NO20120549A1 - Ceramic hotplate components and their manufacturing method - Google Patents

Abstract

The invention describes a fabrication method for flat, ceramic heat sink and plinth components for cooling high-power LEDs and heat-producing integrated electronic components, lighting components in the transport sector, and for residential and outdoor lighting, comprising in order: i) mixing of a ceramic, "green" paste , ii) sizing and optionally structuring the ceramic paste, and iii) sintering the sized and structured ceramic paste. The dimensioning and structuring of the ceramic paste takes place in two stages, the first step being an extrusion of the paste and the second being calendering of the extruded paste, which enables fabrication of dense or porous, unstructured or structured cooling plate components. Ceramic components made by this method are also described.

Description

Ceramic heat sink components and their fabrication method

Firstly, this invention encompasses a method for the fabrication of planar, ceramic heat sinks and base components as defined in Claim 1. Secondly, this invention encompasses both porous and dense, structured and unstructured heat sink components produced according to this production method.

Background to the Invention

Light-emitting diodes (LED) and other electronic components are continuously being developed towards ever higher performance in an ever smaller area. A certain part of the energy turnover in such components ends up as heat that must be led away from an ever smaller area. For this purpose, cooling plates must be used.

Heatsinks are generally well known by users, and various structures, configurations and materials are in use. Cooling plates can either passively dissipate heat, or actively e.g. by using fans, optionally combined with partially porous structures (US patent 6,967,844), or by using circulating fluids in channels integrated in, or connected to, the cooling plate (e.g. European patent EP 1 175 135). The external refrigerant can be both gas and liquid.

Most commercially available heatsinks utilize metal with high thermal conductivity, such as aluminum (Al). The advantages are that metal is often easy to shape (milling, casting, forging, extrusion, etc., see e.g.: F. Forghan et al., Manuf. Eng., May 1999,1-8), has a very high thermal conductivity, and often has a moderate material price.

An alternative solution is to use ceramic materials. Certain ceramic materials have a high thermal conductivity, but are relatively expensive. Others have a moderately good conductivity, but are cheap and easy to shape using ceramic methods.

In the literature, one also finds proposals to combine metallic and ceramic materials (see e.g.: WO patent 2008/072845, US patent 6,033,787).

When choosing material for the cooling plate, all the functions of the cooling plate must be considered. For all electrical/electronic components, electrical supply lines are needed for the supply of energy (power) and the exchange of information/communication. These wires are most simply deposited using a printing technology directly on the cooling plate. The use of metallic cooling plates will therefore require an electrically insulating layer between the cooling plate and the printed wiring network, to prevent an electrical short circuit between the wires. This insulating layer will generally reduce the heat flow away from the heat generating component. With the use of a ceramic cooling plate, this will not be a problem, since these materials are in themselves very good electrical insulators, with very high electrical resistance. The electrical wiring harness can therefore be pressed directly on top of the ceramic cooling plate without any intermediate insulation. The ceramic cooling plate will therefore be structurally simpler and cheaper to produce than the more complex metallic ones, and will often show better thermal cooling of the mounted LED/electronic component than a corresponding metallic one with an insulating layer.

Ceramic cooling plates are now commercially available to some extent. These can be made of different materials, such as: alumina (Al2O3), aluminum nitride (AIN), beryllium oxide (BeO), silicon carbide (SiC), and others. Thermal conductivity varies from the lowest for alumina (25 W/m K) to the highest for beryllium oxide (250 W/m K). Ceramic composite materials have also been proposed (eg: Si-impregnated SiC: US patent 2007/0252267, ceramic/metal: US patent 7,598,533). Furthermore, low-temperature sintered ceramics (LTCC) are used as an integral part of heat sinks (US patent 2010/0089620, US patent 2009/0091020), although thermal conductivity is generally low for such materials. In addition to this, diamond has also been proposed for use in cooling plates, often in composite or laminate form (eg: US patent 5,791,045, US patent 7,538,423, US patent 6,758,264). Porous cooling plates have also been proposed (US patent 2010/0019380, European patent EP1463 113, US patent 2008/0315238).

