NO333724B1 - En mikromekanisk rekke med optisk reflekterende overflater - Google Patents
En mikromekanisk rekke med optisk reflekterende overflater Download PDFInfo
- Publication number
- NO333724B1 NO333724B1 NO20092837A NO20092837A NO333724B1 NO 333724 B1 NO333724 B1 NO 333724B1 NO 20092837 A NO20092837 A NO 20092837A NO 20092837 A NO20092837 A NO 20092837A NO 333724 B1 NO333724 B1 NO 333724B1
- Authority
- NO
- Norway
- Prior art keywords
- substrate
- movable
- layer
- beams
- dielectric layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 125000006850 spacer group Chemical group 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 230000004927 fusion Effects 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000013461 design Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 230000005686 electrostatic field Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0808—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more diffracting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1828—Diffraction gratings having means for producing variable diffraction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO20092837A NO333724B1 (no) | 2009-08-14 | 2009-08-14 | En mikromekanisk rekke med optisk reflekterende overflater |
| JP2012524244A JP5731503B2 (ja) | 2009-08-14 | 2010-08-13 | 微小機械素子 |
| US13/387,473 US20120243095A1 (en) | 2009-08-14 | 2010-08-13 | Configurable micromechanical diffractive element with anti stiction bumps |
| CN201080031496.9A CN102471046B (zh) | 2009-08-14 | 2010-08-13 | 一种带有抗摩擦力凸块的可配置微型机械衍射元件 |
| SG2012004446A SG177720A1 (en) | 2009-08-14 | 2010-08-13 | A configurable micromechanical diffractive element with anti stiction bumps |
| CA2771156A CA2771156A1 (en) | 2009-08-14 | 2010-08-13 | Micro mechanical element |
| EP10742505A EP2464595A2 (en) | 2009-08-14 | 2010-08-13 | A configurable micromechanical diffractive element with anti stiction bumps |
| AU2010283716A AU2010283716B8 (en) | 2009-08-14 | 2010-08-13 | A configurable micromechanical diffractive element with anti stiction bumps |
| PCT/EP2010/061850 WO2011018521A2 (en) | 2009-08-14 | 2010-08-13 | Micro mechanical element |
| RU2012108958/28A RU2559032C9 (ru) | 2009-08-14 | 2010-08-13 | Микромеханический элемент |
| BR112012003271A BR112012003271A2 (pt) | 2009-08-14 | 2010-08-13 | elemento micromecânico |
| IL217987A IL217987A0 (en) | 2009-08-14 | 2012-02-07 | A configurable micromechanical diffractive element with anti stiction bumps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO20092837A NO333724B1 (no) | 2009-08-14 | 2009-08-14 | En mikromekanisk rekke med optisk reflekterende overflater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO20092837A1 NO20092837A1 (no) | 2011-02-15 |
| NO333724B1 true NO333724B1 (no) | 2013-09-02 |
Family
ID=43586564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20092837A NO333724B1 (no) | 2009-08-14 | 2009-08-14 | En mikromekanisk rekke med optisk reflekterende overflater |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20120243095A1 (pt) |
| EP (1) | EP2464595A2 (pt) |
| JP (1) | JP5731503B2 (pt) |
| CN (1) | CN102471046B (pt) |
| AU (1) | AU2010283716B8 (pt) |
| BR (1) | BR112012003271A2 (pt) |
| CA (1) | CA2771156A1 (pt) |
| IL (1) | IL217987A0 (pt) |
| NO (1) | NO333724B1 (pt) |
| SG (1) | SG177720A1 (pt) |
| WO (1) | WO2011018521A2 (pt) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011524807A (ja) * | 2008-06-18 | 2011-09-08 | アクタマックス サージカル マテリアルズ リミテッド ライアビリティ カンパニー | 波形の搬送プレートを有する混合デバイス |
| US8757444B2 (en) | 2009-12-17 | 2014-06-24 | Actamax Surgical Materials, Llc | Dispensing device having an array of laterally spaced tubes |
| GB2497295A (en) | 2011-12-05 | 2013-06-12 | Gassecure As | Method and system for gas detection |
