PH24847A - Hermetically sealed semiconductor casing - Google Patents

Hermetically sealed semiconductor casing

Info

Publication number
PH24847A
PH24847A PH32806A PH32806A PH24847A PH 24847 A PH24847 A PH 24847A PH 32806 A PH32806 A PH 32806A PH 32806 A PH32806 A PH 32806A PH 24847 A PH24847 A PH 24847A
Authority
PH
Philippines
Prior art keywords
hermetically sealed
sealed semiconductor
semiconductor casing
casing
hermetically
Prior art date
Application number
PH32806A
Inventor
Michael J Pryor
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of PH24847A publication Critical patent/PH24847A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
PH32806A 1984-09-19 1985-09-19 Hermetically sealed semiconductor casing PH24847A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65198684A 1984-09-19 1984-09-19

Publications (1)

Publication Number Publication Date
PH24847A true PH24847A (en) 1990-11-27

Family

ID=24615053

Family Applications (1)

Application Number Title Priority Date Filing Date
PH32806A PH24847A (en) 1984-09-19 1985-09-19 Hermetically sealed semiconductor casing

Country Status (2)

Country Link
JP (1) JPS6178145A (en)
PH (1) PH24847A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5386575A (en) * 1977-01-10 1978-07-31 Mitsubishi Electric Corp Production of semiconductor device
JPS5690546A (en) * 1979-12-24 1981-07-22 Sumitomo Electric Ind Ltd Composite material for semiconductor part
JPS58188186A (en) * 1982-04-19 1983-11-02 オリン・コ−ポレ−シヨン Improved semiconductor package

Also Published As

Publication number Publication date
JPS6178145A (en) 1986-04-21

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