The cost picture is important for many cooling plate applications. For ceramic heat sinks, this means that the most cost-effective material is alumina. However, this requires that the production method must also be an efficient and low-cost method, so that the overall cost of the cooling plate is low. Previously reported production of cooling plates has been carried out with pressing and/or machining of the "green"/sintered product, which can be classified as a "batch" or single component method, (see e.g.: US patent 2004/0027067). Casting has also been proposed (US patent 6,786,982).

Terpstra et al. (US patent 5,523,049) has proposed a method for the production of cooling plates by compression molding material particles in a polymer matrix into a mold, followed by a decomposition of the polymer and a consolidation of the resulting component in a press/forge, before the final sintering of the plate . This process must also be classified as a "batch" or single component method, and particularly suitable for metallic components.

Purpose of the Invention

One purpose of the invention is to provide an improved production method for the fabrication of planar, ceramic cooling plate and base components, intended for use in cooling high-power LED and heat-producing integrated electronic components.

It is further an object to provide a method to be able to dimension the cooling plate in a precise manner, quickly, and in an "in-line" process.

It is a further object to provide a method for directly, quickly and "in-line" to be able to structure the cooling plate.

The invention

The above-mentioned purposes are achieved with the fabrication method according to a first aspect of the invention, which is described in claim 1.

According to another aspect, the invention includes cooling plate and base components defined in claim 11.

Preferred embodiments of the invention are described in the various, independent claims.

The invention provides a highly efficient, low-cost fabrication method for the purpose of producing planar, porous or non-porous, ceramic heat sink and socket components for high-power LED and heat-producing integrated electronic devices, the material formulation of the input material, the structuring of the plates, and the final processing of the components produced by the method. The manufacturing method is well suited for a continuous, "in-line" production, but the production can of course also be carried out in a segmented, non-continuous process. The manufactured cooling plates can be cooled both passively and actively. Therefore, porous cooling plates can achieve increased convective cooling by forced cooling through the pores.

The manufactured components can also be used for heating purposes, such as heating, evaporation and/or boiling.

The method uses a combination of an extruder and a calender/roller, which ensures both a very good mixing and homogenization of the "green", ceramic material paste, as well as a very good and accurate dimensioning of the manufactured components. Both of these steps are preferably carried out "in-line", which results in a high production rate. The method produces a sheet or foil product that can be structured during the calendering/rolling, or alternatively can be deep drawn, embossed or structured in a more complex way in an additional subsequent step outside the production line. This innovative, new fabrication method provides a simple, efficient and high-volume method for simple and inexpensive manufacturing of heatsink components.

The ceramic starting material should preferably be a readily available commodity in large volumes. An excellent candidate is alumina, which is electrically insulating but with an acceptable thermal conductivity. "Acceptable" in this respect can be defined as conductivities above 15 W/m K, depending on the application. The use of ceramic cooling plates will simplify the electrical connection, as the wiring can be pressed directly onto the surface of the cooling plate, e.g. with printing technology. The ceramic cooling plate can be made with a uniform material structure or as a laminate. Furthermore, it can be produced as a flat plate, or as a structured plate, e.g. with cooling fins. In this context, "structured" shall mean any design that differs from a simple flat and uniformly thick structure, e.g. structures containing fins or heat sinks on at least one side.

The required electrical wiring pattern can be applied directly to the ceramic plate surface using any printing technology. The heat-generating component can then be mounted directly on the ceramic plate's surface by gluing, soldering or other joining methods. The external, heat-absorbing medium can either be a gas or a liquid. Forced, convective cooling can significantly increase the cooling effect. For this purpose, the cooling plate can be made of a porous material, without significant changes to the manufacturing method. For many applications, however, an external, convective cooling is sufficient, and in these cases the cooling plate should be manufactured from dense, non-porous materials.

The use of these components is in: automotive industry, household and street lighting, besides electronics industry and many other applications.

