NO20083847L - Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyninger - Google Patents
Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyningerInfo
- Publication number
- NO20083847L NO20083847L NO20083847A NO20083847A NO20083847L NO 20083847 L NO20083847 L NO 20083847L NO 20083847 A NO20083847 A NO 20083847A NO 20083847 A NO20083847 A NO 20083847A NO 20083847 L NO20083847 L NO 20083847L
- Authority
- NO
- Norway
- Prior art keywords
- solder
- plated
- solder joints
- soldering
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
De prinsippene som beskrives her vedrører fremgangsmåter for lodding av elektrodeterminaler, pinner eller lederammer i kommersielle elektriske komponenter for pålitelighet ved høye temperaturer. I en utførelsesform, forut for lodding av de elektriske komponentene, blir et forhåndsplettert loddemiddellag fjernet fra lederammen eller pinnene, og nikkel- og/eller gullfilmer blir dannet med autokatalytisk plettering. Fjerningen av det forhåndspletterte loddemiddellaget unngår overskudd av forhåndsplettert Sn med et loddemiddel med høyt Pb-innhold som senker smeltepunktet til mellom 180 ºC og 220 ºC og svekker loddesammenføyningene. Nikkellaget som dannes med en autokatalytisk plettering, virker som en barriere for interdiffusjon av tinn fra loddemiddelet med kopper i lederammematerialet, som ellers kan inntreffe ved høye temperaturer. Interdiffusjon danner et intermetallisk forbindelseslag av kopper og tinn og forringer styrken til loddesammenføyningen. De nye loddeprosessene forbedrer påliteligheten til loddesammenføyninger ved høye temperaturer og forlenger elektronikkens levetid.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76715906P | 2006-03-07 | 2006-03-07 | |
US11/552,973 US7566592B2 (en) | 2006-03-07 | 2006-10-26 | Method and process of manufacturing robust high temperature solder joints |
PCT/IB2007/000489 WO2007102062A2 (en) | 2006-03-07 | 2007-03-02 | Method and process of manufacturing robust high temperature solder joints |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20083847L true NO20083847L (no) | 2008-10-06 |
Family
ID=38254940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20083847A NO20083847L (no) | 2006-03-07 | 2008-09-05 | Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyninger |
Country Status (5)
Country | Link |
---|---|
US (1) | US7566592B2 (no) |
EP (1) | EP2005807A2 (no) |
CA (1) | CA2644460A1 (no) |
NO (1) | NO20083847L (no) |
WO (1) | WO2007102062A2 (no) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100247955A1 (en) * | 2006-09-29 | 2010-09-30 | Kabushiki Kaisha Toshiba | Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same |
US20100012708A1 (en) * | 2008-07-16 | 2010-01-21 | Schlumberger Technology Corporation | Oilfield tools comprising modified-soldered electronic components and methods of manufacturing same |
JP2011228388A (ja) * | 2010-04-16 | 2011-11-10 | Honda Motor Co Ltd | 補助基板接合構造 |
TWI384922B (zh) * | 2010-10-22 | 2013-02-01 | Inventec Corp | 電路板的電子零組件佈局方法及其電路板結構 |
TW201309843A (zh) * | 2011-08-23 | 2013-03-01 | Taiwan Uyemura Co Ltd | 薄鎳-鈀-金鍍層,帶有導線的此鍍層所成封裝結構以及彼等之製作方法 |
US10180035B2 (en) | 2013-04-01 | 2019-01-15 | Schlumberger Technology Corporation | Soldered components for downhole use |
WO2015089470A1 (en) * | 2013-12-13 | 2015-06-18 | Schlumberger Canada Limited | Tin-antimony-based high temperature solder for downhole components |
US10012036B2 (en) | 2014-09-19 | 2018-07-03 | Halliburton Energy Services, Inc. | Downhole electronic assemblies |
US11329023B2 (en) | 2020-04-10 | 2022-05-10 | Schlumberger Technology Corporation | Interconnection of copper surfaces using copper sintering material |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4122215A (en) * | 1976-12-27 | 1978-10-24 | Bell Telephone Laboratories, Incorporated | Electroless deposition of nickel on a masked aluminum surface |
US6012537A (en) * | 1997-10-16 | 2000-01-11 | Prime Directional Systems, L.L.C. | Printed circuit board mounting for oil tools |
US6246011B1 (en) * | 1998-12-02 | 2001-06-12 | Nortel Networks Limited | Solder joint reliability |
US7105383B2 (en) | 2002-08-29 | 2006-09-12 | Freescale Semiconductor, Inc. | Packaged semiconductor with coated leads and method therefore |
US7696611B2 (en) * | 2004-01-13 | 2010-04-13 | Halliburton Energy Services, Inc. | Conductive material compositions, apparatus, systems, and methods |
US7320937B1 (en) * | 2005-10-19 | 2008-01-22 | The United States Of America As Represented By The National Security Agency | Method of reliably electroless-plating integrated circuit die |
US7615712B2 (en) * | 2006-10-31 | 2009-11-10 | Smith International, Inc. | Integrated circuit packages including damming and change protection cover for harsh environments |
-
2006
- 2006-10-26 US US11/552,973 patent/US7566592B2/en not_active Expired - Fee Related
-
2007
- 2007-03-02 CA CA002644460A patent/CA2644460A1/en not_active Abandoned
- 2007-03-02 EP EP07733906A patent/EP2005807A2/en not_active Withdrawn
- 2007-03-02 WO PCT/IB2007/000489 patent/WO2007102062A2/en active Application Filing
-
2008
- 2008-09-05 NO NO20083847A patent/NO20083847L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US7566592B2 (en) | 2009-07-28 |
WO2007102062A2 (en) | 2007-09-13 |
US20070212817A1 (en) | 2007-09-13 |
CA2644460A1 (en) | 2007-09-13 |
EP2005807A2 (en) | 2008-12-24 |
WO2007102062A3 (en) | 2008-01-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |