NO963394D0 - Heat sink for semiconductor components and the like - Google Patents

Heat sink for semiconductor components and the like

Info

Publication number
NO963394D0
NO963394D0 NO963394A NO963394A NO963394D0 NO 963394 D0 NO963394 D0 NO 963394D0 NO 963394 A NO963394 A NO 963394A NO 963394 A NO963394 A NO 963394A NO 963394 D0 NO963394 D0 NO 963394D0
Authority
NO
Norway
Prior art keywords
heat sink
semiconductor components
semiconductor
components
sink
Prior art date
Application number
NO963394A
Other languages
Norwegian (no)
Other versions
NO321138B1 (en
NO963394L (en
Inventor
Uwe Bock
Original Assignee
Alusuisse Lonza Services Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Lonza Services Ag filed Critical Alusuisse Lonza Services Ag
Publication of NO963394D0 publication Critical patent/NO963394D0/en
Publication of NO963394L publication Critical patent/NO963394L/en
Publication of NO321138B1 publication Critical patent/NO321138B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Catalysts (AREA)
NO19963394A 1995-08-17 1996-08-14 Dress body for semiconductor components and similar equipment NO321138B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29513283 1995-08-17

Publications (3)

Publication Number Publication Date
NO963394D0 true NO963394D0 (en) 1996-08-14
NO963394L NO963394L (en) 1997-02-18
NO321138B1 NO321138B1 (en) 2006-03-27

Family

ID=8011935

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19963394A NO321138B1 (en) 1995-08-17 1996-08-14 Dress body for semiconductor components and similar equipment

Country Status (3)

Country Link
EP (1) EP0759636A3 (en)
DE (1) DE29602366U1 (en)
NO (1) NO321138B1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29715585U1 (en) * 1997-08-28 1998-12-24 Hoogovens Aluminium Profiltechnik Bonn GmbH, 53117 Bonn Cooling device for electrical or electronic components
DE19845374C2 (en) * 1998-10-02 2003-01-02 Swg Metallverarbeitung Und Mon Process for the production of heat sinks for electrical and / or electronic components
DE10056387B4 (en) * 2000-11-14 2008-11-13 Corus Aluminium Profiltechnik Gmbh Cooling device and method for its production and apparatus for carrying out the method
US7188661B2 (en) * 2003-11-13 2007-03-13 Thermamasters, Llc Process for joining members of a heat transfer assembly and assembly formed thereby
JP2011154929A (en) * 2010-02-15 2011-08-11 Sun-Lite Sockets Industry Inc Heat exhausting device
US20210389059A1 (en) * 2018-12-28 2021-12-16 Dong Guan Han Xu Hardware & Plastic Technology Co., Ltd. Riveting apparatus for thin heat sink fin and thin cover plate
DE102019107280A1 (en) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Cooling device for cooling a third-party object to be cooled

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI75666C (en) * 1985-10-11 1988-07-11 Neste Oy Heat transfer means and method for producing the heat transfer means.
DE3814145C2 (en) * 1988-04-27 1998-07-23 Hess Joachim Device for supplying or removing heat
EP0483058B1 (en) * 1990-10-24 1995-08-30 Alusuisse-Lonza Services Ag Heat sink for semiconductor components
DE4134929A1 (en) * 1991-10-23 1993-04-29 Vaw Ver Aluminium Werke Ag Heat transfer body for cooling of semiconductor component - has ribs upstanding from base to grip prongs of component which are forced into corresp. grooves

Also Published As

Publication number Publication date
NO321138B1 (en) 2006-03-27
NO963394L (en) 1997-02-18
DE29602366U1 (en) 1996-05-02
EP0759636A3 (en) 1998-07-29
EP0759636A2 (en) 1997-02-26

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Legal Events

Date Code Title Description
MM1K Lapsed by not paying the annual fees