| AU2019378878A1 (en) | 2018-11-15 | 2021-06-03 | Butterfly Network, Inc. | Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices |
| GB201820293D0 (en) | 2018-12-13 | 2019-01-30 | Draeger Safety Ag & Co Kgaa | Gas sensor |
| WO2020176149A1 (en) | 2019-02-25 | 2020-09-03 | Butterfly Network, Inc. | Adaptive cavity thickness control for micromachined ultrasonic transducer devices |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002044033A2 (en) * | 2000-11-29 | 2002-06-06 | Microassembly Technologies, Inc. | Mems device with integral packaging |
| EP1296171A2 (en) * | 2001-09-20 | 2003-03-26 | Eastman Kodak Company | Electro-mechanical grating device having a continuously controllable diffraction efficiency |
| US6621392B1 (en) * | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
| EP1561724A1 (en) * | 2004-02-06 | 2005-08-10 | General Electric Company | Micromechanical device with thinned cantilever structure and related methods |
| EP1640322A2 (en) * | 2004-09-27 | 2006-03-29 | Idc, Llc | System and method for protecting micro-structure of display array using spacers in gap within display device |
| WO2009037256A2 (de) * | 2007-09-18 | 2009-03-26 | Austriamicrosystems Ag | Mikroelektromechanisches bauelement und herstellungsverfahren |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6219015B1 (en) * | 1992-04-28 | 2001-04-17 | The Board Of Directors Of The Leland Stanford, Junior University | Method and apparatus for using an array of grating light valves to produce multicolor optical images |
| US5311360A (en) * | 1992-04-28 | 1994-05-10 | The Board Of Trustees Of The Leland Stanford, Junior University | Method and apparatus for modulating a light beam |
| US6243474B1 (en) * | 1996-04-18 | 2001-06-05 | California Institute Of Technology | Thin film electret microphone |
| WO1999052006A2 (en) * | 1998-04-08 | 1999-10-14 | Etalon, Inc. | Interferometric modulation of radiation |
| US6238581B1 (en) * | 1998-12-18 | 2001-05-29 | Eastman Kodak Company | Process for manufacturing an electro-mechanical grating device |
| US6586841B1 (en) | 2000-02-23 | 2003-07-01 | Onix Microsystems, Inc. | Mechanical landing pad formed on the underside of a MEMS device |
| US6437965B1 (en) | 2000-11-28 | 2002-08-20 | Harris Corporation | Electronic device including multiple capacitance value MEMS capacitor and associated methods |
| US6829092B2 (en) * | 2001-08-15 | 2004-12-07 | Silicon Light Machines, Inc. | Blazed grating light valve |
| JP3639978B2 (ja) * | 2002-05-10 | 2005-04-20 | 日本航空電子工業株式会社 | 光スイッチ |
| US6908201B2 (en) * | 2002-06-28 | 2005-06-21 | Silicon Light Machines Corporation | Micro-support structures |
| JP2004061937A (ja) * | 2002-07-30 | 2004-02-26 | Japan Aviation Electronics Industry Ltd | 微小可動デバイス |
| FR2848021B1 (fr) * | 2002-11-28 | 2005-05-06 | Commissariat Energie Atomique | Micro-commutateur electrostatique pour composants a faible tension d'actionnement |
| NO318360B1 (no) * | 2002-12-30 | 2005-03-07 | Sinvent As | Konfigurerbart diffraktiv optisk element |
| US7411717B2 (en) | 2003-02-12 | 2008-08-12 | Texas Instruments Incorporated | Micromirror device |
| US7072093B2 (en) * | 2003-04-30 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Optical interference pixel display with charge control |
| JP2005099206A (ja) * | 2003-09-22 | 2005-04-14 | Seiko Epson Corp | 波長可変フィルタおよび波長可変フィルタの製造方法 |
| KR100645640B1 (ko) * | 2003-11-03 | 2006-11-15 | 삼성전기주식회사 | 회절형 박막 압전 마이크로 미러 및 그 제조 방법 |
| JP4210245B2 (ja) * | 2004-07-09 | 2009-01-14 | セイコーエプソン株式会社 | 波長可変フィルタ及び検出装置 |
| US7310180B2 (en) * | 2004-11-05 | 2007-12-18 | Silicon Light Machines Corporation | Dielectric spacer for enhanced squeeze-film damping of movable members of MEMS devices |
| US20060278942A1 (en) * | 2005-06-14 | 2006-12-14 | Innovative Micro Technology | Antistiction MEMS substrate and method of manufacture |
