 procent wagowych bez¬ wodnika maleinowego. Wlasciwa przyczepnosc kle¬ ju do laczonych elementów zapewnia kopolimer etylen-octan winylu i addukt maleinowy kalafo¬ nii talowej. Elastycznosc i wodoodpornosc zlacza zapewnia sie przez wlasciwy udzial w skladzie kleju polipropylenu ataktycznego i wosku poliety¬ lenowego. Przygotowanie kleju wedlug wynalaz¬ ku przedstawiono w ponizszych przykladach.Przyklad I. Do mieszalnika metalowego o pojemnosci 1,5 dm* wyposazonego w mieszadlo kot¬ wiczne oraz nawinieta na zewnetrznej powierzch¬ ni spirale grzejna wprowadzono 130 g wosku po¬ lietylenowego o sredniej masie czasteczkowej 5000 i 450 g adduktu maleinowego kalafonii talowej o zawartosci 8—12 procent wagowych bezwodnika maleinowego. Nastepnie wolna przestrzen mieszal¬ nika przedmuchano azotem, wlaczono ogrzewanie i uruchomiono mieszadlo. Po stopieniu znajduja¬ cych sie w mieszalniku skladników i ogrzaniu ich do temperatury 150°C wprowadzono do mieszal¬ nika 120 g polipropylenu ataktycznego o sredniej masie czasteczkowej 10 000 i 300 g kopolimeru etylen-octan winylu o zawartosci 27—29 procent wagowych octanu winylu. Zawartosc mieszalnika ogrzewa sie do temperatury 180°C i utrzymuje 121 2023 121 202 4 w tej temperaturze przez 1,5 godziny przy inten¬ sywnym mieszaniu. Nastepnie otrzymany klej wy¬ lano na gladka blache ze stali nierdzewnej i po schlodzeniu rozdrobniono na kawalki o wymiarze ok. 5 mm.Przyklad II. Do urzadzenia jak w przykla¬ dzie I zaladowano 70 g wosku polietylenowego o sredniej masie czasteczkowej 5000 i 500 g adduk- tu maleinowego kalafonii talowej o zawartosci 8—12. procent wagowych bezwodnika maleinowe¬ go. Po stopieniu wprowadzonych skladników do mieszalnika wprowadzono 80 g polipropylenu atak- tycznego o sredniej masie czasteczkowej 10 000 i 350 g kopolimeru etylen-octan winylu o zawar¬ tosci 27—29 procent wagowych octanu winylu.Zawartosc mieszalnika homogenizowano w tem¬ peraturze 190°C przez okres 2 godzin a otrzyma¬ ny klej konfekcjonowano jak w przykladzie I.Próbki kleju otrzymane wedlug przykladów 1 i 2 ogrzewano do 175°C i uzyto do sklejenia grzbie¬ tów wkladów notesów. Powstale zlacza charak¬ teryzowaly sie bardzo dobra przyczepnoscia do papieru, elastycznoscia w szerokim zakresie tem¬ peratur, dobrymi wlasnosciami wytrzymalosciowy- 5 mi oraz odpornoscia na starzenie. PLThe patent description was published: 30.11.1984 121202 Int. Cl. » C09J3 / 14 C08L 23/08 CZYUI-NIA Hurtll Patt ^ iS00 * / • * I * - Creators of the invention: Jan Mosio-Mosiewski, Elzbieta Wrzesien Authorized by the patent: Institute of Heavy Organic Synthesis "Blachownia", Kedzierzyn-Kozle (Poland) Glue The subject of the invention is hot-melt adhesive, which is used mainly in bookbinding for gluing the backs of inlays in a seamless binding. Hot-melt adhesives are thermoplastic substances, containing 100% dry weight. The characteristic feature of these adhesives is that they melt at temperatures from 150 to 200 ° C. In general, the hot melt adhesive consists of a thermoplastic polymer that determines its strength, an adhesion promoter, a softener, a filler and an antioxidant. The polymers most commonly used in the production of hot melt adhesives are: polyethylene, polyvinyl acetate, copolymers of ethylene with vinyl acetate. Polyvinyl acetate as a component of hot melt adhesives has a number of disadvantages. This polymer becomes brittle at temperatures close to 0 ° C. This causes congestion. The need to supplement the adhesive composition with natural resins and plasticizers in order to ensure adequate flexibility of the joint. An example of an adhesive based on an ethylene-vinyl acetate copolymer is described in Japanese Patent Specification No. 7 721048. This adhesive consists of an ethylene-vinyl acetate copolymer, a copolymer cyclopentene-maleic anhydride-alpha-methylstyrene-1,3-pentadiene and resin. The present invention is an adhesive consisting of 30-35 parts by weight of an ethylene-vinyl acetate copolymer containing 27-29 percent by weight of vinyl acetate, 8-12 parts by weight polypropylene of atactic lumen having an average molecular weight of 10,000.7-13 parts by weight of polyethylene wax with an average molecular weight of 5000.45-50 parts by weight of tall rosin maleic adduct containing 8-12 weight percent of maleic anhydride. Proper adhesion of the adhesive to the joined elements is ensured by ethylene-vinyl acetate copolymer and tall rosin maleic adduct. The flexibility and water resistance of the joint is ensured by the appropriate composition of atactic polypropylene and polyethylene wax in the adhesive. The preparation of the adhesive according to the invention is shown in the following examples: Example I. In a metal mixer with a capacity of 1.5 liters, equipped with an anchor stirrer and a heating coil wound on the outer surface, 130 g of polyethylene wax with an average molecular weight were introduced. 5000 and 450 g of tall rosin maleic adduct with a content of 8-12 weight percent maleic anhydride. Thereafter, the free space in the mixer was purged with nitrogen, the heating was turned on, and the mixer was turned on. After melting the ingredients in the mixer and heating them to 150 ° C., 120 g of atactic polypropylene with an average molecular weight of 10,000 and 300 g of ethylene-vinyl acetate copolymer containing 27-29 weight percent vinyl acetate were introduced into the mixer. The contents of the mixer are heated to 180 ° C and kept at this temperature for 1.5 hours with vigorous agitation. Then the obtained glue was poured onto a smooth stainless steel sheet and, after cooling, it was ground into pieces of about 5 mm. Example II. 70 g of a polyethylene wax with an average molecular weight of 5000 and 500 g of a maleic adduct of tall rosin with a content of 8-12 were charged to the device as in Example 1. percent by weight of maleic anhydride. After the ingredients were melted, 80 g of attack polypropylene with an average molecular weight of 10,000 and 350 g of ethylene-vinyl acetate copolymer containing 27-29 percent by weight of vinyl acetate were introduced into the mixer. The contents of the mixer were homogenized at 190 ° C for period of 2 hours, and the obtained glue was packaged as in Example 1. The glue samples obtained according to Examples 1 and 2 were heated to 175 ° C and used to glue the spines of the notebook inlays. The resulting joints were characterized by very good adhesion to paper, flexibility in a wide temperature range, good strength properties and resistance to aging. PL