Furthermore, such cooling plate components can be used for heating, evaporation and/or cooking purposes and others, and will thus not necessarily be limited to cooling components and applications.

Short figure description

Below, the invention will be described in detail, with examples which should not be considered as limiting the invention, and with reference to the figures: Figure 1: Schematic presentation of the innovative fabrication method. (1) represents the mixing and homogenization of the ceramic mass, (2) the sizing and structuring step, (3) the drying step, (4) the cutting step, and (5) the sintering step. Figure 2: Analytical simulation of forced convective cooling per cm<2> from a 2 mm thick, porous, planar cooling plate with pore size 15 µm, as a function of cooling gas overpressure with a temperature difference of 60°C. Figure 3: Shows a sintered, porous, ceramic cooling plate with fins, in alumina material. Diameter is 75 mm and the fins are ribs with dimensions lxl mm (aspect ratio 1), the thickness of the base plate is

2 mm.

Figure 4: Shows sintered 60 x 15 mm unstructured, dense, alumina ceramic heat sinks with thicknesses of 1, 2, and 3 mm. Figure 5: Shows experimental values for luminescence versus power, for an LXK2-PW12-S00 LED mounted on flat ceramic heat sinks of thickness 1, 2, and 3 mm. Figure 6: Shows sintered 60 x 15 mm dense alumina ceramic heat sinks with aspect ratio 1 fins and 2 mm base plate thickness. Figure 7: Shows a manufactured, "green", ceramic (Al203) cooling plate tape with fins with aspect ratio 1 and thickness of the base plate of 2 mm.

Detailed Description of the Invention

The present invention provides a continuous or discrete, low cost fabrication method for manufacturing planar heat sink and socket components for high power LED and heat producing electronic integrated circuits.

For a more complete understanding of the technology of the present invention, the following description follows:

1. The separate, technical steps in the manufacturing method,

2. Formulation of the starting material,

3. Structuring of the manufactured components,

4. Final processing of the components,

5. Application of the components.

The separate, technical steps in the manufacturing method

Figure 1 shows a schematic flow diagram for the proposed continuous in-line fabrication method. Fabrication can also be carried out in separate process steps that are not organized in a production line. However, the individual steps in the fabrication are all necessary steps, and can be made up of either a simple physical unit, or two or more units in combination, in order to achieve the desired result. The essential steps in the fabrication process are solid mixing, structuring and sintering. The numbers refer to Figure 1: Pasta mixing and homogenization ( 1). The green input material is first mixed together and homogenized. This process can be done in one or two physical processing machines. If one machine is used, a high shear mixer or kneader is preferable. With two machines, a high-speed, intensive rotary mixer combined with an extruder is preferable. However, this shall not limit the patent from using other effective mixing and homogenization methods.

The paste produced using this step (e.g. from an extruder) is preferably a flat foil, ready for the next step which is sizing and structuring. However, forming into foil can also take place during the dimensioning and structuring step.

Dimensioning and structuring ( 2). Dimensioning and structuring takes place with a roller or calender. The number of rollers/roll sets can be chosen according to the purpose. This is essential for a high surface quality and an accurate dimensioning of the "green" product.

By engraving a pattern in one or two rollers, a pattern or structure can be embossed into the "green" product. This covers both a partial pattern embossing, as when fins or ribs are to be produced on one side for increased heat release, and a partial perforation of the product to facilitate the separation of the individual components.

The shaping and structuring of the foil (paste) can in principle also be done with the extruder. However, this would mean that the surface quality and dimensional accuracy would not be as good as if this were done after rolling/calendering. Heat sink components produced with the proposed method should therefore be rolled/calendered for high surface quality and high dimensional accuracy.

Both extruders and rollers/calenders are well-known tools for the ceramics industry. However, the combination of the two tools for the manufacture of ceramic heat sink components has not been reported previously, and therefore represents a new and innovative method for the manufacture of ceramic heat sinks.

As an alternative, the manufactured and dimensioned "green" tape can also be used for deep drawing, punching, pressing, embossing, casting and shaped as a plastic material in a more complex way in a subsequent "off-line" process step.