| US20080074725A1 (en) * | 2006-08-25 | 2008-03-27 | Spatial Photonics, Inc. | Micro devices having anti-stiction materials |
| US7919006B2 (en) * | 2007-10-31 | 2011-04-05 | Freescale Semiconductor, Inc. | Method of anti-stiction dimple formation under MEMS |
| FR2925889B1 (fr) | 2007-12-27 | 2010-01-29 | Commissariat Energie Atomique | Procede de realisation d'un dispositif micromecanique et/ou nanomecanique a butees anti-collage |
| US7961376B2 (en) | 2007-12-31 | 2011-06-14 | Texas Instruments Incorporated | Reducing adherence in a MEMS device |
| US7864403B2 (en) * | 2009-03-27 | 2011-01-04 | Qualcomm Mems Technologies, Inc. | Post-release adjustment of interferometric modulator reflectivity |
| US20120107992A1 (en) * | 2010-10-28 | 2012-05-03 | Freescale Semiconductor, Inc. | Method of producing layered wafer structure having anti-stiction bumps |
| US8338207B2 (en) * | 2011-01-13 | 2012-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bulk silicon moving member with dimple |
| US8940586B2 (en) * | 2011-11-23 | 2015-01-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanism for MEMS bump side wall angle improvement |
-
2009
- 2009-08-14 NO NO20092837A patent/NO333724B1/no unknown
-
2010
- 2010-08-13 CA CA2771156A patent/CA2771156A1/en not_active Abandoned
- 2010-08-13 BR BR112012003271A patent/BR112012003271A2/pt not_active Application Discontinuation
- 2010-08-13 CN CN201080031496.9A patent/CN102471046B/zh active Active
- 2010-08-13 WO PCT/EP2010/061850 patent/WO2011018521A2/en active Application Filing
- 2010-08-13 EP EP10742505A patent/EP2464595A2/en not_active Withdrawn
- 2010-08-13 SG SG2012004446A patent/SG177720A1/en unknown
- 2010-08-13 JP JP2012524244A patent/JP5731503B2/ja active Active
- 2010-08-13 US US13/387,473 patent/US20120243095A1/en not_active Abandoned
- 2010-08-13 AU AU2010283716A patent/AU2010283716B8/en not_active Ceased
-
2012
- 2012-02-07 IL IL217987A patent/IL217987A0/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002044033A2 (en) * | 2000-11-29 | 2002-06-06 | Microassembly Technologies, Inc. | Mems device with integral packaging |
| EP1296171A2 (en) * | 2001-09-20 | 2003-03-26 | Eastman Kodak Company | Electro-mechanical grating device having a continuously controllable diffraction efficiency |
| US6621392B1 (en) * | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
| EP1561724A1 (en) * | 2004-02-06 | 2005-08-10 | General Electric Company | Micromechanical device with thinned cantilever structure and related methods |
| EP1640322A2 (en) * | 2004-09-27 | 2006-03-29 | Idc, Llc | System and method for protecting micro-structure of display array using spacers in gap within display device |
| WO2009037256A2 (de) * | 2007-09-18 | 2009-03-26 | Austriamicrosystems Ag | Mikroelektromechanisches bauelement und herstellungsverfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| IL217987A0 (en) | 2012-03-29 |
| RU2559032C2 (ru) | 2015-08-10 |
| US20120243095A1 (en) | 2012-09-27 |
| WO2011018521A3 (en) | 2011-08-25 |
| JP2013501954A (ja) | 2013-01-17 |
| CN102471046B (zh) | 2015-09-09 |
| AU2010283716B2 (en) | 2015-03-05 |
| RU2012108958A (ru) | 2013-09-20 |
| AU2010283716B8 (en) | 2015-08-06 |
| EP2464595A2 (en) | 2012-06-20 |
| CN102471046A (zh) | 2012-05-23 |
| SG177720A1 (en) | 2012-03-29 |
| JP5731503B2 (ja) | 2015-06-10 |
| WO2011018521A2 (en) | 2011-02-17 |
| AU2010283716A8 (en) | 2015-08-06 |
| BR112012003271A2 (pt) | 2016-03-01 |
| AU2010283716A1 (en) | 2012-02-09 |
| CA2771156A1 (en) | 2011-02-17 |
| NO20092837A1 (no) | 2011-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CHAD | Change of the owner's name or address (par. 44 patent law, par. patentforskriften) |
Owner name: SINTEF TTO AS, NO |