Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Bond Co LtdfiledCriticalThree Bond Co Ltd
Publication of PH12020050184A1publicationCriticalpatent/PH12020050184A1/en
An object of the present invention is to provide an epoxy resin adhesive agent which exhibits excellent adhesive force at the time of high temperature heating and maintains the adhesive force even after a temperature cycling test required for a motor member. An epoxy resin adhesive agent containing the following components (A) to (E): component (A): an epoxy resin having two or more epoxy groups in one molecule; component (B): a curing agent for epoxy resin; component (C): polystyrene particles having a glass transition temperature (by DSC method) of 70øC or more; component (D): resin particles having a glass transition temperature (by DSC method) of 0øC or less (however, excluding component (C)); and component (E): spacer particles having an average particle diameter of 10 to 500 æm (however, excluding components (C) and (D)).
PH12020050184A2019-06-282020-06-19Epoxy resin adhesive agent, cured product, and motor
PH12020050184A1
(en)
manufacturing process for producing a liquid resin infusion molded article, curable composition, cured molded article, and use of a curable composition.