Optionally, different ceramic materials can also be laminated in the rolling/calendering step, to achieve special properties for the component, either mechanically, structurally or chemically. Such laminated structures will appear as monolithic structures with isotropic and homogeneous properties within each layer.

Cutting (4) is part of the structuring, and can take place after a drying step, just before sintering. Individual components can be cut directly, but a more cost-effective way would be to punch out multi-component sheets, so that a large number of components hang together in a perforated sheet, which after sintering can be easily broken apart if necessary. The further handling and processing (e.g. printing of electrical wiring pattern) will be simplified in this way. Alternatively, the cutting can take place after the foil has been produced.

The cutting will usually be organized "in-line", as a continuous process step, where components, or multi-component sheets, are cut out in a shape that makes sintering easier. If necessary, sheets or individual components can be cut out in an external step before sintering. The component is delivered either as individual components or component sheets after the dimensioning and structuring step.

The sintering ( 5) is the last link in a continuous production line. The drying (3) of the "green" products can be considered as part of the sintering process, which takes place directly after the rolling/calendering, preferably as part of the continuous, or "in-line", process. Air, either dry or humidified, at room temperature or a higher temperature, can be used as a drying medium. Alternatively, drying can take place after cutting. It is also possible to carry out the drying outside the continuous line, off-line. The sintering is also preferably continuous, but can alternatively be a batch furnace, "off-line".

Finishing of the components can take place after the final sintering, and will for example include printing (eg: silk or tampon printing, inkjet printing, intaglio printing or stencil printing) of the electrical wiring network. The heat-generating component can then be mounted directly on the surface of the cooling plate, in the desired location, with gluing, soldering or other joining methods.

As an alternative to printing as a post-processing step, a pattern can also be embossed into the green material prior to sintering.

Finally, quality control (QC), packaging and shipping will take place.

The formulation of the starting material

The preferred manufacturing method requires an input material in the form of a highly viscous paste, with ceramic powder material, organic binder, plasticizer, dispersant and solvent. Depending on the quality of the ceramic powder material used, particle size, shape and properties, the paste will typically consist of: 60-90 weight-% ceramic powder material, 2-15 weight-% binder, 0-10 weight-% plasticizer, 0-5 wt% dispersant and 0-30 wt% solvent. By "high-viscosity paste" here is meant a paste which has a viscosity which is sufficient to retain its physical form during the process as long as it is not exposed to external forces (other than gravity).

Of the ceramic materials that will be suitable and useful for the invention, commercial goods are widely available. Of these, many oxides are the cheapest, with alumina as the preferred material. Alumina is electrically insulating (electrical resistance of the order of 10<14>ohnrvcm) but with acceptable heat conduction (thermal heat conduction of the order of 25 W/m K). Dense materials made with the proposed method will often be preferable to materials with small particles of different sizes. Porous materials are either produced with powder material with the same particle size as practically possible and with large particles, or with pore formers.

It may be desirable to mix other inorganic materials into the base material to achieve special properties or a different binding phase after sintering which guarantees a good mechanical bond between the ceramic powder particles. These additives are often, but not limited to, other oxides based on metals such as calcium, cerium, lanthanum, silicon, strontium, titanium, and/or zirconium, and derivatives, extensions, mixtures, and combinations thereof.

The organic binder can be used either together with a solvent or without. This solvent can be either an organic solvent or water. Solvent-free binders are usually waxes, rubber types, thermoplastic materials, or other polymeric materials that can be quickly cured by light, solvents (including water) or temperature. Binders that require solvents are usually organic or inorganic materials that can be dissolved in special solvents (including water) and that will have an increased viscosity when the solvent is removed. Extrusion and calendering will generally require pastes with a relatively low content of binder and solvent.