Claims (1)

1. Zastrzezenie patentowe Klej topliwy zawierajacy kopolimer etylen-octan 10 winylu, wosk polietylenowy i addukt maleinowy kalafonii talowej, znamienny tym, ze sklada sie z 30—35 czesci wagowych kopolimeru etylen-octan winylu o zawartosci 27—29% wagowych octanu winylu, 8—12 czesci wagowych polipropylenu atak- 15 tycznego o sredniej masie czasteczkowej 10 000, 7—13 czesci wagowych wosku polietylenowego o sredniej masie czasteczkowej 5000 i 45—50 czesci wagowych adduktu maleinowego kalafonii talo¬ wej o zawartosci 8—12% wagowych bezwodnika 2Q maleinowego. PZGraf. Koszalin A-1S58 85 A-4 Cena IM il PL1. Patent claim A hotmelt adhesive containing ethylene-vinyl acetate copolymer, polyethylene wax and tall rosin maleic adduct, characterized in that it consists of 30-35 parts by weight of ethylene-vinyl acetate copolymer with a content of 27-29% by weight of vinyl acetate, 8 - 12 parts by weight of an attack polypropylene with an average molecular weight of 10,000, 7-13 parts by weight of polyethylene wax with an average molecular weight of 5,000 and 45-50 parts by weight of tallow rosin maleic adduct with 8-12% by weight of maleic anhydride . PZGraf. Koszalin A-1S58 85 A-4 Price IM number PL
PL21620779A 1979-06-07 1979-06-07 Hot-melt adhesive PL121202B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL21620779A PL121202B1 (en) 1979-06-07 1979-06-07 Hot-melt adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL21620779A PL121202B1 (en) 1979-06-07 1979-06-07 Hot-melt adhesive

Publications (2)

Publication Number Publication Date
PL216207A1 PL216207A1 (en) 1981-01-16
PL121202B1 true PL121202B1 (en) 1982-04-30

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PL21620779A PL121202B1 (en) 1979-06-07 1979-06-07 Hot-melt adhesive

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PL (1) PL121202B1 (en)

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PL216207A1 (en) 1981-01-16

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