NO20083847L - Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyninger - Google Patents

Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyninger

Info

Publication number
NO20083847L
NO20083847L NO20083847A NO20083847A NO20083847L NO 20083847 L NO20083847 L NO 20083847L NO 20083847 A NO20083847 A NO 20083847A NO 20083847 A NO20083847 A NO 20083847A NO 20083847 L NO20083847 L NO 20083847L
Authority
NO
Norway
Prior art keywords
solder
plated
solder joints
soldering
layer
Prior art date
Application number
NO20083847A
Other languages
English (en)
Inventor
Shigeru Sato
Jiro Takeda
Atsushi Kayama
So Suzuki
Lionel Beneteau
Original Assignee
Schlumberger Technology Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technology Bv filed Critical Schlumberger Technology Bv
Publication of NO20083847L publication Critical patent/NO20083847L/no

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582Metallic layers on lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10909Materials of terminal, e.g. of leads or electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

De prinsippene som beskrives her vedrører fremgangsmåter for lodding av elektrodeterminaler, pinner eller lederammer i kommersielle elektriske komponenter for pålitelighet ved høye temperaturer. I en utførelsesform, forut for lodding av de elektriske komponentene, blir et forhåndsplettert loddemiddellag fjernet fra lederammen eller pinnene, og nikkel- og/eller gullfilmer blir dannet med autokatalytisk plettering. Fjerningen av det forhåndspletterte loddemiddellaget unngår overskudd av forhåndsplettert Sn med et loddemiddel med høyt Pb-innhold som senker smeltepunktet til mellom 180 ºC og 220 ºC og svekker loddesammenføyningene. Nikkellaget som dannes med en autokatalytisk plettering, virker som en barriere for interdiffusjon av tinn fra loddemiddelet med kopper i lederammematerialet, som ellers kan inntreffe ved høye temperaturer. Interdiffusjon danner et intermetallisk forbindelseslag av kopper og tinn og forringer styrken til loddesammenføyningen. De nye loddeprosessene forbedrer påliteligheten til loddesammenføyninger ved høye temperaturer og forlenger elektronikkens levetid.
NO20083847A 2006-03-07 2008-09-05 Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyninger NO20083847L (no)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US76715906P 2006-03-07 2006-03-07
US11/552,973 US7566592B2 (en) 2006-03-07 2006-10-26 Method and process of manufacturing robust high temperature solder joints
PCT/IB2007/000489 WO2007102062A2 (en) 2006-03-07 2007-03-02 Method and process of manufacturing robust high temperature solder joints

Publications (1)

Publication Number Publication Date
NO20083847L true NO20083847L (no) 2008-10-06

Family

ID=38254940

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20083847A NO20083847L (no) 2006-03-07 2008-09-05 Fremgangsmate og prosess for a lage robuste hoy-temperatur loddesammenfoyninger

Country Status (5)

Country Link
US (1) US7566592B2 (no)
EP (1) EP2005807A2 (no)
CA (1) CA2644460A1 (no)
NO (1) NO20083847L (no)
WO (1) WO2007102062A2 (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100247955A1 (en) * 2006-09-29 2010-09-30 Kabushiki Kaisha Toshiba Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same
US20100012708A1 (en) * 2008-07-16 2010-01-21 Schlumberger Technology Corporation Oilfield tools comprising modified-soldered electronic components and methods of manufacturing same
JP2011228388A (ja) * 2010-04-16 2011-11-10 Honda Motor Co Ltd 補助基板接合構造
TWI384922B (zh) * 2010-10-22 2013-02-01 Inventec Corp 電路板的電子零組件佈局方法及其電路板結構
TW201309843A (zh) * 2011-08-23 2013-03-01 Taiwan Uyemura Co Ltd 薄鎳-鈀-金鍍層,帶有導線的此鍍層所成封裝結構以及彼等之製作方法
US10180035B2 (en) 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
WO2015089470A1 (en) * 2013-12-13 2015-06-18 Schlumberger Canada Limited Tin-antimony-based high temperature solder for downhole components
US10012036B2 (en) 2014-09-19 2018-07-03 Halliburton Energy Services, Inc. Downhole electronic assemblies
US11329023B2 (en) 2020-04-10 2022-05-10 Schlumberger Technology Corporation Interconnection of copper surfaces using copper sintering material

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US6012537A (en) * 1997-10-16 2000-01-11 Prime Directional Systems, L.L.C. Printed circuit board mounting for oil tools
US6246011B1 (en) * 1998-12-02 2001-06-12 Nortel Networks Limited Solder joint reliability
US7105383B2 (en) 2002-08-29 2006-09-12 Freescale Semiconductor, Inc. Packaged semiconductor with coated leads and method therefore
US7696611B2 (en) * 2004-01-13 2010-04-13 Halliburton Energy Services, Inc. Conductive material compositions, apparatus, systems, and methods
US7320937B1 (en) * 2005-10-19 2008-01-22 The United States Of America As Represented By The National Security Agency Method of reliably electroless-plating integrated circuit die
US7615712B2 (en) * 2006-10-31 2009-11-10 Smith International, Inc. Integrated circuit packages including damming and change protection cover for harsh environments

Also Published As

Publication number Publication date
US7566592B2 (en) 2009-07-28
WO2007102062A2 (en) 2007-09-13
US20070212817A1 (en) 2007-09-13
CA2644460A1 (en) 2007-09-13
EP2005807A2 (en) 2008-12-24
WO2007102062A3 (en) 2008-01-17

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