Heatsink components produced by the proposed fabrication method are homogeneous and will generally be monolithic with a substantially uniform structure. Laminated materials will be ideally uniform and homogeneous in each layer. For porous components, designed for forced convection through pores, it is essential that all pores are open, isotropic and homogeneous, so that forced convection (with e.g. air) can occur homogeneously throughout the component, with open access for the environment. Closed porosity will not contribute to forced cooling.

Increased heat transfer: In principle, any heatsink exposed to free convection will be cooled from the surface caused by the surrounding air being heated by the heat from the heat-generating component. In addition to free convective cooling, forced convective cooling can also be used to remove heat from the cooling plate. Forced convective cooling can be achieved e.g. using a fan that blows air over the cooling plate. This will noticeably increase the cooling of the plate with the heat-generating component, with negligible energy consumption. For cooling plates made of dense, non-porous materials, the increased cooling due to forced convection will occur entirely through the outer surface of the cooling plate.

For porous materials, however, the increased heat transfer will also be able to occur through the inner pore walls in the porous material, which represents a surface area that is 5-6 orders of magnitude larger than the outer surface area of the cooling plate. The pore size will therefore be selected to achieve the most efficient flow through the pores. If the pores are too small, the friction for the air flow will be too high (permeability too low). However, if the pores become too large, the mechanical properties will be greatly reduced, according to Griffith's equation:

where Of is the breaking strength of the material and D is the pore diameter.

The permeability (*:) of a porous material can be defined as follows: which is given in units of Darcy when the pore diameter is given in pm [1 Darcy = IO"<12>m<2>], p is the porosity and the geometric factor a is:

where t is the pore tortuosity.

The material porosity is also important in this context and must not be too low as this will reduce the permeability and consequently the convective cooling in the pores, but also not too high as this will reduce the removal of heat from the heat-generating source, according to a general, empirical equation:

where Xp is the denthermal conductivity of the porous material and Å,0 is the thermal conductivity of the corresponding dense material.

The permeability relates to a well-defined flowing medium (coolant), thus becomes:

which is usually given in units of [m<2>/barh], where \ i is the viscosity of the flowing medium, e.g. air, given in units of Poise [1 P = 1 dyn sec/cm2= 0.1 N-s/m2 = 2.781010barh]. For air at 50°C the viscosity is 1.95110"<4>P.

For porous materials, the Reynolds number for forced convection in the pores is defined as follows:

where Um is the mean air velocity in the pores and v is the kinematic viscosity defined by:

where p is the density of the refrigerant, e.g. air. Kinematic viscosity \ i is given in units of Stoke [1 St = 1 cm<2>/s]. For air at 50°C, the kinematic viscosity is 0.1785 St.

For forced convective cooling through the pores of a porous cooling plate, the preferred pore size is in the range 5-40 pm, and the porosity in the range 20-50%. Such forced cooling will greatly increase the cooling of the cooling plate, with only a small addition in energy consumption, due to the effective cooling in the pores of the isotropic material, see Figure 2.

An estimate of the cooling effect for the porous cooling plate with circular geometry as shown in Figure 3, in a material with a pore size of 15 pm, shows that with an excess pressure of only 0.8 bar, the forced convective cooling will absorb 880 W from the cooling plate with a temperature of ambient air of 20°C and a maximum temperature on the heatsink of 80°C. In this regime, the air flow in the pores is laminar and fully developed. For comparison, the cooling effect with free convection from a dense cooling plate under the same conditions is of the order of 0.2 W/cm<2>, with forced convective cooling of the order of 2 W/cm<2> (with air speeds of the order of 10 m/s), while forced convective cooling through pores will produce a cooling effect of the order of 20 W/cm<2> (with an added overpressure of 0.8 bar)

The added refrigerant can be either a gas or a liquid. In our examples, air is described throughout. However, this shall not exclude any other cooling medium.

Porous materials are manufactured according to similar recipes and procedures as dense materials.

The structuring of the components

Cooling plates can be supplied as flat plates, as a sheet of plates of regular shape, or as structured components with e.g. cooling fins.

When the heat generating component (e.g. LED) is mounted on the surface of the heatsink, the temperature will quickly reach close to the same value on both sides. Especially for materials with moderate thermal conductivity (such as alumina) the thickness of the cooling plate will play an important role. Thick cooling plates will generally spread the heat away from the heat-generating component in a more efficient way and thus ensure a lower operating temperature - and longer life - for the LED/component. An increased cooling plate area will give similar results. Figure 4 shows unstructured, sintered and dense heat sinks made of alumina with thicknesses of 1, 2, and 3 mm, and Figure 5 shows luminescence of a commercial LED mounted on an unstructured heat sink with thicknesses of 1, 2, and 3 mm. Increased LED luminescence is a result of increased cooling of the LED (reduced LED temperature).

To increase the cooling capacity of a cooling plate, cooling fins can be made. This represents a structuring that can be done directly in the proposed fabrication method, in the rolling or calendering step, without significant adjustments to the method. Figures 3, 6 and 7 show alumina cooling plates with cooling fins. Figure 3 shows a sintered, porous cooling plate, Figure 6 shows sintered, dense cooling plates, while

Figure 7 shows a "green" cooling plate together with a cross-section of the structured material.

The final processing of the components

The final processing of the components, when required, takes place after sintering and will typically include printing (silk or tampon printing, inkjet printing, gravure printing or stencil printing) of the electrical wiring pattern, separation of the individual cooling plates from a sheet and edge cleaning of the components, before quality control, packaging and dispatch of the products.

The application of the components

Alumina cooling plates are suitable for the low-cost market, where the price of the cooling plate is important. New, growing markets for LED-based lighting are e.g. in the transport market, residential lighting, outdoor lighting and many other applications.

Other markets are within the electronics sector where forced cooling is also used.

Furthermore, the fabricated cooling components will also be able to be used for heating purposes, such as heating, evaporation and boiling, and will thus not be limited to cooling devices and

- applications.

Due to the material's properties, low price and satisfactory heat conduction, alumina, Al 2 O 3 , is the preferred material for the proposed invention. However, all heat-conducting ceramic materials can be used to manufacture cooling plates according to the proposed invention, and should therefore not be excluded.

For applications where high thermal conductivity is a priority, other ceramic materials can be advantageously used, such as: aluminum nitride (AIN), beryllium oxide (BeO), silicon carbide (SiC), and others. Ceramic composite materials, or the combination of the aforementioned materials, can also be used with advantage. These can all be produced with the proposed fabrication method.

To produce porous ceramic materials, other additive materials may also be needed to make sintering easier. These additive materials include other inorganic oxide materials based on calcium, cerium, lanthanum, silicon, strontium, titanium, and/or zirconium, and derivatives, expansions, blends, and/or combinations thereof.

Examples

Various cooling plates have been produced according to the proposed invention. Experiments with attached LED have also been carried out.

Example 1

Cooling plates manufactured according to the invention are shown in Figure 4. These are unstructured, dense cooling plates with dimensions 60 x 15 mm, and with thicknesses of 1, 2 and 3 mm.

The dense cooling plates are manufactured according to the invention with a paste consisting of: 68.6% by weight of alumina powder material, 10.3% by weight of binder, 2.6% by weight of plasticizer, and 18.5% by weight of water.

The cooling plates are densely sintered at 1650°C.

Example 2

Cooling plates manufactured according to the invention are shown in Figure 6. These are dense cooling plates with dimensions 60 x 15 mm, with a base plate of 2 mm thickness, and with cooling fins with aspect ratio 1 (with height and width equal to 1 mm) and separated by 1 mm . The fins are oriented parallel to the long side of the component.

The dense cooling plate was fabricated and sintered as was the unstructured cooling plate in Example 1.

Electrical connections have been screen printed directly onto the ceramic sintered heatsink, using commercial grade silver paste. A simple LED was then mounted and tested, see Example 4.

Example 3

A cooling plate manufactured according to the invention is shown in Figure 3. This is a porous cooling plate with a diameter of 75 mm, with a base plate of 2 mm thickness, and with cooling fins with aspect ratio 1 (with height and width equal to 1 mm) and separated by 1 mm. The cooling plate is intended for several LEDs.

The porous cooling plate is manufactured according to the invention with a paste consisting of: 81.6 wt% ceramic powder material, 3.5 wt% binder, 1.9 wt% plasticizer, 0.05 wt% dispersant, and 13.0 % water by weight.

The cooling plates are sintered porous at 1650°C.

Electrical leads have been screen printed directly onto the ceramic sintered heatsink with commercial grade silver paste. Several LEDs were installed and tested.

Example 4

The cooling plates from Example 1, manufactured according to the invention, were tested with one LED (Luxeon K2 type: LXK2-PW12-S00; cool white) mounted in an integrating sphere. The thicknesses of the cooling plates were chosen to be 1, 2 and 3 mm. The emitted light was measured with a VIS detector and a calibrated spectrometer (ILT). The data obtained in lumens are given as a function of the supplied power (current) to the LED. The results are shown in Figure 5.

Claims (15)

1. A fabrication method for planar ceramic heat sink and plinth components for cooling high-power LED and heat-generating integrated electronic components, lighting components in the transportation sector, and for residential and outdoor lighting, comprising in order: i) mixing a ceramic "green" paste , ii) dimensioning and any structuring of the ceramic paste, and iii) sintering of the dimensioned and structured ceramic paste, characterized in that the sizing and structuring of the ceramic paste takes place in two steps, where the first step is an extrusion of the paste and the second is calendering of the extruded paste, which will enable the fabrication of dense or porous, unstructured or structured cooling plate components. 2. A manufacturing method as specified in Claim 1, characterized in that the calendering step follows immediately after the extrusion step 3. A manufacturing method as specified in Claim 1, characterized in that the mixing and homogenization of the feed material takes place in a "high shear" mixer or kneader, or in a high-speed, intensive rotary mixer in combination with an extruder. 4. A manufacturing method as stated in Claim 1, characterized in that the sizing and structuring of the "green" paste takes place in an "in-line" single or multi-stage roller or calender, or "off-line" in an additional step with deep drawing, punching, pressing, casting or forging. 5. A manufacturing method as stated in Claim 1, characterized in that the "green" shaped product is dried continuously "in-line", or in an "off-line" drying chamber. 6. A manufacturing method as stated in Claim 1, characterized in that the "green" plate material is cut to the desired shape in an "in-line" or "off-line" cutting or punching step. 7. A manufacturing method as stated in Claim 1, characterized in that the shaped, "green" material components are sintered in a continuous or "batch" type furnace. 8. A manufacturing method as specified in Claim 1, characterized in that the "green" material consists of 60-90 wt% ceramic powder material, 2-15 wt% binder, 0-10 wt% plasticizer, 0-5 wt% dispersant, and 0-30% by weight solvent. 9. A manufacturing method as stated in Claim 1, characterized in that the preferred main material for the finished component is Al2O3. 10. A fabrication method as stated in Claim 1, characterized in that preferred other inorganic material elements are other oxides based on calcium, cerium, lanthanum, silicon, strontium, titanium, and/or zirconium, and derivatives, extensions, mixtures and/or combinations of these . 11. Heatsink components manufactured as specified in Claim 1 12. Cooling plate components as stated in Claim 11, characterized in that the cooling plate components are porous with a preferred pore size in the range 5-40 µm, and porosity in the range 20 - 50%, suitable for forced convective pore cooling. 13. Cooling plate components as stated in Claim 11, characterized in that heat extracted from the finished, porous component is transferred from the pore wall inside the material by means of forced convective cooling through the pores. 14. Heatsink components as specified in Claim 11, characterized in that the required electrical wiring pattern is applied directly to the manufactured component's surface with printing technologies such as silk or tampon printing, inkjet printing, gravure printing or stencil printing. 15. Heatsink components as specified in Claim 11, characterized in that the heat-emitting component can be mounted directly on the surface of the heatsink with gluing, soldering or other joining technology.